Heat dissipation substrate

Abstract

The utility model discloses a heat dissipation substrate. In some embodiments, the heat dissipation substrate comprises a metal plate, an insulating bonding sheet and a copper foil layer which are stacked, and the inner side surface of the metal plate is bonded and connected with the copper foil layer through the insulating bonding sheet; wherein the metal plate comprises an aluminum plate and a copper-clad layer, and the copper-clad layer is at least arranged on the inner side surface of the metal plate; and the heat conduction copper column is arranged to penetrate through the insulating bonding sheet and the copper foil layer so as to be connected with the copper foil layer and the copper-clad layer on the inner side surface of the metal plate, and the heat conduction copper column and the copper foil layer are arranged to have surfaces flush with each other. The heat dissipation substrate has the advantages of being good in heat dissipation effect and low in cost.

Description

Technical Field

[0001] The utility model relates to a heat dissipation substrate for electronic components. Background Art

[0002] A typical structure of a metal heat dissipation substrate is to provide an insulating layer and a conductive layer on a metal plate, and provide heat conduction bosses / heat conduction columns penetrating the insulating layer on the metal plate to form a heat conduction channel in the insulating layer. When the electronic components on the heat dissipation substrate work, the heat generated can be quickly conducted to the metal plate through the connected heat conduction bosses / heat conduction columns to achieve rapid heat dissipation.

[0003] In the prior art, the metal plate used for the metal heat dissipation substrate is usually an aluminum plate or a copper plate, and the heat conduction bosses / heat conduction columns with an integrally formed structure are provided on the aluminum plate or the copper plate. The metal heat dissipation substrate using a copper plate has the advantages of better heat conduction performance and being convenient for etching to make heat conduction copper bosses / heat conduction copper columns, but has the disadvantage of relatively high material cost. Although the metal heat dissipation substrate using an aluminum plate has relatively low material cost, the etching technology of the heat conduction aluminum bosses / heat conduction aluminum columns is not mature and the process control cost is high, while the mechanical processing of the heat conduction aluminum bosses / heat conduction aluminum columns has the problem of very low efficiency. Summary of the Utility Model

[0004] Aiming at the deficiencies of the prior art, the main purpose of the utility model is to provide a heat dissipation substrate with good heat dissipation effect and low cost.

[0005] In order to achieve the above main purpose, the first aspect of the utility model discloses a heat dissipation substrate, including a metal plate, an insulating adhesive sheet and a copper foil layer which are stacked, and the inner surface of the metal plate and the copper foil layer are adhesively connected through the insulating adhesive sheet; wherein:

[0006] The metal plate includes an aluminum plate and a copper-clad layer, and the copper-clad layer is at least provided on the inner surface of the metal plate;

[0007] Heat conduction copper columns, which are arranged to penetrate the insulating adhesive sheet and the copper foil layer to be connected with the copper foil layer and the copper-clad layer on the inner surface of the metal plate, and are arranged to have a surface flush with the copper foil layer.

[0008] Further, the copper foil layer is provided with conductive circuits and at least one heat conduction pad, and each heat conduction pad is connected with a plurality of the heat conduction copper columns.

[0009] Further, the outer surface of the metal plate is also provided with the copper-clad layer.

[0010] According to a specific embodiment of the first aspect of the utility model, the thickness of the copper-clad layer is 10μm - 50μm.

[0011] According to a specific embodiment of the first aspect of the present utility model, a zinc connection layer is provided between the copper-clad layer and the aluminum plate.

[0012] To achieve the above main purpose, a second aspect of the present utility model discloses a heat dissipation substrate, which includes a metal plate, an insulating adhesive sheet, and a circuit board stacked. The inner surface of the metal plate is adhesively connected to the circuit board through the insulating adhesive sheet. The circuit board includes an insulating core board and a copper foil layer provided on the outer surface of the insulating core board. Among them:

[0013] The metal plate includes an aluminum plate and a copper-clad layer, and the copper-clad layer is provided at least on the inner surface of the metal plate.

[0014] A thermally conductive copper boss, which is provided to penetrate the insulating adhesive sheet and the circuit board to be connected to the copper foil layer and the copper-clad layer on the inner surface of the metal plate, and is provided to have a surface flush with the copper foil layer.

[0015] Further, the copper foil layer is provided with an outer conductive circuit and at least one thermally conductive pad, and each thermally conductive pad is connected to one or more of the thermally conductive copper bosses.

[0016] Further, the circuit board further includes an inner conductive circuit provided on the inner surface of the insulating core board.

[0017] According to a specific embodiment of the second aspect of the present utility model, the thickness of the copper-clad layer is 10 μm to 50 μm.

[0018] According to a specific embodiment of the second aspect of the present utility model, a zinc connection layer is provided between the copper-clad layer and the aluminum plate.

[0019] The technical solution of the present utility model has the following beneficial effects:

[0020] In the heat dissipation substrate of the present utility model, the metal plate includes an aluminum plate and a copper-clad layer provided at least on its inner surface. The composite metal plate structure of the aluminum plate and the copper-clad layer can reduce the material cost of the heat dissipation substrate. Further, the thermally conductive copper column / boss is connected to the copper-clad layer on the inner surface of the metal plate. On the one hand, it ensures the connection reliability between the thermally conductive copper column / boss and the metal plate, which is beneficial to reducing the thermal resistance at the connection interface between the two. On the other hand, the copper column / boss with high thermal conductivity can achieve rapid heat conduction from the electronic component to the metal plate. Thus, the heat dissipation substrate of the present utility model can achieve good heat dissipation performance while reducing the manufacturing cost.

[0021] To more clearly illustrate the purpose, technical solution, and advantages of the present utility model, the present utility model will be further described in detail below with reference to the drawings and specific embodiments. Description of the Drawings

[0022] Figure 1 is a schematic structural diagram of the heat dissipation substrate in Embodiment 1;

[0023] Figure 2 is a schematic structural diagram of the heat dissipation substrate in Embodiment 2. Detailed implementation manners

[0024] In the following description, the technical solutions of the present invention are elaborated in detail in combination with specific embodiments. However, the present invention can also be implemented in other variable ways based on the description herein. Therefore, the protection scope of the present invention is not limited to the limitations of the specific embodiments disclosed below.

[0025] Embodiment 1

[0026] As Figure 1 shown, the heat dissipation substrate of Embodiment 1 includes a metal plate 20, an insulating adhesive sheet 12, and a copper foil layer 13 which are stacked. The inner surface of the metal plate 20 is adhesively connected to the copper foil layer 13 through the insulating adhesive sheet 12. Among them, the insulating adhesive sheet 12 and the copper foil layer 13 can be fixed on the metal plate 20 by the commonly used hot pressing method in the art.

[0027] The metal plate 20 includes an aluminum plate 21 and a copper-clad layer 22. The thickness of the aluminum plate 21 can be set as required, and the present invention does not limit this. In Embodiment 1, copper-clad layers 22 can be provided on both the inner surface and the outer surface of the metal plate 20 / aluminum plate 21. The copper-clad layer 22 can be obtained by electroplating copper. The thickness of the copper-clad layer 22 is preferably 10 μm to 50 μm (for example, 15 μm), but is not limited thereto. Further, a zinc connection layer with an appropriate thickness (not shown in the figure) can be provided between the copper-clad layer 22 and the aluminum plate 21 to enhance the bonding force between the copper-clad layer 22 and the aluminum plate 21. As a variation of Embodiment 1, the metal plate 20 can also be provided with a copper-clad layer 22 only on the inner surface.

[0028] Among them, the copper-clad layer 22 on the inner surface of the metal plate 20 / aluminum plate 21 can not only enhance the bonding force between the metal plate 20 and the insulating adhesive sheet 12, but also enhance the bonding force between the metal plate 20 and the heat-conducting copper column 16 (detailed later). The copper-clad layer 22 on the outer surface is conducive to realizing the connection between the metal plate 20 and an external radiator (not shown in the figure) and improving the bonding force of the connection interface. For example, it is convenient to realize the welding connection between the metal plate 20 and the external radiator.

[0029] Further, the heat dissipation substrate of Embodiment 1 further includes a heat-conducting copper column 16. The heat-conducting copper column 16 is arranged to penetrate through the insulating adhesive sheet 12 and the copper foil layer 13 to be connected to the copper foil layer 13 and the copper-clad layer 22 on the inner surface of the metal plate 20. The heat-conducting copper column 16 is arranged to have a surface flush with the copper foil layer 13.

[0030] The heat-conducting copper posts 16 can be obtained by electroplating copper filling method. Exemplarily, after fixing the insulating adhesive sheet 12 and the copper foil layer 13 on the metal plate 20, a blind hole (the bottom surface of the blind hole is the metal plate 20) penetrating through the insulating adhesive sheet 12 and the copper foil layer 13 can be processed by laser (laser) drilling method, and then electroplating copper filling is carried out in the blind hole to obtain the heat-conducting copper posts 16. Exemplarily, the diameter of the heat-conducting copper posts 16 can be 0.1 mm to 1 mm, which can be specifically set according to requirements, and the present utility model does not limit this.

[0031] The copper foil layer 13 is provided with conductive circuits 131 and at least one heat-conducting pad 132. Each heat-conducting pad 132 is connected to a plurality of heat-conducting copper posts 16. The plurality of heat-conducting copper posts 16 can be distributed in a two-dimensional array or in a radial distribution, and the present utility model does not limit this. In use, an electronic component can be installed on the heat dissipation substrate, thermally connected to the heat-conducting pad 132 and electrically connected to the conductive circuit 131. The heat generated by the electronic component can be quickly conducted to the metal plate 20 through the heat-conducting pad 132 and the heat-conducting copper posts 16 to achieve rapid heat dissipation.

[0032] Embodiment 2

[0033] As Figure 2 shown, the heat dissipation substrate of Embodiment 2 includes a metal plate 20, an insulating adhesive sheet 12 and a circuit board 10 which are stacked. The inner surface of the metal plate 20 and the circuit board 10 are adhesively connected through the insulating adhesive sheet 12. Among them, the insulating adhesive sheet 12 and the circuit board 10 can be fixed on the metal plate 20 by the commonly used hot pressing method in the art.

[0034] The metal plate 20 includes an aluminum plate 21 and a copper-clad layer 22. The copper-clad layer 22 is arranged on the inner surface of the metal plate 20 / aluminum plate 21. For example, copper is electroplated on the inner surface of the aluminum plate 21 to obtain the copper-clad layer 22. The thickness of the copper-clad layer 22 is preferably 10 μm to 50 μm, but is not limited thereto. Further, a zinc connection layer with an appropriate thickness (not shown in the figure) can be provided between the copper-clad layer 22 and the aluminum plate 21. As a variation of Embodiment 2, the outer surface of the metal plate 20 / aluminum plate 21 can also be provided with a copper-clad layer 22.

[0035] Further, the heat dissipation substrate of Embodiment 2 further includes a heat-conducting copper boss 15. The heat-conducting copper boss 15 is arranged to penetrate through the insulating adhesive sheet 12 and the circuit board 10 to be connected to the copper foil layer 13 and the copper-clad layer 22 on the inner surface of the metal plate 20, and is arranged to have a flush surface with the copper foil layer 13.

[0036] The heat-conducting copper boss 15 can be obtained by the electroplating copper filling method. Exemplarily, a receiving groove for manufacturing the heat-conducting copper boss 15 can be pre-processed in the insulating adhesive sheet 12 and the circuit board 10. After the insulating adhesive sheet 12 and the circuit board 10 provided with the receiving groove are hot-pressed and fixed to the metal plate 20, electroplating copper filling is carried out in the receiving groove to obtain the heat-conducting copper boss 15. Preferably, after the hot-pressing and fixing step, the copper-clad layer 22 on the bottom surface of the receiving groove is first degummed to remove the adhesive glue (resin) that flows from the insulating adhesive sheet 12 to the copper-clad layer 22 on the bottom surface of the receiving groove during the hot-pressing step, and then the heat-conducting copper boss 15 is electroplated in the receiving groove to ensure the reliable connection between the heat-conducting copper boss 15 and the metal plate 20.

[0037] Exemplarily, the circuit board 10 includes an insulating core board 11 and a copper foil layer 13 provided on the outer surface of the insulating core board 11; the copper foil layer 13 is provided with conductive circuits 131 and at least one heat-conducting pad 132, and each heat-conducting pad 132 is connected to one or more heat-conducting copper bosses 15. An inner-layer conductive circuit 14 can be provided on the inner surface of the insulating core board 11, and the inner-layer conductive circuit 14 and the conductive circuit 131 on the surface of the circuit board 10 can be electrically connected through conductive vias.

[0038] In Embodiment 2, the circuit board 10 can be as Figure 2 shown to have only one insulating core board 11, or can have multiple insulating core boards 11, and the multiple insulating core boards 11 can be adhesively connected through an insulating adhesive sheet (such as a prepreg). When the circuit board 10 has multiple insulating core boards 11, in addition to providing the copper foil layer 13 on the outer surface of the outermost insulating core board 11, conductive circuits can also be provided on the inner surface of the outermost insulating core board 11 and the remaining insulating core boards 11 to form a circuit board 10 with multiple conductive circuits.

[0039] In use, the electronic component can be installed on the heat dissipation substrate, thermally connected to the heat-conducting pad 132 and electrically connected to the conductive circuit 131, and the heat generated by the electronic component can be quickly conducted to the metal plate 20 through the heat-conducting pad 132 and the heat-conducting copper boss 15 to achieve rapid heat dissipation.

[0040] Although the present utility model is disclosed above with specific embodiments, these embodiments are not intended to limit the scope of implementation of the present utility model. Any ordinary technician in the art, without departing from the scope of the invention of the present utility model, can make some modifications or changes, that is, all equivalent changes made in accordance with the present utility model should be covered by the protection scope of the present utility model.

Claims

1. A heat dissipation substrate, comprising a metal plate, an insulating adhesive sheet and a copper foil layer which are stacked, and the inner surface of the metal plate is adhesively connected to the copper foil layer through the insulating adhesive sheet; characterized in that: The metal plate comprises an aluminum plate and a copper-clad layer, and the copper-clad layer is disposed at least on the inner surface of the metal plate; Thermal copper columns, which are arranged to penetrate through the insulating adhesive sheet and the copper foil layer to be connected to the copper foil layer and the copper-clad layer on the inner surface of the metal plate, and are arranged to have a flush surface with the copper foil layer.

2. The heat dissipation substrate according to claim 1, wherein: The copper foil layer is provided with conductive circuits and at least one thermal pad, and each of the thermal pads is connected to a plurality of the thermal copper columns.

3. The heat dissipation substrate according to claim 1, wherein: The outer surface of the metal plate is also provided with the copper-clad layer.

4. The heat dissipation substrate according to claim 1, wherein: The thickness of the copper-clad layer is 10 μm to 50 μm.

5. The heat dissipation substrate according to claim 1, wherein: A zinc connection layer is provided between the copper-clad layer and the aluminum plate.

6. A heat dissipation substrate, comprising a metal plate, an insulating adhesive sheet and a circuit board which are stacked, and the inner surface of the metal plate is adhesively connected to the circuit board through the insulating adhesive sheet, and the circuit board comprises an insulating core board and a copper foil layer disposed on the outer surface of the insulating core board; characterized in that: The metal plate comprises an aluminum plate and a copper-clad layer, and the copper-clad layer is disposed at least on the inner surface of the metal plate; Thermal copper bosses, which are arranged to penetrate through the insulating adhesive sheet and the circuit board to be connected to the copper foil layer and the copper-clad layer on the inner surface of the metal plate, and are arranged to have a flush surface with the copper foil layer.

7. The heat dissipation substrate according to claim 6, wherein: The copper foil layer is provided with outer conductive circuits and at least one thermal pad, and each of the thermal pads is connected to one or more of the thermal copper bosses.

8. The heat dissipation substrate according to claim 6, wherein: The circuit board further comprises inner conductive circuits disposed on the inner surface of the insulating core board.

9. The heat dissipation substrate according to claim 6, characterized in that: The thickness of the copper-clad layer is 10 μm to 50 μm.

10. The heat dissipation substrate according to claim 6, wherein: A zinc connection layer is provided between the copper-clad layer and the aluminum plate.

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