Wafer flat edge arraying device

Abstract

The utility model relates to a wafer flat edge arraying device which comprises an overturning table assembly and a lifting table assembly. The overturning table assembly comprises an overturning table and an overturning driving mechanism for driving the overturning table to overturn between a first limit position and a second limit position; the overturning table is provided with at least one storage position for fixing a wafer conveying box, and when the overturning table is located at a first limit position, wafers in the wafer conveying box at the storage position are approximately horizontally placed; when the overturning table is located at a second limit position, the wafers in the wafer conveying box at the storage position are approximately vertically placed; the lifting table assembly comprises a lifting table arranged below the overturning table, a carrier roller horizontally arranged on the lifting table, a rotation driving mechanism for driving the carrier roller to rotate and a lifting driving mechanism. And the lifting driving mechanism is in transmission connection with the lifting table and is used for driving the lifting table to lift, so that the carrier rollers on the lifting table can just vertically abut against the wafer on the overturning table at the second position.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing processes, and particularly relates to a wafer flat-edge alignment device. Background Art

[0002] The edges of a wafer include a round edge and a flat edge. The flat edge (also known as the positioning edge) is formed by a diamond saw cutting on a silicon ingot before the silicon wafer is cut into individual pieces. After cutting, the individual wafers present a shape like a superior arc bow, and the chord part is the flat edge. The existence of the flat edge has the following important functions:

[0003] Positioning and alignment: The flat edge can help the equipment accurately position and align the silicon wafer during the manufacturing process, thus ensuring the accuracy and consistency of subsequent processing steps. This is because precise control is crucial in the chip manufacturing process, and the existence of the flat edge provides a physical reference and positioning point for this process.

[0004] Crystal orientation identification: The position and number of flat edges are closely related to the crystal orientation of the silicon wafer. By observing the configuration of the flat edges, the type of crystal orientation of the silicon wafer, such as <111>, <110>, or <100>, etc., can be quickly determined. This is very important for ensuring the performance and reliability of the chip because different crystal orientations will affect the physical and chemical properties of the material.

[0005] In the semiconductor manufacturing process, the vertical chemical vapor deposition furnace (Furnace tube) is a widely used cluster deposition device, which has the advantages of high deposition efficiency and high-precision control. The conventional structure of the vertical chemical vapor deposition furnace mainly includes a furnace tube and a furnace door arranged at the lower part of the furnace tube. The furnace tube serves as a deposition reaction chamber, and a precursor nozzle component is arranged inside. A susceptor is fixedly arranged on the liftable furnace door. The number of nozzles in the precursor nozzle component varies according to the requirements of the deposited film or the process requirements, and one or more nozzles can be set. The nozzle component is distributed along the axis of the susceptor and is arranged on one side of the susceptor. The furnace tube is also provided with an air inlet and an air outlet.

[0006] From the above structure, it can be seen that during the deposition process, no matter how the nozzles and the susceptor structure inside the furnace tube are improved, the gas inside the furnace tube must be uneven, resulting in inconsistent deposition thickness distribution of the wafers in each area and uneven deposition film thickness on each wafer. At this time, the flat edge plays an extremely important role in judging the deposition film thickness distribution of the wafer. Therefore, before the flat-edge wafers enter the vertical chemical vapor deposition furnace, the flat edges of each wafer need to be aligned.

[0007] At present, the wafer flat edge alignment is achieved by a roller abutting against the wafer circumference of the wafer transport box. A crank is connected to the end of the roller. When adjusting the wafer position, the staff often turns the crank to make the wafer abutting against the roller start to rotate until the flat edges of each wafer abut against the outer wall of the roller to achieve the flat edge alignment of each wafer. After that, the wafer is sent to the loading equipment of the vertical chemical deposition furnace for loading. Conventional loading equipment mainly includes two parts: a wafer transport box handling robot and a wafer handling robot.

[0008] Due to the manual roller turning, the wafer position needs to be checked manually after adjustment to avoid the wafer position not being adjusted properly. In addition, manual adjustment makes the efficiency of wafer adjustment depend on the proficiency of the staff, which makes it impossible to connect manual operations and subsequent robot operations, and the loading efficiency of the vertical chemical deposition furnace is not stable enough.

[0009] Therefore, it is necessary to improve and optimize the existing flat panel aligning device so that it can better meet user needs. Utility Model Content

[0010] The purpose of the embodiment of the utility model is to address the shortcomings of the prior art structure and to propose a wafer flat edge alignment device that can achieve automatic flat edge alignment and automatic assembly line operation for aligning and loading, thereby improving production efficiency.

[0011] In order to achieve the above-mentioned utility model object, a wafer flat edge alignment device proposed in the embodiment of the utility model is realized by the following technical scheme:

[0012] A wafer flat edge alignment device, characterized by comprising:

[0013] The turning table assembly comprises a turning table and a turning driving mechanism for driving the turning table to turn between a first extreme position and a second extreme position; the turning table is provided with at least one storage position for selectively fixing a wafer conveying box, when the turning table is in the first extreme position, the wafers in the wafer conveying box on the storage position are placed roughly horizontally; when the turning table is in the second extreme position, the wafers in the wafer conveying box on the storage position are placed roughly vertically;

[0014] The lifting platform assembly includes a lifting platform arranged below the turning platform, rollers arranged horizontally on the lifting platform, a rotation driving mechanism for driving the rollers to rotate, and a lifting driving mechanism; the lifting driving mechanism is transmission-connected to the lifting platform and is used to drive the lifting platform to rise so that the rollers on it can just vertically abut and lift the outer edge of the wafer on the turning platform in the second position.

[0015] A grooved roller is also provided on the lifting table in parallel with the idler roller. The grooved roller and the idler roller are driven by a rotation driving mechanism to rotate synchronously. Grooves are evenly arranged circumferentially on the surface of the grooved roller. When the lifting driving mechanism drives the lifting table to rise: the wafers in the wafer transfer box on the turning table in the second position are just embedded in the grooves of the grooved roller and can be supported by the bottom of the grooves and the idler roller at the same time.

[0016] The rotation driving mechanism includes a stepping motor. A first pulley is fixedly installed at one end of the idler roller, a second pulley is fixedly installed at one end of the grooved roller, and a third pulley is installed on the output shaft of the stepping motor. The first pulley and the second pulley have the same diameter, and the belt is wound around the first pulley, the second pulley and the third pulley.

[0017] The grooved roller is provided with a wafer-aligning bushing made of Teflon, and grooves are evenly arranged circumferentially on the surface of the wafer-aligning bushing.

[0018] The idler roller is provided with a silica gel sleeve.

[0019] A clamping mechanism for clamping the wafer transfer box is provided on the turning table.

[0020] The turning table assembly further includes a frame. The turning table is pivotally connected to the frame. The turning driving mechanism is a cylinder, the seat part of which is pivotally connected to the frame, and the piston part of which is pivotally connected to the turning table.

[0021] Compared with the prior art, the beneficial effects of the present utility model are: automatic edge flattening and alignment can be realized, and the alignment and feeding are carried out automatically in an assembly line operation, improving the production efficiency. Moreover, the device also has the advantages of simple structure, simple and convenient operation, high precision, etc., greatly improving the product quality. Description of the Drawings

[0022] Through the following description of its exemplary embodiments in conjunction with the drawings, the above features and advantages of the present utility model will become clearer and easier to understand.

[0023] Figure 1 It is a perspective view I of the wafer edge flattening and alignment device according to an embodiment of the present utility model;

[0024] Figure 2 It is a perspective view II of the wafer edge flattening and alignment device according to an embodiment of the present utility model;

[0025] Figure 3 It is a structural view of the turning table assembly and the lifting table assembly according to an embodiment of the present utility model;

[0026] Figure 4 It is a structural view of the lifting table assembly according to an embodiment of the present utility model. Detailed Embodiments

[0027] The following specific embodiments illustrate the implementation manners of the present utility model. Those skilled in this technology can easily understand other advantages and effects of the present utility model from the content disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all of them. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present utility model without making creative efforts belong to the scope of protection of the present utility model.

[0028] Terms such as "front", "rear", "left", "right", "inside", "outside", etc. cited in this specification are only for the convenience of clear narration, rather than to limit the scope of implementation of the present utility model. The change or adjustment of their relative relationship, without substantial change in the technical content, should also be regarded as the scope of implementation of the present utility model.

[0029] In the description of the following embodiments, unless otherwise clearly specified and limited, terms such as "connection" should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components, unless otherwise clearly limited. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.

[0030] See Figures 1-3 As shown, the embodiment of the present utility model relates to a specific wafer transfer box 1. Grooves are evenly arranged on the opposite side walls of the wafer transfer box 1. A cavity that penetrates up and down and is used for inserting wafers is formed between the two side walls, and the lower opening of the cavity is smaller than the upper opening and can prevent the wafers from falling off. The embodiment of the present utility model provides a wafer flat-edge alignment device, which includes a frame 2, and further includes:

[0031] A turning table assembly 3

[0032] There are two storage positions for fixing the wafer transfer box on the turning table 31. The storage positions are adapted to the shape of the lower opening part of the wafer transfer box, and the wafer transfer box can be placed on it in a manner that exposes the lower opening. A clamping mechanism 33 is arranged beside the storage position and is used for clamping the wafer transfer box. In this embodiment, the clamping mechanism 33 is a clamping block driven by a cylinder, and it can cooperate with the baffle on the other side of the storage position to clamp the wafer transfer box.

[0033] The flipping drive mechanism 32 is drivingly connected to the flipping table 31, and drives the flipping table 31 to flip between a first extreme position and a second extreme position. When the flipping table 31 is in the first extreme position, the wafers in the wafer transfer cassette 1 on its storage position are placed substantially horizontally; when the flipping table 31 is in the second extreme position, the wafers in the wafer transfer cassette 1 on its storage position are placed substantially vertically. It should be particularly noted here that the wafers do not need to be absolutely vertical or horizontal at the first extreme position and the second extreme position. For example, at the first extreme position, the wafer transfer cassette can have a slight inclination to prevent the wafers from slipping out of the opening, but it must be ensured that the manipulator can pick up the wafers horizontally at the first extreme position, and the wafers can be lifted by the idler rollers and the grooved rollers at the second extreme position.

[0034] In a preferred embodiment, the flipping table 31 is pivotally connected to the frame 34, and the flipping drive mechanism 32 is a cylinder, the seat part of which is pivotally connected to the frame 34, and the piston part is pivotally connected to the flipping table 31, so as to realize the flipping of the flipping table 31.

[0035] Lifting table assembly 4

[0036] See Figures 1-4 As shown, the lifting table assembly 4 includes a lifting table 41 and a lifting drive mechanism 42.

[0037] The lifting table 41 is arranged directly below the flipping table. The lifting table 41 is provided with idler rollers 42, grooved rollers 43, and a rotation drive mechanism 44. The idler rollers 42 and the grooved rollers 43 are both horizontally rotatably arranged and are parallel to each other. The idler rollers 42 and the grooved rollers 43 are driven by the rotation drive mechanism 44 to rotate synchronously. Specifically, a pulley 421 is fixedly installed at one end of the idler roller 42, and a pulley 431 is fixedly installed at one end of the grooved roller 43. The rotation drive mechanism 44 includes a stepping motor 441, and a pulley 442 is installed on the output shaft of the stepping motor 441. The pulleys 421 and 431 have the same diameter, and a belt 443 is wound around the pulley 442, the pulley 421, and the pulley 431, so as to realize driving the idler rollers 42 and the grooved rollers 43 to rotate synchronously by the stepping motor 441.

[0038] The grooved roller 43 is provided with a wafer aligning bushing, that is to say, grooves are circumferentially and evenly arranged on its circumferential surface, and the grooves are in clearance fit with the wafers in the wafer transfer cassette. In a preferred embodiment, the wafer aligning bushing of the grooved roller 43 is made of Teflon. And the idler roller 42 is provided with a silica gel sleeve to increase the friction when contacting the wafers.

[0039] The lifting drive mechanism 42 is a cylinder. When the lifting drive mechanism 42 drives the lifting table 41 to rise, the carrying rollers 42 and the grooved rollers 43 rise. The wafers in the wafer transfer box on the turntable 41 in the second position are exactly and correspondingly embedded in the grooves of the grooved rollers 43 and are in interference fit with the groove side plates. At this time, the wafers abut against the bottom of the grooves of the grooved rollers 43 and the carrying rollers 42, and are slightly lifted and supported by the bottom of the grooves of the grooved rollers 43 and the carrying rollers 42 at the same time. When the carrying rollers 42 and the grooved rollers 43 rotate synchronously, they can drive the wafers to rotate until the flat sides. When the wafers rotate until the flat sides face down, the carrying rollers 42 and the grooved rollers 43 just stop contacting the edges of the wafers at the same time, and the wafers fall and are supported by the wafer transfer box. Therefore, it can be seen that the distance between the carrying rollers 42 and the grooved rollers 43 needs to match the width of the flat sides of the wafers.

[0040] When each wafer has its flat side facing down, the wafers in the wafer transfer box are all aligned. Since the maximum rotation angle of the wafers does not exceed 360°, setting the carrying rollers 42 and the grooved rollers 43 to rotate one circle for each operation can complete the alignment of the wafers.

[0041] Compared with the prior art, the beneficial effects of the present utility model are as follows: It can realize automatic flat-side alignment, and the alignment and feeding are carried out automatically in an assembly line operation, improving the production efficiency. Moreover, the device also has the advantages of simple structure, simple and convenient operation, and high precision, greatly improving the product quality.

[0042] The above details the inventive concept and implementation manner of the present utility model through embodiments. However, those of ordinary skill in the art to which the present utility model pertains can understand that the above embodiments of the present utility model are only one of the preferred embodiments of the present utility model. Due to space limitations, all implementation manners cannot be listed one by one here. Any implementation that can embody the technical solution of the claims of the present utility model falls within the protection scope of the present utility model.

[0043] It should be noted that the above content is a further detailed description of the present utility model in combination with specific implementation manners. It cannot be determined that the specific implementation manners of the present utility model are limited to this. Under the guidance of the above embodiments, those skilled in the art can make various improvements and deformations on the basis of the above embodiments, and these improvements or deformations fall within the protection scope of the present utility model.

Claims

1. A wafer flat edge alignment device, characterized in that Comprising: A turning table assembly, including a turning table and a turning drive mechanism for driving the turning table to turn between a first extreme position and a second extreme position; at least one storage position for selectively fixing a wafer transfer cassette is provided on the turning table. When the turning table is in the first extreme position, the wafers in the wafer transfer cassette on its storage position are placed substantially horizontally; when the turning table is in the second extreme position, the wafers in the wafer transfer cassette on its storage position are placed substantially vertically. A lifting table assembly, including a lifting table provided below the turning table, a roller horizontally provided on the lifting table, a rotation drive mechanism for driving the roller to rotate, and a lifting drive mechanism; the lifting drive mechanism is in transmission connection with the lifting table and is used for driving the lifting table to rise so that the roller thereon can just vertically abut against and lift the outer edge of the wafer on the turning table in the second position.

2. The wafer flat-edge alignment device according to claim 1, wherein: A grooved roller is also provided on the lifting table in parallel with the roller. The grooved roller and the roller are driven by the rotation drive mechanism to rotate synchronously. Grooves are circumferentially and uniformly provided on the circumferential surface of the grooved roller; when the lifting drive mechanism drives the lifting table to rise: the wafers in the wafer transfer cassette on the turning table in the second position just embed into the grooves of the grooved roller and can be supported by both the bottom of the grooves and the roller at the same time.

3. The wafer flat-edge alignment device according to claim 2, wherein: The rotation drive mechanism includes a stepping motor. A first pulley is fixedly installed at one end of the roller, a second pulley is fixedly installed at one end of the grooved roller, a third pulley is installed on the output shaft of the stepping motor, the first pulley and the second pulley have the same diameter, and a belt is wound around the first pulley, the second pulley and the third pulley.

4. The wafer flat-edge alignment device according to claim 3, characterized in that: The grooved roller is provided with a wafer aligning bushing made of Teflon, and grooves are circumferentially and uniformly provided on the circumferential surface of the wafer aligning bushing.

5. A wafer flat edge alignment device according to claim 4, characterized in that: The roller is provided with a silica gel sleeve.

6. The wafer flat-edge alignment device according to claim 1, characterized in that: A clamping mechanism for clamping the wafer transfer cassette is provided on the turning table.

7. The wafer flat-edge aligning device according to claim 1, characterized in that: The turning table assembly further includes a frame body. The turning table is pivotally connected to the frame body. The turning drive mechanism is a cylinder, the seat body part of which is pivotally connected to the frame body, and the piston part of which is pivotally connected to the turning table.

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