Tank type cleaning system

Abstract

The utility model relates to a groove type cleaning system. The groove type cleaning system comprises at least two groove type cleaning machines and a second silicon wafer transfer mechanism. Each groove type cleaning machine comprises a plurality of processing grooves and a first silicon wafer transfer mechanism. The second silicon wafer transferring mechanism can grab the silicon wafers and enable the silicon wafers to be transferred between the processing grooves of the two groove type cleaning machines. On one hand, all the groove type cleaning machines can independently work, and under the transfer of the first silicon wafer transfer mechanism, silicon wafers are subjected to various treatments in sequence through all the treatment grooves; on the other hand, when one processing groove of one groove type cleaning machine is abnormal, the silicon wafer in front of the abnormal processing groove can be transferred by the second silicon wafer transfer mechanism to enter the other groove type cleaning machine for various subsequent processing steps; therefore, the defects of scrapping, badness or reworking caused by the fact that the abnormal silicon wafer in front of the processing groove is not processed in time can be avoided, the production efficiency is improved, the reworking rate is reduced, and the rejection rate is reduced.

Description

Technical Field

[0001] This application relates to the technical field of silicon wafer cleaning, and particularly to a tank cleaning system. Background Art

[0002] With the rapid development of solar cell technology, TOPCon (Tunnel Oxide Passivated Contact) cells, HJT (Hereto-junction with Intrinsic Thin-layer heterojunction) cells, and XBC (X Back Contact, a general term for various back-contact crystalline silicon solar cells) cells are blooming, and are attracting more and more attention.

[0003] The production process of crystalline silicon cells usually involves a tank cleaning machine, which meets various functions such as texturing, alkaline polishing, RCA cleaning, etc. Taking the texturing function as an example, low-concentration alkaline texturing is often used to form surface pyramids and reduce reflectivity. This process has become the standard process in the industry. Taking the current standard texturing and cleaning process as an example, the main process steps include: SDE damage removal → water washing → pre-cleaning → water washing → texturing → water tank → post-cleaning → water washing → pickling → water washing → slow lifting → drying.

[0004] Although the texturing process has been standardized, various abnormalities often occur in the tank texturing machine, including but not limited to robotic arm abnormalities, tank jams, etc. These abnormalities often take a long time to handle, reaching 30 min - 60 min. During this processing time, the silicon wafers in the previous steps are blocked in different tanks of the tank cleaning machine. Among them, when there are silicon wafers inside the tanks corresponding to the SDE damage removal and texturing steps, it will cause abnormal thinning of the silicon wafers. If not processed in time, it often results in scrapping; the pre-cleaning and post-cleaning tanks will also cause continuous corrosion of the silicon wafers located inside, seriously affecting the surface microstructure and causing rework; if the pickling tank has an overtime, if the time is too long, tetrafluorosilicate will also be deposited on the silicon wafer surface, affecting the surface microstructure of the silicon wafer. This time is controlled at 30 min. If the HF tank overtime is greater than 30 min, rework is required, and if it is less than 30 min, it flows downstream normally, resulting in a significant reduction in production efficiency. Summary of the Invention

[0005] Based on this, it is necessary to overcome the defects of the prior art and provide a tank cleaning system that can reduce or eliminate the problems of scrapping or rework caused by equipment abnormalities, improve production efficiency, reduce the rework rate, and reduce the scrap rate.

[0006] A tank cleaning system, the tank cleaning system includes:

[0007] At least two tank cleaning machines, each of the tank cleaning machines including a plurality of processing tanks and a first wafer transfer mechanism capable of grasping a wafer and transferring the wafer between the respective processing tanks of the same tank cleaning machine; and

[0008] A second wafer transfer mechanism capable of grasping a wafer and transferring the wafer between the processing tanks of the two tank cleaning machines.

[0009] In one embodiment, all the processing tanks of each of the tank cleaning machines are arranged in sequence along a first direction Z; the positions of the respective processing tanks of all the tank cleaning machines are correspondingly arranged, and the second wafer transfer mechanism is used to transfer the wafer between two correspondingly arranged processing tanks.

[0010] In one embodiment, there are a plurality of the second wafer transfer mechanisms, and all the second wafer transfer mechanisms are arranged at intervals in sequence along the first direction Z.

[0011] In one embodiment, the processing tank includes a water tank, and the second wafer transfer mechanism is used to transfer the wafer between two correspondingly arranged water tanks.

[0012] In one embodiment, the tank cleaning system further includes a spare water tank corresponding to the second wafer transfer mechanism, the spare water tank is arranged between two water tanks corresponding to the second wafer transfer mechanism, and the second wafer transfer mechanism can also be used to transfer the wafer between the spare water tank and the two water tanks.

[0013] In one embodiment, the first wafer transfer mechanism of each of the tank cleaning machines is provided as at least two, and all the first wafer transfer mechanisms are arranged in sequence along the first direction Z.

[0014] In one embodiment, there is at least one overlap between the processing tanks responsible for being transferred by two adjacent first wafer transfer mechanisms along the first direction Z.

[0015] In one embodiment, the overlapping processing tanks between two adjacent first wafer transfer mechanisms along the first direction Z are water tanks.

[0016] In one embodiment, the tank cleaning machine is a texturing cleaning machine; the texturing cleaning machine includes an SDE tank, a first water tank, a pre-cleaning tank, a second water tank, a texturing tank, a third water tank, a post-cleaning tank, a fourth water tank, an acid pickling tank, a fifth water tank, a slow lift tank, and a drying tank arranged in sequence along the first direction Z.

[0017] In one embodiment, there are two pre - cleaning tanks which are arranged in sequence between the first water tank and the second water tank; there are three texturing tanks which are arranged in sequence between the second water tank and the third water tank; there are two third water tanks which are arranged in sequence between the texturing tanks and the post - cleaning tank; there are five drying tanks which are arranged in sequence behind the slow lifting tank.

[0018] For the above - mentioned tank - type cleaning system, on the one hand, each tank - type cleaning machine can work independently. Under the transfer of the first wafer transfer mechanism, the wafers pass through each processing tank in sequence for various treatments. On the other hand, when one of the processing tanks of a tank - type cleaning machine is abnormal, the wafers in front of the abnormal processing tank can enter another tank - type cleaning machine through the transfer of the second wafer transfer mechanism for subsequent various processing steps. In this way, it can be avoided that the wafers in front of the abnormal processing tank are scrapped, defective or reworked due to untimely processing, that is, the wafers in front of the abnormal processing tank can be processed in time by another normally working tank - type cleaning machine, so as to reduce or eliminate the problems of scrapping or rework caused by equipment abnormalities, improve production efficiency, reduce the rework rate and reduce the scrap rate. Brief Description of the Drawings

[0019] Figure 1 It is a simplified structure diagram of the tank - type cleaning system according to an embodiment of the present application.

[0020] Figure 2 It is a simplified structure diagram of the tank - type cleaning system according to another embodiment of the present application.

[0021] Figure 3 It is a simplified structure diagram of the tank - type cleaning system according to still another embodiment of the present application.

[0022] Figure 4 It is a simplified structure diagram of the tank - type cleaning system according to yet another embodiment of the present application.

[0023] Figure 5 The tank - type cleaning system according to an embodiment of the present application is specifically a structure diagram of a texturing cleaning machine.

[0024] 10. Tank - type cleaning machine; 11. Processing tank; 111. Water tank; 12. First wafer transfer mechanism; 20. Second wafer transfer mechanism; 30. Spare water tank. Detailed Embodiments

[0025] To make the above objects, features, and advantages of the present application more apparent and understandable, the following provides a detailed description of the specific embodiments of the present application in conjunction with the accompanying drawings. Many specific details are set forth in the following description to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present application. Therefore, the present application is not limited by the specific embodiments disclosed below.

[0026] It should be noted that the process of the standard texturing cleaning process in the related art generally includes: SDE damage removal → water washing → pre-cleaning → water washing → texturing → water tank → post-cleaning → water washing → pickling → water washing → slow lifting → drying. Correspondingly, the SDE damage removal tank mainly uses an alkali (such as NaOH) to remove the damaged layer on the surface of the silicon wafer caused by cutting, and at the same time remove large particles on the surface of the silicon wafer; the water washing tank, also called the water tank, mainly functions to remove the chemicals in the previous tank before dilution, clean the surface of the silicon wafer, and prevent various chemicals from mixing in the tank; the pre-cleaning tank uses a cleaning method of alkali plus hydrogen peroxide, which comes from the RCA cleaning solution, and can effectively remove organic substances on the surface of the silicon wafer; the texturing tank mainly uses additives and alkali to form a dense pyramid on the surface of the silicon wafer, reduce the light reflection of the battery chip, and improve the efficiency of the battery chip; the post-cleaning tank cleans the additives remaining on the surface of the silicon wafer after texturing and cleans the surface of the silicon wafer; the pickling tank, such as hydrofluoric acid, removes the oxide layer on the surface of the silicon wafer to prepare for drying; the slow lifting tank reduces the water on the surface of the silicon wafer to prepare for drying; the drying tank removes the water on the surface of the silicon wafer to prepare for the next process.

[0027] As described in the background art, various abnormalities often occur in the existing tank cleaning machines, such as manipulator abnormalities and tank jams. The probability of abnormalities occurring is 4 - 5 times per month, and each occurrence will cause different degrees of scrap and rework problems. For the above reasons, the present application provides a tank cleaning system, which can reduce or eliminate the problems of scrap or rework caused by equipment abnormalities, improve production efficiency, reduce the rework rate, and reduce the scrap rate.

[0028] Refer to Figure 1 , Figure 1 , which shows a simplified structural diagram of the tank cleaning system according to an embodiment of the present application. A tank cleaning system provided by an embodiment of the present application includes: at least two tank cleaning machines 10 and a second wafer transfer mechanism 20. Each tank cleaning machine 10 includes a plurality of processing tanks 11 and a first wafer transfer mechanism 12 that can grab the wafer and transfer the wafer between the respective processing tanks 11 of the same tank cleaning machine 10. The second wafer transfer mechanism 20 can grab the wafer and transfer the wafer between the processing tanks 11 of the two tank cleaning machines 10.

[0029] The above-mentioned slot cleaning system, on the one hand, each slot cleaning machine 10 can work independently. Under the transfer of the first wafer transfer mechanism 12, wafers pass through each processing tank 11 in sequence to perform various processes; on the other hand, when one of the processing tanks 11 of a slot cleaning machine 10 is abnormal, the wafers in front of the abnormal processing tank 11 can enter another slot cleaning machine 10 through the transfer of the second wafer transfer mechanism 20 for subsequent various processing steps. In this way, it can avoid wafers in front of the abnormal processing tank 11 from being scrapped, defective or reworked due to untimely processing, that is, the wafers in front of the abnormal processing tank 11 can be timely processed through another normally operating slot cleaning machine 10, so as to reduce or eliminate the problems of scrapping or rework caused by equipment abnormalities, improve production efficiency, reduce the rework rate, and reduce the scrap rate.

[0030] It should be noted that when one of the processing tanks 11 of a slot cleaning machine 10 is abnormal, the wafers in the process flow in front of the abnormal processing tank 11 can enter another slot cleaning machine 10 through the transfer of the second wafer transfer mechanism 20 for subsequent various processing steps. After all the wafers in front of the abnormal processing tank 11 have flowed into another slot cleaning machine 10, the wafers in the abnormal processing tank 11 are reworked or scrapped, and the abnormal processing tank 11 is repaired in a timely manner.

[0031] In some embodiments, the number of slot cleaning machines 10 includes but is not limited to two, three, four or more, which can be flexibly adjusted and set according to actual needs and will not be limited here. The second wafer transfer mechanism 20 can not only transfer wafers between the processing tanks 11 of two slot cleaning machines 10, but also transfer wafers between the processing tanks 11 of three, four or more slot cleaning machines 10. In this embodiment, specifically taking two slot cleaning machines 10 as an example for expansion, the second wafer transfer mechanism 20 is arranged between the two second wafer transfer mechanisms 20 for realizing the mutual transfer of wafers between the processing tanks 11 of the two slot cleaning machines 10.

[0032] In some embodiments, the first wafer transfer mechanism 12 includes but is not limited to a robotic arm or other transfer mechanisms. Among them, the robotic arm can reach into the interior of the processing tank 11 to grab the wafer, transfer the grabbed wafer to the interior of another processing tank 11, and then place the wafer in the processing tank 11, so as to realize the transfer of the wafer between two different-position processing tanks 11 of the same slot cleaning machine 10. The specific structure of the second wafer transfer mechanism 20 is similar to that of the first wafer transfer mechanism 12 and will not be elaborated here as long as it meets the requirement of mutually transferring wafers between the processing tanks 11 of two slot cleaning machines 10.

[0033] Please refer to Figure 1, in one embodiment, all the processing tanks 11 of each tank cleaning machine 10 are arranged in sequence along the first direction Z. The positions of the respective processing tanks 11 of all the tank cleaning machines 10 are correspondingly arranged, and the second wafer transfer mechanism 20 is used to transfer wafers between two correspondingly arranged processing tanks 11. In this way, when an abnormality occurs in the processing tank 11 of one of the tank cleaning machines 10, the second wafer transfer mechanism 20 causes the wafers in the previous steps of the abnormal processing tank 11 to be transferred between the two correspondingly arranged processing tanks 11. Since the two correspondingly arranged processing tanks 11 are relatively close in distance and have the same function, it is convenient for the wafers in front of the abnormal processing tank 11 to be smoothly transferred to another normally operating tank cleaning machine 10 for subsequent various processing steps, and the two tank cleaning machines 10 can cooperate better.

[0034] It should be noted that the corresponding arrangement of the respective processing tanks 11 of one tank cleaning machine 10 and the respective processing tanks 11 of another tank cleaning machine 10 means that the two processing tanks 11 are at least partially opposite or completely opposite in a direction perpendicular to the first direction Z.

[0035] Generally speaking, the probability of damage to the correspondingly arranged processing tanks 11 of the two tank cleaning machines 10 is very low. Therefore, in the case of an abnormal damage to the processing tank 11 of one of the tank cleaning machines 10, the wafers of the faulty machine are transferred to a normal machine for normal production to reduce or eliminate the problems of scrapping or rework caused by equipment abnormalities.

[0036] Please refer to Figure 1 , in one embodiment, there are multiple second wafer transfer mechanisms 20, and all the second wafer transfer mechanisms 20 are arranged at intervals in sequence along the first direction Z. In this way, the wafers in multiple processing tanks 11 at different positions of the two tank cleaning machines 10 can be transferred through the corresponding second wafer transfer mechanisms 20. Thus, when an abnormality occurs in one of the processing tanks 11 on the tank cleaning machine 10, the second wafer transfer mechanism 20 located in the previous step of the abnormal processing tank 11 and close to the abnormal processing tank 11 is selected to act, so that more wafers in the previous step of the abnormal processing tank 11 can be transferred to another tank cleaning machine 10 for subsequent step processes.

[0037] In some embodiments, the second wafer transfer mechanism 20 is not limited to one, specifically, for example, two, three, four or more, and can be flexibly adjusted and selected according to actual needs. In this embodiment, please refer to Figure 5, when the tank cleaning machine 10 is set as a texturing cleaning machine, for example, three second wafer transfer mechanisms 20 are selected and specifically arranged at the 5th position, the 10th position, and the 14th position respectively, so as to connect the two processing tanks 11 corresponding to the 5th position to each other, connect the two processing tanks 11 corresponding to the 10th position to each other, and connect the two processing tanks 11 corresponding to the 14th position to each other.

[0038] Please refer to Figure 2 , in an embodiment, the processing tank 11 includes a water tank 111, and the second wafer transfer mechanism 20 is used to transfer wafers between two water tanks 111 arranged corresponding to positions. Wherein, the water tank 111 can remove the chemicals before dilution, clean the surface of the wafer, and prevent the mixing of various chemicals in the tank. In addition, when the water tank 111 is selected as the interconnection part of the two tank cleaning machines 10, there is no chemical reaction, and it is easier to play a buffering and smooth transition role, and can avoid the adverse defects such as chemical reactions caused when using chemical tanks.

[0039] Of course, as some alternative solutions, the processing tank 11 further includes a chemical tank. For the texturing cleaning machine, the chemical tank includes but is not limited to an SDE tank, a pre-cleaning tank, a texturing tank, a post-cleaning tank, an acid pickling tank, etc. The second wafer transfer mechanism 20 is used to transfer wafers between two chemical tanks arranged corresponding to positions.

[0040] Please refer to Figure 3 , in an embodiment, the tank cleaning system further includes a spare water tank 30 corresponding to the second wafer transfer mechanism 20. The spare water tank 30 is arranged between two water tanks 111 corresponding to the second wafer transfer mechanism 20. The second wafer transfer mechanism 20 can also be used to transfer wafers between the spare water tank 30 and the two water tanks 111. In this way, the spare water tank 30 provides a temporary storage position and plays a buffering and transitional role. Specifically, the second wafer transfer mechanism 20 can transfer one of the wafers in the previous steps of the abnormal processing tank 11 in time, especially the wafers in high-speed thinning tanks such as the SDE damage removal tank and the texturing tank, for example, transfer them to the spare water tank 30, where they can stay for a long time without being damaged, and avoid rework or scrapping treatment due to the wafers staying in high-speed thinning tanks such as the SDE damage removal tank and the texturing tank for a long time.

[0041] Among them, the high-speed thinning tank refers to the processing tank 11 where the thinning rate of the wafer > 0.1um / min.

[0042] Please refer to Figure 4, in one embodiment, at least two first wafer transfer mechanisms 12 of each tank cleaning machine 10 are provided, and all the first wafer transfer mechanisms 12 are arranged in sequence along the first direction Z. Thus, for each tank cleaning machine 10, since at least two first wafer transfer mechanisms 12 are provided, each of the first wafer transfer mechanisms 12 can be responsible for transferring wafers in the processing tanks 11 of different regions of the tank cleaning machine 10 respectively. When all the first wafer transfer mechanisms 12 work synchronously, the working efficiency can be greatly improved.

[0043] Please refer to Figure 4 , in one embodiment, at least one of the processing tanks 11 responsible for transfer by two adjacent first wafer transfer mechanisms 12 along the first direction Z overlaps with each other. Thus, the two adjacent first wafer transfer mechanisms 12 are docked at the overlapping processing tank 11, so as to realize the smooth transfer of wafers in the processing tanks 11 of two adjacent different regions. Therefore, under the coordinated work of each first wafer transfer mechanism 12, wafers can enter each processing tank 11 in sequence for corresponding various processing operations.

[0044] Please refer to Figure 5 , specifically, when there are 19 processing tanks 11 in the tank cleaning machine 10 and, for example, 3 first wafer transfer mechanisms 12 are provided, the first first wafer transfer mechanism 12 is responsible for arbitrarily transferring wafers between the 1st processing tank 11 and the 5th processing tank 11, the second first wafer transfer mechanism 12 is responsible for arbitrarily transferring wafers between the 5th processing tank 11 and the 10th processing tank 11, and the third first wafer transfer mechanism 12 is responsible for arbitrarily transferring wafers between the 15th processing tank 11 and the 19th processing tank 11.

[0045] Please refer to Figure 4 and Figure 5 , in one embodiment, the processing tanks 11 responsible for transfer by two adjacent first wafer transfer mechanisms 12 along the first direction Z overlap with each other as the water tank 111. Thus, compared with the chemical tank, there is no chemical reaction in the water tank 111, and it is easier to play a role in buffering and smooth transition, which can avoid adverse defects such as chemical reactions caused when using a chemical tank.

[0046] Please refer to Figure 5 , in one embodiment, the tank cleaning machine 10 is a texturing cleaning machine. The texturing cleaning machine includes an SDE tank, a first water tank, a pre-cleaning tank, a second water tank, a texturing tank, a third water tank, a post-cleaning tank, a fourth water tank, an acid pickling tank, a fifth water tank, a slow lift tank and a drying tank arranged in sequence along the first direction Z. Thus, the wafers can sequentially complete the following steps in the texturing cleaning machine: SDE damage removal → water washing → pre-cleaning → water washing → texturing → water tank 111 → post-cleaning → water washing → acid pickling → water washing → slow lift → drying.

[0047] It should be noted that the processing times of the SDE tank, the first water tank, the pre-cleaning tank, the second water tank, the texturing tank, the third water tank, the post-cleaning tank, the fourth water tank, the pickling tank, the fifth water tank, the slow lifting tank, and the drying tank are different, and can be flexibly adjusted and set according to actual requirements.

[0048] Adjusting the number of different functional tanks according to the processing capabilities of each processing tank 11 can improve the processing efficiency and processing capacity. Please refer to Figure 5 , in one embodiment, there are two pre-cleaning tanks arranged in sequence between the first water tank and the second water tank. There are three texturing tanks arranged in sequence between the second water tank and the third water tank. There are two third water tanks arranged in sequence between the texturing tank and the post-cleaning tank. There are five drying tanks arranged in sequence behind the slow lifting tank. In this way, both of the two pre-cleaning tanks can process the silicon wafers, all of the three texturing tanks can process the silicon wafers, both of the two third water tanks can process the silicon wafers, and all of the five drying tanks can process the silicon wafers. The first silicon wafer transfer mechanism 12 can selectively transfer the silicon wafers to one of the pre-cleaning tanks for processing according to actual needs, can selectively transfer the silicon wafers to one of the texturing tanks for processing, can selectively transfer the silicon wafers to the third water tank for processing, and can selectively transfer the silicon wafers to the drying tank for processing, thereby improving the processing efficiency and processing capacity.

[0049] Among them, as Figure 5 shown, the processing times of each processing tank of the texturing and cleaning machine in the embodiment are shown in the following table:

[0050]

[0051] As an example, assume that each processing tank has 6 flower baskets, and each flower basket contains 100 silicon wafers, that is, there are 600 silicon wafers in one processing tank. For example, the post-cleaning tank No. 11 of one of the texturing and cleaning machines (also abbreviated as Line 1 for example) is abnormal, and another texturing and cleaning machine is normal (also abbreviated as Line 2 for example). Assume that one column of silicon wafers is blocked in each of the front processing tanks No. 1 to No. 10 of the Line 1 texturing and cleaning machine, then a total of 10 columns of silicon wafers are blocked, resulting in 6000 silicon wafers being blocked. Among them, there are 6 chemical tanks, and 3600 silicon wafers are blocked in the chemical tanks. Based on this, the allocation logic after the abnormality in this embodiment includes: the PLC controls in a mode that preferentially shortens the time in high-rate thinning tanks such as the SDE loss removal tank and the texturing tank. Specifically, the post-cleaning tank No. 11 of Line 1 is abnormal. First, the feeding time needs to be set according to the time of the production capacity bottleneck tank. Currently, according to the time, the texturing tank and the drying tank are the bottleneck tanks, the single-tank time is 150 s, and the robot running time is 30 s. Therefore, the feeding time is 180 s per batch; when the post-cleaning tank No. 11 of Line 1 is abnormal, the texturing and cleaning machines of Line 1 and Line 2 both stop feeding. The silicon wafers in the internal tanks of the Line 2 machine continue to be normal until the silicon wafers in front of the post-cleaning tank No. 11 of Line 2 complete the process of 10 tanks normally, and the feeding of Line 2 resumes.

[0052] For Line 1, there are three states of the 1# SDE tank and the 2# first water tank: First, there are wafers in both the 1# SDE tank and the 2# first water tank. The wafers in the 2# first water tank need to continue to be produced later. The wafers are transferred to the pre-cleaning tank and stay there waiting. After the process of the 1# SDE tank is completed, they can be placed in the 2# first water tank and stay there waiting; Second, there are wafers in the 1# SDE tank and no wafers in the 2# first water tank. After the process of the 1# SDE tank is completed, the wafers are transferred to the 2# first water tank and stay there waiting; Third, there are no wafers in the 1# SDE tank, and both the 11# SDE tank and the 2# first water tank are suspended without any changes; The overall principle is that the SDE tank and the texturing tank do not temporarily store wafers. The logic of the texturing tank is the same as that of the 1# SDE tank. There are 3 water tanks including a spare water tank after the texturing tank. When an abnormality occurs at the 11th position, these 3 water tanks can always empty the wafers in the texturing tank. If the wafers in the texturing tank cannot be emptied, the wafers in the spare water tank are inserted into the production of Line 2 for one batch; When the silicon wafers in front of the 11# SDE tank of Line 2 are produced, the wafers of Line 1 enter Line 2 one after another and continue to be produced until the wafers in front of Line 1 are produced normally. In this way, due to the abnormal wafers in the 11th tank of Line 1, the subsequent production is carried out normally through the interconnection method, avoiding the scrapping and rework caused by the wafer blockage in the tank due to the abnormality, and greatly enhancing the production continuity. Other tank bodies or robot abnormalities can be scheduled using a similar logic, and the entire scheduling method can be carried out by the PLC of the machine.

[0053] In a specific embodiment, silicon wafers with a size of 210*105mm and a resistivity of 0.5-2.1Ω were used for comparative production verification. The normal machine output was 12,000 pcs / h, and the uptime was about 90% (actual production time / total time). The control group was the single-line separate production mode of 2 machines for texturing in the conventional heterojunction production process; the optimized group used the interconnected production mode of 2 machines as the experimental group, and they were each produced for one month.

[0054] The following production data was collected:

[0055]

[0056] Analysis was carried out based on the above table:

[0057] As can be seen from the data, after production using the device in this embodiment, the rework rate decreased by 0.26%, the scrapped wafers were basically eliminated, and the losses caused by rework and scrapping to production were significantly reduced;

[0058] The uptime increased by 1.25%. The main reason is that during single-line production, after the equipment processes an abnormality, the wafers blocked in the tank need to be drained before the source can be changed and production can start again. The time for draining defective products is generally 1-2h. Therefore, every time an abnormality occurs in the non-interconnected production situation, 1-2h will be wasted. In this verification, plus the additional rework time, the total is 9h;

[0059] The output increased by 256,800 pieces / month, and the output increased by 1.68%. The increase in output can overall reduce the costs of various auxiliary materials for the battery wafers.

[0060] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to this application.

[0061] In addition, if the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0062] In this application, unless otherwise clearly specified and defined, if terms such as "installed", "connected", "linked", "fixed", etc. appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0063] In this application, unless otherwise clearly specified and defined, if there is a description such as a first feature being "on" or "under" a second feature, its meaning can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature can mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature has a higher horizontal height than the second feature. The first feature being "under", "beneath" and "underneath" the second feature can be that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower horizontal height than the second feature.

[0064] It should be noted that if an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. If an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. If so, the terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used in this application are only for the purpose of illustration and do not represent the only implementation.

[0065] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity in description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered to be within the scope described in this specification.

[0066] The above-described embodiments merely represent several implementation manners of the present application. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patented application. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present application, several modifications and improvements can still be made, and these all fall within the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the appended claims.

Claims

1. A tank type cleaning system, characterized in that, The slot cleaning system includes: At least two slot cleaning machines (10), each of the slot cleaning machines (10) including a plurality of processing tanks (11) and a first wafer transfer mechanism (12) capable of gripping a wafer and transferring the wafer between the respective processing tanks (11) of the same slot cleaning machine (10); and A second wafer transfer mechanism (20), the second wafer transfer mechanism (20) being capable of gripping a wafer and transferring the wafer between the processing tanks (11) of two of the slot cleaning machines (10).

2. The slot cleaning system according to claim 1, wherein, All of the processing tanks (11) of each slot cleaning machine (10) are arranged in sequence along a first direction Z; the positions of the respective processing tanks (11) of all of the slot cleaning machines (10) are correspondingly arranged, and the second wafer transfer mechanism (20) is used to transfer the wafer between two correspondingly arranged processing tanks (11).

3. The slot cleaning system according to claim 2, wherein, There are a plurality of the second wafer transfer mechanisms (20), and all of the second wafer transfer mechanisms (20) are arranged at intervals in sequence along the first direction Z.

4. The slot cleaning system according to claim 2, wherein The processing tank (11) includes a water tank (111), and the second wafer transfer mechanism (20) is used to transfer the wafer between two correspondingly arranged water tanks (111).

5. The trough cleaning system according to claim 4, wherein, The slot cleaning system further includes a standby water tank (30) corresponding to the second wafer transfer mechanism (20), the standby water tank (30) being arranged between two of the water tanks (111) corresponding to the second wafer transfer mechanism (20), and the second wafer transfer mechanism (20) can also be used to transfer the wafer between the standby water tank (30) and the two water tanks (111).

6. The trough cleaning system according to claim 2, wherein, The first wafer transfer mechanism (12) of each slot cleaning machine (10) is provided as at least two, and all of the first wafer transfer mechanisms (12) are arranged in sequence along the first direction Z.

7. The slot cleaning system according to claim 6, characterized in that, There is at least one overlap between the processing tanks (11) responsible for transfer by two adjacent first wafer transfer mechanisms (12) along the first direction Z.

8. The trough cleaning system according to claim 7, characterized in that, The processing tanks (11) that overlap between two adjacent first wafer transfer mechanisms (12) along the first direction Z are water tanks (111).

9. The slot cleaning system according to claim 1, characterized in that, The slot cleaning machine (10) is a texturing cleaning machine; the texturing cleaning machine includes an SDE tank, a first water tank, a pre-cleaning tank, a second water tank, a texturing tank, a third water tank, a post-cleaning tank, a fourth water tank, an acid pickling tank, a fifth water tank, a slow lift tank, and a drying tank arranged in sequence along the first direction Z.

10. The trough cleaning system according to claim 9, characterized in that, There are two pre-cleaning tanks arranged in sequence between the first water tank and the second water tank; there are three texturing tanks arranged in sequence between the second water tank and the third water tank; there are two third water tanks arranged in sequence between the texturing tank and the post-cleaning tank; and there are five drying tanks arranged in sequence behind the slow lift tank.

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