Circuit board copper deposition device

Abstract

The utility model is suitable for the technical field of circuit board processing, and provides a circuit board copper deposition device which comprises a copper deposition tank used for performing copper deposition operation on a circuit board. The cleaning tank is fixedly mounted on the outer wall of one side of the copper deposition tank and is used for cleaning the circuit board subjected to copper deposition; the water pump is fixedly mounted on the outer wall of one side of the cleaning pool; the flow dividing pipe is fixedly installed on the inner wall of the cleaning pool, the flow dividing pipe is communicated with the water outlet end of the water pump, and a plurality of water outlets are formed in the flow dividing pipe; the stirring mechanism is assembled on the copper deposition tank and is used for stirring the copper liquid in the copper deposition tank; and the support frame is fixedly arranged on the copper deposition tank and the cleaning tank. According to the circuit board copper deposition device provided by the scheme, copper deposition operation can be performed on the circuit board, and meanwhile, the circuit board subjected to copper deposition can be cleaned, so that subsequent processing operation is facilitated, and the overall operation efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of circuit board processing, and particularly relates to a circuit board copper deposition device. Background Art

[0002] A circuit board is a core component of an electronic device, used to connect electronic components (such as resistors, capacitors, inductors, diodes, transistors, integrated circuits, etc.) and carry the electrical connections between these components. The main function of the circuit board is to provide a stable electrical connection platform, enabling current to flow smoothly between different electronic components to achieve the predetermined functions of the electronic device.

[0003] During the process of processing a circuit board, a copper deposition operation needs to be performed on the circuit board. The purpose of copper deposition is to improve the electrical conductivity of the circuit board. When performing copper deposition on the circuit board, a corresponding circuit board copper deposition device needs to be used. However, some existing circuit board copper deposition devices still have certain deficiencies in the actual use process. Some circuit board copper deposition devices can only perform copper deposition operations on the circuit board. However, after performing the copper deposition operation on the circuit board, it is also necessary to clean the remaining copper on the circuit board. However, some existing circuit board copper deposition devices cannot perform a certain cleaning operation on the circuit board after copper deposition and still require separate operations, increasing the complexity of the overall operation of the circuit board. Summary of the Utility Model

[0004] The utility model provides a circuit board copper deposition device, aiming to solve the problem that the currently used circuit board copper deposition device cannot clean the circuit board after copper deposition as proposed in the above background art.

[0005] To solve the above problems, the utility model is realized as follows. A circuit board copper deposition device includes: a copper deposition tank for performing copper deposition operations on the circuit board; a cleaning tank fixedly installed on the outer wall of one side of the copper deposition tank for cleaning the circuit board after copper deposition; a water pump fixedly installed on the outer wall of one side of the cleaning tank; a shunt pipe fixedly installed on the inner wall of the cleaning tank, the shunt pipe being communicated with the water outlet end of the water pump, and a plurality of water outlets being provided on the shunt pipe; a stirring mechanism assembled on the copper deposition tank for stirring the copper solution in the copper deposition tank; a support frame fixedly installed on the copper deposition tank and the cleaning tank, a telescopic rod being provided on the support frame, a rotating mechanism being provided on the output shaft of the telescopic rod, a placing rack being provided on the rotating mechanism for placing the circuit board, the rotating mechanism being used to drive the circuit board placed on the placing rack to rotate; a moving mechanism assembled on the support frame and the telescopic rod for driving the circuit board placed on the placing rack to move.

[0006] Preferably, the stirring mechanism includes: a power motor fixedly installed on the outer wall of one side of the copper deposition tank; a stirring frame rotatably installed on the copper deposition tank, one end of the stirring frame is fixedly connected to the output shaft of the power motor, and the stirring frame is used to stir the copper solution in the copper deposition tank.

[0007] Preferably, the rotating mechanism includes: a mounting shell fixedly installed on the output shaft of the telescopic rod; a driving motor fixedly installed inside the mounting shell; a mounting shaft rotatably installed on the mounting shell, one end of the mounting shaft is fixedly connected to the output shaft of the driving motor; a connecting frame fixedly installed at the bottom end of the mounting shaft, and the connecting frame is connected to the placing frame.

[0008] Preferably, a plurality of hooks are provided on the connecting frame, and a plurality of connecting rings are fixedly installed on the outer wall of the placing frame, and the plurality of connecting rings are respectively adapted to the plurality of hooks.

[0009] Preferably, the moving mechanism includes: a servo motor fixedly installed on the support frame; a lead screw rotatably installed on the support frame, one end of the lead screw is fixedly connected to the output shaft of the servo motor; a connecting block threadedly sleeved on the lead screw, and the connecting block is fixedly connected to the telescopic rod.

[0010] Preferably, a limiting rod is fixedly installed on the support frame, the limiting rod is slidably connected to the connecting block, a heating plate is provided on the copper deposition tank, the heating plate is used to heat the solution in the copper deposition tank, and a temperature sensor is provided on the copper deposition tank, and the temperature sensor is used to monitor the temperature of the copper solution in the copper deposition tank.

[0011] Preferably, a controller is provided on one side of the support frame, and the controller is used for control operations.

[0012] Compared with the related art, the copper deposition device for circuit boards provided by the present invention has the following beneficial effects:

[0013] Compared with the prior art, the copper deposition device for circuit boards provided by this solution:

[0014] A copper deposition device for circuit boards is formed by a copper deposition tank, a cleaning tank, a water pump, a shunt pipe, a stirring mechanism, a support frame, a telescopic rod, a rotating mechanism, a placing frame, a moving mechanism and a controller, which can perform copper deposition operations on circuit boards and can also perform cleaning operations on the circuit boards after copper deposition, thus facilitating subsequent processing operations and improving the overall operation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a front view structural schematic diagram of a copper deposition device for circuit boards provided by the present invention;

[0016] Figure 2 is the schematic diagram of the front sectional view of the present utility model;

[0017] Figure 3 is Figure 2 the enlarged schematic diagram of part A shown in

[0018] Figure 4 is Figure 2 the enlarged schematic diagram of part B shown in

[0019] Figure 5 is the three - dimensional schematic diagram of the connecting frame in the present utility model.

[0020] Reference numerals: 1, copper deposition tank; 2, cleaning tank; 3, water pump; 301, shunt pipe; 4, stirring mechanism; 401, power motor; 402, stirring frame; 5, support frame; 6, telescopic rod; 7, rotating mechanism; 701, mounting shell; 702, drive motor; 703, mounting shaft; 704, connecting frame; 8, placing rack; 9, moving mechanism; 901, servo motor; 902, lead screw; 903, connecting block. Detailed implementation manners

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs; the terms used in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above - mentioned drawings are intended to cover non - exclusive inclusion. The terms "first", "second", etc. in the specification and claims of this application or the above - mentioned drawings are used to distinguish different objects and not to describe a specific order; the terms "inner", "outer", "left", "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be understood as a limitation of the present utility model.

[0022] Referring to "embodiment" herein means that a specific feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of this application. The phrase appears at various positions in the specification and does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0023] An embodiment of the present utility model provides a copper deposition device for circuit boards, as shown in Figures 1-5As shown, the copper deposition device for circuit boards includes: a copper deposition tank 1 for performing copper deposition operations on circuit boards; a cleaning tank 2 fixedly installed on the outer wall of one side of the copper deposition tank 1 for cleaning the circuit boards after copper deposition; a water pump 3 fixedly installed on the outer wall of one side of the cleaning tank 2; a shunt pipe 301 fixedly installed on the inner wall of the cleaning tank 2, the shunt pipe 301 being connected to the water outlet end of the water pump 3, and a plurality of water outlets being provided on the shunt pipe 301; a stirring mechanism 4 assembled on the copper deposition tank 1 for stirring the copper solution in the copper deposition tank 1; a support frame 5 fixedly installed on the copper deposition tank 1 and the cleaning tank 2, a telescopic rod 6 being provided on the support frame 5, a rotating mechanism 7 being provided on the output shaft of the telescopic rod 6, a placement rack 8 being provided on the rotating mechanism 7 for placing circuit boards, the rotating mechanism 7 being used to drive the circuit boards placed on the placement rack 8 to rotate; and a moving mechanism 9 assembled on the support frame 5 and the telescopic rod 6 for driving the circuit boards placed on the placement rack 8 to move.

[0024] In this embodiment, a certain amount of copper solution is put into the copper deposition tank 1, and the stirring mechanism 4 is started through the controller to stir the copper solution in the copper deposition tank 1, so that the copper solution is more uniform, and then the copper deposition operation on the circuit board can be better performed. The circuit board is placed on the placement rack 8, and the telescopic rod 6 is started through the controller to drive the circuit board to move down into the copper deposition tank 1, so as to perform the copper deposition operation on the circuit board. During the copper deposition process, the rotating mechanism 7 is started through the controller to drive the circuit board to rotate, so that the circuit board and the copper solution can be fully contacted, improving the copper deposition effect.

[0025] After the copper deposition is completed, the telescopic rod 6 is started through the controller to drive the circuit board after copper deposition to move up a certain height, and then the moving mechanism 9 is started through the controller to move the circuit board above the cleaning tank 2 (a drain pipe is provided on the cleaning tank 2), and then the circuit board is inserted into the cleaning tank 2 through the telescopic rod 6. Then, the water pump 3 (the water inlet end of the water pump 3 is connected to the corresponding water source pipeline) is started, and the cleaning water is sprayed onto the circuit board through the water outlets on the shunt pipe 301, so as to perform the cleaning operation on the circuit board. During cleaning, the telescopic rod 6 can be used to drive the circuit board to move up and down, and the rotating mechanism 7 can be used to drive the circuit board to rotate, so as to fully clean the circuit board and improve the cleaning effect. The entire operation process can perform copper deposition operations on the circuit board and at the same time clean the circuit board after copper deposition, thus facilitating subsequent processing operations and improving the overall operation efficiency.

[0026] In a further preferred embodiment of the present utility model, the stirring mechanism 4 includes: a power motor 401 fixedly installed on an outer wall of one side of the copper deposition tank 1; a stirring frame 402 rotatably installed on the copper deposition tank 1, one end of the stirring frame 402 being fixedly connected to an output shaft of the power motor 401, and the stirring frame 402 being used to stir the copper solution in the copper deposition tank 1.

[0027] In this embodiment, when using the stirring mechanism 4, the power motor 401 is started by the controller to drive the stirring frame 402 to rotate, stirring the copper solution in the copper deposition tank 1, so that the copper solution is more uniform, and then better copper deposition operation is carried out on the circuit board.

[0028] In a further preferred embodiment of the present utility model, the rotating mechanism 7 includes: a mounting shell 701 fixedly installed on an output shaft of the telescopic rod 6; a driving motor 702 fixedly installed in the mounting shell 701; a mounting shaft 703 rotatably installed on the mounting shell 701, one end of the mounting shaft 703 being fixedly connected to an output shaft of the driving motor 702; a connecting frame 704 fixedly installed at the bottom end of the mounting shaft 703, and the connecting frame 704 being connected to the placement frame 8.

[0029] In this embodiment, when using the rotating mechanism 7, the driving motor 702 is started by the controller to drive the mounting shaft 703 to rotate, thereby driving the placement frame 8 on the connecting frame 704 to rotate, and then driving the circuit board to rotate. On the one hand, it can further stir the copper solution, and on the other hand, it can make the circuit board fully contact with the copper solution, improving the copper deposition effect of the circuit board.

[0030] In a further preferred embodiment of the present utility model, a plurality of hooks are provided on the connecting frame 704, and a plurality of connecting rings are fixedly installed on an outer wall of the placement frame 8, and the plurality of connecting rings are respectively adapted to the plurality of hooks.

[0031] In this embodiment, through the mutual cooperation of the hooks and the connecting rings, the placement frame 8 and the connecting frame 704 can be connected and fixed.

[0032] In a further preferred embodiment of the present utility model, the moving mechanism 9 includes: a servo motor 901 fixedly installed on the support frame 5; a lead screw 902 rotatably installed on the support frame 5, one end of the lead screw 902 being fixedly connected to an output shaft of the servo motor 901; a connecting block 903 threadedly sleeved on the lead screw 902, and the connecting block 903 being fixedly connected to the telescopic rod 6.

[0033] In this embodiment, when using the moving mechanism 9, the controller is used to start the servo motor 901 to drive the lead screw 902 to rotate. Under the limiting effect of the limiting rod on the connecting block 903, the lead screw 902 can drive the connecting block 903 to move, so as to move the circuit board from above the copper deposition tank 1 to above the cleaning tank 2, which facilitates the cleaning operation of the circuit board after copper deposition.

[0034] In a further preferred embodiment of the present invention, a limiting rod is fixedly installed on the support frame 5. The limiting rod is slidably connected to the connecting block 903. A heating plate is arranged on the copper deposition tank 1. The heating plate is used to heat the solution in the copper deposition tank 1. A temperature sensor is arranged on the copper deposition tank 1. The temperature sensor is used to monitor the temperature of the copper solution in the copper deposition tank 1.

[0035] In this embodiment, the limiting rod can play a role in limiting the connecting block 903. The heating plate can heat the copper solution in the copper deposition tank 1, and the temperature sensor can monitor the temperature of the copper solution in the copper deposition tank 1.

[0036] In a further preferred embodiment of the present invention, a controller is arranged on one side of the support frame 5. The controller is used for control operations.

[0037] In this embodiment, it is convenient to perform control operations through the controller.

[0038] In summary, compared with the related art, through the copper deposition tank 1, the cleaning tank 2, the water pump 3, the shunt pipe 301, the stirring mechanism 4, the support frame 5, the telescopic rod 6, the rotating mechanism 7, the placement rack 8, the moving mechanism 9 and the controller, a circuit board copper deposition device is formed, which can perform copper deposition operations on the circuit board and can also perform cleaning operations on the circuit board after copper deposition, thus facilitating subsequent processing operations and improving the overall operation efficiency.

[0039] In several embodiments provided by the present application, it should be understood that the disclosed device can be implemented in other ways.

[0040] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than limiting the protection scope of the invention. Obviously, the described embodiments are only some embodiments of the present invention, rather than all embodiments. Based on these embodiments, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present invention. Although the present invention has been described in detail with reference to the above embodiments, those of ordinary skill in the art can still, without conflict and without making creative efforts, combine, add or delete the features in the embodiments of the present invention according to the circumstances or make other adjustments, so as to obtain different technical solutions that essentially do not depart from the concept of the present invention, and these technical solutions also belong to the scope of protection of the present invention.

Claims

1. A copper deposition device for a circuit board, characterized in that, Comprising: A copper immersion tank for performing copper immersion operation on a circuit board; A cleaning tank fixedly installed on an outer wall of one side of the copper immersion tank for cleaning the circuit board after copper immersion; A water pump fixedly installed on an outer wall of one side of the cleaning tank; A shunt pipe fixedly installed on an inner wall of the cleaning tank, the shunt pipe being communicated with a water outlet end of the water pump, and a plurality of water outlets being provided on the shunt pipe; A stirring mechanism assembled on the copper immersion tank for stirring the copper solution in the copper immersion tank; A support frame fixedly installed on the copper immersion tank and the cleaning tank, an expansion rod being provided on the support frame, a rotating mechanism being provided on an output shaft of the expansion rod, a placing rack being provided on the rotating mechanism for placing the circuit board, and the rotating mechanism being used for driving the circuit board placed on the placing rack to rotate; A moving mechanism assembled on the support frame and the expansion rod for driving the circuit board placed on the placing rack to move.

2. The copper deposition device for circuit boards according to claim 1, characterized in that, The stirring mechanism includes: A power motor fixedly installed on an outer wall of one side of the copper immersion tank; A stirring frame rotatably installed on the copper immersion tank, one end of the stirring frame being fixedly connected to an output shaft of the power motor, and the stirring frame being used for stirring the copper solution in the copper immersion tank.

3. The copper deposition device for circuit boards according to claim 1, wherein, The rotating mechanism includes: A mounting shell fixedly installed on the output shaft of the expansion rod; A driving motor fixedly installed in the mounting shell; A mounting shaft rotatably installed on the mounting shell, one end of the mounting shaft being fixedly connected to an output shaft of the driving motor; A connecting frame fixedly installed at a bottom end of the mounting shaft, the connecting frame being connected to the placing rack.

4. The copper deposition device for circuit boards according to claim 3, wherein, A plurality of hooks are provided on the connecting frame, and a plurality of connecting rings are fixedly installed on an outer wall of the placing rack, and the plurality of connecting rings are respectively adapted to the plurality of hooks.

5. The copper deposition device for circuit boards according to claim 1, wherein, The moving mechanism includes: A servo motor fixedly installed on the support frame; A lead screw rotatably installed on the support frame, one end of the lead screw being fixedly connected to an output shaft of the servo motor; A connecting block threadedly sleeved on the lead screw, the connecting block being fixedly connected to the expansion rod.

6. The copper deposition device for circuit boards according to claim 5, characterized in that, A limiting rod is fixedly installed on the support frame, the limiting rod is slidably connected to the connecting block, a heating plate is provided on the copper immersion tank for heating the solution in the copper immersion tank, and a temperature sensor is provided on the copper immersion tank for monitoring the temperature of the copper solution in the copper immersion tank.

7. The copper deposition device for circuit boards according to claim 1, characterized in that, A controller is provided on one side of the support frame for performing control operations.

Images