Laser hole cutting workbench

Abstract

The utility model discloses a laser hole cutting workbench, which relates to the technical field of laser processing and comprises a side support frame, an air cylinder is arranged on one side of the side support frame, the output end of the air cylinder is connected with a laser beam emitter, a transposition mechanism is arranged right below the laser beam emitter, and the transposition mechanism is connected with the laser beam emitter. The position changing mechanism adjusts the hole cutting position of the surface of a workpiece according to the specification of the workpiece and conducts positioning treatment on the outer side of the workpiece, and a cleaning mechanism is arranged on one side of the position changing mechanism and cleans chippings generated by laser cutting on the surface of the material stacking table. The outer side of the workpiece is clamped through the side clamp arranged on the outer side of the stacking table, the unfolding size of the positions of the electric cylinder and the side clamp is adjusted according to the clamping requirement, the outer side of the workpiece is positioned and limited through the side clamp, and the requirement for clamping and positioning different positions of workpieces of different specifications is met.

Description

Technical Field

[0001] The utility model relates to the technical field of laser processing, and particularly relates to a laser hole cutting workbench. Background Art

[0002] As an advanced manufacturing technology in the processing field, laser processing has been widely applied to important sectors of the national economy such as automobiles, electronics, electrical appliances, aviation, metallurgy, and machinery manufacturing. Laser drilling has also been well applied in the field of laser processing, and its demand is increasingly trending towards miniaturization of the aperture, and it is required that the aperture of laser processing drilling is small, about 0.05mm - 0.5mm.

[0003] It is difficult for the laser hole cutting workbench to clean the debris generated during cutting, which easily causes the debris to stay on the workbench and affect subsequent hole cutting processing. Moreover, the single symmetrically arranged fixture can only clamp relatively regular workpieces. When processing less regular workpieces, it will affect the stability of the workbench during the drilling process of the workpiece, and it is easy for the workpiece to be displaced. Summary of the Invention

[0004] The purpose of the utility model is to provide a laser hole cutting workbench to solve the above-mentioned defects in the prior art.

[0005] A laser hole cutting workbench includes side support frames. One side of the side support frames is provided with a cylinder, and the output end of the cylinder is connected with a laser beam emitter. A position changing mechanism is arranged directly below the laser beam emitter. The position changing mechanism adjusts the hole cutting position on the surface of the workpiece according to the specifications of the workpiece and performs positioning processing on the outside of the workpiece. A cleaning mechanism is arranged on one side of the position changing mechanism, and the cleaning mechanism cleans the debris generated by laser cutting on the surface of the material loading table.

[0006] Preferably, the position changing mechanism includes a material loading table, a servo motor, side clamps, electric cylinders, and a workpiece turntable. The bottom end of the workpiece turntable is connected with the output end of the servo motor, the bottom end of the servo motor is connected with the top end of the material loading table, the side clamps are circularly distributed on the outside of the material loading table, and one side of the side clamps is connected with the output end of the electric cylinder.

[0007] Preferably, the servo motor is connected with one end of the side clamp through the circumferentially distributed electric cylinders.

[0008] Preferably, the cleaning mechanism includes a soft brush, side positioning frames, a storage box, and a chip discharge port. The soft brush is arranged below the workpiece turntable. A chip discharge port is formed through one side of the material loading table. The storage box is arranged directly below the chip discharge port, and the outside of the storage box is connected with side positioning frames.

[0009] Preferably, the material loading table is connected with the outside of the storage box through the side positioning frames arranged at the bottom end.

[0010] Preferably, a rubber pad is adhesively connected to the middle of the material stacking table.

[0011] Compared with the prior art, the utility model has the following advantages:

[0012] 1. The outer side of the workpiece is clamped by the side clamp arranged on the outer side of the material stacking table, and according to the clamping requirements, the positions and dimensions of the electric cylinder and the side clamp are adjusted. The outer side of the workpiece is positioned and limited by the side clamp, so as to meet the clamping and positioning of workpieces with different specifications at different positions.

[0013] 2. After the clamping is completed, the side clamp and the workpiece are driven to rotate by the servo motor. At the same time, the soft brush arranged under the workpiece turntable is used to clean the debris generated during the workpiece processing. Then, the debris is collected by the storage box arranged on one side, which is convenient for cleaning the debris on the surface of the material stacking table while processing the workpiece, and also convenient for the debris on the surface of the workpiece and the workpiece turntable to fall off. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a three-dimensional structural schematic diagram of the whole utility model.

[0015] Figure 2 It is a side view structural schematic diagram of the side support frame in the utility model.

[0016] Figure 3 It is a front sectional structural schematic diagram of the material stacking table in the utility model.

[0017] Figure 4 It is a top view structural schematic diagram of the workpiece turntable in the utility model.

[0018] Wherein:

[0019] 1. Side support frame; 2. Material stacking table; 3. Servo motor; 4. Side clamp; 5. Electric cylinder; 6. Workpiece turntable; 7. Transposition mechanism; 8. Laser beam emitter; 9. Cleaning mechanism; 10. Soft brush; 11. Side positioning frame; 12. Storage box; 13. Chip discharge port; 14. Cylinder; 15. Rubber pad. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0020] In order to make the technical means, creative features, achieved purposes and functions of the utility model easy to understand, the utility model will be further described below in conjunction with specific embodiments.

[0021] Such as Figures 1 to 4As shown in the figure, a laser hole-cutting workbench includes a side support frame 1. On one side of the side support frame 1, there is a cylinder 14. The output end of the cylinder 14 is connected to a laser beam emitter 8. Right below the laser beam emitter 8, there is a transposition mechanism 7. The transposition mechanism 7 adjusts the hole-cutting positions on the surface of the workpiece according to the specifications of the workpiece and positions the outside of the workpiece. On one side of the transposition mechanism 7, there is a cleaning mechanism 9. The cleaning mechanism 9 cleans the debris generated by laser cutting on the surface of the material loading table 2.

[0022] In this embodiment, the transposition mechanism 7 includes a material loading table 2, a servo motor 3, side clamps 4, an electric cylinder 5, and a workpiece turntable 6. The bottom end of the workpiece turntable 6 is connected to the output end of the servo motor 3. The bottom end of the servo motor 3 is connected to the top end of the material loading table 2. The side clamps 4 are circularly distributed on the outside of the material loading table 2. One side of the side clamps 4 is connected to the output end of the electric cylinder 5. The side clamps 4 clamp workpieces of different sizes or shapes to prevent the workpieces from shaking during rotation.

[0023] In this embodiment, the servo motor 3 is connected to one end of the side clamp 4 through the electrically cylinders 5 that are annularly distributed on the outside. The servo motor 3 drives the side clamp 4 to rotate while using a soft brush 10 for rotational cleaning.

[0024] In this embodiment, the cleaning mechanism 9 includes a soft brush 10, a side positioning frame 11, a storage box 12, and a chip discharge port 13. The soft brush 10 is arranged below the workpiece turntable 6. One side of the material loading table 2 is penetrated and provided with a chip discharge port 13. Right below the chip discharge port 13, there is a storage box 12. The outside of the storage box 12 is connected to a side positioning frame 11. The storage box 12 stores the chips generated during processing to prevent the chips from scattering outside the material loading table 2.

[0025] In this embodiment, the material loading table 2 is connected to the outside of the storage box 12 through the side positioning frame 11 provided at the bottom end. The side positioning frame 11 positions and disassembles the storage box 12.

[0026] In this embodiment, a rubber pad 15 is adhesively connected to the middle of the material loading table 2 to increase the contact friction of the workpiece.

[0027] When this laser hole-cutting workbench is actually applied, it includes the following working contents:

[0028] Step 1: The operator places the workpiece on the surface of the workpiece turntable 6. According to the specifications and dimensions of the workpiece, by turning on the electric cylinder 5, the electric cylinder 5 drives the side clamp 4 provided on one side to perform a lateral displacement, and the surface of the workpiece is clamped and positioned by the side clamp 4. The rubber pad 15 is used to increase the contact surface at the bottom end of the workpiece, avoiding the situation that the workpiece sways from above on the surface of the workpiece turntable 6 during the processing. The cylinder 14 drives the laser beam emitter 8 to descend vertically, so that the laser beam emitter 8 corresponds to the surface of the workpiece to be processed, which is conducive to the laser beam emitter 8 opening holes on the surface of the workpiece;

[0029] Step 2: The operator turns on the servo motor 3, and the servo motor 3 drives the workpiece turntable 6 to rotate. The workpiece turntable 6 drives the workpiece to rotate, and the processing surface of the workpiece and the laser beam emitter 8 is switched. The debris generated during the processing directly falls onto the surface of the material loading table 2;

[0030] Step 3: After the drilling of the workpiece is completed, the servo motor 3 drives the workpiece turntable 6 to rotate, and the soft brush 10 provided at the bottom end of the workpiece turntable 6 rotates, so that the soft brush 10 cleans the debris on the surface of the material loading table 2. At the same time, the debris on the surface of the workpiece turntable 6 that rotates at an accelerated speed directly falls onto the surface of the material loading table 2. During the rotation process, the soft brush 10 directly sweeps the debris into the inside of the chip discharge port 13. The operator then turns on the electric cylinder 5, and the electric cylinder 5 drives the side clamp 4 to move, releasing the clamping of the workpiece;

[0031] Step 4: The debris directly falls into the through hole opened at the top end of the storage box 12, and then the storage box 12 is taken out from the outside of the side positioning frame 11. The storage box 12 is separated from the material loading table 2, and the debris inside the storage box 12 is directly dumped, and then the storage box 12 is inserted into the inside of the side positioning frame 11 again.

[0032] Therefore, the above disclosed embodiments are illustrative in all aspects and not exclusive. All changes within the scope of the present invention or equivalent to the present invention are encompassed by the present invention.

Claims

1. A laser hole-cutting workbench, characterized in that: It includes a side support frame (1). One side of the side support frame (1) is provided with a cylinder (14). The output end of the cylinder (14) is connected to a laser beam emitter (8). A position-changing mechanism (7) is arranged directly below the laser beam emitter (8). The position-changing mechanism (7) adjusts the hole-cutting position on the surface of the workpiece according to the specifications of the workpiece and positions the outer side of the workpiece. A cleaning mechanism (9) is arranged on one side of the position-changing mechanism (7). The cleaning mechanism (9) cleans the debris generated by laser cutting on the surface of the material stacking table (2). The position-changing mechanism (7) includes a material stacking table (2), a servo motor (3), side clamps (4), an electric cylinder (5), and a workpiece turntable (6). The bottom end of the workpiece turntable (6) is connected to the output end of the servo motor (3). The bottom end of the servo motor (3) is connected to the top end of the material stacking table (2). The side clamps (4) are circularly distributed on the outer side of the material stacking table (2). One side of the side clamps (4) is connected to the output end of the electric cylinder (5).

2. The laser hole-cutting workbench according to claim 1, characterized in that: The servo motor (3) is connected to one end of the side clamp (4) through the electrically actuated cylinders (5) that are annularly distributed on the outside.

3. The laser hole-cutting workbench according to claim 1, characterized in that: The cleaning mechanism (9) includes a soft brush (10), a side positioning frame (11), a storage box (12), and a chip discharge port (13). The soft brush (10) is arranged below the workpiece turntable (6). A chip discharge port (13) is formed through one side of the material stacking table (2). A storage box (12) is arranged directly below the chip discharge port (13). The outer side of the storage box (12) is connected to a side positioning frame (11).

4. A laser hole-cutting workbench according to claim 3, characterized in that: The material stacking table (2) is connected to the outer side of the storage box (12) through the side positioning frame (11) arranged at the bottom end.

5. A laser hole-cutting workbench according to claim 1, characterized in that: A rubber pad (15) is adhesively connected to the middle of the material stacking table (2).

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