Silicon nitride high-temperature ceramic heating plate
By designing a detachable structure of silicon nitride high-temperature ceramic heating plate, the maintenance difficulties in the event of heating resistance wire failure are solved, and the rapid repair and cost reduction of the heating plate are achieved.
Patent Information
- Application Number
- CN202422338944.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-25
- Publication Date
- 2025-07-11
- Estimated Expiration
- 2034-09-25
AI Technical Summary
When the heating resistor wire fails, the existing silicon nitride high-temperature ceramic heating plates are difficult to repair and need to be replaced as a whole, which increases the maintenance cost.
A silicon nitride high-temperature ceramic heating plate with a detachable structure is designed, and the removable connection between the U-shaped heating tube and the ceramic thermal conductor plate is achieved through components such as locking bolts and adaptor plates, allowing the heating tube and thermal conductor plate to be replaced separately.
It realizes rapid repair of heating plates, reduces maintenance costs, and avoids the need for overall replacement.
Smart Images

Figure CN223093899U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of heating plates, in particular to a silicon nitride high-temperature ceramic heating plate. Background Art
[0002] The silicon nitride high-temperature ceramic heating plate is a special heating element made of an advanced ceramic material - silicon nitride (Si3N4) as the substrate and embedded with heating resistance wires inside. Silicon nitride is famous for its excellent high-temperature resistance, good thermal stability, excellent mechanical strength and chemical stability, and can maintain stable physical and chemical properties in extremely high-temperature environments. It is an ideal material for manufacturing high-temperature heating equipment.
[0003] Although the silicon nitride high-temperature ceramic heating plate has many advantages, there are also certain maintenance problems in practical applications. Since the heating resistance wires are cast inside the ceramic plate, this integrated design improves the heating efficiency and stability, but also makes it particularly difficult to repair when there are faults in the heating resistance wires or inside the ceramic plate. Specifically, when problems such as open circuit, short circuit or aging occur in the heating resistance wires, since they are buried deep inside the ceramic plate, they cannot be directly replaced or repaired, and usually the entire heating plate needs to be replaced, which greatly increases the maintenance cost. Summary of the Utility Model
[0004] The purpose of the utility model aims to solve at least one of the above technical defects.
[0005] For this reason, an object of the utility model is to provide a silicon nitride high-temperature ceramic heating plate to solve the problems mentioned in the background art and overcome the deficiencies existing in the prior art.
[0006] To achieve the above object, an embodiment of one aspect of the utility model provides a silicon nitride high-temperature ceramic heating plate, including a bottom frame. An assembly groove is provided on the side surface of the bottom frame. A transfer plate is slidably connected to the inner wall of the assembly groove. The transfer plate is slidably connected to the bottom frame through bolts. A U-shaped heating tube is fixedly connected to the inner side of the transfer plate. The U-shaped heating tube is located inside the bottom frame. A U-shaped cushion plate is fixedly connected to the inner wall of the bottom frame. The top surface of the U-shaped cushion plate is attached to the outer surface of the U-shaped heating tube. A ceramic heat conduction plate is slidably connected to the inner wall of the bottom frame. A U-shaped embedding groove is provided on the bottom surface of the ceramic heat conduction plate. The U-shaped heating tube is slidably connected to the ceramic heat conduction plate through the U-shaped embedding groove. Grooves are provided on the front and back surfaces of the bottom frame. A locking plate is slidably connected to the inner wall of each groove. Pressing plates are fixedly connected to the top surfaces of the two locking plates. The bottom surface of the pressing plate is attached to the top surface of the ceramic heat conduction plate. A number of locking bolts are rotatably connected to one side of the locking plate. The screw parts of the number of locking bolts are threadedly connected to the bottom frame.
[0007] Preferably, according to any of the above solutions, a plurality of ceramic strips are fixedly connected to the top surface of the ceramic heat conducting plate, and the plurality of ceramic strips are linearly arrayed on the top surface of the ceramic heat conducting plate.
[0008] Preferably, according to any of the above solutions, two conducting wires are fixedly connected to the outer side of the adapter plate. The two conducting wires are electrically connected to the U-shaped heating pipe through the adapter plate. The top surfaces of the bottom frame, the adapter plate, and the ceramic heat conducting plate are on the same horizontal plane.
[0009] Preferably, according to any of the above solutions, a splicing pin is fixedly connected to the bottom surface of the adapter plate, a splicing hole is formed in one side of the bottom frame, and the splicing pin is slidably connected to the bottom frame through the splicing hole.
[0010] Preferably, according to any of the above solutions, a plurality of threaded sleeves are embedded and installed on the inner wall of the groove, and the screw parts of the plurality of locking bolts are fixedly connected to the bottom frame through the threaded sleeves.
[0011] Preferably, according to any of the above solutions, the U-shaped backing plate is slidably connected to the ceramic heat conducting plate through a U-shaped embedding groove. An arc-shaped groove is formed in the top surface of the U-shaped backing plate, and the U-shaped heating pipe is slidably connected to the U-shaped backing plate through the arc-shaped groove.
[0012] Preferably, according to any of the above solutions, a clamping plate is fixedly connected to the bottom surface of the ceramic heat conducting plate, a clamping groove is formed in the inner wall of the bottom frame, and the clamping plate is slidably connected to the bottom frame through the clamping groove.
[0013] Preferably, according to any of the above solutions, limiting baffles are fixedly connected to both sides of the U-shaped backing plate. A limiting groove is formed in the bottom surface of the ceramic heat conducting plate. The U-shaped heating pipe is slidably connected to the limiting baffle, and the limiting baffle is slidably connected to the ceramic heat conducting plate through the limiting groove.
[0014] Compared with the prior art, the advantages and beneficial effects of the present utility model are as follows:
[0015] 1. When maintenance work on the ceramic heating plate needs to be carried out, first, it is necessary to twist a plurality of locking bolts to make them move out of the threaded sleeves, which can release the locking of the locking plate. Subsequently, the locking plate is pulled out from the inside of the groove. At this time, the pressing plate will move away from the ceramic heat conducting plate, which can release the locking of the ceramic heat conducting plate. Then, the ceramic heat conducting plate is pulled out from the inside of the bottom frame, so that the U-shaped heating pipe can be exposed. At this time, the adapter plate is removed from the bottom frame, and the U-shaped heating pipe and the ceramic heat conducting plate can be quickly disassembled, which is convenient for separately replacing the U-shaped heating pipe and the ceramic heat conducting plate. It is not necessary to replace the entire heating plate, which can reduce the maintenance cost of the heating plate.
[0016] 2. After replacing the U-shaped heating tube, the new U-shaped heating tube can be placed on the U-shaped backing plate. At this time, the limit baffle can block the U-shaped heating tube to prevent it from shifting on the U-shaped backing plate. Then, the ceramic heat-conducting plate is inserted into the bottom frame. At this time, the U-shaped heating tube will be embedded into the U-shaped embedding groove. Finally, the two locking plates are locked in the groove through the locking bolts, and the ceramic heat-conducting plate can be assembled with the bottom frame, realizing the rapid assembly of the heating plate. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 is a schematic structural diagram of the assembly of the present utility model;
[0018] Figure 2 is a schematic cross-sectional structural diagram of the assembly of the present utility model;
[0019] Figure 3 is a schematic structural diagram of the bottom frame of the present utility model;
[0020] Figure 4 is a schematic structural diagram of the ceramic heat-conducting plate of the present utility model;
[0021] Figure 5 is a schematic structural diagram of the U-shaped heating tube of the present utility model.
[0022] In the figure: 1-bottom frame, 2-assembly groove, 3-transition plate, 4-U-shaped heating tube, 5-U-shaped backing plate, 6-ceramic heat-conducting plate, 7-U-shaped embedding groove, 8-groove, 9-locking plate, 10-pressure plate, 11-ceramic strip, 12-conductive wire, 13-splicing pin, 14-splicing hole, 15-threaded sleeve, 16-locking bolt, 17-arc groove, 18-card plate, 19-limit baffle, 20-limit groove, 21-card slot. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0023] The present utility model will be further described below with reference to the accompanying drawings, but the protection scope of the present utility model is not limited to the following.
[0024] As Figures 1 to 5As shown in the figure, a silicon nitride high-temperature ceramic heating plate includes a bottom frame 1. An assembly groove 2 is formed on the side surface of the bottom frame 1. A transfer plate 3 is slidably connected to the inner wall of the assembly groove 2. The transfer plate 3 is slidably connected to the bottom frame 1 by bolts. A U-shaped heating tube 4 is fixedly connected to the inner side of the transfer plate 3. The U-shaped heating tube 4 is located inside the bottom frame 1. A U-shaped backing plate 5 is fixedly connected to the inner wall of the bottom frame 1. The top surface of the U-shaped backing plate 5 is in contact with the outer surface of the U-shaped heating tube 4. A ceramic heat-conducting plate 6 is slidably connected to the inner wall of the bottom frame 1. A U-shaped embedding groove 7 is formed on the bottom surface of the ceramic heat-conducting plate 6. The U-shaped heating tube 4 is slidably connected to the ceramic heat-conducting plate 6 through the U-shaped embedding groove 7. Grooves 8 are formed on both the front and back surfaces of the bottom frame 1. A locking plate 9 is slidably connected to the inner wall of each groove 8. A pressing plate 10 is fixedly connected to the top surface of each of the two locking plates 9. The bottom surface of the pressing plate 10 is in contact with the top surface of the ceramic heat-conducting plate 6. A number of locking bolts 16 are rotatably connected to one side of the locking plate 9. The screw parts of the number of locking bolts 16 are threadedly connected to the bottom frame 1.
[0025] As an alternative technical solution of the present utility model, a number of ceramic strips 11 are fixedly connected to the top surface of the ceramic heat-conducting plate 6. The number of ceramic strips 11 are linearly arrayed on the top surface of the ceramic heat-conducting plate 6. The arrangement of the ceramic strips 11 can prevent articles from sliding on the ceramic heat-conducting plate 6.
[0026] As an alternative technical solution of the present utility model, two conducting wires 12 are fixedly connected to the outer side of the transfer plate 3. The two conducting wires 12 are electrically connected to the U-shaped heating tube 4 through the transfer plate 3. The top surfaces of the bottom frame 1, the transfer plate 3 and the ceramic heat-conducting plate 6 are on the same horizontal plane. The arrangement of the transfer plate 3 facilitates the disassembly and assembly of the U-shaped heating tube 4.
[0027] As an alternative technical solution of the present utility model, a splicing pin 13 is fixedly connected to the bottom surface of the transfer plate 3. A splicing hole 14 is formed on one side of the bottom frame 1. The splicing pin 13 is slidably connected to the bottom frame 1 through the splicing hole 14. The transfer plate 3 is clamped to the bottom frame 1 through the splicing pin 13, which can make the connection between the transfer plate 3 and the bottom frame 1 more stable.
[0028] As an alternative technical solution of the present utility model, a number of threaded sleeves 15 are embedded and installed on the inner wall of the groove 8. The screw parts of the number of locking bolts 16 are fixedly connected to the bottom frame 1 through the threaded sleeves 15. The arrangement of the threaded sleeves 15 can make the screwing connection between the locking bolts 16 and the bottom frame 1 more stable.
[0029] As an alternative technical solution of the present utility model, the U-shaped backing plate 5 is slidably connected to the ceramic heat-conducting plate 6 through the U-shaped embedding groove 7. An arc-shaped groove 17 is formed on the top surface of the U-shaped backing plate 5. The U-shaped heating tube 4 is slidably connected to the U-shaped backing plate 5 through the arc-shaped groove 17. The arrangement of the U-shaped backing plate 5 can support the U-shaped heating tube 4 and ensure that the U-shaped heating tube 4 is closely attached to the ceramic heat-conducting plate 6.
[0030] As an alternative technical solution of the present utility model, a clamping plate 18 is fixedly connected to the bottom surface of the ceramic heat conduction plate 6, and a clamping groove 21 is formed in the inner wall of the bottom frame 1. The clamping plate 18 is slidably connected to the bottom frame 1 through the clamping groove 21.
[0031] As an alternative technical solution of the present utility model, limiting baffles 19 are fixedly connected to both sides of the U-shaped cushion plate 5. A limiting groove 20 is formed in the bottom surface of the ceramic heat conduction plate 6. The U-shaped heating tube 4 is slidably connected to the limiting baffle 19. The limiting baffle 19 is slidably connected to the ceramic heat conduction plate 6 through the limiting groove 20. The limiting baffle 19 can block the U-shaped heating tube 4 and can cause the U-shaped heating tube 4 to deviate from the U-shaped cushion plate 5.
[0032] A silicon nitride high-temperature ceramic heating plate has the following working principle:
[0033] 1): When maintenance operations on the ceramic heating plate are required, first, twist a plurality of locking bolts 16 to move them out of the threaded sleeve 15, which can release the locking of the locking plate 9. Subsequently, pull out the locking plate 9 from the inside of the groove 8. At this time, the pressing plate 19 will move away from the ceramic heat conduction plate 6, which can release the locking of the ceramic heat conduction plate 6. Subsequently, pull out the ceramic heat conduction plate 6 from the inside of the bottom frame 1.
[0034] 2): Remove the adapter plate 3 from the bottom frame 1, and the U-shaped heating tube 4 and the ceramic heat conduction plate 6 can be quickly disassembled, which facilitates the separate replacement of the U-shaped heating tube 4 and the ceramic heat conduction plate 6.
[0035] 3): Insert the ceramic heat conduction plate 6 into the inside of the bottom frame 1. At this time, the U-shaped heating tube 4 will be embedded into the U-shaped embedding groove 7. Finally, lock the two locking plates 9 in the groove 8 through the locking bolts 16 to assemble the ceramic heat conduction plate 6 and the bottom frame 1.
[0036] In summary, for the silicon nitride high-temperature ceramic heating plate, when maintenance work on the ceramic heating plate is required, first, multiple locking bolts 16 need to be turned to move them out of the threaded sleeve 15, which can release the locking of the locking plate 9. Subsequently, the locking plate 9 is pulled out from the inside of the groove 8. At this time, the pressing plate 19 will move away from the ceramic heat conduction plate 6, and the locking of the ceramic heat conduction plate 6 can be released. Then, the ceramic heat conduction plate 6 is pulled out from the bottom frame 1, and the U-shaped heating tube 4 can be exposed. At this time, the adapter plate 3 is removed from the bottom frame 1, and the U-shaped heating tube 4 and the ceramic heat conduction plate 6 can be quickly disassembled, which is convenient for separately replacing the U-shaped heating tube 4 and the ceramic heat conduction plate 6. There is no need to replace the entire heating plate, which can reduce the maintenance cost of the heating plate. After replacing the U-shaped heating tube 4, a new U-shaped heating tube 4 can be placed on the U-shaped backing plate 5. At this time, the limit baffle 19 can block the U-shaped heating tube 4 to prevent the U-shaped heating tube 4 from shifting from the U-shaped backing plate 5. Then, the ceramic heat conduction plate 6 is inserted into the bottom frame 1. At this time, the U-shaped heating tube 4 will be embedded into the U-shaped embedding groove 7. Finally, the two locking plates 9 are locked in the groove 8 through the locking bolts 16, and the ceramic heat conduction plate 6 and the bottom frame 1 can be assembled, realizing the rapid assembly of the heating plate.
Claims
1. A silicon nitride high-temperature ceramic heating plate, characterized in that: It includes a bottom frame (1), an assembly groove (2) is formed on the side surface of the bottom frame (1), a transfer plate (3) is slidably connected to the inner wall of the assembly groove (2), the transfer plate (3) is slidably connected to the bottom frame (1) by bolts, a U-shaped heating pipe (4) is fixedly connected to the inner side of the transfer plate (3), the U-shaped heating pipe (4) is located inside the bottom frame (1), a U-shaped backing plate (5) is fixedly connected to the inner wall of the bottom frame (1), the top surface of the U-shaped backing plate (5) is in contact with the outer surface of the U-shaped heating pipe (4), a ceramic heat conducting plate (6) is slidably connected to the inner wall of the bottom frame (1), a U-shaped embedding groove (7) is formed on the bottom surface of the ceramic heat conducting plate (6), the U-shaped heating pipe (4) is slidably connected to the ceramic heat conducting plate (6) through the U-shaped embedding groove (7), grooves (8) are formed on both the front and back surfaces of the bottom frame (1), a locking plate (9) is slidably connected to the inner wall of each groove (8), pressing plates (10) are fixedly connected to the top surfaces of the two locking plates (9), the bottom surface of the pressing plate (10) is in contact with the top surface of the ceramic heat conducting plate (6), a number of locking bolts (16) are rotatably connected to one side of the locking plate (9), and the screw parts of the number of locking bolts (16) are threadedly connected to the bottom frame (1).
2. The silicon nitride high-temperature ceramic heating plate according to claim 1, wherein: A number of ceramic strips (11) are fixedly connected to the top surface of the ceramic heat conducting plate (6), and the number of ceramic strips (11) are linearly arrayed on the top surface of the ceramic heat conducting plate (6).
3. The silicon nitride high-temperature ceramic heating plate according to claim 2, characterized in that: Two conducting wires (12) are fixedly connected to the outer side of the transfer plate (3), the two conducting wires (12) are electrically connected to the U-shaped heating pipe (4) through the transfer plate (3), and the top surfaces of the bottom frame (1), the transfer plate (3) and the ceramic heat conducting plate (6) are on the same horizontal plane.
4. The silicon nitride high-temperature ceramic heating plate according to claim 3, characterized in that: A splicing pin (13) is fixedly connected to the bottom surface of the transfer plate (3), a splicing hole (14) is formed on one side of the bottom frame (1), and the splicing pin (13) is slidably connected to the bottom frame (1) through the splicing hole (14).
5. The silicon nitride high-temperature ceramic heating plate according to claim 4, wherein: A number of threaded sleeves (15) are embedded and installed on the inner wall of the groove (8), and the screw parts of the number of locking bolts (16) are fixedly connected to the bottom frame (1) through the threaded sleeves (15).
6. The silicon nitride high-temperature ceramic heating plate according to claim 5, wherein: The U-shaped backing plate (5) is slidably connected to the ceramic heat conducting plate (6) through the U-shaped embedding groove (7), an arc-shaped groove (17) is formed on the top surface of the U-shaped backing plate (5), and the U-shaped heating pipe (4) is slidably connected to the U-shaped backing plate (5) through the arc-shaped groove (17).
7. The silicon nitride high-temperature ceramic heating plate according to claim 6, characterized in that: A clamping plate (18) is fixedly connected to the bottom surface of the ceramic heat conducting plate (6), a clamping groove (21) is formed on the inner wall of the bottom frame (1), and the clamping plate (18) is slidably connected to the bottom frame (1) through the clamping groove (21).
8. The silicon nitride high-temperature ceramic heating plate according to claim 7, wherein: Limiting baffles (19) are fixedly connected to both sides of the U-shaped backing plate (5), a limiting groove (20) is formed on the bottom surface of the ceramic heat conducting plate (6), the U-shaped heating pipe (4) is slidably connected to the limiting baffle (19), and the limiting baffle (19) is slidably connected to the ceramic heat conducting plate (6) through the limiting groove (20).