Airflow distribution device and coating equipment

By setting up a uniform plate and cleaning pipe in the coating chamber, the problems of uneven gas distribution and air hole blockage are solved, the coating quality is improved and the cleaning process is simplified.

CN223118546UActive Publication Date: 2025-07-18CHENGDU ZHONGKE ZHUOER INTELLIGENT TECH GRP CO LTD
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Patent Information

Application Number
CN202422403977.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-09-30
Publication Date
2025-07-18
Estimated Expiration
2034-09-30

AI Technical Summary

Technical Problem

In existing coating equipment, gas cannot be evenly distributed in the coating chamber, resulting in uneven coating layer, and direct contact of reaction gas may lead to clogging of air holes and difficulty in cleaning splashing substances.

Method used

A uniform flow plate is arranged in the coating chamber and the gas pipeline is arranged opposite to the gas pipeline to form a flowing gas path, preventing the gas from flowing directly and dividing evenly, and a cleaning pipe and a barrier plate are set up to allow independent gas to pass in and clean impurities.

Benefits of technology

The uniformity of the coating layer is improved, avoiding the blockage of pores and adhesion of splashing substances, and improving the coating quality and cleaning convenience.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to an airflow distribution device and coating equipment, which comprises a coating chamber, an air path pipeline and a flow uniformizing plate, the side wall of the coating chamber is communicated with the air path pipeline, the flow uniformizing plate is arranged in the coating chamber, the flow uniformizing plate and the air path pipeline are oppositely arranged, a flowing air path is formed between the inner wall of the coating chamber and the flow uniformizing plate, and the flow uniformizing plate is communicated with the air path pipeline. And the uniform flow plate is used for uniformly dividing gas entering the coating chamber. According to the utility model, the uniform flow plate can block the direct circulation of gas when the gas enters the coating chamber, and the gas is diffused towards the gap direction of the flowing gas path, so that the gas is uniformly introduced into the coating chamber under the action of the uniform flow plate to carry out coating reaction with the substrate, the uniformity of the coating layer of the substrate is ensured, and the coating quality is improved.
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Description

Technical Field

[0001] The utility model relates to the technical field of coating equipment, and particularly relates to a coating equipment with an air flow distribution device. Background Art

[0002] The full name of the ALD coating process is Atomic Layer Deposition, which is a method of forming a uniform and dense thin film on the surface of a material through atomic layer deposition. The atomic layer deposition technology forms a thin film by alternately introducing gaseous precursors into the reaction chamber in pulses and undergoing surface saturation chemical reactions on the deposition substrate. Through the atomic layer deposition coating equipment, substances can be deposited layer by layer on the surface of the substrate in the form of single atomic layers. Each coating is one atomic layer. According to the atomic characteristics, coating 10 times is about 1nm.

[0003] After the gas is introduced into the coating chamber through the externally arranged air inlet pipe, due to the influence of the position of the air inlet pipe on the gas flow path, the reaction gas cannot uniformly reach the surface of the substrate in the coating chamber for reaction, resulting in a low quality of the coated film layer. Content of the Utility Model

[0004] The purpose of the first aspect of the utility model is to solve the technical problem that the film layer formed by the coating reaction is uneven because the gas cannot uniformly adhere to the substrate in the coating chamber due to the gas inlet position during coating. A gas flow distribution device for coating equipment is provided, which can uniformly distribute the gas introduced from the side through a flow equalizing plate, ensuring that the gas is evenly ejected to reach the surface of the substrate, improving the uniformity of the film layer. The main idea is as follows:

[0005] A gas flow distribution device includes a coating chamber, an air path pipeline, and a flow equalizing plate. The side wall of the coating chamber is communicated with the air path pipeline, and the flow equalizing plate is arranged inside the coating chamber. The flow equalizing plate is relatively arranged with the air path pipeline. A flowing air path is formed between the inner wall of the coating chamber and the flow equalizing plate, and the flowing air path is communicated with the air path pipeline. The flow equalizing plate is used to uniformly distribute the gas entering the coating chamber. In this solution, a flow equalizing plate is arranged inside the coating chamber, so that a gap between the flow equalizing plate and the inner wall of the coating chamber forms a flowing air path. When the external air path pipeline introduces gas into the coating chamber, the gas entering the coating chamber will be blocked by the flow equalizing plate when it directly flows through. At the same time, under the resistance of the flow equalizing plate, the gas will diffuse towards the gap direction of the flowing air path. Then, the gas evenly dispersed in the flowing air path will be uniformly introduced into the coating chamber through the action of the flow equalizing plate to react with the substrate for coating. The uniform distribution of the gas in the coating chamber ensures the uniformity of the substrate coating layer, thereby improving the coating quality.

[0006] Preferably, the gas pipeline includes an intake pipeline group and an outlet pipeline, and the intake pipeline group and the outlet pipeline are respectively arranged on opposite side walls of the coating chamber. The intake pipeline group introduces reaction gas that undergoes surface saturation chemical reaction on the deposition substrate into the coating chamber. An outlet pipeline is arranged on the side wall opposite to the intake pipeline group of the coating chamber to discharge the excess gas remaining after the saturation chemical reaction, so as to avoid the influence of residual gas on the subsequent coating reaction.

[0007] Preferably, the flow equalizing plate includes an intake flow equalizing plate and an outlet flow equalizing plate. The intake flow equalizing plate is arranged at the outlet of the intake pipeline group, and the outlet flow equalizing plate is arranged at the inlet of the outlet pipeline. The intake flow equalizing plate is used to receive the gas output from the outlet of the intake pipeline group, and the outlet flow equalizing plate is used to receive the gas input from the inlet of the outlet pipeline. Under the resistance of the intake flow equalizing plate, the gas diffuses towards the gap direction of the flowing gas path and uniformly outputs the gas into multiple pores of the intake flow equalizing plate for coating reaction with the substrate; when the outlet pipe evacuates gas, the gas in the flowing gas path connected to the outlet pipe is first evacuated, and under the action of pressure, the gas on the side of the flowing gas path passes through multiple pores arranged on the outlet flow equalizing plate to evacuate the coating chamber evenly in the horizontal direction, avoiding the formation of evacuation dead corners at positions far from both sides of the outlet, resulting in slow gas output.

[0008] Preferably, a plurality of pores are evenly distributed on the flow equalizing plate, and the sum of the areas of the pores is smaller than the cross-sectional area of the gas pipeline. By arranging a plurality of pores smaller than the cross-section of the gas pipeline on the flow equalizing plate, when the gas pipeline fills the coating chamber with gas, the output gas will be blocked by the flow equalizing plate, causing the flow rate of the output gas to be blocked and slowed down, and the gas gradually flows and diffuses around the flow equalizing plate.

[0009] Preferably, the gap width of the flowing gas path is 0.5 - 2 mm. Constraining the width of the flowing gas path within the range of 0.5 - 2 mm can enable the gas to enter the coating chamber through the pores of the flow equalizing plate under the action of the output pressure after being evenly distributed in the flowing gas path, avoiding excessive gas remaining in the flowing gas path and affecting the coating effect.

[0010] The second objective of the present utility model is to solve the technical problem that different gases participating in the reaction will have a chemical reaction when directly contacting the flow equalizing plate, which may cause blockage of the air holes. Further, the intake pipe group includes a cleaning pipe and a plurality of reaction gas pipes. The cleaning pipe is used to introduce inert gas, and the plurality of reaction gas pipes are used to introduce different reaction gases respectively. In this solution, the number and types of different gases are such that each gas is assigned a separate reaction gas pipe, and a cleaning pipe is provided to be able to introduce nitrogen or other inert gas into the coating chamber. After the gas in the reaction gas pipe enters the coating chamber for reaction, nitrogen is output through the cleaning pipe to extrude the reaction gas in the flow path and at the position of the flow equalizing plate by air pressure, and then the gas of the next reaction gas pipe is output. This can make the gases introduced into the coating chamber by the plurality of reaction gas pipes independent of each other, avoiding direct contact and reaction of the gas sources of multiple reaction gases, and thus avoiding blockage of the air holes during the long-term process.

[0011] The third objective of the present utility model is to solve the technical problems that chemical reactions during the coating reaction will generate splashing substances, which are difficult to clean when adhering to the inner wall of the coating chamber, and if the splashing substances are not cleaned in time, it will affect the subsequent coating quality. Further, a baffle plate is provided in the coating chamber, and the baffle plate is detachably connected to the coating chamber through a fastener. In this solution, a detachably connected baffle plate is provided on the inner wall of the coating chamber, which can prevent impurities from directly adhering to the inner wall of the coating chamber, and the baffle plate can be directly replaced to clean the coating impurities.

[0012] Preferably, the baffle plate is welded to the flow equalizing plate. The end of the baffle plate and the end of the flow equalizing plate are integrally connected by welding, so that the flow equalizing plate can be synchronously installed in the coating chamber through the installation of the baffle plate, and the installation position is on the side wall where there is no interference with the operation of the flow equalizing plate. And during the coating process, some splashing substances will also adhere to the flow equalizing plate. When the baffle plate is disassembled, the flow equalizing plate can also be disassembled and reinstalled at the same time.

[0013] A coating device further includes a chamber door, a sample stage, an electrode assembly, and a heating assembly. The chamber door is installed on the top of the coating chamber through a hinge, and the chamber door is used to achieve vacuum sealing of the coating chamber. The chamber door is provided with an electrode assembly for coating the substrate. Inside the coating chamber, there is a sample stage for placing the substrate, and below the coating chamber, there is a heating assembly for heating the substrate.

[0014] The beneficial effects of the present utility model are as follows:

[0015] By arranging a flow equalizing plate inside the coating chamber, the flow equalizing plate will block the direct flow of gas when the gas enters the coating chamber, and diffuse the gas towards the gap of the flow gas path, so that the gas uniformly enters the inside of the coating chamber under the action of the flow equalizing plate to react with the substrate for coating, ensuring the uniformity of the coating layer on the substrate, thereby improving the coating quality. Brief Description of the Drawings

[0016] Figure 1 It is a schematic structural diagram of the present invention.

[0017] Figure 2 It is a structural section of the present invention Figure 1 。

[0018] Figure 3 It is a schematic structural diagram of the flow gas path of the present invention.

[0019] Figure 4 It is a structural section of the present invention Figure 2 。

[0020] The reference numerals include: 1. Coating chamber; 2. Gas path pipeline; 21. Cleaning pipeline; 22. Reaction gas pipeline; 23. Exhaust pipeline; 3. Flow equalizing plate; 31. Air holes; 4. Flow gas path; 5. Baffle plate; 6. Fastener; 7. Chamber door; 8. Specimen stage; 9. Electrode assembly; 10. Heating assembly. Detailed Description of the Invention

[0021] In order to make the purpose, technical solutions and advantages of the embodiments clearer, the present invention will be further described in detail below with reference to the drawings and embodiments. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. On the contrary, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0022] In the present disclosure, unless otherwise stated, the orientation terms such as "inside, outside" are defined according to the self-profile of the corresponding components. The terms such as "first, second" used in the present disclosure are used to distinguish one element from another, and do not have sequence and importance.

[0023] Embodiment 1:

[0024] As Figures 1-4As shown in the figure, an air flow distribution device includes a coating chamber 1, an air duct 2, and a flow equalizing plate 3. The side wall of the coating chamber 1 is connected to the air duct 2. A flow equalizing plate 3 is arranged inside the coating chamber 1. The flow equalizing plate 3 is arranged opposite to the air duct 2. A flowing air path 4 is formed between the inner wall of the coating chamber 1 and the flow equalizing plate 3. The flowing air path 4 is connected to the air duct 2. The flow equalizing plate 3 is used to evenly distribute the gas entering the coating chamber 1.

[0025] In this solution, a flow equalizing plate 3 is arranged inside the coating chamber 1, so that a gap between the flow equalizing plate 3 and the inner wall of the coating chamber 1 forms a flowing air path 4. When the external air duct 2 introduces gas into the coating chamber 14, the gas entering the coating chamber 1 will be blocked by the flow equalizing plate 3 arranged in the coating chamber 1, and at the same time, under the resistance of the flow equalizing plate 3, the gas will diffuse towards the gap direction of the flowing air path 4. Then, the gas evenly dispersed in the flowing air path 4 will be evenly introduced into the coating chamber 1 under the action of the flow equalizing plate 3 to react with the substrate for coating. The uniform distribution of the gas in the coating chamber 1 ensures the uniformity of the coating layer on the substrate, thereby improving the coating quality.

[0026] As Figure 2 shown in the figure, the air duct 2 includes an intake duct group and an outlet duct 23. The intake duct group and the outlet duct 23 are respectively arranged on the opposite side walls of the coating chamber 1. The intake duct group introduces reaction gas that undergoes a surface saturation chemical reaction on the deposition substrate into the coating chamber 1. An outlet duct 23 is arranged on the side wall opposite to the intake duct group of the coating chamber 1 to discharge the excess gas remaining after the saturation chemical reaction, avoiding the influence of residual gas on the subsequent coating reaction.

[0027] As Figure 1 shown in the figure, the flow equalizing plate 3 includes an intake flow equalizing plate and an outlet flow equalizing plate. The intake flow equalizing plate is arranged at the outlet of the intake duct group, and the outlet flow equalizing plate is arranged at the inlet of the outlet duct 23. The intake flow equalizing plate is used to receive the gas output from the outlet of the intake duct group, and the outlet flow equalizing plate is used to receive the gas input from the inlet of the outlet duct 23. Under the resistance of the intake flow equalizing plate, the gas will diffuse towards the gap direction of the flowing air path 4 and evenly output the gas into the multiple pores of the intake flow equalizing plate to react with the substrate for coating. When the outlet duct 23 conducts air extraction, the gas in the flowing air path 4 connected to the outlet duct 23 is first extracted. Under the action of the pressure, the gas on the side of the flowing air path 4 evenly extracts the gas in the coating chamber 1 in the horizontal direction through the multiple pores arranged on the outlet flow equalizing plate, avoiding the formation of an air extraction dead angle at positions far from both sides of the outlet, resulting in slow gas output.

[0028] As Figure 4As shown, a plurality of air holes 31 are evenly distributed on the uniform flow plate 3, and the sum of the areas of the air holes 31 is smaller than the cross-sectional area of the gas path pipe 2. By providing a plurality of air holes 31 smaller than the cross-section of the gas path pipe on the uniform flow plate 2, when the gas path pipe 2 fills the coating chamber with gas, the output gas will be blocked by the uniform flow plate 3, causing the flow rate of the output gas to be blocked and slowed down, and the gas gradually flows and diffuses around the uniform flow plate 3.

[0029] In this embodiment, in order to better enable the uniform flow plate 3 to reduce the flow rate of the gas in the intake pipe 2 and form resistance, the sum of the areas of all the air holes 31 of the uniform flow plate 3 is smaller than the cross-sectional area of a single intake pipe 2.

[0030] The gap width of the flow gas path 4 is 0.5 - 2 mm. Constraining the width of the flow gas path 4 within the range of 0.5 - 2 mm can enable the gas to be evenly distributed in the flow gas path and then enter the coating chamber through the air holes 31 of the uniform flow plate 3 under the action of the output pressure, avoiding excessive gas remaining in the flow gas path 4 and affecting the coating effect.

[0031] Embodiment 2:

[0032] As Figure 2 shown, the intake pipe group of this embodiment includes a cleaning pipe 21 and a plurality of reaction gas pipes 22. The cleaning pipe 21 is used to introduce inert gas, and the plurality of reaction gas pipes 22 are used to introduce different reaction gases respectively.

[0033] In this embodiment, each gas is allocated a separate reaction gas pipe 22 by the quantity and type of the introduced different gases, and a cleaning pipe 21 is provided to be able to introduce nitrogen or other inert gas into the coating chamber 1. After the gas in the reaction gas pipe 22 reacts in the coating chamber, nitrogen is output through the cleaning pipe 21 to extrude the reaction gas at the position of the flow gas path 4 and the uniform flow plate 3 by air pressure, and then the gas output of the next reaction gas pipe 22 is carried out. This can make the gases introduced into the coating chamber 1 by the plurality of reaction gas pipes 22 independent of each other, avoiding the direct contact and reaction of the gas sources of multiple reaction gases, and thus avoiding the blockage of the air holes in the long-term process.

[0034] Embodiment 3:

[0035] As Figure 2 shown, a baffle plate 5 is provided in the coating chamber 1 of this embodiment, and the baffle plate 5 is detachably connected to the coating chamber 1 through a fastener 6. This solution provides a detachably connected baffle plate 5 on the inner wall of the coating chamber 1, which can prevent impurities from directly adhering to the inner wall of the coating chamber, and the baffle plate 5 can be directly replaced to clean the coating impurities.

[0036] The baffle plate 5 is welded to the flow equalizing plate 3. The end of the baffle plate 5 and the end of the flow equalizing plate 3 are integrally connected by welding, so that the flow equalizing plate 3 can be synchronously installed in the coating chamber through the installation of the baffle plate 5, and the installation position is on the side wall that does not interfere with the operation of the flow equalizing plate 3. And during the coating process, some splashing substances will also adhere to the flow equalizing plate 3. When the baffle plate 5 is disassembled, the flow equalizing plate 3 can also be disassembled and reinstalled at the same time.

[0037] Embodiment 4:

[0038] As Figures 1-4 shown, this embodiment provides a coating device, which further includes a chamber door 7, a sample stage 8, an electrode assembly 9 and a heating assembly 10. The chamber door 1 is installed on the top of the coating chamber 1 through a hinge. The chamber door 7 is used to achieve the vacuum seal of the coating chamber 1. The chamber door 7 is provided with an electrode assembly 9 for coating the substrate. Inside the coating chamber 1, there is a sample stage 8 for placing the substrate, and below the coating chamber 1, there is a heating assembly 10 for heating the substrate.

[0039] In one embodiment, the electrode assembly 9 includes a radio frequency power supply and an electrode plate. After the electrode plate is connected to the radio frequency power supply, it can form a plasma to etch the surface of the substrate; a water cooling structure is provided in the heating assembly 10. After a cooling medium is introduced into the water cooling structure, the heating assembly 10 can be quickly cooled down.

[0040] Place the substrate on the sample stage 8. The heating assembly 10 evenly heats the substrate to the process temperature through the sample stage 8. When the substrate temperature is stable, gas is introduced into the coating chamber 1 through the intake pipe group of the gas flow distribution device of the coating device. Start the radio frequency power supply, and the electrode plate forms a plasma to etch the surface of the substrate. After the etching is completed, turn off the power supply and the intake pipe group.

[0041] The above are only the embodiments of the present invention. Common knowledge such as specific structures and characteristics in the solutions is not described in detail here. It should be pointed out that for those skilled in the art, without departing from the structure of the present invention, several deformations and improvements can be made, which should also be regarded as the protection scope of the present invention, and these will not affect the implementation effect of the present invention and the practicability of the patent. The protection scope required by this application should be based on the content of its claims, and the specific implementation manners in the specification can be used to interpret the content of the claims.

Claims

1. An air flow distribution device, characterized in that: It includes a coating chamber (1), a gas pipeline (2) and a flow equalizing plate (3). The side wall of the coating chamber (1) is connected to the gas pipeline (2). The flow equalizing plate (3) is arranged inside the coating chamber (1). The flow equalizing plate (3) is arranged opposite to the gas pipeline (2). A flowing gas path (4) is formed between the inner wall of the coating chamber (1) and the flow equalizing plate (3). The flowing gas path (4) is connected to the gas pipeline (2). The flow equalizing plate (3) is used to evenly distribute the gas entering the coating chamber (1).

2. The air flow distribution device according to claim 1, characterized in that: The gas pipeline (2) includes an intake pipeline group and an outlet pipeline (23). The intake pipeline group and the outlet pipeline (23) are respectively arranged on the opposite side walls of the coating chamber (1).

3. The air flow distribution device according to claim 1, characterized in that: The flow equalizing plate (3) includes an intake flow equalizing plate and an outlet flow equalizing plate. The intake flow equalizing plate is arranged at the outlet of the intake pipeline group. The outlet flow equalizing plate is arranged at the inlet of the outlet pipeline (23).

4. The air flow distribution device according to claim 1, wherein: A plurality of air holes (31) are evenly distributed on the flow equalizing plate (3). The sum of the areas of the air holes (31) is smaller than the cross-sectional area of the gas pipeline (2).

5. An air flow distribution device according to claim 1, characterized in that: The gap width of the flowing gas path (4) is 0.5 - 2 mm.

6. An air flow distribution device according to claim 2, characterized in that: The intake pipeline group includes a cleaning pipeline (21) and a plurality of reaction gas pipelines (22). The cleaning pipeline (21) is used to introduce inert gas. The plurality of reaction gas pipelines (22) are used to respectively introduce different reaction gases.

7. The air flow distribution device according to claim 1, wherein: A baffle plate (5) is arranged inside the coating chamber (1). The baffle plate (5) is detachably connected to the coating chamber (1) through a fastener (6).

8. An air flow distribution device according to claim 7, characterized in that: The baffle plate (5) is welded to the flow equalizing plate (3).

9. A coating device, characterized in that: It includes the gas flow distribution device according to any one of claims 1 - 8.

10. A coating device according to claim 9, characterized in that: It further includes a chamber door (7), a sample stage (8), an electrode assembly (9) and a heating assembly (10). The chamber door (7) is installed on the top of the coating chamber (1) through a hinge. The chamber door (7) is used to achieve vacuum sealing of the coating chamber (1). The chamber door (7) is provided with an electrode assembly (9) for coating the substrate. A sample stage (8) for placing the substrate is arranged inside the coating chamber (1). A heating assembly (10) for heating the substrate is arranged below the coating chamber (1).