Electronic device
By setting up an antenna layer and an air channel on the outer surface of the line structure and forming a heat dissipation layer on the air channel, the problem of the inability to discharge heat from the radio frequency chip is solved and the heat dissipation efficiency and operational efficiency of the electronic device are improved.
Patent Information
- Application Number
- CN202422227983.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2024-09-04
- Filing Date
- 2024-09-11
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-09-11
AI Technical Summary
In traditional antenna packaging technology, the RF chip is buried in the line structure, which causes heat to be unable to be discharged in time, resulting in excessive accumulation of temperature and affecting performance.
An antenna layer is provided on the outer surface of the line structure, and an air channel is formed on the second electronic component and/or the third electronic component, combined with the heat dissipation layer to improve the heat dissipation efficiency, and heat is transmitted to the outside world through the air channel.
Effective heat dissipation, avoid excessive temperature, improve the operating efficiency of electronic components, and prevent performance decline.
Smart Images
Figure CN223093117U_ABST
Abstract
Description
Technical Field
[0001] This application relates to an electronic device, especially an electronic device with an antenna layer. Background Art
[0002] Currently, wireless communication has developed rapidly, the network resource traffic has become increasingly large, and the required wireless transmission bandwidth has also become larger; furthermore, as the communication era evolves towards 6G, the transmission speed is dozens of times higher than the previous generation. Therefore, in order to meet the greater bandwidth and frequency authorization limitations, the communication frequency may reach sub-THz (sub-terahertz).
[0003] Traditional antenna-in-package technology (AiP) mainly integrates the radio frequency chip and the antenna structure in a single package. As shown in the electronic device 1, it mainly buries the radio frequency chip 11 in the circuit structure 10, and an antenna layer 12 is provided outside the circuit structure 10. Figure 1 However, since the aforementioned radio frequency chip 11 is buried in the circuit structure 10, if the heat generated during the operation of the radio frequency chip 11 cannot be discharged outwards in time, it will lead to problems such as excessive temperature accumulation, resulting in a decline in the performance of the radio frequency chip 11 or even damage.
[0004]
[0005] Therefore, how to overcome the problems of the above-mentioned prior art has actually become an urgent issue to be solved at present. Utility Model Content
[0006] In view of the above-mentioned deficiencies of the prior art, this application provides an electronic device, including: a circuit structure having a circuit layer and having opposite first and second sides; a first electronic component embedded in the circuit structure; a second electronic component coupled to the second side of the circuit structure, wherein the second electronic component is electrically connected to the first electronic component through the circuit layer and forms a plurality of air channels exposed on the second side of the circuit structure; and an antenna layer provided on the second side of the circuit structure.
[0007] In the aforementioned electronic device, the first electronic component has opposite first and second surfaces, and a plurality of first electrical contacts electrically connected to the circuit layer are respectively provided on the first surface and the second surface.
[0008] In the aforementioned electronic device, the second electronic component has opposite third and fourth surfaces, the third surface is an electrically active surface, faces the first electronic component and is provided with a plurality of second electrical contacts electrically connected to the circuit layer, and the fourth surface is a non-electrically active surface and is exposed on the second side of the circuit structure and forms the plurality of air channels.
[0009] In the aforementioned electronic device, the plurality of air channels are in the form of a plurality of fin-shaped structures with grooves.
[0010] In the foregoing electronic device, a heat dissipation layer is formed on the plurality of air channels.
[0011] In the foregoing electronic device, the heat dissipation layer serves as a shielding layer between the second electronic component and the antenna layer.
[0012] In the foregoing electronic device, a plurality of conductive components are further included and disposed on the first side of the circuit structure.
[0013] In the foregoing electronic device, a third electronic component is further included and coupled to the second side of the circuit structure.
[0014] In the foregoing electronic device, the third electronic component has opposite fifth and sixth surfaces. The fifth surface faces the first electronic component and is provided with a plurality of third electrical contacts electrically connected to the circuit layer. The sixth surface is exposed on the second side of the circuit structure and is formed with a plurality of air channels.
[0015] In the foregoing electronic device, the depth of the air channels of the third electronic component can be selected to be greater than, less than, or equal to the depth of the air channels of the second electronic component.
[0016] In the foregoing electronic device, a heat dissipation layer is formed on the plurality of air channels of the third electronic component.
[0017] In the foregoing electronic device, the heat dissipation layer serves as a shielding layer between the third electronic component and the antenna layer.
[0018] As can be seen from the above, the electronic device of the present application mainly improves the operation efficiency by disposing the antenna layer, the second electronic component, and / or the third electronic component on the outer surface of the circuit structure and on the same side, and vertically connecting them to the first electronic component embedded in the circuit structure below. At the same time, the first electronic component can transfer heat upward to the second electronic component and / or the third electronic component above. Moreover, the second electronic component and / or the third electronic component are formed with air channels (deep grooves), and a heat dissipation layer is formed on the air channels to achieve a heat conduction effect. Description of the Drawings
[0019] Figure 1 It is a schematic cross-sectional view of an existing electronic device having an antenna layer.
[0020] Figure 2 It is a schematic cross-sectional view of the electronic device of the present application.
[0021] Description of the Main Component Symbols
[0022] 1 Electronic device
[0023] 10 Circuit structure
[0024] 11 RF chip
[0025] 12 antenna layer
[0026] 2 electronic device
[0027] 20 circuit structure
[0028] 20a first side
[0029] 20b second side
[0030] 200 insulating layer
[0031] 201 circuit layer
[0032] 21 first electronic component
[0033] 21a first surface
[0034] 21b second surface
[0035] 210 first electrical contact
[0036] 22 second electronic component
[0037] 22a third surface
[0038] 22b fourth surface
[0039] 220 second electrical contact
[0040] 221, 231 air channels
[0041] 222, 232 heat dissipation layers
[0042] 23 third electronic component
[0043] 23a fifth surface
[0044] 23b sixth surface
[0045] 230 third electrical contact
[0046] 24 antenna layer
[0047] 25 conductive element
[0048] h1, h2 depths Detailed implementation manners
[0049] The following describes the implementation manners of the present application through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present application from the content disclosed in this specification.
[0050] It should be noted that the structures, proportions, sizes, etc. shown in the attached drawings of this specification are only used to cooperate with the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the implementation conditions of this application. Therefore, they do not have any technical essence. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects that this application can produce and the purposes that can be achieved, should still fall within the scope that can be covered by the technical content disclosed in this application. At the same time, the terms such as "upper", "first", "second", and "one" cited in this specification are only for the convenience of clear description, and are not used to limit the implementation scope of this application. The change or adjustment of their relative relationships, without substantial change in the technical content, should also be regarded as the scope that this application can implement.
[0051] Please refer to Figure 2 , which is a schematic cross-sectional view of the electronic device 2 of this application. The electronic device 2 includes a circuit structure 20, a first electronic component 21 embedded in the circuit structure 20, a second electronic component 22 coupled to the circuit structure 20, and an antenna layer 24 disposed on the circuit structure 20.
[0052] The circuit structure 20 has opposite first and second sides 20a and 20b, and includes an insulating layer 200 and a circuit layer 201 coupled to the insulating layer 200, such as a redistribution layer (RDL).
[0053] In this embodiment, the material for forming the circuit layer 201 is, for example, copper, and the materials for forming the insulating layer 200 are dielectric materials such as polybenzoxazole (PBO), polyimide (PI), prepreg (PP), etc.
[0054] The first electronic component 21 is, for example, a first radio frequency chip, which is embedded in the circuit structure 20 and has opposite first and second surfaces 21a and 21b. Among them, a plurality of first electrical contacts 210 are respectively provided on the first surface 21a and the second surface 21b for electrical connection to the circuit layer 201.
[0055] The second electronic component 22 is, for example, a second radio frequency chip, which is coupled to the second side 20b of the circuit structure 20 and has opposite third and fourth surfaces 22a and 22b. Among them, the third surface 22a is an electrical action surface and faces the first electronic component 21 (the second surface 21b) and is provided with a plurality of second electrical contacts 220 for electrical connection to the circuit layer 201.
[0056] The first electronic component 21 can be electrically connected to the second electrical contact 220 on the third surface 22a of the second electronic component 22 through the first electrical contact 210 on its second surface 21b and the circuit layer 201, so that the first electronic component 21 and the second electronic component 22 are electrically coupled to each other.
[0057] In addition, the fourth surface 22b of the second electronic component 22 is exposed on the second side 20b of the circuit structure 20, and the fourth surface 22b is a non-electrical working surface and is formed with a plurality of air channels 221, for example, in a fin shape with a plurality of grooves formed by etching. Accordingly, the first electronic component 21 embedded in the circuit structure 20 can transfer the heat generated during operation to the second electronic component 22 exposed outside the circuit structure 20 through the circuit layer 201, and dissipate it to the outside through the plurality of air channels 221, so as to improve the heat dissipation efficiency and prevent the first electronic component 21 and the second electronic component 22 from accumulating too high a temperature and causing a decrease in performance.
[0058] The antenna layer 24 is disposed on the second side 20b of the circuit structure 20. The antenna layer 24 can be made into a patterned antenna layer with a thin thickness by sputtering, vaporing, electroplating, electroless plating, chemical plating, foiling or other methods. Alternatively, the antenna layer 24 can adopt a patch structure.
[0059] A heat dissipation layer 222 can be formed on the plurality of air channels 221 on the fourth surface 22b of the second electronic component 22. The heat dissipation layer 222 is, for example, a metal layer formed by coating / sputtering to improve the heat conduction efficiency of the plurality of air channels 221. In an embodiment of the present application, the heat dissipation layer 222 (metal layer) can be used as a shielding layer between the second electronic component 22 and the antenna layer 24 to avoid mutual interference between the antenna layer 24 and the second electronic component 22.
[0060] In addition, in an embodiment, a third electronic component 23 can also be combined on the second side 20b of the circuit structure 20, so that the second electronic component 22, the antenna layer 24 and the third electronic component 23 are spaced apart from each other and disposed on the second side 20b of the circuit structure 20.
[0061] The third electronic component 23 is, for example, a third radio frequency chip, which has opposite fifth surface 23a and sixth surface 23b. Among them, the fifth surface 23a faces the first electronic component 21 (second surface 21b) and is provided with a plurality of third electrical contacts 230 for electrically connecting to the circuit layer 201. The sixth surface 23b of the third electronic component 23 is exposed on the second side 20b of the circuit structure 20, and the sixth surface 23b is a non-electrically acting surface and is formed with a plurality of air channels 231 (for example, fin-shaped). Accordingly, the first electronic component 21 embedded in the circuit structure 20 can transfer the heat generated during operation to the second electronic component 22 and the third electronic component 23 exposed outside the circuit structure 20 through the circuit layer 201, and dissipate to the outside through the plurality of air channels 221 of the second electronic component 22 and the plurality of air channels 231 of the third electronic component 23, so as to improve the heat dissipation efficiency and avoid the reduction of performance caused by excessive accumulated temperature.
[0062] A heat dissipation layer 232 can also be formed on the plurality of air channels 231 of the third electronic component 23 to improve the heat conduction efficiency of the plurality of air channels 231. In an embodiment of the present application, the heat dissipation layer 232 (metal layer) can be used as a shielding layer between the third electronic component 23 and the antenna layer 24, which can avoid mutual interference between the antenna layer 24 and the third electronic component 23.
[0063] The depth h2 of the air channels 231 of the third electronic component 23 can be selected to be greater than, less than or equal to the depth h1 of the air channels 221 of the second electronic component 22. The main point is that the greater the computing power of the electronic component, the deeper the air channels.
[0064] In addition, the electronic device 2 can further include a plurality of conductive elements 25 provided on the first side 20a of the circuit structure 20. The plurality of conductive elements 25 are, for example, spherical like solder balls, or columnar like copper pillars, solder bumps and other metal materials, or stud conductors made by wire bonding machines, but not limited thereto, so that the subsequent electronic device 2 can be placed on an external device (such as a circuit board) through the plurality of conductive elements 25.
[0065] In summary, the electronic device disclosed in the present application mainly improves the operation efficiency by arranging the antenna layer, the second electronic component and / or the third electronic component on the outer surface of the circuit structure and on the same side, and vertically connecting them to the first electronic component embedded in the circuit structure below. At the same time, the first electronic component can transfer heat upward to the second electronic component and / or the third electronic component above, and the second electronic component and / or the third electronic component are formed with air channels (deep grooves), and a heat dissipation layer is formed on the air channels to achieve a heat conduction effect.
[0066] The above embodiments are only used to exemplarily illustrate the principles and effects of the present application, rather than to limit the present application. Those skilled in the art can modify the above embodiments without departing from the spirit and scope of the present application. Therefore, the scope of the rights protected by the present application should be as listed in the claims.
Claims
1. An electronic device, characterized in that, Comprising: A circuit structure having a circuit layer and opposite first and second sides; A first electronic component embedded in the circuit structure; A second electronic component coupled to the second side of the circuit structure, wherein the second electronic component is electrically connected to the first electronic component through the circuit layer and has a plurality of air channels exposed on the second side of the circuit structure; And An antenna layer disposed on the second side of the circuit structure.
2. The electronic device according to claim 1, wherein The first electronic component has opposite first and second surfaces, and a plurality of first electrical contacts electrically connected to the circuit layer are respectively provided on the first and second surfaces.
3. The electronic device according to claim 1, characterized in that The second electronic component has opposite third and fourth surfaces, the third surface being an electrically active surface facing the first electronic component and having a plurality of second electrical contacts electrically connected to the circuit layer, and the fourth surface being a non-electrically active surface exposed on the second side of the circuit structure and having the plurality of air channels formed thereon.
4. The electronic device according to claim 1, wherein The plurality of air channels are fin-shaped with grooves.
5. The electronic device according to claim 1, wherein A heat dissipation layer is formed on the plurality of air channels.
6. The electronic device according to claim 5, wherein The heat dissipation layer serves as a shielding layer between the second electronic component and the antenna layer.
7. The electronic device according to claim 1, wherein The electronic device further includes a plurality of conductive components disposed on the first side of the circuit structure.
8. The electronic device according to claim 1, wherein, The electronic device further includes a third electronic component coupled to the second side of the circuit structure.
9. The electronic device according to claim 8, wherein The third electronic component has opposite fifth and sixth surfaces, the fifth surface facing the first electronic component and having a plurality of third electrical contacts electrically connected to the circuit layer, and the sixth surface being exposed on the second side of the circuit structure and having a plurality of air channels formed thereon.
10. The electronic device according to claim 9, wherein The depth of the air channels of the third electronic component can be selected to be greater than, less than, or equal to the depth of the air channels of the second electronic component.
11. The electronic device according to claim 9, wherein, A heat dissipation layer is formed on the plurality of air channels of the third electronic component.
12. The electronic device according to claim 11, wherein The heat dissipation layer serves as a shielding layer between the third electronic component and the antenna layer.