Flexible circuit board and pressure-sensitive substrate

Abstract

The utility model relates to a flexible circuit board and a pressure sensitive substrate, which comprise a curing plate, a reinforcing layer and at least two flexible main bodies, the reinforcing layer is provided with a blind hole, the curing plate is arranged in the blind hole and is fixedly connected with the reinforcing layer, and the reinforcing layer and the curing plate are crimped between two adjacent flexible main bodies. The reinforcing layer is arranged between the flexible main bodies, the blind holes are formed in the reinforcing layer, and due to limiting of the blind holes, the curing plate can be effectively prevented from moving in the flexible circuit board; in addition, the curing plate can be fixedly connected with the blind holes, so that the curing plate is further effectively prevented from moving or falling off in the flexible circuit board. Compared with the prior art, the flexible circuit board and the pressure-sensitive substrate disclosed by the utility model can achieve the purpose of preventing the curing plate from moving or falling off.

Description

Technical Field

[0001] The utility model relates to the technical field of flexible circuit board manufacturing and processing, in particular to a flexible circuit board and a pressure-sensitive substrate. Background Art

[0002] A flexible printed circuit (FPC), also known as a flexible circuit board or a flexible printed circuit board, is favored for its excellent characteristics such as light weight, thin thickness, and free bending and folding.

[0003] During the manufacturing process of a flexible circuit board, a curing board is often added to it, so that the flexible circuit board has a certain strength, combines the advantages of a rigid circuit board and a flexible circuit board, and provides good mechanical properties for the flexible circuit board.

[0004] In a conventional curing board, its surface is adhered to the flexible circuit board by glue. However, for the flexible circuit board produced in this way, the adhered curing board may move or fall off due to impact, aging, or temperature rise, which is not conducive to the normal use of the flexible circuit board. Summary of the Utility Model

[0005] In order to solve the problem that the adhered curing board may move or fall off due to impact, aging, or temperature rise, the utility model provides a flexible circuit board and a pressure-sensitive substrate.

[0006] The technical solution adopted by the utility model is that a flexible circuit board includes a curing board, a reinforcing layer, and at least two flexible bodies. Blind holes are provided on the reinforcing layer, and the curing board is arranged in the blind holes and fixedly connected to the reinforcing layer. The reinforcing layer and the curing board are crimped between two adjacent flexible bodies.

[0007] Preferably, the reinforcing layer is a glass fiber layer.

[0008] Preferably, the reinforcing layer and the curing board, and the reinforcing layer and the flexible body are adhesively connected to each other.

[0009] Preferably, there are at least two mutually separated reinforcing layers, and curing boards are arranged in the blind holes of the multiple reinforcing layers.

[0010] Preferably, at least two curing boards are arranged in the reinforcing layer.

[0011] Preferably, at least one reinforcing structure protruding away from the curing board is fixedly connected to the circumferential direction of the curing board, and the curing board is fixedly connected to the reinforcing layer through the reinforcing structure.

[0012] Preferably, one end of the reinforcing structure is connected to the side surface of the curing board, and the other end is flush with the edge of the blind hole.

[0013] Preferably, the shape of the curing plate is a polygon, the number of reinforcing structures is the same as the number of sides of the polygon, and each side of the polygon is fixedly connected with a reinforcing structure.

[0014] The present utility model also provides a pressure-sensitive substrate, including the flexible circuit board described above.

[0015] Preferably, the flexible circuit board is connected with a pressure-sensitive module for identifying external pressure.

[0016] Compared with the prior art, the present utility model has the following beneficial effects:

[0017] The present application discloses a flexible circuit board. By providing a reinforcing layer between flexible bodies and providing blind holes on the reinforcing layer, due to the limitation of the blind holes, the movement of the curing plate in the flexible circuit board can be effectively prevented. In addition, the curing plate can also be fixedly connected with the blind holes, further effectively preventing the curing plate from moving or falling off in the flexible circuit board.

[0018] Compared with the prior art, a flexible circuit board disclosed in the present application can achieve the purpose of preventing the curing plate from moving or falling off.

[0019] The present application also discloses a pressure-sensitive substrate, including the flexible circuit board described above. By using the flexible circuit board, the purpose of thinning can be achieved. Description of the Drawings

[0020] The following will describe the present utility model in detail with reference to the embodiments and the drawings, where:

[0021] Figure 1 shows a schematic structural diagram of a flexible circuit board provided by an embodiment of the present utility model;

[0022] Figure 2 shows a schematic structural diagram of another embodiment of a flexible circuit board provided by an embodiment of the present utility model;

[0023] Figure 3 shows an enlarged schematic diagram of loading a curing plate in a reinforcing layer of a flexible circuit board provided by an embodiment of the present utility model.

[0024] Reference Signs Description:

[0025] 10. Flexible body; 20. Curing plate; 30. Reinforcing layer; 40. Blind hole; 50. Reinforcing structure. Detailed Embodiments

[0026] To make the objectives, technical solutions, and advantages of the present utility model clearer, the following will further describe in detail the embodiments of the present utility model in conjunction with the accompanying drawings. The examples of the embodiments are shown in the drawings, where the same or similar reference numerals represent the same or similar components or components with the same or similar functions from beginning to end. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present utility model, and cannot be construed as a limitation to the present utility model.

[0027] The present utility model discloses a flexible circuit board. Please refer to Figures 1 to 3 , which includes a cured board 20, a reinforcing layer 30, and at least two flexible bodies 10. There are blind holes 40 on the reinforcing layer 30. The cured board 20 is disposed in the blind holes 40 and fixedly connected to the reinforcing layer 30. The reinforcing layer 30 and the cured board 20 are pressed between two adjacent flexible bodies 10.

[0028] By providing a reinforcing layer 30 between the flexible bodies 10 and providing blind holes 40 on the reinforcing layer 30, due to the limitation of the blind holes 40, the cured board 20 can be effectively prevented from moving in the flexible circuit board; in addition, the cured board 20 can also be fixedly connected to the blind holes 40, further effectively preventing the cured board 20 from moving or falling off in the flexible circuit board. Compared with the prior art, a flexible circuit board disclosed in the present application can achieve the purpose of preventing the cured board 20 from moving or falling off.

[0029] Among them, only the flexible body 10 placed at the bottom is shown in Figure 1 and Figure 2 , and the flexible body 10 covering the top is not shown.

[0030] In some embodiments, the flexible body 10 is provided with blind holes 40 having the same shape and size as the cured board 20, and the blind holes 40 and the cured board 20 cooperate with each other, so that the limiting effect is better.

[0031] In some embodiments, the reinforcing layer 30 is a fiberglass layer.

[0032] Selecting glass fiber to make the fiberglass layer can enable the reinforcing layer 30 to have excellent tensile strength and elastic modulus, and is more suitable for use in the flexible circuit board to improve its overall strength.

[0033] Among them, the cured board 20 and the flexible body 10 are separated by a fiberglass layer. When the flexible body 10 leaks electricity, due to the high electrical insulation of the fiberglass layer, the current on the flexible body 10 cannot be transmitted to the cured board 20, thereby achieving the purpose of insulation.

[0034] In some specific embodiments, the reinforcing layer 30 and the cured board 20, and the reinforcing layer 30 and the flexible body 10 are adhesively bonded to each other.

[0035] Specifically, the bonding method is more convenient. At the same time, using the bonding method can avoid the interference caused by metal components and magnetic components to current and signals when using threaded and magnetic connection methods, making the signal transmission and current flow more stable.

[0036] In some embodiments, please refer to Figure 1 , there are at least two reinforcing layers 30 separated from each other, and a curing plate 20 is arranged in each blind hole 40 of the plurality of reinforcing layers 30.

[0037] It should be noted that the number of the reinforcing layers 30 and the curing plates 20 matches, and any two reinforcing layers 30 are separated from each other on the flexible main body 10, so that the flexible circuit board can be applied to more scenarios.

[0038] In some embodiments, please refer to Figure 2 , at least two curing plates 20 are arranged in the reinforcing layer 30.

[0039] Specifically, by arranging a plurality of curing plates 20 in the reinforcing layer 30, it is convenient to divide this flexible circuit board into multiple flexible circuit units that can be used independently in subsequent steps, and each flexible circuit unit can have a curing plate 20.

[0040] In some embodiments, please refer to Figure 3 , at least one reinforcing structure 50 protruding away from the curing plate 20 is fixedly connected to the circumferential direction of the curing plate 20, and the curing plate 20 is fixedly connected to the reinforcing layer 30 through the reinforcing structure 50.

[0041] It should be noted that by selecting the curing plate 20, the flexible circuit board is not easily deformed and has higher strength; the reinforcing structure 50 is connected to the side of the curing plate 20 and protrudes away from the curing plate 20, so that the reinforcing structure 50 can form a firm support on the side of the curing plate 20. At the same time, due to the existence of the reinforcing structure 50, the reinforcing structure 50 can also play the same role as the curing plate 20, providing a certain hardness for the flexible circuit board and increasing its mechanical properties.

[0042] Specifically, the shape of the reinforcing structure 50 is not limited in this application. The reinforcing structure 50 can be selected as a rod-shaped, rib-shaped structure, etc., or can be an annular structure around the circumference of the curing plate 20 to obtain higher structural stability. In addition, the number of the reinforcing structures 50 is not limited in this application. Obviously, the more the number of the reinforcing structures 50, the firmer the connection to the curing plate 20.

[0043] In addition, the reinforcing structure 50 and the curing plate 20, and the reinforcing structure 50 and the flexible main body 10 can be connected by connection methods such as bonding and threading.

[0044] In some embodiments, referring to Figure 3 , one end of the reinforcement structure 50 is connected to the side surface of the cured plate 20, and the other end is flush with the edge of the blind hole 40.

[0045] It should be noted that the other end of the reinforcement structure 50 is flush with the edge of the blind hole 40, so that the reinforcement structure 50 can obtain a larger contact area with the reinforcement layer 30, improving the structural strength of the flexible circuit board.

[0046] In some embodiments, referring to Figure 3 , the cured plate 20 is in a polygonal shape, the number of the reinforcement structures 50 is the same as the number of sides of the polygon, and each side of the polygon is fixedly connected with a reinforcement structure 50.

[0047] Specifically, the cured plate 20 is in a polygonal shape, and the reinforcement structures 50 are provided in multiple directions of the polygon, which can fix the cured plate 20 in each direction, thereby obtaining a more stable fixing effect, making the cured plate 20 not easy to fall off, and at the same time, the mechanical properties of the flexible circuit board can be further increased.

[0048] In some embodiments, the cured plate 20 is a stainless steel plate.

[0049] It should be noted that by setting the cured plate 20 as a stainless steel plate, the corrosion of the cured plate 20 can be prevented, and the structural strength of the flexible circuit board is prevented from being affected after corrosion.

[0050] The present utility model also discloses a pressure-sensitive substrate, including the above-mentioned flexible circuit board.

[0051] By using the flexible circuit board, the purpose of thinning can be achieved.

[0052] In some embodiments, the flexible circuit board is connected with a pressure-sensitive module for identifying external pressure.

[0053] Specifically, by being connected with a pressure-sensitive module for identifying external pressure, when a user applies pressure, the pressure-sensitive substrate can identify it.

[0054] In the description of this specification, if terms such as "Embodiment 1", "this embodiment", "in an embodiment", etc. appear, it means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the utility model or the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example; moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in an appropriate manner.

[0055] In the description of this specification, terms such as "connection", "installation", "fixation", "setting", "having", etc. are understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0056] In the description of this specification, relative terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including one..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0057] The above description of the embodiments is for the convenience of those of ordinary skill in the art to understand and apply the technology of this case. Obviously, those who are familiar with the technology in this field can easily make various modifications to these examples and apply the general principles described here to other embodiments without creative labor. Therefore, this case is not limited to the above embodiments. For the following several situations of modification, they should all be within the protection scope of this case: ① A new technical solution implemented based on the technical solution of the present utility model and combined with the existing well-known common sense, and the technical effect produced by this new technical solution does not exceed the technical effect of the present utility model; ② An equivalent replacement of some features of the technical solution of the present utility model using well-known technology, and the technical effect produced is the same as the technical effect of the present utility model; ③ An expansion based on the technical solution of the present utility model, and the substantial content of the expanded technical solution does not exceed the technical solution of the present utility model; ④ An equivalent transformation made using the content of the specification and drawings of the present utility model, directly or indirectly applied in other related technical fields.

Claims

1. A flexible circuit board, characterized in that, It includes a curing plate, a reinforcing layer and at least two flexible bodies. There are blind holes in the reinforcing layer. The curing plate is arranged in the blind holes and fixedly connected to the reinforcing layer. The reinforcing layer and the curing plate are crimped between two adjacent flexible bodies.

2. The flexible circuit board according to claim 1, wherein The reinforcing layer is a fiberglass layer.

3. A flexible circuit board according to claim 2, wherein, The reinforcing layer and the curing plate are adhesively bonded to each other, and the reinforcing layer and the flexible body are adhesively bonded to each other.

4. A flexible circuit board according to claim 1, wherein There are at least two mutually separated reinforcing layers, and the curing plates are arranged in the blind holes of the plurality of reinforcing layers.

5. A flexible circuit board according to claim 1, wherein At least two curing plates are arranged in the reinforcing layer.

6. A flexible circuit board according to any one of claims 1 to 5, characterized in that, At least one reinforcing structure protruding away from the curing plate is fixedly connected to the circumference of the curing plate, and the curing plate is fixedly connected to the reinforcing layer through the reinforcing structure.

7. A flexible circuit board according to claim 6, wherein, One end of the reinforcing structure is connected to the side surface of the curing plate, and the other end is flush with the edge of the blind hole.

8. A flexible circuit board according to claim 6, characterized in that, The shape of the curing plate is polygonal, the number of the reinforcing structures is the same as the number of sides of the polygon, and each side of the polygon is fixedly connected with one reinforcing structure.

9. A pressure-sensitive substrate, characterized in that, It includes the flexible circuit board according to any one of claims 1 to 8.

10. A pressure-sensitive substrate according to claim 9, characterized in that, The flexible circuit board is connected with a pressure sensing module for identifying external pressure.

Images