Circuit board welding structure with protective layer

Abstract

The utility model relates to a circuit board welding structure with a protective layer, which relates to the technical field of electronic parts and comprises a circuit board body, at least two welding spots arranged at intervals are arranged on the circuit board body, and each welding spot is correspondingly connected with a lead assembly. The protection layer comprises a connection protection part capable of covering all the joints of the wire assemblies and the welding spots, by adopting the design, the influence of external physical stress on the joints of the wire assemblies and the welding spots can be effectively isolated, the damage to the joints of the welding spots and the wire assemblies caused by external pressure or bending is prevented, and the service life of the wire assemblies is prolonged. Therefore, the overall reliability of the circuit board is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic components, and particularly relates to a circuit board welding structure with a protective layer. Background Art

[0002] With the increasing popularity of electronic products and the continuous upgrading of functions, the importance of circuit board welding technology in electronic devices has become increasingly prominent. Circuit board welding is a key link for connecting and fixing electronic components, and its quality directly affects the performance and service life of products. In modern electronic devices, especially in portable devices and consumer electronics products, the reliability and durability of circuit board welding structures are particularly important.

[0003] Currently, many circuit board welding structures still adopt traditional welding methods, mainly with the direct connection of wire components to solder joints. Although this design has certain simplicity and cost-effectiveness in the production process, it also has significant potential safety hazards and reliability problems. Especially when no protective layer is provided between the wire components and the solder joints, improper physical forces, such as excessive bending or multiple bends, may be applied to the wires during use, resulting in damage to the connection between the solder joints and the wire components.

[0004] Specifically, when the wire components are subjected to excessive bending forces, the stress at the solder joints will increase sharply. This stress may cause fatigue damage or direct detachment of the solder joints. In addition, since the solder joints are usually the only physical connection between the circuit board and the wires, the failure of the solder joints will directly lead to the interruption of circuit functions, thereby affecting the normal operation of the entire device. This potential risk may not only cause product failures but also pose more serious safety hazards, especially in applications with high safety requirements.

[0005] The utility model is developed in view of the deficiencies of the existing technology. Summary of the Utility Model

[0006] Regarding the above-mentioned technical problem in the circuit board welding structure of the existing technology that no protective layer is provided between the wire components and the solder joints, and when the wire components are subjected to excessive bending forces, the stress at the solder joints will increase sharply, and this stress may cause fatigue damage or direct detachment of the solder joints.

[0007] The technical solution adopted by the utility model to solve its technical problems is as follows:

[0008] A circuit board welding structure with a protective layer includes a circuit board body. At least two spaced solder joints are provided on the circuit board body. Each solder joint is correspondingly connected to a wire component. A protective layer is also provided on the circuit board body. The protective layer includes a connection protection part that can cover the connection parts of all wire components and solder joints.

[0009] A circuit board welding structure with a protective layer as described above, each of the wire assemblies includes an electrically connected section, a connecting section, and an extending section connected in sequence. The electrically connected section is connected to the solder joint, and the protective layer further includes a wire protection part that can cover all the connecting sections.

[0010] A circuit board welding structure with a protective layer as described above, the protective layer further includes a solder joint protection part that can cover all the solder joints.

[0011] A circuit board welding structure with a protective layer as described above, the connection protection part, the wire protection part, and the solder joint protection part are an integrally formed structure.

[0012] A circuit board welding structure with a protective layer as described above, the protective layer is an ultraviolet curable glue, a hot melt glue, a yellow glue, or a 704 curable glue.

[0013] A circuit board welding structure with a protective layer as described above, the circuit board body is provided with flat welding parts corresponding to the solder joints one by one. The flat welding parts have flat welding surfaces, and the solder joints are arranged at the welding surfaces.

[0014] A circuit board welding structure with a protective layer as described above, the circuit board body includes a functional part and a welding part. A functional component is assembled on the functional part, and the solder joints are located on the welding part.

[0015] A circuit board welding structure with a protective layer as described above, the functional component includes a reed switch or a Hall switch.

[0016] A circuit board welding structure with a protective layer as described above, the wire assembly includes a wire body.

[0017] A circuit board welding structure with a protective layer as described above, a plug-in part extending outward is provided on one side of the circuit board body.

[0018] The beneficial effects of the present invention are:

[0019] 1. A circuit board welding structure with a protective layer of the present invention relates to the technical field of electronic parts and includes a circuit board body. At least two spaced solder joints are provided on the circuit board body. Each solder joint is correspondingly connected to a wire assembly. Specifically, by providing a protective layer on the circuit board body, the protective layer includes a connection protection part that can cover the connection parts of all wire assemblies and solder joints. With such a design, it can effectively isolate the influence of external physical stress on the connection parts of wire assemblies and solder joints, prevent damage to the connection parts of solder joints and wire assemblies caused by external pressure or bending, and thus improve the overall reliability of the circuit board.

[0020] 2. The protective glue layer in this embodiment uses ultraviolet curable glue, which has the characteristic of rapid curing. The ultraviolet curable glue is precisely dropped onto the solder joints and wire assemblies to ensure that the ultraviolet curable glue can cover the key areas of the solder joints, connection points, and wire assemblies. Then, this area is irradiated with an ultraviolet lamp, usually for 3 to 15 seconds (preferably 5 to 10 seconds). This process prompts the glue layer to quickly cure, forming a firm and stable protective layer, improving production efficiency, reducing production time. After drying, the ultraviolet curable glue forms an integrated protective glue layer structure on the solder joints, the connection points between the solder joints and the electrical connection segments, the connection points between the connection segments, and the connection segments.

[0021] 3. Further, the ultraviolet curable glue has the advantage of good hardness, making the protective glue layer formed by the ultraviolet curable glue have a certain mechanical strength, preventing the solder joints and connection points from being damaged when affected by external forces, and being able to better protect the solder joints, electrical connection segments, and connection segments. Moreover, the ultraviolet curable glue also has the advantages of high solubility and good waterproof performance, enabling the circuit board welding structure to better adapt to high-temperature environments and effectively avoiding the influence of factors such as water vapor and water bodies on the circuit board. It is applicable to devices that need to be heated, such as humidifiers, water dispensers, or coffee machines.

[0022] The following will further illustrate the present utility model in conjunction with the drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is one of the structural schematic diagrams of the present utility model (reed switch circuit board);

[0024] Figure 2 is the front view schematic diagram of the present utility model (reed switch circuit board);

[0025] Figure 3 is Figure 2 the sectional view along line A - A;

[0026] Figure 4 is the exploded schematic diagram of the present utility model (reed switch circuit board);

[0027] Figure 5 is the second structural schematic diagram of the present utility model (reed switch circuit board, the protective layer is transparent and has a plug-in part);

[0028] Figure 6 is one of the structural schematic diagrams of the present utility model (Hall switch circuit board);

[0029] Figure 7 is the front view schematic diagram of the present utility model (Hall switch circuit board);

[0030] Figure 8 is Figure 7Schematic cross-sectional view along line B-B;

[0031] Figure 9 Exploded view of the present utility model (Hall switch circuit board);

[0032] Figure 10 Second structural schematic diagram of the present utility model (Hall switch circuit board, with the protective layer being transparent). Specific embodiments

[0033] The following will describe the embodiments of the present utility model in detail with reference to the accompanying drawings.

[0034] As Figures 1 to 10 shown, a circuit board welding structure with a protective layer in this embodiment includes a circuit board body 1. At least two spaced-apart solder joints 11 are provided on the circuit board body 1. Each of the solder joints 11 is correspondingly connected to a wire assembly 2. Specifically, by providing a protective layer 3 on the circuit board body 1, the protective layer 3 includes a connection protection portion 31 that can cover the connection between all the wire assemblies 2 and the solder joints 11. With such a design, it can effectively isolate the influence of external physical stress on the connection between the wire assemblies 2 and the solder joints 11, and prevent damage to the connection between the solder joints and the wire assemblies due to external pressure or bending,

[0035] thereby improving the overall reliability of the circuit board.

[0036] As Figures 1 to 10 shown, each of the wire assemblies 2 in this embodiment includes an electrically connected section 21, a connecting section 22, and an extended section 23 that are sequentially connected. The electrically connected section 21 is connected to the solder joint 11. The protective layer 3 further includes a wire protection portion 32 that can cover all the connecting sections 22.

[0037] Specifically, the connection protection portion 31 covers the connection between the electrically connected section 21 of all the wire assemblies 2 and the solder joint 11, mainly for protecting the solder joint and its surrounding area, preventing the solder joint from loosening, cracking, or falling off due to external force, vibration, or environmental changes, and ensuring a more stable connection between the electrically connected section 21 and the solder joint 11 by providing additional physical protection.

[0038] Furthermore, the wire protection part 32 is another part of the protective layer 3, which specifically covers all the connection segments 22 of the wire assemblies 2 and the connection joints between the connection segments 22 and the electrical connection segments 21. With the design of the wire protection part 32, the connection segments 22 are protected and fixed. When the wire assemblies 2 are bent, under the action of the wire protection part 32, the connection segments 22 will not be bent or will have a lower bending degree. The wire protection part 32 can effectively limit the bending amplitude of the connection segments 22, reduce the stress effect of bending on the connection segments 22, enable the connection segments 22 to be effectively protected when subjected to external stress or multiple bends, greatly weaken the stress concentration phenomenon in this part, and thus reduce the risk of circuit failure caused by fatigue or mechanical damage.

[0039] Furthermore, under the double protection of the wire protection part 32 and the connection protection part 31, the stress effect of bending on the connection segments 22 can be effectively reduced. And because the wire protection part 32 restricts the bending of the connection segments 22, the stress transmitted to the connection joint between the electrical connection segments 21 and the solder joints 11 is indirectly reduced. The weakening of this stress transmission makes the connection between the electrical connection segments 21 and the solder joints 11 more stable and not easily loosened or broken under the action of external forces, further improving the durability and impact resistance of the entire welding structure.

[0040] Preferably, the protective layer 3 in this embodiment includes a connection protection segment 31 and a wire protection segment 32, enabling the protective layer 3 to cover the connection joints between the electrical connection segments 21 and the solder joints 11 and the connection segments 22, thereby expanding the coverage area of the protective layer 3. The connection protection segment 31 and the wire protection segment 32 work together to form a complete protection barrier, reducing the influence of external impacts and stresses on the electrical connection segments 21 and the solder joints 11, and thus reducing the risk of connection failure.

[0041] Moreover, it can improve the adhesion of the protective layer 3 to the solder joints 11 and the wire assemblies 2, avoiding the situation of the protective layer 3 falling off.

[0042] In some other embodiments, the wire protection part 32 can cover all the connection segments 22. This fully covered design can more effectively prevent mechanical damage to the connection segments 22 caused by external forces such as bending, stretching or impact, and further reduce the stress transmitted to the connection joint between the electrical connection segments 21 and the solder joints 11.

[0043] In some other embodiments, the connection protection segment 31 can cover all the connection joints between the electrical connection segments 21 and the solder joints 11. This fully covered design can more effectively protect the connection joints between the electrical connection segments 21 and the solder joints 11.

[0044] As Figures 1 to 10 shown, the protective layer 3 of this embodiment further includes a solder joint protection part 33 that can cover all the solder joints.

[0045] Specifically, the solder joint protection part 33 can completely cover all the solder joints to form a sealed protective cover, preventing the solder joints from being eroded by external environmental factors (such as moisture, dust, and chemicals), and effectively protecting the solder joints.

[0046] Furthermore, the design of the solder joint protection part 33 can increase the mechanical strength of the solder joints, making them more capable of withstanding pulling and bending, reducing the occurrence of solder joint failures caused by mechanical stress. Moreover, the covering design of the protective layer helps to disperse the stress applied to the solder joints, reducing the fatigue damage caused by frequent operations and ensuring the long-term reliability of the solder joints.

[0047] Furthermore, the protective layer 3 in this embodiment includes a connection protection section 31, a wire protection section 32, and a solder joint protection part 33, enabling the protective layer 3 to cover the solder joints 11, the connection part between the electrical connection section 21 and the solder joints 11, and the connection section 22, thereby further expanding the coverage area of the protective layer 3. The solder joint protection part 33, the connection protection section 31, and the wire protection section 32 work together to form a complete and comprehensive protection barrier, reducing the impact of external shocks and stresses on the electrical connection section 21 and the solder joints 11, and thus reducing the risk of connection failure.

[0048] Moreover, it can improve the adhesion of the protective layer 3 to the solder joints 11 and the wire assembly 2, preventing the protective layer 3 from falling off.

[0049] Such as Figures 1 to 10 As shown, the connection protection section 31, the wire protection section 32, and the solder joint protection part 33 of this embodiment are of an integrally formed structure.

[0050] With such a design, the integrally formed design eliminates the seams and connection points between the various protection parts, reduces potential weaknesses, makes the entire protective layer structure more stable, and reduces the risk of component detachment or failure caused by external forces.

[0051] Preferably, the protective layer 3 of this embodiment is a protective glue layer, and the protective glue layer can be an ultraviolet curable glue, a hot melt glue, a yellow glue, or a 704 curable glue, etc.

[0052] Preferably, the protective glue layer in this embodiment uses an ultraviolet curable glue. The ultraviolet curable glue has the characteristic of rapid curing. The ultraviolet curable glue is precisely dropped onto the solder joint 11 and the wire assembly 2 to ensure that the ultraviolet curable glue can cover the solder joint, the connection part, and the key areas of the wire assembly 2. Then, this area is irradiated with an ultraviolet lamp, usually for 3 to 15 seconds (preferably 5 to 10 seconds). This process promotes the rapid curing of the glue layer to form a firm and stable protective layer. After drying, the ultraviolet curable glue forms an integrated protective glue layer structure on the solder joint 11, the connection between the solder joint 11 and the electrical connection section 21, the connection between the connection section 22 and the electrical connection section 21, and the connection section 22.

[0053] Specifically, when dropping onto the solder joint 11 and the wire assembly 2, under the irradiation of the ultraviolet lamp, the ultraviolet curable glue can be rapidly cured in a short time, which greatly improves the production efficiency and reduces the production time.

[0054] Preferably, the ultraviolet curable glue can form good adhesion with a variety of substrates (such as metals, plastics, etc.) to ensure the tight combination of the protective layer with the solder joint and the connecting parts. After curing, the ultraviolet curable glue forms a complete protective glue layer structure on the solder joint 11, the connection between the solder joint 11 and the electrical connection section 21, the connection between the connection section 22 and the electrical connection section 21, and the connection section 22, and can cure the above structure, thereby effectively protecting each of the above structures.

[0055] Furthermore, after the ultraviolet curable glue dries, the connection section 22, the solder joint 11, and the electrical connection section 21 can be fixed in the protective glue layer formed by the ultraviolet curable glue. When the user bends the wire assembly 2, only the extension section 23 and the connection between the extension section 23 and the connection section 22 are bent, while the connection section 22, the solder joint 11, and the electrical connection section 21 are fixed at the protective glue layer and will not be bent, thus ensuring the protection effect at the connection between the solder joint 11 and the electrical connection section 21.

[0056] Moreover, the protective glue layer can also tighten the connection section 22, the solder joint 11, and the electrical connection section 21. During the curing process of the ultraviolet curable glue, with the volatilization of the solvent and the shrinkage of the glue layer, a certain tightening force will be generated on the connection section 22, the solder joint 11, and the electrical connection section 21. This tightening force can help maintain the close contact of each connection part and avoid poor connection caused by loosening. Through the tightening effect, the protective glue layer can effectively reduce the displacement of the connection section 22. When the wire assembly 2 is subjected to an external force (i.e., pulling the extension section 23), the tightened protective glue layer can provide additional support, enhance the resistance of the connection section 22, the electrical connection section 21, and the solder joint 11 to tensile and shear forces, and reduce the risk of damage.

[0057] Furthermore, the UV curable adhesive has the advantage of good hardness, enabling the protective adhesive layer formed by the UV curable adhesive to have a certain mechanical strength, preventing damage to the solder joints and connections when affected by external forces, and being able to better protect the solder joints, electrical connection segments, and connection segments. Moreover, the UV curable adhesive also has the advantages of high solubility and good waterproof performance, enabling the circuit board welding structure to better adapt to high-temperature environments and effectively avoiding the influence of factors such as water vapor and water bodies on the circuit board, and is applicable to devices that need to be heated, such as humidifiers, water dispensers, or coffee machines.

[0058] Furthermore, the UV curable adhesive has good transparency, facilitating visual inspection and monitoring of the solder joints and connection status after curing to ensure the welding quality.

[0059] Preferably, the protective adhesive layer can also be made of hot melt adhesive. The hot melt adhesive can flow after heating, facilitating its application to the solder joints 11 and the wire assembly 2, and quickly solidifies after cooling. It can withstand tension and bending within a certain range.

[0060] Preferably, the protective adhesive layer can also be made of yellow glue. The yellow glue has high bonding strength, can well cover the solder joints 11 and the wire assembly 2, and generally has good weather resistance and aging resistance, suitable for long-term use.

[0061] Preferably, the protective adhesive layer can also be made of 704 curing adhesive. The 704 curing adhesive can maintain stable performance in both high-temperature and low-temperature environments, ensuring the normal operation of the circuit board welding structure, and the 704 curing adhesive has good electrical insulation performance, suitable for the protection requirements of electronic devices.

[0062] As Figures 1 to 10 shown, the circuit board body 1 of this embodiment is provided with flat welding parts 12 corresponding one by one to the solder joints 11. The flat welding parts 12 have flat welding surfaces, and the solder joints 11 are located at the welding surfaces. Only by making the electrical connection segment 21 abut against the welding surface on the flat solder joint and welding the two through flat welding process can the connection between the solder joint 11 and the electrical connection segment 21 be realized, and then the wire can be assembled on the circuit board. The structure is simple, the operation is convenient, the production efficiency can be effectively improved, and moreover, with such a design, it is convenient for the UV curable adhesive to drip onto the circuit board body 1, further reducing the production difficulty and improving the production efficiency.

[0063] As Figures 1 to 10 shown, the circuit board body 1 of this embodiment includes a functional part 13 and a welding part 14. A functional component 15 is assembled on the functional part 13, and the solder joints 11 are located on the welding part 14. With such a design, there is a certain distance between the solder joints 11 and the functional part, avoiding the situation that the welding will affect the functional components.

[0064] As Figures 1 to 10As shown, the functional component 15 of this embodiment includes a reed switch or a Hall switch.

[0065] Specifically, the functional component 15 on the circuit board includes structures such as a reed switch or a Hall switch, and can be used on two-wire, three-wire or multi-wire circuit boards.

[0066] Specifically, for the liquid level detection of a two-wire circuit board (reed switch circuit board), the sensor type is a reed switch. Since a reed switch usually only involves the on-off of the circuit, its circuit board may be relatively simple. It adopts a two-wire wiring method, that is, one wire is the power supply wire and the other wire is the signal wire (or called the feedback wire). Therefore, only two sets of wire assemblies 2 need to be set. On the circuit board, through welding, the solder joints 11 are formed to connect with the wire assemblies 2.

[0067] Specifically, for the liquid level detection of a three-wire circuit board (Hall switch circuit board), the sensor type is a Hall switch. Since a Hall switch usually adopts a three-wire wiring method, including a power supply wire (positive and negative) and a signal wire, only three sets of wire assemblies 2 need to be set. On the circuit board, through welding, the solder joints 11 are formed to connect with the wire assemblies 2.

[0068] Specifically, for the liquid level detection of a four-wire circuit board (ultrasonic liquid level gauge, some specially designed Hall switch liquid level gauges or current-type liquid level sensors), taking the ultrasonic liquid level gauge as an example, it uses ultrasonic pulses for non-contact measurement, and determines the liquid level height 3 by calculating the time between the sound wave emission and reception. It usually adopts a four-wire wiring method, and the four-wire wiring method usually includes two power supply wires (positive and negative) and two signal wires (positive and negative or feedback + / -). This wiring method helps to ensure the stable transmission of power supply and signals and reduce interference.

[0069] In practical applications, the appropriate circuit board design can be selected according to the technical specifications and wiring requirements of the specific sensor.

[0070] As Figures 1 to 10 shown, the wire assembly 2 of this embodiment includes a wire body. Its electrical connection section 21 is the exposed core wire at one end of the wire body. The connection section 22 and the extension section 23 are wire bodies with insulating sheaths, and the connection section 22 is located between the exposed core wire and the extension section 23.

[0071] In some other embodiments, the wire assembly 2 further includes a welding terminal. The welding terminal is used to connect the exposed core wire and the connection section 22. The welding terminal is connected to the solder joint 11. The connection protection section 31 covers the connection between the welding terminal and the solder joint 11, and the wire protection section 32 covers the welding terminal and the connection section 22. The appropriate design can be selected according to actual needs.

[0072] As Figures 1 to 10As shown in the figure, on one side of the circuit board body 1 of this embodiment, there is a plug-in part 16 extending outward to increase the volume of the circuit board body, and it can be fixed on the using device by the cooperation of the plug-in part and the using device using this circuit board. The structure is simple and the operation is convenient.

[0073] Preferably, other electrical components on the circuit board body 1 (such as reed switches or Hall switches, etc.) can also be covered and protected by adding a protective glue layer (such as ultraviolet curable glue) to avoid damage to the electrical components caused by factors such as collision and ensure the normal operation of the circuit board.

[0074] The above only uses the embodiment to further illustrate the technical content of the present invention to make it easier for readers to understand, but it does not mean that the implementation mode of the present invention is limited to this. Any technical extension or re-creation based on the present invention is protected by the present invention. The protection scope of the present invention is subject to the claims.

Claims

1. A circuit board welding structure with a protective layer, characterized in that: It includes a circuit board body (1), at least two spaced solder joints (11) are provided on the circuit board body (1), and a wire assembly (2) is correspondingly connected to each solder joint (11). A protective layer (3) is also provided on the circuit board body (1), and the protective layer (3) includes a connection protection part (31) that can cover the connection parts of all wire assemblies (2) and solder joints (11).

2. The solder joint structure of a circuit board with a protective layer according to claim 1, characterized in that: Each wire assembly (2) includes an electrical connection section (21), a connection section (22), and an extension section (23) connected in sequence. The electrical connection section (21) is connected to the solder joint (11), and the protective layer (3) also includes a wire protection part (32) that can cover all connection sections (22).

3. A circuit board welding structure with a protective layer according to any one of claims 1 or 2, characterized in that: The protective layer (3) also includes a solder joint protection part (33) that can cover all solder joints.

4. A soldering structure of a circuit board with a protective layer according to claim 3, characterized in that: The connection protection part (31), the wire protection part (32), and the solder joint protection part (33) are of an integrally formed structure.

5. A circuit board welding structure with a protective layer according to any one of claims 1 or 2, characterized in that: The protective layer (3) is an ultraviolet curable glue, a hot melt glue, a yellow glue, or a 704 curable glue.

6. The solder joint structure of a circuit board with a protective layer according to claim 1, wherein: Flat welding parts (12) corresponding to the solder joints (11) are provided on the circuit board body (1). The flat welding parts (12) have flat welding surfaces, and the solder joints (11) are arranged at the welding surfaces.

7. The welding structure of a circuit board with a protective layer according to claim 1, wherein: The circuit board body (1) includes a functional part (13) and a welding part (14). A functional component (15) is assembled on the functional part (13), and the solder joints (11) are located on the welding part (14).

8. The soldering structure of a circuit board with a protective layer according to claim 7, wherein: The functional component (15) includes a reed switch or a Hall switch.

9. A soldering structure of a circuit board with a protective layer according to any one of claims 1 or 2, characterized in that: The wire assembly (2) includes a wire body.

10. A soldering structure of a circuit board with a protective layer according to claim 1, characterized in that: A plug-in part (16) extending outward is provided on one side of the circuit board body (1).

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