Chip heating test equipment

Abstract

The utility model discloses a chip heating test device. The automatic chip testing machine comprises a rack, a testing feeding station, a testing station, a testing discharging station, a conveying and transferring mechanism, a heating module and a testing module, wherein the testing feeding station, the testing station and the testing discharging station are sequentially arranged in the X direction; the conveying and transferring mechanism is used for conveying chips among the three stations; the heating module is arranged beside the testing feeding station; the conveying and transferring mechanism is used for conveying chips on the conveying and transferring mechanism to the testing module, the feeding unit is arranged beside the heating module, and the receiving unit, the feeding and transferring mechanism, the discharging and transferring mechanism and the tray transferring mechanism are arranged beside the testing and discharging station. According to the utility model, the layout is compact, the space is saved, the loading, heating, conveying, testing and unloading of chips can be automatically completed, the testing efficiency can be improved, the turnover of material trays of the material supply unit and the material receiving unit can be realized, and the number of standby material trays is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of chip testing, and particularly relates to a chip heating test device. Background Technique

[0002] The chip will ultimately be used in the main board or the whole machine system equipped with the main board. When the whole machine system is in use, it will generate heat or be in an environment with a certain pressure. The chip itself is very sensitive to temperature and pressure. Therefore, during the actual production process of the chip, the chip will be heated and tested to ensure the stability and accuracy of the chip when running in the whole machine system. There are similar devices designed in the prior art. For example, an automatic test and sorting machine for IC chips disclosed in Chinese Patent Grant Publication No. CN102698969B mainly consists of a feeding solid tray separation input device, a heating platform device, a feeding gripper platform device, a material boat module device, a test gripper combination module device, a discharging sorting gripper platform device, a defective product classification and collection module, an empty tray positioning gripper device, a qualified product classification and collection module, an operation keyboard, a discharging empty tray separation input device, a feeding empty tray output stacking device, an electric control system, etc. It can automatically input the full-tray chips to be tested and sorted into place through the tray separation input device, and transfer them to the material boat one by one through the feeding gripper platform device. The test gripper combination module device accurately sucks the chips to be tested on the left material boat and moves them into the test position for testing, and then puts them back on the right material boat. Further, the tested chips are sent to the classification and sorting position, and the discharging sorting gripper platform device classifies and places them into the corresponding finished crystal trays or defective crystal trays according to the test results. After the full tray, they are sent out of the machine in an orderly manner. In this solution, the feeding gripper platform device needs to carry the products on the feeding solid tray separation input device to the heating platform device, and then place the products heated on the heating platform device on the material boat module device. Since the distances between the receiving grooves for placing products on the feeding solid tray separation input device, the heating platform device, and the material boat module device are different, but in order to save space and reduce the space occupied by the test device, it is desired to use the same feeding gripper platform device for handling. Therefore, a structure capable of adjusting the distance between several grippers on the feeding gripper platform device needs to be designed to realize the handling of chips among the feeding solid tray separation input device, the heating platform device, and the material boat module device. However, in this solution, in order to realize the adjustment of the distance between several grippers, two gripper components are arranged on each synchronous belt, and the two gripper components are arranged on the upper belt and the lower belt of the synchronous belt. The position adjustment of the grippers is realized through the transmission of the synchronous belt. Four gripper components are provided, and correspondingly, two synchronous belts need to be provided. If the number of gripper components increases, the number of synchronous belts needs to be increased correspondingly, and the whole structure will be very complex, resulting in a large occupied space and being unfavorable for the layout of the whole test device.

[0003] Therefore, it is necessary to provide a chip heating test device to solve the above technical problems. Content of the Utility Model

[0004] The main purpose of the present utility model is to provide a chip heating test device, which has a compact layout, saves space, can automatically complete the feeding, heating, conveying, testing and discharging of chips, can also improve the testing efficiency, and at the same time can realize the turnover of the trays of the feeding unit and the receiving unit and reduce the number of spare trays.

[0005] The present utility model realizes the above purpose through the following technical solutions: a chip heating test device, which includes a frame, a test feeding station, a test station and a test discharging station arranged in sequence along the X direction, a conveying and transferring mechanism for chip conveying between the above three stations, a heating module arranged beside the test feeding station for heating the chips, a test module arranged at the test station for testing the heated chips, a handling and pressing mechanism for handling the chips on the conveying and transferring mechanism to the test module and pressing the chips to make the chips contact the test module reliably to achieve conduction, a feeding unit arranged beside the heating module, a receiving unit arranged beside the test discharging station, a feeding handling mechanism for chip handling among the feeding unit, the heating module and the conveying and transferring mechanism, a discharging handling mechanism for handling the chips tested on the transplanting and conveying mechanism at the test discharging station to the receiving unit, and a tray handling mechanism for realizing tray handling between the feeding unit and the receiving unit;

[0006] The feeding handling mechanism includes a first handling module for handling chips, the first handling module includes a plurality of second adsorption components, the second adsorption components are movably arranged on a moving adjustment plate, and an adjustment component for adjusting the distance between a plurality of the moving adjustment plates in the X direction is arranged on the first handling module.

[0007] Further, the heating module includes a heating component arranged on the frame and a heating carrier arranged on the heating component, and a heating groove conforming to the shape of the chip is arranged on the heating carrier; a test carrier is arranged on the test module, and a test circuit and a plurality of test grooves for accommodating the chips and conforming to the shape of the chips are arranged on the test carrier.

[0008] Further, the conveying and transferring mechanism includes a loading carrier that moves between the test loading station and the test station to perform the loading operation, an unloading carrier that moves between the test station and the test unloading station to perform the unloading operation, a moving platform for installing and fixing the loading carrier and the unloading carrier, and a first driving motor for driving the moving platform to move in the X direction; the conveying and transferring mechanism includes a first conveying and transferring mechanism and a second conveying and transferring mechanism arranged in parallel with the first conveying and transferring mechanism, and the test module is arranged between the first conveying and transferring mechanism and the second conveying and transferring mechanism.

[0009] Further, the handling and pressing mechanism includes a first handling and pressing mechanism for handling the chips on the first conveying and transferring mechanism to the test module and a second handling and pressing mechanism for handling the chips on the second conveying and transferring mechanism to the test module. The first handling and pressing mechanism and the second handling and pressing mechanism are symmetrically arranged front and back and are commonly arranged on an installation frame.

[0010] Further, both the first handling and pressing mechanism and the second handling and pressing mechanism include a YZ-axis driving module arranged on the installation frame, a moving mounting column driven by the YZ-axis driving module to move in the YZ direction, and an adsorption and pressing module arranged at the end of the moving mounting column for adsorbing and pressing the chips. A plurality of first adsorption components are arranged on the adsorption and pressing module, and an adsorption and pressing head that is shaped like the chip and adsorbs and presses the chip is arranged at the lower end of the first adsorption component.

[0011] Further, the loading handling mechanism further includes a first XY-axis driving module for driving the first handling module to move in the XY direction and for handling the chips; the unloading handling mechanism includes a second XY-axis driving module fixed on the machine frame and a second handling module driven by the second XY-axis driving module to move in the XY direction and for handling the chips. The structure of the second handling module is the same as that of the first handling module.

[0012] Further, the first handling module further includes a handling frame, a second driving motor arranged on the handling frame, and a pushing plate driven by the second driving motor to move up and down. The pushing plate pushes a plurality of second adsorption components to move downward simultaneously, and an elastic component for resetting the second adsorption components upward is arranged between the second adsorption components and the moving adjustment plate.

[0013] Further, the adjustment assembly includes a rotation driving member provided on the handling rack and an adjustment shaft driven by the rotation driving member to rotate. A spiral groove is provided on the outer wall of the adjustment shaft. A plurality of the moving adjustment plates are provided with avoidance grooves for the adjustment shaft to pass through. A pin shaft extending into the spiral groove is provided on the groove wall at the upper end of the avoidance groove.

[0014] Further, a first roller assembly is provided at the upper right end of the first XY-axis driving module, and a second roller assembly is provided at the upper left end of the second XY-axis driving module. A first guide rail for the first roller assembly to move back and forth is provided on the left side of the mounting rack, and a second guide rail for the second roller assembly to move back and forth is provided on the right side of the mounting rack; both the first roller assembly and the second roller assembly include a roller bracket and a roller.

[0015] Further, the tray handling mechanism includes a gripper module for gripping the tray and a gripper driving module for driving the gripper module to handle between the feeding unit and the receiving unit. The gripper module includes a support plate, a first cylinder fixed on the support plate, a gripper frame driven by the first cylinder to move up and down, a first lifting component provided at the front end of the gripper frame and used to support the front end of the tray, and a second lifting component provided at the rear end of the gripper frame and used to support the rear end of the tray. A plurality of pressing rods for pressing on the upper surface of the tray are provided on the support plate.

[0016] Compared with the prior art, the beneficial effects of a chip heating test device of the present utility model are as follows:

[0017] (1) The test setup provided by this solution has a compact layout, saves space, can automatically complete the feeding, heating, conveying, testing and discharging of the chips, and can also improve the testing efficiency;

[0018] (2) A plurality of adsorption components provided on the handling modules of the feeding handling mechanism and the discharging handling mechanism can be driven to move up and down by the same pushing plate. At the same time, the distance between each adsorption component can be adjusted by the same adjustment assembly. The structure of the adjustment assembly is simple and compact, occupying a small space;

[0019] (3) The feeding and transferring mechanism is provided with a feeding carrier and a discharging carrier that are synchronously linked. When the feeding carrier receives the heated chips at the test feeding station, simultaneously the discharging carrier receives the tested chips at the test station. Under the action of the first driving member, the feeding carrier moves from the test feeding station to the test station to perform the feeding action, and at the same time the corresponding discharging carrier moves from the test station to the test discharging station to perform the discharging action. It can complete the material receiving and the feeding and discharging actions simultaneously, with a fast beat. At the same time, a heating and heat preservation plate is provided on the feeding carrier, which can prevent the heated product from losing heat on the feeding and transferring mechanism and reducing the temperature, so as to ensure accurate test conditions when the chip is heated and tested.

[0020] (4) The first handling and pressing mechanism and the second handling and pressing mechanism are alternately actuated to alternately transfer the chips on the first feeding and transferring mechanism and the second feeding and transferring mechanism to the test module, improving the test beat and thus the test efficiency. Moreover, the first handling and pressing mechanism and the second handling and pressing mechanism can not only alternately transfer the chips to the test module, but also press the chips during the chip test so that the pins of the chips can be in reliable contact with the test circuit of the test module to achieve conduction. They have both the functions of handling and pressing. Therefore, there is no need to separately provide a pressing mechanism on the test module, which can simplify the structure of the test module.

[0021] (5) The provided tray handling mechanism can transfer the empty trays recycled from the feeding unit to the receiving unit to load the tested chips, realizing the automatic handling of the trays between the feeding unit and the receiving unit, which is beneficial to the turnover of the trays and can reduce the number of spare trays. Description of the Drawings

[0022] Figure 1 It is a three-dimensional structural schematic diagram of the chip heating and testing equipment according to an embodiment of the present invention;

[0023] Figure 2 It is a three-dimensional structural schematic diagram of the chip heating and testing equipment according to an embodiment of the present invention;

[0024] Figure 3 It is a top view structural schematic diagram of the chip heating and testing equipment according to an embodiment of the present invention;

[0025] Figure 4 It is a three-dimensional structural schematic diagram of the material placement module according to an embodiment of the present invention;

[0026] Figure 5 It is a three-dimensional structural schematic diagram of the feeding and transferring mechanism according to an embodiment of the present invention;

[0027] Figure 6 It is a three-dimensional structural schematic diagram of the feeding handling mechanism according to an embodiment of the present invention;

[0028] Figure 7 It is a three-dimensional structure schematic diagram of the first handling module in the embodiment of the present utility model;

[0029] Figure 8 It is a three-dimensional structure schematic diagram of the second adsorption component installed on the moving adjustment plate in the embodiment of the present utility model;

[0030] Figure 9 It is a three-dimensional structure schematic diagram of the handling mechanism in the embodiment of the present utility model;

[0031] Figure 10 It is a three-dimensional structure schematic diagram of the first handling mechanism or the second handling mechanism in the embodiment of the present utility model;

[0032] Figure 11 It is a three-dimensional structure schematic diagram of the adsorption module in the embodiment of the present utility model;

[0033] Figure 12 It is a three-dimensional structure schematic diagram of the tray handling mechanism in the embodiment of the present utility model;

[0034] Figure 13 It is a three-dimensional structure schematic diagram of the gripper module in the embodiment of the present utility model;

[0035] The numbers in the figure represent:

[0036] 100 - Chip heating test equipment; 200 - Tray;

[0037] 1 - Frame;

[0038] 2 - Feeding unit, 21 - Material placement module, 22 - Tray placement module, 23 - Tray recycling module, 24 - Tray inflow module, 25 - Magazine, 251 - Positioning frame, 252 - Support block, 253 - Second cylinder, 26 - Handling waiting position, 27 - Tray conveyor line, 271 - Conveyor frame, 272 - First transmission shaft, 273 - Third synchronous belt pulley drive assembly, 274 - Conveyor belt, 281 - Transfer plate, 282 - Transfer drive assembly, 29 - Camera;

[0039] 3 - Receiving unit, 31 - Defective product receiving unit, 32 - Good product receiving unit, 33 - Receiving module;

[0040] 4 - Heating module, 41 - Heating carrier, 42 - Heating tank;

[0041] 5 - Conveyor and transfer mechanism, 51 - First conveyor and transfer mechanism, 52 - Second conveyor and transfer mechanism, 53 - First drive motor, 54 - Moving platform, 55 - Loading carrier, 56 - Unloading carrier, 57 - Accommodation groove;

[0042] 6 - Testing module;

[0043] 7 - Loading and handling mechanism, 71 - First XY-axis drive module, 711 - First transmission component, 7111 - Second transmission shaft, 7112 - Second drive motor, 7113 - Second transmission belt, 712 - Moving cantilever beam, 713 - Second transmission component, 72 - First handling module, 721 - Handling rack, 722 - Second drive motor, 723 - Pushing plate, 724 - Second adsorption component, 7241 - Mounting block, 7242 - Adsorption rod, 7243 - Second adsorption head, 7244 - Guide rod, 7245 - Second air inlet, 7246 - Support shaft, 725 - Moving adjustment plate, 726 - Support guide rod, 727 - Rotation drive member, 728 - Adjustment shaft, 729 - Pin shaft, 73 - First roller assembly, 731 - First roller bracket, 732 - First roller;

[0044] 8 - Handling and pressing mechanism, 81 - First handling and pressing mechanism, 82 - Second handling and pressing mechanism, 83 - Mounting frame, 831 - First guide rail, 832 - Second guide rail, 84 - YZ-axis drive module, 841 - Third drive motor, 842 - Moving beam, 843 - Fourth drive motor, 85 - Moving mounting column, 86 - Adsorption and pressing module, 861 - First air inlet, 87 - First adsorption component, 871 - Adsorption and pressing head;

[0045] 9 - Unloading and handling mechanism, 91 - Second XY-axis drive module, 92 - Second handling module, 93 - Second roller assembly;

[0046] 10 - Tray handling mechanism, 101 - Gripper module, 1011 - Support plate, 1012 - First cylinder, 1013 - Gripper frame, 1014 - First lifting component, 1015 - Second lifting component, 1016 - First slider, 1017 - Tray, 1018 - Lifting part, 1019 - Pressing rod, 10110 - Third cylinder, 102 - Gripper drive module, 1021 - Cross beam, 1022 - Third transmission shaft, 1023 - Fifth drive motor, 1024 - First transmission belt, 1025 - First slide rail, 103 - Belt clip;

[0047] 40 - Test loading station; 50 - Test station; 60 - Test unloading station. Detailed implementation manner

[0048] Please refer to Figures 1-13, this embodiment is a chip heating test device. The chip heating test device 100 includes a frame 1, a test loading station 40, a test station 50, and a test unloading station 60 arranged in sequence along the X direction, a conveying and transferring mechanism 5 for chip conveying among the above three stations, a heating module 4 arranged beside the test loading station 40 for heating the chips, a test module 6 arranged at the test station 50 for testing the heated chips, a handling and pressing mechanism 8 for transporting the chips on the conveying and transferring mechanism 5 to the test module 6 and pressing the chips to ensure reliable contact with the test module 6 for conduction, a feeding unit 2 arranged beside the heating module 4, a receiving unit 3 arranged beside the test unloading station 60, a loading handling mechanism 7 for chip handling among the feeding unit 2, the heating module 4, and the conveying and transferring mechanism 5, a unloading handling mechanism 9 for transporting the chips tested on the conveying and transferring mechanism 5 at the test unloading station 60 to the receiving unit 3, and a tray handling mechanism 10 for tray handling between the feeding unit 2 and the receiving unit 3.

[0049] The feeding unit 2 includes a material placement module 21 for placing the chips to be tested and a tray placement module 22 for placing the trays 200, which are arranged in parallel. The tray placement module 22 includes a tray recycling module 23 and a tray inflow module 24 arranged in sequence on the right side of the material placement module 21.

[0050] In this embodiment, after all the chips in the tray 200 on the material placement module 21 are grabbed, the tray handling mechanism 10 transports the empty tray on the material placement module 21 to the tray recycling module 23. Since there are requirements for the cleanliness of the tray 200, the tray on the tray recycling module 23 needs to be cleaned before loading chips. Therefore, a tray inflow module 24 is arranged on the right side of the tray recycling module 23. After the tray handling mechanism 10 transports the empty tray on the material placement module 21 to the tray recycling module 23, the tray 200 first flows out from the tray recycling module 23 for cleaning. After cleaning, it is placed on the tray inflow module 24, and then the tray handling mechanism 10 transports the empty tray on the tray inflow module 24 to the receiving unit 3 for loading the tested chips. In this way, it is possible to input trays filled with chips and empty trays on the feeding unit 2, and only output trays loaded with tested chips on the receiving unit 3, forming a structure with input on one side and output on the other side, with a reasonable layout and avoiding the problem of handling errors during production.

[0051] In other embodiments, if the cleanliness requirement for the tray 200 is not high, the tray inflow module 24 may not be provided, and the empty tray on the tray recycling module 23 can be directly transported to the receiving unit 3 to load the tested chips. This can achieve the automatic transportation of the tray 200 between the feeding unit 2 and the receiving unit 3, which is not only beneficial to saving the space of the machine, but also beneficial to the turnover of the tray 200 and can reduce the number of spare trays 200.

[0052] The three modules, namely the material placement module 21, the tray recycling module 23, and the tray inflow module 24, are arranged in parallel along the X direction. The structures of the material placement module 21, the tray recycling module 23, and the tray inflow module 24 are the same and each includes a bin 25 for storing the tray 200, a handling waiting position 26 provided at the front end of the bin 25, a tray conveyor line 27 for conveying the tray 200 on the bin 25 to the handling waiting position 26, and a transfer module for supporting the tray 200 and transferring the tray 200 on the bin 25 to the tray conveyor line 27.

[0053] The tray conveyor line 27 includes a conveyor frame 271, two first drive shafts 272 provided on the frame 1, and a third synchronous pulley drive assembly 273 for driving the first drive shafts 272 to rotate. The two drive shafts 271 are connected together by a conveyor belt 274 to achieve rotational transmission between the two drive shafts 271, and two conveyor belts 274 are provided. A camera 29 for photographing the chips in the tray 200 at the handling waiting position 26 is provided on the tray conveyor line 27.

[0054] The bin 25 includes a positioning frame 251 provided on the conveyor frame 271 and a plurality of support components provided on both sides of the positioning frame 251; the positioning frame 251 is formed by enclosing four columns, and tray positioning grooves conforming to the outer circumference of the tray 200 are provided on the inner sides of the opposite columns; the support components include support blocks 252 and second cylinders 253 for driving the support blocks 252 to extend or retract. In this embodiment, four support components are provided to jointly support both sides of the tray 200.

[0055] The transfer module includes a transfer plate 281 and a transfer drive assembly 282 for driving the transfer plate 281 to move up and down. The width of the transfer plate 281 is smaller than the distance between the two conveyor belts 274 to facilitate movement between the bin and the tray conveyor line 27.

[0056] The receiving unit 3 includes a defective product receiving unit 31 and a non-defective product receiving unit 32. The defective product receiving unit 31 is provided on the right side of the conveying and transfer mechanism 5, and the non-defective product receiving unit 32 is provided on the right side of the feeding unit 2.

[0057] A number of receiving modules 33 are arranged side by side in the good product receiving unit 32. The structure of the receiving module 33 is the same as that of the material placement module 21, the tray recycling module 23, and the tray inflow module 24, enabling the trays loaded with tested chips to flow out and be stored in the storage bin, which will not be elaborated here; multiple groups of receiving modules 33 are provided, and the trays in the multiple receiving modules 33 are removed together after being filled, so as to reduce the frequency of receiving.

[0058] After the chips on the feeding unit 2 are transported, the trays will be emptied, and the receiving unit 3 requires empty trays to load the tested chips. In the prior art, the empty trays are manually taken out from the feeding unit 2 and then manually placed on the receiving unit. This not only has a large handling intensity but also wastes manpower and has a high cost. Therefore, in this solution, a tray handling mechanism 10 is provided between the feeding unit 2 and the receiving unit 3 to transport the empty trays on the feeding unit 2 to the receiving unit 3, which can realize the turnover of trays between the feeding unit 2 and the receiving unit 3, reduce the working intensity, and save costs. The tray handling mechanism 10 includes a gripper module 101 for grasping the tray 200 and a gripper driving module 102 for driving the gripper module 101 to carry out handling between the feeding unit 2 and the receiving unit 3.

[0059] The gripper driving module 102 includes a cross beam 1021 arranged on the frame 1, third transmission shafts 1022 arranged at both ends of the cross beam 1021, and a fifth driving motor 1023 for driving the third transmission shafts 1022 to rotate. The two third transmission shafts 1022 are connected together by a first transmission belt 1024 to achieve rotational transmission, and the gripper module 101 is fixed on the first transmission belt 1024 through a belt clip 103. The gripper driving module 102 spans above multiple storage bins 25 and multiple handling waiting positions 26 in the X direction, which can not only realize the handling of the tray 200 but also not interfere with the feeding and receiving operations; in this embodiment, the gripper driving module 102 is a belt linear drive. Therefore, the front and rear ends of the receiving module 33, the material placement module 21, the tray recycling module 23, and the tray inflow module 24 are arranged in alignment, so that the tray handling mechanism 10 can move linearly left and right to realize the handling of the tray.

[0060] The gripper module 101 includes a support plate 1011 fixed at one end of the belt clip 103, a first air cylinder 1012 fixed on the support plate 1011, a gripper frame 1013 driven by the first air cylinder 1012 to move up and down, a first lifting component 1014 arranged at the front end of the gripper frame 1013 for supporting the front end of the tray 200, and a second lifting component 1015 arranged at the rear end of the gripper frame 1013 for supporting the rear end of the tray 200. A first slide rail 1025 is arranged on the cross beam 1021, and the support plate 1011 is slidably arranged on the first slide rail 1025 through a first slider 1016.

[0061] The first lifting component 1014 and the second lifting component 1015 have the same structure and both include a third cylinder 10110 and a pallet 1017 driven by the third cylinder 10110 to extend or retract. The pallet 1017 has an "L" - shaped structure. The pallet 1017 includes a mounting end that extends horizontally and is located above the gripper frame 1013, and a lifting end that extends downward from the side of the gripper frame 1013 and is used to lift the tray 200. A lifting portion 1018 that extends horizontally and can extend into the bottom of the tray 200 is formed at the end of the lifting end. The two lifting portions 1018 of the first lifting component 1014 and the second lifting component 1015 are arranged oppositely to jointly lift the tray 200. To improve the stability of the movement of the first lifting component 1014 and the second lifting component 1015, the mounting end of the pallet 1017 is arranged on the upper surface of the gripper frame 1013 through a slide rail and slider.

[0062] A number of pressing rods 1019 for pressing on the upper surface of the tray 200 are also arranged on the support plate 1011. When the first lifting component 1014 and the second lifting component 1015 lift the tray 200, the number of pressing rods 1019 presses on different positions of the upper surface of the tray 200 to prevent the tray 200 from shaking during the handling process. The arranged pressing rods 1019 can ensure the stability of the tray 200 during handling.

[0063] The heating module 4 includes a heating component arranged on the frame 1 and a heating carrier 41 arranged on the heating component. A heating groove 42 conforming to the shape of the chip is arranged on the heating carrier 41. The heating component continuously heats the heating carrier 41 to synchronously heat the chip, and a thermocouple is arranged on the heating component to monitor the temperature of the heating carrier 41 in real - time; the loading and handling mechanism 7 continuously transports the chip from the material placement module 21 into the heating groove 42 of the heating carrier 41. The heating carrier 41 transfers heat to the chip to achieve the heating of the chip. At the same time, the system records the heating time and heating state of the chip. After the chip heating is completed, the system sends information to the loading and handling mechanism 7, and then transports the heated chip to the conveying and transfer mechanism 5 for the next action.

[0064] In this embodiment, two groups of heating modules 4 are arranged along the Y - direction to keep a sufficient number of chips in a heated state before testing, which can meet the testing rhythm. In other embodiments, the number of heating modules 4 can be adjusted according to the testing rhythm, and no limitation is made here.

[0065] The conveying and transferring mechanism 5 includes a first conveying and transferring mechanism 51 and a second conveying and transferring mechanism 52 arranged in parallel with the first conveying and transferring mechanism 51. The testing module 6 is arranged in the middle of the first conveying and transferring mechanism 51 and the second conveying and transferring mechanism 52. Correspondingly, the handling and pressing mechanism 8 includes a first handling and pressing mechanism 81 for handling the chips on the first conveying and transferring mechanism 51 to the testing module 6 and a second handling and pressing mechanism 82 for handling the chips on the second conveying and transferring mechanism 52 to the testing module 6. The first handling and pressing mechanism 81 and the second handling and pressing mechanism 82 are symmetrically arranged front and back and are jointly arranged on a mounting frame 83, and the mounting frame 83 is located directly above the testing module 6.

[0066] A test carrier is arranged on the testing module 6. A plurality of test slots for accommodating the chips and conforming to the shape of the chips are arranged on the test carrier. A test circuit is arranged inside the test carrier. The chips are placed in the test slots. At the same time, the handling and pressing mechanism 8 presses the chips so that the pins of the chips can be in reliable contact with the PIN pins of the test circuit to achieve conduction. After the chips are conducted with the testing module 6, relevant tests can be carried out.

[0067] The first conveying and transferring mechanism 51 and the second conveying and transferring mechanism 52 are symmetrically arranged front and back and both include a first driving motor 53, a moving platform 54 driven by the first driving motor 53 to move left and right, and a loading carrier 55 and an unloading carrier 56 arranged side by side in the X direction on the moving platform 54. The loading carrier 55 and the unloading carrier 56 can achieve synchronous linkage. The loading carrier 55 moves between the test loading station 40 and the test station 50 to achieve the loading action. At the same time, correspondingly, the unloading carrier 56 moves between the test station 50 and the test unloading station 60 to achieve the unloading action. The loading carrier 55 and the unloading carrier 56 have the same structure and are both provided with accommodation grooves 57 conforming to the shape of the chips. After the chips are heated on the heating module 4, they are first transported to the loading carrier 55 by the loading handling mechanism 7, and then the handling and pressing mechanism 8 transports the heated chips from the loading carrier 55 to the testing module 6 for testing. Therefore, a heating and heat preservation plate is arranged on the loading carrier 55, which can prevent the heated products from losing heat on the loading carrier 55 and reducing the temperature, so as to ensure accurate test conditions when the chips are heated and tested.

[0068] In this embodiment, the number of test slots on the testing module 6 is set to eight. Correspondingly, both the loading carrier 55 and the unloading carrier 56 are provided with eight accommodation grooves 57, and the arrangement of the accommodation grooves 57 on the loading carrier 55 and the unloading carrier 56 is the same, with four arranged in the X direction and two rows.

[0069] The process of the conveying and transferring mechanism 5 for conveying is as follows: The first driving motor 53 drives the moving platform 54 to drive the loading carrier 55 to be located at the test loading station 40 to receive the heated chips carried by the loading and handling mechanism 7 from the heating module 4. At the same time, the unloading carrier 56 is located at the test station 50. After the loading carrier 55 receives the chips, the first driving motor 53 drives the moving platform 54 to drive the loading carrier 55 and the unloading carrier 56 to move. The loading carrier 55 moves from the test loading station 40 to the test station 50 to wait for the loading operation. At the same time, the corresponding unloading carrier 56 moves from the test station 50 to the test unloading station 60. The first handling and pressing mechanism 81 or the second handling and pressing mechanism 82 transports the heated chips on the loading carrier 55 to the test module 6 for testing. After the loading is completed, the first driving motor 53 drives the moving platform 54 to drive the loading carrier 55 and the unloading carrier 56 to move. The loading carrier 55 moves from the test station 50 to the test loading station 40 to continue to receive the heated chips. At the same time, the corresponding unloading carrier 56 moves from the test unloading station 60 to the test station 50 to receive the tested chips. After both the loading carrier 55 and the unloading carrier 56 receive the chips, the first driving motor 53 drives the moving platform 54 to drive the loading carrier 55 and the unloading carrier 56 to move. The loading carrier 55 moves from the test loading station 40 to the test station 50 to wait for the next loading operation. At the same time, the corresponding unloading carrier 56 moves from the test station 50 to the test unloading station 60. The material handling mechanism 9 transports the tested chips on the unloading carrier 56 to the receiving unit 3 or the good product receiving unit 32, completing one test cycle of the chips. The first handling and pressing mechanism 81 and the second handling and pressing mechanism 82 act alternately, respectively and alternately transporting the chips on the first conveying and transferring mechanism 51 and the second conveying and transferring mechanism 52 to the test module 6 for testing, which can improve the test rhythm.

[0070] Both the first handling and pressing mechanism 81 and the second handling and pressing mechanism 82 include a YZ-axis driving module 84 arranged on the mounting frame 83, a moving mounting column 85 driven by the YZ-axis driving module 84 to move in the YZ direction, and an adsorption and pressing module 86 arranged at the end of the moving mounting column 85 for adsorbing and pressing the chips. A number of first adsorption components 87 are arranged on the adsorption and pressing module 86. An adsorption and pressing head 871 that imitates the shape of the chip and adsorbs and presses the chip is arranged at the lower end of the first adsorption component 87. A first adsorption channel that penetrates the upper and lower ends is arranged inside the first adsorption component 87. A first air inlet 861 corresponding to and communicating with the first adsorption channel is arranged on the side wall of the adsorption and pressing module 86. Each first air inlet 861 communicates with the corresponding first adsorption channel to form a first gas inlet and outlet channel for gas to enter and exit.

[0071] Both the loading carrier 55 and the unloading carrier 56 are provided with first positioning pins that cooperate with the adsorption and pressing module 86 for positioning. The test carrier of the test module 6 is provided with second positioning pins that cooperate with the adsorption and pressing module 86 for positioning. The bottom of the adsorption and pressing module 86 is provided with positioning holes that cooperate with the first positioning pins and the second positioning pins. So that when the adsorption and pressing module 86 is handling and pressing, a plurality of adsorption and pressing heads 871 can accurately extend into the accommodation groove 57 or the test groove to ensure that the chip can be accurately taken out or accurately pressed on the surface of the chip.

[0072] Since during testing, it is necessary to press the adsorption and pressing head 871 against the surface of the chip so that the pins of the chip can reliably contact the PIN pins of the following test circuit to achieve conduction, and relevant tests can be carried out after conduction. Therefore, the adsorption and pressing head 871 is made of copper or soft alloy material, and the bottom surface of the adsorption and pressing head 871 is smoothly arranged to avoid scratching the chip.

[0073] When the first handling and pressing mechanism 81 and the second handling and pressing mechanism 82 handle the chip, the YZ-axis driving module 84 drives the moving mounting column 85 to drive the adsorption and pressing module 86 to move to the loading carrier 55. The positioning hole of the adsorption and pressing module 86 cooperates with the first positioning pin of the loading carrier 55 for guiding and positioning, so that a plurality of adsorption and pressing heads 871 are positioned on the corresponding chips. A plurality of first gas inlet and outlet channels are simultaneously evacuated, so that a plurality of adsorption and pressing heads 871 simultaneously adsorb the chips, and the chips are transported to the test groove on the test module 6 under the drive of the YZ-axis driving module 84. The YZ-axis driving module 84 drives the moving mounting column 85 to drive the adsorption and pressing module 86 to move downward, and a plurality of adsorption and pressing heads 871 are simultaneously pressed against the upper surface of each chip, so that the pins of the chip can reliably contact the test circuit of the test module 6 to achieve conduction, and relevant tests of the chip can be completed under heating and conditioning conditions after conduction.

[0074] In this embodiment, four first adsorption components 87 are installed on each adsorption and pressing module 86, which can adsorb four chips at the same time. Therefore, two adsorption and pressing modules 86 are installed at the lower end of each moving mounting column 85, and the two modules 86 work together to adsorb and transport the chips on the loading carrier 55 or the unloading carrier 56.

[0075] The YZ-axis driving module 84 includes a third driving motor 841, a moving beam 842 that is driven by the third driving motor 841 to move in the Z direction, and a fourth driving motor 843 that drives the moving mounting column 85 to move in the Y direction. The moving beam 842 is provided with a second slide rail, and the moving mounting column 85 is slidably arranged on the second slide rail through a second slider.

[0076] The loading and handling mechanism 7 and the unloading and handling mechanism 9 have the same structure, and the loading and handling mechanism 7 and the unloading and handling mechanism 9 are symmetrically arranged on the left and right sides of the frame 1. The loading and handling mechanism 7 includes a first XY-axis driving module 71 fixed on the frame 1 and a first handling module 72 driven by the first XY-axis driving module to move in the XY directions and used for handling chips. The unloading and handling mechanism 9 includes a second XY-axis driving module 91 fixed on the frame 1 and a second handling module 92 driven by the second XY-axis driving module to move in the XY directions and used for handling chips.

[0077] The structures of the first handling module 72 and the second handling module 92 both include a handling frame 721, a second driving motor 722 arranged on the handling frame 721, a pushing plate 723 driven by the second driving motor 722 to move up and down, and a plurality of second adsorption components 724 driven by the pushing plate 723 to move downward simultaneously. The number of the second adsorption components 724 is the same as the number of the accommodation grooves 57 on the transfer table and the number of the test grooves on the test module 6, and the arrangement directions are the same. However, the tray is designed to be able to load more chips, so the chips are arranged at the smallest possible spacing; in order to improve the heating efficiency on the heating module 4, the arrangement spacing of the heating grooves on the heating module 4 is also as small as possible, but different from the arrangement spacing on the tray; affected by the test circuit, the arrangement spacing of the test grooves is different from that of the heating grooves. Therefore, the arrangement spacings of the tray, the heating grooves, and the accommodation grooves are all different. In order to be able to use the same loading and handling mechanism 7 for handling, a structure capable of adjusting the spacing between a plurality of second adsorption components 724 on the loading and handling mechanism 7 is designed to realize the handling of chips among the feeding unit 2, the heating module 4, and the conveying and transferring mechanism 5.

[0078] Every two adjacent second adsorption components 724 are in a group and are elastically and movably arranged on a moving and adjusting plate 725. Since the number of the second adsorption components 724 is eight, a total of four horizontally arranged moving and adjusting plates 725 are provided. An elastic component for resetting the second adsorption component 724 upward is arranged between the second adsorption component 724 and the moving and adjusting plate 725. An adjusting component for adjusting the spacing of the moving and adjusting plate 725 in the X direction is arranged on the handling frame 721.

[0079] The adjustment assembly includes a rotation driving member 727 disposed on the handling frame 721 and an adjustment shaft 728 driven by the rotation driving member 727 to rotate. A spiral groove is provided on the outer wall of the adjustment shaft 728. A plurality of moving adjustment plates 725 are provided with avoidance grooves for the adjustment shaft 728 to pass through. The upper groove wall of the avoidance groove is provided with a pin shaft 729 extending into the spiral groove of the adjustment shaft 728. When the rotation driving member 727 drives the adjustment shaft 728 to rotate, the pin shaft 729 moves in the spiral groove of the screw 7172 and drives the moving adjustment plate 725 to move in the X direction. The moving adjustment plate 72 drives the second adsorption assembly 724 to move in the X direction, thereby realizing the adjustment of the spacing between several second adsorption assemblies 724 in the X direction. In order to improve the stability of the moving adjustment plate 725 during movement, the four moving adjustment plates 725 are movably mounted on the handling frame 721 through a plurality of support guide rods 726. The support guide rods 726 are movably disposed inside the moving adjustment plate 725, and both ends of the support guide rods 726 are fixed to the handling frame 721.

[0080] The second adsorption assembly 724 includes a mounting block 7241 at the upper end and an adsorption rod 7242 disposed at the lower end of the mounting block. The adsorption rod 7242 is mounted on the moving adjustment plate 725 through a bearing. The lower end of the mounting block 7241 is connected to the moving adjustment plate 725 through an elastic component. The elastic component includes a spring pull rod fixed to the upper end of the moving adjustment plate 725 and a spring having its upper end disposed on the spring pull rod and its lower end fixed to the mounting block 7241. When the pushing plate 723 pushes the adsorption assembly 724 downward, the spring is stretched. When the pushing plate 723 moves upward, the spring contracts to drive the adsorption assembly 724 to rise and reset. In order to improve the stability of the up-and-down movement of the adsorption rod 7242, a plurality of guide rods 7244 are installed between the mounting block 7241 and the moving adjustment plate 725. Two second adsorption assemblies 724 are mounted on one moving adjustment plate 725. Horizontal support shafts 7246 for the pushing plate 723 to push are provided on the relatively inner sides of the two second adsorption assemblies 724.

[0081] In this embodiment, there are two rows of a total of eight adsorption assemblies, which are driven by the same pushing plate 723 to move up and down, and at the same time, the spacing between each adsorption assembly is adjusted by the same adjustment assembly. The structure of the adjustment assembly is simple and compact, occupying a small space. In other embodiments, the number of adsorption assemblies and the arrangement of the adsorption assemblies can be designed according to actual situations. Therefore, the handling module designed in this solution can realize the adjustment of the spacing between several adsorption assemblies through one adjustment assembly, with a simple design structure and a small occupied space.

[0082] The adsorption rod 7242 includes a second adsorption head 7243 provided at the lower end for adsorbing the chip and a second adsorption channel penetrating through the upper and lower ends. A second air inlet 7245 communicating with the second adsorption channel is provided on the side wall of the mounting block 7241. The second air inlet 7245 and the second adsorption channel communicate to form a second gas inlet and outlet channel for gas to enter and exit.

[0083] The structures of the first XY-axis driving module 71 and the second XY-axis driving module 91 both include a first transmission component 711 fixed on the frame 1, a moving cantilever beam 712 that moves in the Y direction under the drive of the first transmission component 711, and a second transmission component 713 fixed on the moving cantilever beam 712. The second transmission component 713 drives the first handling module 72 or the second handling module 92 to move in the X direction.

[0084] Both the first transmission component 711 and the second transmission component 713 include two second transmission shafts 7111 and a second driving motor 7112 for driving the second transmission shafts 7111 to rotate. The two transmission shafts 7111 are connected together by a second transmission belt 7113 to achieve rotational transmission between the two second transmission shafts 7111. The second driving motor 7112 of the first transmission component 711 is arranged along the Z direction, and the driving motor of the second transmission component 713 is arranged along the Y direction. The reasonable layout of the two motors can save space.

[0085] Since the right end of the first XY-axis driving module 71 and the left end of the second XY-axis driving module 91 are both designed as moving cantilever beams, when the first handling module 72 and the second handling module 92 move at a high frequency, the first XY-axis driving module 71 and the second XY-axis driving module 91 will generate a shaking phenomenon, thus affecting the accuracy of the first handling module 72 and the second handling module 92 in grasping and handling. In addition, since the bottoms of the first XY-axis driving module 71 and the second XY-axis driving module 91 have overlapping movements with the conveying and transfer mechanism 5, there is no position below the first XY-axis driving module 71 and the second XY-axis driving module 91 to set up a motion track. Therefore, a first roller assembly 73 is provided at the upper right end of the first XY-axis driving module 71, a second roller assembly 93 is provided at the upper left end of the second XY-axis driving module 91, a first guide rail 831 for the first roller assembly 73 to move back and forth is provided on the left side of the mounting frame 83, and a second guide rail 832 for the second roller assembly 93 to move back and forth is provided on the right side. The first roller assembly 73 is movably arranged on the first guide rail 831, and the second roller assembly 93 is movably arranged on the second guide rail 832. When the first XY-axis driving module 71 and the second XY-axis driving module 91 move back and forth, the moving cantilever beams 712 are respectively supported on the first guide rail 831 and the second guide rail 832, which can ensure the stability of the back-and-forth movement, thereby ensuring the accuracy of the first handling module 72 and the second handling module 92 in grasping and handling; the first roller assembly 73 and the second roller assembly 93 are respectively located in the upper left and upper right, and will not interfere with the movement of the conveying and transfer mechanism 5.

[0086] The first roller assembly 73 includes a first roller bracket 731 fixed to the right end of the first XY-axis driving module 71 and a pair of first rollers 732 fixed to the first roller bracket 731 and rolling on the first guide rail 831 provided thereon; the second roller assembly 93 includes a second roller bracket fixed to the left end of the second XY-axis driving module 91 and a pair of second rollers fixed to the second roller bracket and rolling on the second guide rail 832.

[0087] When applying a chip heating test device 100 provided by the present solution, first place the tray 200 containing chips into the bin 25 of the material placement module 21. The tray 200 is placed on the transfer module, and the bottommost tray 200 is transferred to one end of the tray conveyor line 27 via the transfer module and conveyed to the handling waiting position 26 by the tray conveyor line 27. The chip is handled by the loading handling mechanism 7 onto the heating module 4 for heating. Meanwhile, place multiple clean empty trays on the tray inflow module 24. With the same actions as the above feeding, the penultimate empty tray enters the handling waiting position 26 of the tray inflow module 24, and the empty tray on the tray inflow module 24 is handled by the tray handling mechanism 10 to the receiving unit 3 to load the tested chips; after the chips in the tray 200 on the handling waiting position 26 of the material placement module 21 are completely grabbed, the empty tray on the material placement module 21 is handled by the tray handling mechanism 10 to the handling waiting position 26 of the tray recycling module 23, and then the empty tray is conveyed to the bin 25 end of the tray recycling module 23 by the tray conveyor line 27 and supported on the support assembly; after the chip on the heating module 4 is heated, the first drive motor 53 drives the moving platform 54 to drive the loading carrier 55 to be located at the test loading station 40 to receive the heated chip handled by the loading handling mechanism 7 from the heating module 4. Meanwhile, the unloading carrier 56 is located at the test station 50. After the loading carrier 55 receives the chip, the first drive motor 53 drives the moving platform 54 to drive the loading carrier 55 and the unloading carrier 56 to move. The loading carrier 55 moves from the test loading station 40 to the test station 50 to wait for the loading action, and at the same time, the corresponding unloading carrier 56 moves from the test station 50 to the test unloading station 60. The first handling pressing mechanism 81 and the second handling pressing mechanism 82 act alternately to alternately handle the chips on the loading carrier 55 of the first conveying transfer mechanism 51 and the second conveying transfer mechanism 52 to the test module 6 for testing. When the first handling pressing mechanism 81 and the second handling pressing mechanism 82 handle the chips, the YZ-axis drive module 84 drives the moving mounting column 85 to drive the adsorption pressing module 86 to move onto the loading carrier 55. The positioning holes of the adsorption pressing module 86 cooperate with the first positioning pins of the loading carrier 55 for guiding and positioning, so that a plurality of adsorption pressing heads 871 are positioned on the corresponding chips. A plurality of first gas inlet and outlet channels are evacuated simultaneously, so that a plurality of adsorption pressing heads 871 simultaneously adsorb the chips, and the chips are handled to the test slots on the test module 6 under the drive of the YZ-axis drive module 84. The YZ-axis drive module 84 drives the moving mounting column 85 to drive the adsorption pressing module 86 to move downward, and a plurality of adsorption pressing heads 871 simultaneously press on the upper surfaces of each chip, so that the pins of the chip can be in reliable contact with the test circuit of the test module 6 to achieve conduction, and after conduction, the relevant tests of the chip under heating conditions can be completed;After the loading is completed, the first driving motor 53 drives the moving platform 54 to drive the loading carrier 55 and the unloading carrier 56 to move. The loading carrier 55 moves from the testing station 50 to the testing loading station 40 to continue receiving the chips that have been heated. At the same time, the corresponding unloading carrier 56 moves from the testing unloading station 60 to the testing station 50 to receive the chips that have been tested. After both the loading carrier 55 and the unloading carrier 56 have completed receiving, the first driving motor 53 drives the moving platform 54 to drive the loading carrier 55 and the unloading carrier 56 to move. The loading carrier 55 moves from the testing loading station 40 to the testing station 50 to await the next loading operation. At the same time, the corresponding unloading carrier 56 moves from the testing station 50 to the testing unloading station 60. The material handling mechanism 9 transports the chips that have been tested on the unloading carrier 56 at the testing unloading station 60 to the receiving unit 3. The defective products are placed in the defective product receiving unit 31, and the tested qualified products are placed in the handling waiting position 26 of the receiving module 33 of the qualified product receiving unit 32. After a whole tray is filled, the tray 200 is transported to the storage bin via the tray conveyor line 27 to obtain the tested and tray-filled chips.;

[0088] The chip heating test method includes the following steps:

[0089] S1. The loading and handling mechanism 7 transports the chips on the feeding unit 2 to the heating module 4 for heating;

[0090] S2. The loading and handling mechanism 7 transports the chips that have been heated on the heating module 4 to the loading carrier 55 at the testing loading station 40. At this time, the unloading carrier 56 is located at the testing station 50;

[0091] S3. The first driving motor 53 drives the moving platform 54 to drive the loading carrier 55 to move from the testing loading station 40 to the testing station 50, and at the same time, the unloading carrier 56 moves from the testing station 50 to the testing unloading station 60;

[0092] S4. The handling and pressing mechanism 8 transports the chips that have been heated on the loading carrier 55 to the testing module 6 to complete the loading operation. The handling and pressing mechanism 8 continues to press on the surface of the chip so that the pins of the chip can be in reliable contact with the test circuit of the testing module 6 to achieve conduction. After conduction, the test of the chip under heating conditions can be completed;

[0093] S5. The first driving motor 53 drives the moving platform 54 to drive the loading carrier 55 to move from the testing station 50 to the testing loading station 40 to continue receiving the chips that have been heated and transported by the loading and handling mechanism 7; at the same time, the unloading carrier 56 moves from the testing unloading station 60 to the testing station 50 to receive the chips that have been tested and transported by the handling and pressing mechanism 8;

[0094] After the loading carrier 55 and the unloading carrier 56 have completed receiving, the first driving motor 53 drives the moving platform 54 to drive the loading carrier 55 to move from the test loading station 40 to the test station 50 for the next loading action. At the same time, the unloading carrier 56 moves from the test station 50 to the test unloading station 60, and the unloading handling mechanism 9 transports the tested chips on the unloading carrier 56 at the test unloading station 60 to the receiving unit 3 to complete the testing of the chips.

[0095] The above are only some embodiments of the present invention. For those of ordinary skill in the art, without departing from the inventive concept of the present invention, several variations and improvements can still be made, and these all fall within the protection scope of the present invention.

Claims

1. A chip heating test device, characterized in that: It includes a frame, a test loading station, a test station, and a test unloading station arranged in sequence along the X direction, a conveying and transfer mechanism for chip conveying among the above three stations, a heating module arranged beside the test loading station for heating the chips, a test module arranged at the test station for testing the heated chips, a handling and pressing mechanism for handling the chips on the conveying and transfer mechanism onto the test module and pressing the chips tightly to ensure reliable contact with the test module for conduction, a feeding unit arranged beside the heating module, a receiving unit arranged beside the test unloading station, a loading handling mechanism for chip handling among the feeding unit, the heating module, and the conveying and transfer mechanism, a unloading handling mechanism for handling the tested chips on the transfer and conveying mechanism at the test unloading station onto the receiving unit, and a tray handling mechanism for tray handling between the feeding unit and the receiving unit; The loading handling mechanism includes a first handling module for handling chips. The first handling module includes a plurality of second adsorption components, the second adsorption components are movably arranged on a moving adjustment plate, and an adjustment component for adjusting the spacing of the plurality of moving adjustment plates in the X direction is arranged on the first handling module.

2. The chip heating test device according to claim 1, characterized in that: The heating module includes a heating component arranged on the frame and a heating carrier arranged on the heating component. A heating groove conforming to the shape of the chip is arranged on the heating carrier; a test carrier is arranged on the test module, and a test circuit and a plurality of test grooves for accommodating the chip and conforming to the shape of the chip are arranged on the test carrier.

3. The chip heating test device according to claim 1, characterized in that: The conveying and transfer mechanism includes a loading carrier for moving between the test loading station and the test station to achieve the loading action, an unloading carrier for moving between the test station and the test unloading station to achieve the unloading action, a moving platform for installing and fixing the loading carrier and the unloading carrier, and a first driving motor for driving the moving platform to move in the X direction; the conveying and transfer mechanism includes a first conveying and transfer mechanism and a second conveying and transfer mechanism arranged in parallel with the first conveying and transfer mechanism, and the test module is arranged between the first conveying and transfer mechanism and the second conveying and transfer mechanism.

4. The chip heating test device according to claim 3, characterized in that: The handling and pressing mechanism includes a first handling and pressing mechanism for handling the chips on the first conveying and transfer mechanism onto the test module and a second handling and pressing mechanism for handling the chips on the second conveying and transfer mechanism onto the test module. The first handling and pressing mechanism and the second handling and pressing mechanism are symmetrically arranged front and back and are jointly arranged on an installation frame.

5. The chip heating test device according to claim 4, wherein: The first handling and pressing mechanism and the second handling and pressing mechanism both include a YZ-axis driving module arranged on the mounting frame, a moving mounting column driven by the YZ-axis driving module to move in the YZ direction, and an adsorption and pressing module arranged at the end of the moving mounting column for adsorbing and pressing the chip. A plurality of first adsorption components are arranged on the adsorption and pressing module, and an adsorption and pressing head that is shaped like the chip and adsorbs and presses the chip is arranged at the lower end of the first adsorption component.

6. The chip heating test device according to claim 4, wherein: The loading and handling mechanism further includes a first XY-axis driving module that drives the first handling module to move in the XY direction and is used to handle the chip; the unloading and handling mechanism includes a second XY-axis driving module fixed on the frame and a second handling module that is driven by the second XY-axis driving module to move in the XY direction and is used to handle the chip. The structure of the second handling module is the same as that of the first handling module.

7. The chip heating test device according to claim 1, characterized in that: The first handling module further includes a handling frame, a second driving motor arranged on the handling frame, and a pushing plate driven by the second driving motor to move up and down. The pushing plate pushes a plurality of second adsorption components to move downward simultaneously. An elastic component for resetting the second adsorption component upward is arranged between the second adsorption component and the moving adjustment plate.

8. The chip heating test device according to claim 7, wherein: The adjustment component includes a rotation driving part arranged on the handling frame and an adjustment shaft driven by the rotation driving part to rotate. A spiral groove is arranged on the outer wall of the adjustment shaft. A plurality of moving adjustment plates are provided with avoidance grooves for the adjustment shaft to pass through, and a pin shaft extending into the spiral groove is arranged on the groove wall at the upper end of the avoidance groove.

9. The chip heating test device according to claim 6, characterized in that: A first roller assembly is arranged at the upper right end of the first XY-axis driving module, and a second roller assembly is arranged at the upper left end of the second XY-axis driving module. A first guide rail for the first roller assembly to move back and forth is arranged on the left side of the mounting frame, and a second guide rail for the second roller assembly to move back and forth is arranged on the right side; both the first roller assembly and the second roller assembly include a roller bracket and a roller.

10. A chip heating test device according to claim 1, characterized in that: The tray handling mechanism includes a gripper module for grasping the tray and a gripper driving module for driving the gripper module to handle between the feeding unit and the receiving unit. The gripper module includes a support plate, a first cylinder fixed on the support plate, a gripper frame driven by the first cylinder to move up and down, a first lifting component arranged at the front end of the gripper frame for supporting the front end of the tray, and a second lifting component arranged at the rear end of the gripper frame for supporting the rear end of the tray. A plurality of pressing rods for pressing on the upper surface of the tray are arranged on the support plate.

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