Developing device for thick film circuit

Abstract

The utility model provides a thick film circuit developing device and relates to the technical field of thick film circuit developing. The thick film circuit developing device comprises a developing box body, a conveying mechanism is arranged in the developing box body and used for conveying a thick film circuit substrate in the first horizontal direction, a supporting frame and a driving mechanism are installed in the developing box body, a sliding rod is horizontally and slidably installed on the supporting frame in the second horizontal direction, and an installation frame is installed on the sliding rod; a developing nozzle is mounted on the mounting frame and located on the upper side of the conveying mechanism, and the driving mechanism can drive the sliding rod to horizontally slide back and forth relative to the supporting frame. Based on the technical scheme provided by the utility model, the thick film circuit developing device can enable developing liquid to be uniformly sprayed on the surface of the substrate, so that the probability of short circuit and open circuit during etching is reduced, and the yield is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of thick film circuit development, in particular to a thick film circuit development device. Background Art

[0002] Thick film circuit development refers to the process of removing the unexposed photoresist on the thick film circuit substrate to be developed through a specific developer during the production of thick film circuits, thereby revealing the required circuit pattern. The developer needs to be evenly sprayed or coated on the surface of the substrate, and then the development time is controlled according to the instructions of the developer.

[0003] The position of the development nozzle of the existing thick film circuit development device is fixed, so that the developer cannot be evenly sprayed on the surface of the substrate, resulting in frequent short circuits and open circuits in subsequent etching and low yield. Therefore, it is necessary to design a thick film circuit development device that can evenly spray the developer on the surface of the substrate, thereby reducing the probability of short circuits and open circuits in etching and improving the yield. Summary of the Utility Model

[0004] In view of the above problems in the prior art, the present application proposes a thick film circuit development device that can evenly spray the developer on the surface of the substrate, thereby reducing the probability of short circuits and open circuits in etching and improving the yield.

[0005] The utility model provides a thick film circuit development device, which includes a development box body. A conveying mechanism is arranged in the development box body and is used for conveying a thick film circuit substrate along a first horizontal direction. A support frame and a driving mechanism are installed in the development box body. A sliding rod is horizontally slidably installed on the support frame along a second horizontal direction. An installation frame is installed on the sliding rod, and a development nozzle is installed on the installation frame. The development nozzle is located above the conveying mechanism, and the driving mechanism can drive the sliding rod to reciprocate horizontally relative to the support frame.

[0006] As a further improvement of the above technical solution:

[0007] In the above-mentioned thick film circuit development device, further, a support seat is installed on the inner side of the development box body, a rotary driving part is installed on the support seat, an eccentric cam is installed on the output shaft of the rotary driving part, two abutting plates are installed in parallel at the end of the sliding rod, the eccentric cam is limited between the two abutting plates, and the rotary driving part drives the eccentric cam to rotate, which can drive the sliding rod to reciprocate horizontally relative to the support frame.

[0008] The above-mentioned thick film circuit developing device. Further, the mounting frame includes a mounting rod which is arranged along the first horizontal direction. A plurality of support rods are symmetrically arranged on the opposite sides of the mounting rod, and the developing nozzle is mounted on the support rods.

[0009] The above technical features can be combined in various suitable ways or replaced by equivalent technical features as long as the object of the present invention can be achieved.

[0010] Compared with the prior art, the thick film circuit developing device provided by the present invention has at least the following beneficial effects: When it is necessary to develop a thick film circuit substrate, the thick film circuit substrate is placed on the conveying mechanism. The conveying mechanism conveys the thick film circuit substrate along the first horizontal direction. The developing nozzle located above the conveying mechanism sprays the developing solution on the surface of the substrate. At the same time, the driving mechanism drives the sliding rod to reciprocate horizontally along the second horizontal direction relative to the support frame, so that the developing solution can be evenly sprayed on the surface of the substrate, thereby reducing the probability of etching short circuits and open circuits and improving the yield.

[0011] In order to make the above objects, features and advantages of the present invention more obvious and understandable, the following specific preferred embodiments are given and described in detail in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention, and therefore should not be regarded as limiting the scope. For those of ordinary skill in the art, other related drawings can be obtained based on these drawings without creative efforts.

[0013] In the following, the present invention will be described in more detail based on the embodiments and with reference to the accompanying drawings. Among them:

[0014] Figure 1 Shows a schematic structural diagram of the thick film circuit developing device provided by the embodiment of the present invention.

[0015] In the drawings, the same components are denoted by the same reference numerals. The drawings are not drawn to actual scale.

[0016] DESCRIPTION OF THE REFERENCE NUMERALS

[0017] 100 - Thick film circuit developing device, 110 - Developing box body, 111 - Support frame, 112 - Sliding rod, 113 - Mounting frame, 114 - Developing nozzle, 115 - Support seat, 116 - Rotary driving member, 117 - Eccentric cam, 118 - Contact plate, 119 - Mounting rod, 120 - Support rod, 130 - Conveying mechanism. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] Embodiments of the present utility model will be described in detail below. Examples of the embodiments are shown in the accompanying drawings, where the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the accompanying drawings are exemplary and are only used to explain the present utility model and should not be construed as a limitation to the present utility model.

[0019] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present utility model.

[0020] In addition, the terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, the meaning of "a plurality" is two or more unless otherwise specifically defined.

[0021] In the present utility model, unless otherwise clearly defined and limited, terms such as "mounted", "connected", "connected to", "fixed" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0022] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "under", "below" and "beneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0023] The present utility model will be further described below in conjunction with the accompanying drawings.

[0024] An embodiment of the present utility model provides a thick film circuit developing device 100, which can evenly spray the developing solution on the surface of the substrate, thereby reducing the probability of etching short circuits and open circuits and improving the yield.

[0025] Please refer to Figure 1 , the thick film circuit developing device 100 provided by the embodiment of the present utility model. The thick film circuit developing device 100 includes a developing box body 110. A conveying mechanism 130 is arranged in the developing box body 110. The conveying mechanism 130 is used to convey the thick film circuit substrate along the first horizontal direction. A support frame 111 and a driving mechanism are installed in the developing box body 110. A sliding rod 112 is horizontally slidably installed on the support frame 111 along the second horizontal direction. An installation frame 113 is installed on the sliding rod 112. A developing nozzle 114 is installed on the installation frame 113. The developing nozzle 114 is located above the conveying mechanism 130. The driving mechanism can drive the sliding rod 112 to reciprocate horizontally relative to the support frame 111.

[0026] When the thick film circuit substrate needs to be developed, the thick film circuit substrate is placed on the conveying mechanism 130. The conveying mechanism 130 conveys the thick film circuit substrate along the first horizontal direction. The developing nozzle 114 located above the conveying mechanism 130 sprays the developing solution on the surface of the substrate. At the same time, the driving mechanism drives the sliding rod 112 to reciprocate horizontally relative to the support frame 111 along the second horizontal direction, so that the developing solution can be evenly sprayed on the surface of the substrate, thereby reducing the probability of etching short circuits and open circuits and improving the yield.

[0027] For the thick film circuit developing device 100 provided by the embodiment of the present utility model, specifically, please refer to Figure 1 , a support seat 115 is installed on the inner side of the developing box body 110. A rotary driving member 116 is installed on the support seat 115. An eccentric cam 117 is installed on the output shaft of the rotary driving member 116. Two abutting plates 118 are installed in parallel at the end of the sliding rod 112. The eccentric cam 117 is limited between the two abutting plates 118. The rotary driving member 116 drives the eccentric cam 117 to rotate, which can drive the sliding rod 112 to reciprocate horizontally relative to the support frame 111. In this embodiment, the rotary driving member 116 is a driving motor. The driving motor drives the eccentric cam 117 to rotate. And because the eccentric cam 117 is limited between the two abutting plates 118, the eccentric cam 117 drives the sliding rod 112 to reciprocate horizontally relative to the support frame 111.

[0028] For the thick film circuit developing device 100 provided by the embodiment of the present utility model, specifically, please refer to Figure 1, the mounting bracket 113 includes a mounting rod 119 which is arranged along the first horizontal direction. A plurality of support rods 120 are symmetrically provided on the opposite sides of the mounting rod 119, and the developing nozzle 114 is mounted on the support rods 120. The conveying mechanism 130 can be belt conveying or other conveying means.

[0029] In the description of this specification, the descriptions with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. mean that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, without contradiction, those skilled in the art can combine the different embodiments or examples described in this specification and the features of the different embodiments or examples.

[0030] Although the present invention has been described herein with reference to specific embodiments, it should be understood that these embodiments are merely examples of the principles and applications of the present invention. Therefore, it should be understood that many modifications can be made to the exemplary embodiments, and other arrangements can be designed, as long as they do not deviate from the spirit and scope of the present invention defined by the appended claims. It should be understood that the different dependent claims and the features described herein can be combined in a manner different from that described in the original claims. It should also be understood that the features described in connection with a single embodiment can be used in other described embodiments.

Claims

1. A thick film circuit developing device, characterized in that, The thick film circuit developing device includes a developing box body, a conveying mechanism is arranged in the developing box body, the conveying mechanism is used for conveying a thick film circuit substrate along a first horizontal direction, a support frame and a driving mechanism are installed in the developing box body, a sliding rod is horizontally and slidably installed on the support frame along a second horizontal direction, a mounting frame is installed on the sliding rod, a developing nozzle is installed on the mounting frame, the developing nozzle is located above the conveying mechanism, and the driving mechanism can drive the sliding rod to reciprocate horizontally relative to the support frame.

2. The thick film circuit developing device according to claim 1, wherein A support seat is installed on the inner side of the developing box body, a rotary driving part is installed on the support seat, an eccentric cam is installed on the output shaft of the rotary driving part, two abutting plates are installed in parallel at the end of the sliding rod, the eccentric cam is limited between the two abutting plates, and the rotary driving part drives the eccentric cam to rotate, which can drive the sliding rod to reciprocate horizontally relative to the support frame.

3. The thick film circuit developing device according to claim 1, characterized in that, The mounting frame includes a mounting rod, the mounting rod is arranged along the first horizontal direction, a plurality of support rods are symmetrically arranged on opposite sides of the mounting rod, and the developing nozzle is installed on the support rods.

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