Wafer dust removal device

Abstract

The wafer dust removal device comprises a box body, a feeding mechanism, a dust removal mechanism and a control end, the box body is provided with a cavity penetrating through the box body, the feeding mechanism comprises a conveying belt, the conveying belt penetrates through the cavity, the dust removal mechanism comprises two dust removal assemblies, a driving assembly and a dust collection and air supply assembly, the driving assembly is arranged between the two dust removal assemblies, and the dust collection and air supply assembly is arranged in the cavity. The two dust removal assemblies and the driving assembly are located in the cavity, each dust removal assembly comprises a rotary dust removal disc base, an air supply pipe module and a dust suction cylinder module, a plurality of air outlet nozzles and a plurality of flexible bristles are arranged at the bottom of each rotary dust removal disc base, dust suction grooves are formed around the outer edges of the air outlet nozzles and the flexible bristles, and the dust suction and air supply assemblies are arranged on one side of the box body. The dust collection and air supply assembly comprises a draught fan and a dust remover, the control end is arranged on the side, opposite to the dust remover, of the box body, the two dust removal assemblies are arranged, so that the wafer sequentially passes through the bottoms of the two dust removal assemblies, the two dust removal assemblies conduct cleaning and dust removal on the wafer, and the dust cleaning effect is improved through two times of cleaning.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor processing, in particular to a wafer dust removal device. Background Art

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and doped with a silicon crystal seed, and then slowly pulled out to form a cylindrical single-crystal silicon. After the silicon ingot is ground, polished, and sliced, a silicon wafer is formed, that is, a wafer.

[0003] At present, during the process of wafer processing and formation, some dust will adhere to the surface of the wafer. If not cleaned, it will affect the quality of the final product. Currently, wafer dust removal generally uses compressed air for open-air blowing indoors. Although it can also remove dust to some extent, the floating dust in the air will fall on the wafer again, resulting in poor cleaning effect. Summary of the Utility Model

[0004] In view of the above situation, it is necessary to provide a wafer dust removal device to solve the problem of poor wafer dust removal effect in the prior art.

[0005] A wafer dust removal device includes a box body, a feeding mechanism, a dust removal mechanism, and a control end. A cavity penetrating the box body is opened on the box body. The feeding mechanism includes a conveyor belt that passes through the cavity and is used for conveying wafers.

[0006] The dust removal mechanism includes two groups of dust removal components, a driving component, and a dust suction and air supply component. The driving component is arranged between the two groups of dust removal components. The two groups of dust removal components and the driving component are located in the cavity. The dust removal component includes a rotating dust removal disc seat, an air supply pipe module, and a dust suction cylinder module. A plurality of air outlet nozzles and a plurality of flexible bristles are provided at the bottom of the rotating dust removal disc seat. A dust suction groove is provided around the outer edge of the air outlet nozzles and the flexible bristles. The top of the dust suction groove is connected to the dust suction cylinder module through a plurality of first dust suction pipes. The dust suction cylinder module is connected to the cavity through a second dust suction pipe. The air supply pipe module is provided at the top of the rotating dust removal disc seat and protrudes outside the cavity. A first gear is provided at the outer edge of the dust suction groove. The driving component is used to drive the first gear to rotate. The rotating dust removal disc seat is movably connected to the dust suction cylinder module.

[0007] The dust suction and air supply component is arranged on one side of the box body. The dust suction and air supply component includes a fan and a dust collector. The fan is arranged above the box body, and the dust collector is arranged on one side of the box body. The fan and the dust collector are connected through a first pipeline. The side of the fan facing away from the first pipeline is connected to the air supply pipe module, and the dust collector is connected to the second dust suction pipe.

[0008] The control end is arranged on one side of the box body facing away from the dust collector, and the control end is used to control the feeding mechanism and the dust suction and air supply assembly.

[0009] Beneficial effects of the present utility model:

[0010] 1. By providing a dust removal mechanism, in the dust removal mechanism, the rotating dust removal disc seat rotates to drive a plurality of flexible brush hairs at its bottom to clean the wafer. At the same time, a plurality of air outlet nozzles at the bottom of the rotating dust removal disc seat spray clean and dust-free air to blow the wafer, which can effectively remove the dust on the surface of the wafer. After the dust on the wafer is blown up, it is sucked into the dust suction groove at the bottom of the rotating dust removal disc seat, avoiding the dust from falling on the wafer again, and greatly improving the dust removal effect on the wafer;

[0011] 2. By providing two sets of dust removal components, the feeding mechanism conveys the wafer, so that the wafer will sequentially pass through the bottoms of the two sets of dust removal components. When the wafer stays at the bottoms of the two sets of dust removal components respectively, the two sets of dust removal components respectively clean and remove dust from the wafer, so that the wafer can be cleaned twice, greatly improving the dust removal effect on the wafer, and through the feeding by the feeding mechanism, the dust removal work on the wafer can be continuously carried out.

[0012] Further, the feeding mechanism further includes a first motor and a bracket. The bracket is fixedly arranged on both sides of the box body. The first motor is arranged on one side of the bracket. A plurality of card seats are evenly distributed on the conveyor belt, and the card seats are used for placing the wafers.

[0013] Further, the distance between adjacent card seats is the same as the distance between the two rotating dust removal disc seats.

[0014] Further, a air supply cavity is arranged at the bottom of the rotating dust removal disc seat, and a plurality of air supply holes are arranged at the bottom of the air supply cavity. The air supply holes are communicated with the air outlet nozzles.

[0015] Further, the air supply pipe module includes a first air supply pipe, a rotary joint and a second air supply pipe. The two ends of the rotary joint are respectively connected to the upper end of the first air supply pipe and the lower end of the second air supply pipe. The lower end of the first air supply pipe is connected to the air supply cavity, and the upper end of the second air supply pipe is connected to the fan.

[0016] Further, the dust suction cylinder module includes a first dust suction cylinder and a second dust suction cylinder. The upper end of the first dust suction cylinder is communicated with the lower end of the second dust suction cylinder. The lower end of the first dust suction cylinder and the upper end of the second dust suction cylinder are both closed ends. The first air supply pipe penetrates through the first dust suction cylinder, and the second air supply pipe penetrates through the second dust suction cylinder.

[0017] Further, the second air supply pipe is connected to the fan through a second pipeline, and the second dust suction pipe is connected to the dust collector through a third pipeline.

[0018] Further, the driving assembly includes a base, a second motor, and a second gear. The base is connected to the top of the inner wall of the box body. The second motor is arranged on the base, and the output shaft of the second motor passes through the base and is connected to the second gear. The first gear and the second gear are meshed and connected.

[0019] Further, an observation window is provided below the control end, and the observation window is used to observe the dust removal situation in the cavity.

[0020] Further, the control end is electrically connected to the fan, the dust collector, the first motor, and the second motor. Description of the Drawings

[0021] Figure 1 Front view of the first embodiment of the present invention;

[0022] Figure 2 Rear view of the first embodiment of the present invention;

[0023] Figure 3 Sectional view of the first embodiment of the present invention;

[0024] Figure 4 Top view of the dust removal assembly of the first embodiment of the present invention;

[0025] Figure 5 Bottom view of the dust removal assembly of the first embodiment of the present invention;

[0026] Figure 6 Sectional view of the dust removal assembly of the first embodiment of the present invention;

[0027] Figure 7 Structural schematic diagram of the driving assembly of the first embodiment of the present invention.

[0028] Description of the reference numerals:

[0029] 10. Box; 11. Cavity; 12. Observation window; 20. Feeding mechanism; 21. Conveyor belt; 22. First motor; 23. Clamping seat; 24. Bracket; 30. Dust removal mechanism; 31. Dust removal assembly; 311. Rotary dust removal disc seat; 3111. Air outlet nozzle; 3112. Flexible brush bristles; 3113. Dust suction groove; 3114. Air supply chamber; 31141. Air supply hole; 312. Air supply pipe module; 3121. First air supply pipe; 3122. Rotary joint; 3123. Second air supply pipe; 313. Dust suction cylinder module; 3131. First dust suction cylinder; 3132. Second dust suction cylinder; 314. First dust suction pipe; 315. Second dust suction pipe; 316. First gear; 32. Driving assembly; 321. Base; 322. Second motor; 323. Second gear; 33. Dust suction and air supply assembly; 331. Fan; 332. Dust collector; 333. First pipeline; 334. Second pipeline; 335. Third pipeline; 40. Control terminal. Detailed implementation manners

[0030] To facilitate the understanding of the present invention, the present invention will be described more comprehensively below with reference to the relevant drawings. Embodiments of the present invention are shown in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0031] It should be noted that when an element is referred to as being "fixedly provided on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are only for the purpose of illustration.

[0032] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those skilled in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more of the related listed items. Moreover, the features between the embodiments of the present invention, the features in the embodiments, and the features of the embodiments can be freely combined on the premise of no obvious conflict or contradiction.

[0033] This embodiment provides a wafer dust removal device, as Figures 1 to 3 shown, including a box 10, a feeding mechanism 20, a dust removal mechanism 30 and a control terminal 40.

[0034] Specifically, a cavity 11 runs through the box body 10. The feeding mechanism 20 includes a conveyor belt 21, a first motor 22, and a bracket 24. The conveyor belt 21 passes through the cavity 11. The bracket 24 is fixed on both sides of the box body 10. The first motor 22 is arranged on one side of the bracket 24. A plurality of clamping seats 23 are evenly distributed on the conveyor belt 21. The distance between adjacent clamping seats 23 is the same as the distance between two groups of the rotary dust removal disc seats 311. The clamping seats 23 are used for placing wafers, and the conveyor belt 21 is used for conveying wafers.

[0035] Specifically, as Figures 1 to 7 shown, the dust removal mechanism 30 includes two groups of dust removal components 31, a driving component 32, and a dust suction and air supply component 33. The driving component 32 is arranged between the two groups of dust removal components 31. The two groups of dust removal components 31 and the driving component 32 are located in the cavity 11. The dust removal component 31 includes a rotary dust removal disc seat 311, an air supply pipe module 312, and a dust suction cylinder module 313. A wind supply cavity 3114 is arranged at the bottom of the rotary dust removal disc seat 311. A plurality of air supply holes 31141, a plurality of air outlet nozzles 3111, and a plurality of flexible brush hairs 3112 are arranged at the bottom of the wind supply cavity 3114. The air supply holes 31141 are communicated with the air outlet nozzles 3111. A dust suction groove 3113 is arranged around the outer edge of the air outlet nozzles 3111 and the flexible brush hairs 3112. The top of the dust suction groove 3113 and the first dust suction cylinder 3131 are connected through a plurality of first dust suction pipes 314.

[0036] Specifically, the air supply pipe module 312 includes a first air supply pipe 3121, a rotary joint 3122, and a second air supply pipe 3123. The two ends of the rotary joint 3122 are respectively connected to the upper end of the first air supply pipe 3121 and the lower end of the second air supply pipe 3123. The lower end of the first air supply pipe 3121 is connected to the wind supply cavity 3114. The upper end of the second air supply pipe 3123 is connected to the fan 331. By connecting the first air supply pipe 3121 and the second air supply pipe 3123 through the rotary joint 3122, when the rotary dust removal disc seat 311 rotates, the first air supply pipe 3121 and the second air supply pipe 3123 can maintain communication with the fan 331.

[0037] Specifically, the dust suction cylinder module 313 includes a first dust suction cylinder 3131 and a second dust suction cylinder 3132. The upper end of the first dust suction cylinder 3131 communicates with the lower end of the second dust suction cylinder 3132. The lower end of the first dust suction cylinder 3131 and the upper end of the second dust suction cylinder 3132 are both closed ends. The first air supply pipe 3121 penetrates through the first dust suction cylinder 3131, and the second air supply pipe 3123 penetrates through the second dust suction cylinder 3132. The second dust suction cylinder 3132 is connected to the dust collector 332 through a second dust suction pipe 315. A first gear 316 is provided on the outer edge of the dust suction groove 3113, and the rotary dust removal disc seat 311 is movably connected to the dust suction cylinder module 313.

[0038] Specifically, the dust suction and air supply assembly 33 is provided on one side of the box body 10. The dust suction and air supply assembly 33 includes a fan 331 and a dust collector 332. The fan 331 is provided above the box body 10, and the dust collector 332 is provided on one side of the box body 10. The fan 331 and the dust collector 332 are connected through a first pipeline 333. Two groups of second pipelines 334 are provided on the side of the fan 331 facing away from the first pipeline 333. The second pipelines 334 are connected to the second air supply pipe 3123, and the dust collector 332 is connected to the second dust suction pipe 315 through a third pipeline 335.

[0039] Specifically, the control end 40 is provided on the side of the box body 10 facing away from the dust collector 332. The control end 40 is used to control the first motor 22, the second motor 322, the fan 331, and the dust collector 332. The control end 40 is electrically connected to the first motor 22, the second motor 322, the fan 331, and the dust collector 332.

[0040] Further, the drive assembly 32 includes a base 321, a second motor 322, and a second gear 323. The base 321 is connected to the top of the inner wall of the box body 10. The second motor 322 is provided on the base 321, and the output shaft of the second motor 322 passes through the base 321 and is connected to the second gear 323. The first gear 316 and the second gear 323 are meshed and connected. The drive motor 332 is used to drive the first gear 316 to rotate.

[0041] Further, an observation window 12 is provided below the control end 40. The observation window 12 is used to observe the dust removal situation in the cavity 11.

[0042] The implementation process of the present utility model is as follows:

[0043] First, place the wafer to be dust-removed on the card seat 23. Control the first motor 22 to start through the control terminal 40. The card seat 23 enters the cavity 11 of the box body 10 along the conveyor belt 21, thereby driving the wafer to move into the cavity 11, making the conveyor belt 21 perform intermittent movement to ensure that the card seat 23 can stay under the rotating dust-removing disc seat 311. When the card seat 23 stays under the rotating dust-removing disc seat 311 close to the inlet side of the cavity 11, the conveyor belt 21 stops working. The control terminal 40 controls the second motor 322 and the blower 331 to start, so that the second gear 323 drives the two groups of first gears 316 to rotate, and thus the rotating dust-removing disc seat 311 also rotates simultaneously. The rotation of the rotating dust-removing disc seat 311 drives the flexible brush hairs at its bottom to contact the surface of the wafer, realizing the cleaning and dust-removing of the wafer. At the same time, the blower 331 works to input clean and dust-free air into the two groups of second pipelines 334. The clean and dust-free air enters the two groups of second air supply pipes 3123 respectively, then enters the first air supply pipe 3121 through the rotary joint 3122, then enters the air supply cavity 3114, and finally sprays out through multiple air outlet nozzles 3111 to blow-dust the wafer. The multiple air outlet nozzles 3111 cooperate with the multiple flexible brush hairs 3112 to make the dust-removing effect on the wafer better. The blower 331 works to generate negative pressure in the dust collector 332, so that suction is generated in the suction slots 3113 of the two groups of dust-removing components 31. After the dust on the wafer is blown up, it is sucked into the suction slots 3113, then enters the first suction pipe 314, then enters the first suction cylinder 3131, and then enters the second suction cylinder 3132, and finally is sucked into the dust collector 332 through the third pipeline 335 for collection, avoiding the dust falling on the wafer again and improving the dust-removing effect on the wafer; then, the conveyor belt 21 drives the wafer on the card seat to move. When it reaches the bottom of the dust-removing component 31 on the side far from the inlet of the cavity 11, the dust-removing component 31 performs dust-removing treatment on the wafer again, so that the wafer can be cleaned twice, greatly improving the dust-removing effect on the wafer. During the operation, the dust-removing situation in the cavity 11 can be observed through the observation window 12. After completion, the conveyor belt 21 drives the wafer on the card seat 23 to move out of the cavity 11, and at this time, the dust-cleaned wafer is stored.

[0044] It should be noted that: the distance between adjacent card seats 23 is the same as the distance between the two groups of rotating dust-removing disc seats 311. Therefore, wafers are placed on adjacent card seats 23 respectively, so that the dust-removing operation on the wafers can be carried out efficiently and continuously. In addition, the first air supply pipe 3121 and the second air supply pipe 3123 are independently arranged from the first suction cylinder 3131 and the second suction cylinder 3132. The clean and dust-free air is sprayed out from the multiple air outlet nozzles 3111 at the bottom of the rotating dust-removing disc seat 311, and after the dust on the wafer is blown up, it is sucked into the suction slots 3113 at the outer edge of the bottom of the rotating dust-removing disc seat 311, thus ensuring independent circulation channels for air supply and suction, without interference with each other, and improving the dust-removing effect.

[0045] Advantages of the present utility model:

[0046] 1. By providing a dust removal assembly 31, the rotating dust removal disc base 311 in the dust removal assembly 31 rotates to drive a plurality of flexible bristles 3112 at its bottom to clean the wafer. At the same time, a plurality of air nozzles 3111 at the bottom of the rotating dust removal disc base 311 spray clean and dust-free air to blow the wafer, which can effectively remove the dust on the surface of the wafer. After the dust on the wafer is blown up, it is sucked into the dust suction groove 3113 at the bottom of the rotating dust removal disc base 311, preventing the dust from falling on the wafer again, and greatly improving the dust removal effect on the wafer.

[0047] 2. By providing two sets of dust removal assemblies 31, the conveyor belt 21 conveys the wafer, so that the wafer will pass through the bottom of the two rotating dust removal disc bases 311 in sequence. When the wafer stays at the bottom of the two rotating dust removal disc bases 311 respectively, the plurality of air nozzles 3111 and the plurality of flexible bristles 3112 clean and remove dust from the wafer respectively, enabling the wafer to be cleaned twice, greatly improving the dust removal effect on the wafer, and the wafer can be continuously dusted through the conveyor belt 21 for feeding.

[0048] In the description of this specification, the description of reference terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0049] The above-described embodiments merely represent the implementation manners of the present utility model, and the description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patent of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present utility model, several modifications and improvements can still be made, and these all belong to the protection scope of the present utility model. Therefore, the protection scope of the patent of the present utility model shall be subject to the appended claims.

Claims

1. A wafer dust removal device, characterized in that: It includes a box body, a feeding mechanism, a dust removal mechanism and a control end. A cavity penetrating the box body is opened on the box body. The feeding mechanism includes a conveyor belt which passes through the cavity and is used for conveying wafers. The dust removal mechanism includes two sets of dust removal components, a driving component and a dust suction and air supply component. The driving component is arranged between the two sets of dust removal components. The two sets of dust removal components and the driving component are located in the cavity. The dust removal component includes a rotating dust removal disc seat, an air supply pipe module and a dust suction cylinder module. A plurality of air outlet nozzles and a plurality of flexible brush hairs are arranged at the bottom of the rotating dust removal disc seat. A dust suction groove is arranged around the outer edges of the air outlet nozzles and the flexible brush hairs. The top of the dust suction groove and the dust suction cylinder module are connected by a plurality of first dust suction pipes. The dust suction cylinder module is connected to the cavity through a second dust suction pipe. The air supply pipe module is arranged at the top of the rotating dust removal disc seat and protrudes out of the cavity. A first gear is arranged on the outer edge of the dust suction groove. The driving component is used to drive the first gear to rotate. The rotating dust removal disc seat is movably connected to the dust suction cylinder module. The dust suction and air supply component is arranged on one side of the box body. The dust suction and air supply component includes a fan and a dust collector. The fan is arranged above the box body. The dust collector is arranged on one side of the box body. The fan and the dust collector are connected through a first pipeline. The side of the fan facing away from the first pipeline is connected to the air supply pipe module. The dust collector is connected to the second dust suction pipe. The control end is arranged on the side of the box body facing away from the dust collector and is used to control the feeding mechanism and the dust suction and air supply component.

2. The wafer dust removal device according to claim 1, wherein: The feeding mechanism further includes a first motor and a bracket. The bracket is fixedly arranged on both sides of the box body. The first motor is arranged on one side of the bracket. A plurality of card seats are evenly distributed on the conveyor belt, and the card seats are used for placing wafers.

3. The wafer dust removal device according to claim 2, characterized in that: The distance between adjacent card seats is the same as the distance between the two sets of rotating dust removal disc seats.

4. The wafer dust removal device according to claim 1, characterized in that: A air supply cavity is arranged at the bottom of the rotating dust removal disc seat. A plurality of air supply holes are arranged at the bottom of the air supply cavity, and the air supply holes are communicated with the air outlet nozzles.

5. The wafer dust removal device according to claim 4, characterized in that: The air supply pipe module includes a first air supply pipe, a rotary joint and a second air supply pipe. The two ends of the rotary joint are respectively connected to the upper end of the first air supply pipe and the lower end of the second air supply pipe. The lower end of the first air supply pipe is connected to the air supply cavity. The upper end of the second air supply pipe is connected to the fan.

6. The wafer dust removal device according to claim 5, wherein: The dust suction cylinder module includes a first dust suction cylinder and a second dust suction cylinder. The upper end of the first dust suction cylinder is communicated with the lower end of the second dust suction cylinder. The lower end of the first dust suction cylinder and the upper end of the second dust suction cylinder are both closed ends. The first air supply pipe penetrates through the first dust suction cylinder, and the second air supply pipe penetrates through the second dust suction cylinder.

7. The wafer dust removal device according to claim 2, characterized in that: The driving component includes a base, a second motor and a second gear. The base is connected to the top of the inner wall of the box body. The second motor is arranged on the base, and the output shaft of the second motor passes through the base and is connected to the second gear. The first gear and the second gear are meshed and connected.

8. The wafer dust removal device according to claim 1, characterized in that: An observation window is provided below the control end, and the observation window is used to observe the dust removal situation in the cavity.

9. The wafer dust removal device according to claim 7, wherein: The control end is electrically connected to the fan, the dust collector, the first motor, and the second motor.

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