Diode sliver device

Abstract

The utility model discloses a diode sliver device, which relates to the technical field of diode production devices, and specifically structurally comprises a workbench, an assembling cavity is formed in the workbench; the pushing mechanism is installed on one side of the workbench, and the movable end of the pushing mechanism moves in the horizontal direction; the material frame is mounted at the movable end of the pushing mechanism; the jacking mechanism is mounted in the workbench; the pushing mechanism comprises a pushing air cylinder installed on one side of the workbench, and the piston rod end of the pushing air cylinder extends into the assembling cavity. The pushing frame is installed in the pushing air cylinder, a matching groove is formed in the pushing frame, and a material frame is installed on the pushing frame; the jacking mechanism comprises a jacking air cylinder, the jacking air cylinder is vertically arranged, and the piston rod end of the jacking air cylinder faces upwards; the jacking block is installed at the piston rod end of the jacking air cylinder, and the jacking block corresponds to the matching groove. The technical problem that an existing sliver is inconvenient to operate is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of diode production devices, in particular to a diode comb bar device. Background Art

[0002] Semiconductor diodes belong to an industry with mature technology. However, in the production line of diodes, there is a process of transferring semi-finished products of multiple electronic components from the template of the previous process to the mold bar of the next process, and then performing operations such as encapsulation and printing word by word. The production factory calls this process comb bar.

[0003] The existing comb bar operation usually adopts manual operation, so the efficiency is relatively low. There are also operations by machines, but the structures of such devices are relatively complex and the operations are inconvenient. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a diode comb bar device, which solves the technical problem of inconvenient comb bar operation in the prior art.

[0005] An embodiment of the present application discloses a diode comb bar device, including:

[0006] A workbench, in which an assembly cavity is opened.

[0007] A pushing mechanism, installed on one side of the workbench, and the movable end of the pushing mechanism moves in the horizontal direction.

[0008] A material rack, installed on the movable end of the pushing mechanism.

[0009] A jacking mechanism, installed inside the workbench.

[0010] The pushing mechanism includes:

[0011] A pushing cylinder, installed on one side of the workbench, and the piston rod end of the pushing cylinder extends into the assembly cavity.

[0012] A pushing frame, installed inside the pushing cylinder, and a matching groove is opened on the pushing frame, and the material rack is installed on the pushing frame.

[0013] The jacking mechanism includes:

[0014] A jacking cylinder, the jacking cylinder is vertically arranged, and the piston rod end of the jacking cylinder faces upward.

[0015] A jacking block, installed on the piston rod end of the jacking cylinder, and the jacking block corresponds to the matching groove.

[0016] This application designs a pushing mechanism and a lifting mechanism. By using the two cooperating mechanisms, the stable transfer of diode materials can be achieved, thereby improving the working efficiency of the combing strip.

[0017] Based on the above technical solutions, the embodiments of this application can also be improved as follows:

[0018] Further, a connecting plate is arranged in the middle of the mating groove, and the connecting plate cooperates with the middle of the material rack. The beneficial effect of this step is that the stability of the material rack during placement can be ensured through the connecting plate.

[0019] Further, there are two lifting blocks, and the lifting blocks are arranged at intervals. The lifting blocks are located on both sides of the connecting plate. The beneficial effect of this step is that the two spaced-apart lifting blocks are used for lifting, and the picking of diodes is completed simultaneously.

[0020] Further, a plurality of through holes are spacedly arranged on the material rack. The through holes are arranged in pairs at intervals, and the through holes in the same group are respectively located on both sides of the connecting plate. The beneficial effect of this step is that the collection of diodes can be coordinated through the plurality of through holes, facilitating the subsequent operations of the diodes.

[0021] Further, a material clamping groove is arranged at the top of the lifting block, and a plurality of first grooves are spacedly arranged at the top of the material clamping groove;

[0022] A plurality of second grooves are spacedly arranged at the top side of the through hole. The beneficial effect of this step is that the placement of the diode on the material rack is completed through the mutual cooperation of the first grooves, the second grooves and the leads of the diode.

[0023] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0024] 1. This application is provided with a pushing mechanism and a lifting mechanism. Through the pushing mechanism, the material rack can be pushed to the corresponding position, and then the lifting mechanism is started to complete the processing of the corresponding diode, so that the diode can be stably placed on the material rack, thereby improving the efficiency of removing the diode from the conversion die.

[0025] 2. This application is provided with spaced lifting blocks, which can place the diodes in two through holes at a time, thereby further improving the working efficiency. Description of the Drawings

[0026] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following will briefly introduce the drawings required for the description of the specific embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0027] Figure 1 The front view of a diode comb device according to a specific embodiment of the present invention;

[0028] Figure 2 is Figure 1 the top view of;

[0029] Figure 3 is Figure 1 the structural schematic diagram of the pushing mechanism in;

[0030] Figure 4 is Figure 1 the structural schematic diagram of the material rack in;

[0031] 1 - Workbench; 2 - Pushing mechanism; 3 - Material rack; 4 - Lifting mechanism;

[0032] 101 - Assembly cavity;

[0033] 201 - Pushing cylinder; 202 - Pushing frame; 203 - Fitting groove; 204 - Connecting plate;

[0034] 301 - Through hole; 302 - Second groove;

[0035] 401 - Lifting cylinder; 402 - Lifting block; 403 - Material clamping groove; 404 - First groove. Specific embodiments

[0036] The following will describe in detail the embodiments of the technical solutions of the present invention in conjunction with the drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present invention, so they are only examples and cannot be used to limit the protection scope of the present invention.

[0037] It should be noted that unless otherwise specified, the technical terms or scientific terms used in this application should have the ordinary meaning understood by those skilled in the art to which the present invention belongs.

[0038] In this application, unless otherwise clearly specified and defined, terms such as "installation", "connection", "fixation", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0039] To better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings of the specification and the specific implementation manners.

[0040] Embodiment:

[0041] As Figures 1-4 shown, this application discloses a diode comb device, which is used to take multiple diodes from the conversion mold, place them on the rack, and then perform the next processing.

[0042] The specific structure of this application includes:

[0043] A workbench 1, with an assembly cavity 101 opened inside the workbench 1. This assembly cavity 101 facilitates the subsequent pushing mechanism to push, so that the corresponding rack is sent out from the assembly cavity 101 and cooperates with the subsequent lifting mechanism to lift and place the material.

[0044] A pushing mechanism 2, installed on one side of the workbench 1, and the movable end of the pushing mechanism 2 moves in the horizontal direction. The purpose of this pushing mechanism 2 is to push the subsequent rack out from inside the assembly cavity 101 for subsequent picking and placing.

[0045] A rack 3, installed at the movable end of the pushing mechanism 2, and this rack 3 is used to place the corresponding diodes.

[0046] A lifting mechanism 4, installed inside the workbench 1. This lifting mechanism 4 can take the diodes from the conversion mold, and when the lifting mechanism 4 moves down, the diodes can be placed on the rack 3 for subsequent operations.

[0047] As Figure 3 shown, the pushing mechanism 2 includes:

[0048] A pushing cylinder 201, installed on one side of the workbench 1, and the piston rod end of the pushing cylinder 201 extends into the assembly cavity 101.

[0049] The pushing frame 202 is installed inside the pushing cylinder 201, and a mating groove 203 is formed on the pushing frame 202. The material rack 3 is installed on the pushing frame 202. The pushing frame 202 is located inside the assembly cavity, and the side wall of the assembly cavity 101 is provided with a sliding groove to facilitate the movement of the pushing frame 202 along the sliding groove.

[0050] As Figure 1 shown, the lifting mechanism 4 includes:

[0051] A lifting cylinder 401, which is vertically arranged, and the piston rod end of the lifting cylinder 401 faces upward.

[0052] A lifting block 402 is installed at the piston rod end of the lifting cylinder 401, and the lifting block 402 corresponds to the mating groove 203, that is, the lifting block 402 can vertically enter and exit the mating groove 203 under the drive of the lifting cylinder 401.

[0053] For further explanation of the pushing mechanism 2 and the lifting mechanism 4 of the present application, the piston rod of the pushing cylinder 201 can be horizontally pushed, that is, it drives the pushing frame 202 to laterally enter or leave the assembly cavity 101. At the same time, when pushing, the pushing cylinder 201 can be used to push the pushing frame 202 for intermittent movement; when the pushing frame 202 stops, the lifting cylinder 401 moves upward, driving the lifting block 402 to move upward and cooperate with the diode on the transfer mold to clamp the diode, and then the lifting cylinder 401 moves downward, driving the lifting block 402 to move downward, so as to realize the downward movement of the diode and ensure that the diode can stably fall onto the pushing frame 202.

[0054] In an embodiment, a connecting plate 204 is arranged in the middle of the mating groove 203, and the connecting plate 204 cooperates with the middle of the material rack 3. The extending direction of the connecting plate 204 is parallel to the movement direction of the pushing cylinder 201. Its main purpose is to divide the mating groove 303 into two front and rear regions, cooperating with the subsequent two lifting blocks to simultaneously perform the combing process on the diodes on both sides.

[0055] Specifically, there are two lifting blocks 402, and the lifting blocks 402 are arranged at intervals. The lifting blocks 402 are located on both sides of the connecting plate 204. In the present application, the lifting blocks 402 are arranged at intervals, so that the combing of the diodes on both sides can be realized simultaneously, thereby improving the working efficiency of diode processing.

[0056] Specifically, a plurality of through holes 301 are arranged at intervals on the material rack 3. The through holes 301 are arranged in pairs at intervals, and the through holes 301 in the same group are respectively located on both sides of the connecting plate 204. In the present application, the through holes 301 in the same group are arranged front and back, cooperating with the lifting blocks 402, so as to improve the efficiency.

[0057] Among them, a material clamping groove 403 is provided at the top of the jacking block 402, and a plurality of first grooves 404 are arranged at intervals at the top of the material clamping groove 403, and the first grooves 404 are distributed along the length direction of the material clamping groove 403;

[0058] A plurality of second grooves 302 are arranged at intervals at the top side of the through hole 301, and similarly, the second grooves 302 are matched with the first grooves 404 to complete the blanking operation.

[0059] The using process of this application is as follows:

[0060] Before use, place the conversion mold containing diodes on the workbench 1, then install the material rack 3 on the connecting plate, start the pushing cylinder 201 to make the material rack 3 move outwards for a certain distance. At this time, the jacking cylinder 401 drives the jacking block 402 to move, so that the jacking block 402 corresponds to the through hole 301 one by one. The jacking block 402 moves upward through the through hole and contacts the diodes of the conversion mold, so that the first grooves 404 are matched with the diodes. Then the jacking block 402 moves the diodes downward, so that the lead ends of the diodes are matched with the second grooves 302, so as to realize that the diodes can be stably placed on the material rack. Through the above actions, until all the through holes of the material rack are filled with diodes, then remove the material rack, and then install a new material rack.

[0061] In the description of the specification of the present utility model, a large number of specific details are described. However, it can be understood that the embodiments of the present utility model can be practiced without these specific details. In some instances, well-known methods, structures, and technologies are not shown in detail so as not to obscure the understanding of this specification.

[0062] In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0063] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the various embodiments of the present invention, and they should all be covered by the scope of the claims and the description of the present invention.

Claims

1. A diode comb device, characterized in that, Comprising: A workbench, inside which an assembly cavity is provided; A pushing mechanism, installed on one side of the workbench, and the movable end of the pushing mechanism moves in the horizontal direction; A material rack, installed on the movable end of the pushing mechanism; A lifting mechanism, installed inside the workbench; The pushing mechanism includes: A pushing cylinder, installed on one side of the workbench, and the piston rod end of the pushing cylinder extends into the interior of the assembly cavity; A pushing frame, installed inside the pushing cylinder, and a fitting groove is provided on the pushing frame, and the material rack is installed on the pushing frame; The lifting mechanism includes: A lifting cylinder, the lifting cylinder is vertically arranged, and the piston rod end of the lifting cylinder faces upward; A lifting block, installed on the piston rod end of the lifting cylinder, and the lifting block corresponds to the fitting groove.

2. The diode comb device according to claim 1, characterized in that, A connecting plate is arranged in the middle of the fitting groove, and the connecting plate cooperates with the middle of the material rack.

3. The diode comb bar device according to claim 2, characterized in that, There are two lifting blocks, and the lifting blocks are arranged at intervals, and the lifting blocks are located on both sides of the connecting plate.

4. The diode comb device according to claim 3, characterized in that, A plurality of through holes are provided on the material rack at intervals, the through holes are arranged in pairs at intervals, and the through holes in the same group are respectively located on both sides of the connecting plate.

5. The diode comb device according to claim 4, characterized in that, A material clamping groove is arranged at the top of the lifting block, and a plurality of first grooves are arranged at intervals at the top of the material clamping groove; A plurality of second grooves are arranged at intervals at the top side of the through hole.

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