Printed circuit board (PCB) with high heat conductivity and large current
The PCB design with copper layers and pillars addresses heat and current limitations by enhancing thermal conductivity, electrical conductivity, mechanical strength, and electromagnetic shielding, ensuring device stability and reliability.
Patent Information
- Application Number
- CN202421633804.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-11
- Publication Date
- 2025-07-15
- Estimated Expiration
- 2034-07-11
AI Technical Summary
Existing printed circuit boards are prone to carbonization when carrying large currents, resulting in circuit breakers and device damage, and insufficient heat dissipation performance, which cannot meet the needs of high-power density electronic equipment.
A multi-layer structural design is adopted, copper plates are used as GND layer, and copper bosses are set up between each layer to increase thermal and electrical conductivity. At the same time, the copper plate is filled with insulating material and embedded in the inner core plate to ensure mechanical strength and electromagnetic shielding effect.
It improves heat dissipation performance, conductivity, mechanical strength and electromagnetic shielding effect, can carry large currents and maintain equipment stability, and is suitable for high power density electronic equipment.
Smart Images
Figure CN223110235U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of PCB printed circuit boards, and particularly relates to a PCB printed circuit board with both high heat conduction and large current carrying capacity. Background Art
[0002] Printed circuit boards are an indispensable part of various current electronic circuits and are widely used in various electronic products and electromechanical products. The development of printed circuit boards has been more than 100 years. The main advantages of using circuit boards are greatly reducing wiring and assembly errors, improving the automation level and production labor rate. According to the number of circuit board layers, they can be divided into single-sided boards, double-sided boards, four-layer boards, six-layer boards, and other multi-layer circuit boards. Due to the limitations of heat dissipation and the withstand voltage difference of materials, the current carried by ordinary circuit boards is relatively small. If the current carried for a long time is too large, the carbonization of the circuit board material is likely to occur, resulting in open circuits and device damage. Content of the Utility Model
[0003] The purpose of the utility model is to provide a PCB printed circuit board with both high heat conduction and large current carrying capacity in order to overcome at least one of the defects existing in the above-mentioned prior art.
[0004] The purpose of the utility model can be realized by the following technical solutions:
[0005] A PCB printed circuit board with both high heat conduction and large current carrying capacity includes a first insulating layer, a first signal layer, a first GND layer, a second insulating layer, a second GND layer, a second signal layer, and a third insulating layer stacked in sequence;
[0006] Wherein, a first copper boss is arranged on the upper surface of the first GND layer, and the first copper boss sequentially penetrates through the first signal layer and the first insulating layer;
[0007] A second copper boss is arranged on the upper surface of the second insulating layer, and the second copper boss sequentially penetrates through the second insulating layer, the first GND layer, the first signal layer, and the first insulating layer.
[0008] Further, the thickness of the first GND layer is at least 2 mm.
[0009] Further, the thickness of the second GND layer is at least 2 mm.
[0010] Further, the thicknesses of the first GND layer and the second GND layer are equal.
[0011] Further, the first GND layer is a purple copper plate.
[0012] Further, the second GND layer is a purple copper plate.
[0013] Further, the first copper boss is a purple copper boss.
[0014] Further, the second copper boss is a red copper boss.
[0015] Further, the first insulating layer is an insulating layer made of FR-4 high-speed board material.
[0016] Further, the third insulating layer is an insulating layer made of FR-4 high-speed board material.
[0017] Compared with the prior art, the utility model has the following advantages:
[0018] (1) Improved heat dissipation performance. The PCB printed circuit board with both high thermal conductivity and large current provided by the utility model, that is, the embedded red copper PCB circuit board, has good heat dissipation performance. The thermal conductivity of red copper is 401 W / (m·K). Due to the relatively high thermal conductivity of copper, the heat-generating components can directly contact the GND, that is, the red copper plate, or indirectly conduct heat to the red copper plate through the high-thermal-conductivity substrate chip. The red copper plate quickly dissipates the received heat, effectively conducting the heat from a point to a large-area red copper block, which is convenient to be absorbed by the external environment, thereby reducing the temperature and thermal load of the device. This is particularly important for high-power-density and high-heat-generation electronic devices, and can ensure the stability and reliability of the device.
[0019] (2) Improved electrical conductivity. The PCB printed circuit board with both high thermal conductivity and large current provided by the utility model also has excellent electrical conductivity. The copper thickness of the conventional printed circuit board is about 200 UM at most, while the copper thickness of the embedded red copper plate can reach about 5000 UM. The red copper plate can be designed on the inner layer or the outer layer of the printed circuit board, and can provide a more stable and reliable current transmission path. In electronic devices, the circuit board is an important medium for current transmission, and the copper layer is the most important conductive material in the PCB circuit board. The thicker copper layer of the embedded red copper plate can provide a greater current-carrying capacity and a lower resistance, thereby improving the electrical conductivity and stability of the device.
[0020] (3) Enhanced mechanical strength. The PCB printed circuit board with both high thermal conductivity and large current provided by the utility model has relatively high mechanical strength and can withstand relatively large mechanical stress and impact force. In electronic devices, the circuit board needs to withstand various mechanical stress and impact forces, such as vibration, collision, etc. The embedded red copper PCB circuit board has better mechanical properties due to the embedded red copper plate inside or outside, and the thicker copper layer, which can ensure the stability and reliability of the product under harsh working environments.
[0021] (4) Electromagnetic shielding enhancement. The PCB printed circuit board with both high thermal conductivity and high current provided by the present utility model also has a certain electromagnetic shielding effect. In electronic devices, electromagnetic interference is a common problem. The thick copper layer of the embedded copper plate PCB circuit board can effectively absorb and reflect electromagnetic waves, reducing the impact of electromagnetic interference on the device. This is particularly important for electronic devices that require high electromagnetic compatibility, ensuring the normal operation and stability of the device.
[0022] (5) Increase in product added value. The PCB printed circuit board with both high thermal conductivity and high current provided by the present utility model has a relatively high price because the copper plate has a high hardness and needs to be cut, processed, and polished. For the copper plate embedded in the inner layer, the unconnected signal holes need to be processed and isolated, resulting in an increase in cost. This is also a major limiting factor in its practical application. Therefore, when choosing to use an embedded copper PCB circuit board, it is necessary to consider the balance between its cost and performance. In some application scenarios with high cost requirements and low performance requirements, other types of circuit boards such as thin copper or copper substrates can be selected. Therefore, when choosing to use a thick copper PCB circuit board, it is necessary to make a trade-off and selection according to specific application scenarios and requirements. Description of the Drawings
[0023] Figure 1 It is a schematic structural diagram of the PCB printed circuit board with both high thermal conductivity and high current in the embodiment;
[0024] Figure 2 It is the relationship between the GND layer and the GM1 layer in the PCB printed circuit board with both high thermal conductivity and high current in the embodiment;
[0025] As shown in the figure, the reference numerals are: 1 - the first insulating layer; 2 - the first signal layer; 3 - the first GND layer; 4 - the second insulating layer; 5 - the second GND layer; 6 - the second signal layer; 7 - the third insulating layer; 8 - the first copper boss; 9 - the second copper boss. Detailed Embodiment
[0026] The present utility model will be described in detail below with reference to the drawings and specific embodiments. This embodiment is implemented on the premise of the technical solution of the present utility model, and the detailed implementation manners and specific operation processes are given, but the protection scope of the present utility model is not limited to the following embodiments.
[0027] Embodiment
[0028] Please refer to Figure 1 , a PCB printed circuit board with both high thermal conductivity and high current, comprising a first insulating layer 1, a first signal layer 2, a first GND layer 3, a second insulating layer 4, a second GND layer 5, a second signal layer 6, and a third insulating layer 7 stacked in sequence;
[0029] The first copper boss 8 is disposed on the upper surface of the first GND layer 3, and the first copper boss 8 sequentially penetrates the first signal layer 2 and the first insulating layer 1;
[0030] A second copper boss 9 is disposed on the upper surface of the second insulating layer 4 , and the second copper boss 9 sequentially penetrates the second insulating layer 4 , the first GND layer 3 , the first signal layer 2 and the first insulating layer 1 .
[0031] In this embodiment, each GND layer of the multi-layer printed circuit board is replaced with a copper plate and placed in the middle layer to solve the problem of board warping caused by asymmetry.
[0032] See also Figure 2 In this embodiment, each GND layer is as small as possible from the machined GM1 layer, and the GND cannot be laid flush with the edge of the machined layer to prevent discharge at the edge of the board.
[0033] In this embodiment, all through holes that are not connected to the GND layer are designed as isolation holes at the corresponding positions. Holes are opened in the copper plate after compensation according to the size of the holes in the GND layer, and then the holes are filled with insulating materials. After filling, a pinhole check is performed to ensure that the insulating material is fully filled. Then, the copper plate is milled out according to the size of the GND layer and embedded in the inner core board. After pressing, holes are punched from the outer layer to connect to the GND layer. This design will have a better grounding effect. In addition, the large copper plate is conducive to rapid heat dissipation. After the GND ground layer is replaced with a copper plate, the heat conduction and electrical conductivity are significantly improved. It plays an important role in electronic equipment, and the size of its role depends on the specific application scenario and needs.
[0034] In this embodiment, the thickness of the first GND layer 3 and the second GND layer 5 are equal; the thickness of the first GND layer 3 and the second GND layer 5 is at least 2 mm, preferably 2 mm.
[0035] In this embodiment, the first GND layer 3 and the second GND layer 5 are both copper plates.
[0036] In this embodiment, the first copper boss 8 and the second copper boss 9 are both copper bosses.
[0037] In this embodiment, the first insulating layer 1 and the third insulating layer 7 are both insulating layers made of FR-4 high-speed board material.
[0038] The above is only the preferred embodiment of the utility model, and does not limit the utility model in other forms. Any technician familiar with the profession may use the technical content disclosed above to change or modify it into an equivalent embodiment with equivalent changes. However, any simple modification, equivalent change and modification made to the above embodiment based on the technical essence of the utility model without departing from the technical solution of the utility model still belongs to the protection scope of the technical solution of the utility model.
Claims
1. A PCB printed circuit board with both high thermal conductivity and large current, characterized in that, It includes a first insulating layer (1), a first signal layer (2), a first GND layer (3), a second insulating layer (4), a second GND layer (5), a second signal layer (6), and a third insulating layer (7) which are stacked in sequence; Among them, a first copper boss (8) is arranged on the upper surface of the first GND layer (3), and the first copper boss (8) sequentially penetrates through the first signal layer (2) and the first insulating layer (1); A second copper boss (9) is arranged on the upper surface of the second insulating layer (4), and the second copper boss (9) sequentially penetrates through the second insulating layer (4), the first GND layer (3), the first signal layer (2), and the first insulating layer (1).
2. The PCB printed circuit board with both high thermal conductivity and large current according to claim 1, characterized in that The thickness of the first GND layer (3) is at least 2 mm.
3. A PCB printed circuit board with both high thermal conductivity and high current, as claimed in claim 1, wherein The thickness of the second GND layer (5) is at least 2 mm.
4. A PCB printed circuit board with both high thermal conductivity and large current, as described in claim 1, characterized in that The thicknesses of the first GND layer (3) and the second GND layer (5) are equal.
5. A PCB printed circuit board with both high thermal conductivity and high current capacity according to claim 1, characterized in that The first GND layer (3) is a purple copper plate.
6. A PCB printed circuit board with both high thermal conductivity and large current, as described in claim 1, wherein The second GND layer (5) is a purple copper plate.
7. A PCB printed circuit board with both high thermal conductivity and large current, as described in claim 1, characterized in that The first copper boss (8) is a purple copper boss.
8. The PCB printed circuit board with both high thermal conductivity and high current according to claim 1, characterized in that, The second copper boss (9) is a purple copper boss.
9. A PCB printed circuit board with both high thermal conductivity and high current, as claimed in claim 1, wherein The first insulating layer (1) is an insulating layer made of FR-4 high-speed board material.
10. A PCB printed circuit board with both high thermal conductivity and high current, as described in claim 1, wherein The third insulating layer (7) is an insulating layer made of FR-4 high-speed board material.