All-in-one wafer flatness detection device

Abstract

The utility model discloses an all-in-one wafer flatness detection device, and relates to the technical field of wafer detection. Comprising an L-shaped support, a plurality of connecting frames are fixedly mounted on one side of the L-shaped support, piston rods are slidably connected to inner cavities of the connecting frames, mounting frames are fixedly mounted at the bottom ends of the piston rods, rolling shafts are rotatably connected to the bottom ends of the mounting frames, connecting pipes are fixedly mounted at the top ends of the connecting frames, and a plurality of transparent bins are fixedly mounted at the top end of the L-shaped support; the other side of the connecting pipe is connected with a transparent bin, and the transparent bin is filled with foam. The rolling shaft moves on the surface of the wafer, the piston rod slides towards the inner cavity of the connecting frame when the rolling shaft encounters a protrusion, gas is blown into the transparent bin through the connecting pipe, foam floats under the action of wind power, and therefore whether the surface of the wafer is flat or not can be visually observed, and the detection efficiency of the surface of the wafer is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer detection, in particular to a multi-in-one wafer flatness detection device. Background Technique

[0002] A wafer refers to a silicon wafer used to fabricate silicon semiconductor circuits, and its raw material is silicon. High-purity polysilicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form a cylindrical single-crystal silicon. Since its shape is circular, it is called a wafer. Various circuit element structures can be processed and fabricated on the silicon wafer to become an IC product with specific electrical functions. If the flatness of the wafer surface is unqualified or there are defects, the functions of the IC product will be greatly reduced.

[0003] According to the Chinese patent publication number CN211012835U, it discloses a wafer flow slice surface flatness detection device, which can detect multiple points on the wafer surface by setting dense touch needles in contact with induction electric sheets, so as to ensure the detection accuracy; although the above measurement method can ensure the measurement accuracy to a certain extent, the accuracy of too many touch needles themselves is difficult to guarantee, and it is difficult to ensure the measurement accuracy, resulting in deviation of the measurement result and affecting the measurement result; and too many touch needles are difficult to set, and it is impossible to truly carry out production and manufacturing, and it is impossible to effectively detect the wafer. To solve the above problems, a multi-in-one wafer flatness detection device is proposed to solve the above problems. Summary of the Utility Model

[0004] In order to solve the above problems, the purpose of the utility model is to provide a multi-in-one wafer flatness detection device.

[0005] To solve the above technical problems, the utility model adopts the following technical scheme: A multi-in-one wafer flatness detection device includes a workbench and a carrier installed at the center position of the top of the workbench. Guide rails are fixedly installed at the center positions on both sides of the top of the workbench. Slide rails are slidably connected inside the guide rails. A vertical rod is fixedly installed at the top of the slide rail. An L-shaped bracket is fixedly installed between the two vertical rods. A plurality of connecting frames are fixedly installed on one side of the L-shaped bracket. A piston rod is slidably connected inside the cavity of the connecting frame. An installation frame is fixedly installed at the bottom of the piston rod. A rotating shaft is rotatably connected to the bottom of the installation frame;

[0006] A connecting pipe is fixedly installed at the top of the connecting frame. A plurality of transparent bins are fixedly installed at the top of the L-shaped bracket. The other side of the connecting pipe is connected to the transparent bin. The inside of the transparent bin is filled with foam.

[0007] Preferably, a ventilation plate is provided at the connection between the connecting pipe and the transparent bin.

[0008] Preferably, the diameter of the ventilation holes on the surface of the ventilation plate is smaller than the foam inside the transparent chamber.

[0009] Preferably, a lead screw is installed on the radial inner wall of the slide rail through internal and external thread cooperation.

[0010] Preferably, a pre-embedded groove is provided at the central position inside the workbench. Relatively two sides inside the pre-embedded groove are both slidably connected with L-shaped moving frames. One side where the two L-shaped moving frames face each other is fixedly installed with a toothed rod, and a gear is rotatably connected at the central position inside the pre-embedded groove.

[0011] Preferably, through grooves extending to the inside of the pre-embedded groove are symmetrically provided at the central position of the top of the workbench. The top of the L-shaped moving frame is fixedly installed with a limiting frame through the through groove.

[0012] Preferably, the two L-shaped moving frames slide in different directions simultaneously through the gear.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] The roller moves on the surface of the wafer. When encountering a protrusion, the piston rod slides towards the inside of the connecting frame cavity, and the gas is blown into the transparent chamber through the connecting pipe. The foam floats under the action of the wind force, so that it can be directly observed whether the surface of the wafer is flat, and the detection efficiency of the wafer surface is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0016] Figure 1 It is a schematic structural diagram of the present utility model;

[0017] Figure 2 It is a cross-sectional view of the workbench of the present utility model;

[0018] Figure 3 It is a schematic structural diagram of the connecting frame in the present utility model;

[0019] Figure 4 is Figure 1 The enlarged structural view of part A in

[0020] In the figure: 1, workbench; 2, guide rail; 3, slide rail; 4, vertical rod; 5, L-shaped bracket; 6, connecting frame; 7, piston rod; 8, mounting frame; 9, roller; 10, connecting pipe; 11, transparent chamber; 12, ventilation plate; 13, embedded groove; 14, L-shaped moving frame; 15, rack; 16, gear; 17, through groove; 18, limiting frame; 19, carrier table. Specific implementation manner

[0021] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0022] Embodiment: As Figures 1-4 shown, the present invention provides a multi-in-one wafer flatness detection device, including a workbench 1 and a carrier table 19 installed at the center position of the top end of the workbench 1. The wafer to be detected is placed on the surface of the carrier table 19. Guide rails 2 are fixedly installed at the center positions on both sides of the top end of the workbench 1. A slide rail 3 is slidably connected inside the guide rail 2. A lead screw is installed on the radial inner wall of the slide rail 3 through internal and external thread cooperation. The lead screw rotates clockwise or counterclockwise under the drive of a servo motor. The rotating lead screw generates a force on the slide rail 3, driving the L-shaped bracket 5 to move along the guide rail 2 directly above the wafer. A vertical rod 4 is fixedly installed at the top end of the slide rail 3. An L-shaped bracket 5 is fixedly installed between the two vertical rods 4. A plurality of connecting frames 6 are fixedly installed on one side of the L-shaped bracket 5. A piston rod 7 is slidably connected inside the cavity of the connecting frame 6. The bottom end of the piston rod 7 is fixedly installed with a mounting frame 8. The bottom end of the mounting frame 8 is rotatably connected with a roller 9. When the roller 9 slides on the surface of the wafer and encounters a protrusion, the piston rod 7 slides toward the inside of the connecting frame 6, and gas is generated inside the cavity of the connecting frame 6 during the sliding process;

[0023] A connecting pipe 10 is fixedly installed at the top end of the connecting frame 6. A plurality of transparent chambers 11 are fixedly installed at the top end of the L-shaped bracket 5. The other side of the connecting pipe 10 is connected to the transparent chamber 11. The inside of the transparent chamber 11 is filled with foam. The gas inside the cavity of the connecting frame 6 is blown into the inside of the transparent chamber 11 through the connecting pipe 10, blowing up the foam inside the transparent chamber 11, and it can be known that the surface of the wafer is not flat enough.

[0024] A ventilation plate 12 is provided at the connection between the connecting pipe 10 and the transparent chamber 11. The diameter of the ventilation holes on the surface of the ventilation plate 12 is smaller than the foam inside the transparent chamber 11.

[0025] The provided ventilation plate 12 prevents the piston rod 7 from sucking the foam inside the transparent bin 11 into the inner cavity of the connecting frame 6 during the process of the piston rod 7 sliding back in the inner cavity of the connecting frame 6 to generate suction force.

[0026] A pre-embedded groove 13 is provided at the central position inside the workbench 1. Both opposite sides inside the pre-embedded groove 13 are slidably connected with L-shaped moving frames 14. A toothed rod 15 is fixedly installed on the opposite side of the two L-shaped moving frames 14. A gear 16 is rotatably connected at the central position inside the pre-embedded groove 13. The two L-shaped moving frames 14 slide in different directions simultaneously through the gear 16. Through grooves 17 extending to the inside of the pre-embedded groove 13 are symmetrically provided at the central position of the top end of the workbench 1. The top end of the L-shaped moving frame 14 is fixedly installed with a limiting frame 18 through the through groove 17.

[0027] Place the wafer to be detected on the surface of the carrier 19. The gear 16 rotates clockwise under the drive of the servo motor. The clockwise rotating gear 16 generates a force on the toothed rod 15, causing the two L-shaped moving frames 14 to slide towards the side of the carrier 19 with the limiting frame 18 attached, so as to limit the wafer on the surface of the carrier 19. On the contrary, when the servo motor rotates counterclockwise, the two L-shaped moving frames 14 slide away from the side of the carrier 19 with the limiting frame 18 attached.

[0028] Obviously, those skilled in the art can make various modifications and variations to the present utility model without departing from the spirit and scope of the present utility model. Thus, if these modifications and variations of the present utility model fall within the scope of the claims of the present utility model and its equivalent technologies, the present utility model also intends to include these modifications and variations.

Claims

1. An all-in-one wafer flatness detection device, comprising a workbench (1) and a carrier table (19) installed at the center position of the top end of the workbench (1), characterized in that: At the central positions on both sides of the top of the workbench (1), guide rails (2) are fixedly installed. A slide rail (3) is slidably connected inside the guide rail (2). A vertical rod (4) is fixedly installed at the top of the slide rail (3). An L-shaped bracket (5) is fixedly installed between the two vertical rods (4). A plurality of connecting frames (6) are fixedly installed on one side of the L-shaped bracket (5). A piston rod (7) is slidably connected inside the cavity of the connecting frame (6). An installation frame (8) is fixedly installed at the bottom end of the piston rod (7). A roller (9) is rotatably connected to the bottom end of the installation frame (8); A connecting pipe (10) is fixedly installed at the top of the connecting frame (6). A plurality of transparent bins (11) are fixedly installed at the top of the L-shaped bracket (5). The other side of the connecting pipe (10) is connected to the transparent bin (11). The inside of the transparent bin (11) is filled with foam.

2. The multi-in-one wafer flatness detection device according to claim 1, characterized in that, A ventilation plate (12) is provided at the connection between the connecting pipe (10) and the transparent bin (11).

3. The multi-in-one wafer flatness detection device according to claim 2, characterized in that, The diameter of the ventilation holes on the surface of the ventilation plate (12) is smaller than the foam inside the transparent bin (11).

4. The multi-in-one wafer flatness detection device according to claim 1, wherein A lead screw is installed on the radial inner wall of the slide rail (3) through internal and external thread cooperation.

5. The multi-in-one wafer flatness detection device according to claim 4, characterized in that, A pre-embedded groove (13) is opened at the central position inside the workbench (1). L-shaped moving frames (14) are slidably connected to both opposite sides inside the pre-embedded groove (13). A toothed rod (15) is fixedly installed on the opposite side of the two L-shaped moving frames (14). A gear (16) is rotatably connected to the central position inside the pre-embedded groove (13).

6. The multi-in-one wafer flatness detection device according to claim 5, wherein, Through grooves (17) extending to the inside of the pre-embedded groove (13) are symmetrically opened at the central position of the top of the workbench (1). A limiting frame (18) is fixedly installed through the through groove (17) at the top of the L-shaped moving frame (14).

7. The multi-in-one wafer flatness detection device according to claim 6, characterized in that, The two L-shaped moving frames (14) slide in different directions simultaneously through the gear (16).

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