Wafer supporting device and thin film deposition equipment

Abstract

The utility model discloses a wafer supporting device and thin film deposition equipment, and the wafer supporting device comprises a weighting part which is provided with at least three installation holes; the number of the supporting pieces is matched with the number of the mounting holes, the bottom ends of the supporting pieces are detachably and fixedly arranged in the mounting holes, and the top ends of the supporting pieces are used for supporting a wafer. According to the utility model, all the supporting members share one weighting member, compared with the prior art that each PIN is independently provided with a heavy punch, the weight of the heating plate can be designed to be heavier, the weight of the weighting member is far greater than that of the heavy punch, greater friction force can be overcome, the smooth movement of the supporting members relative to the heating plate is ensured, the probability of clamping the PIN is greatly reduced, the wafer is prevented from being broken and sliding, and the service life of the heating plate is prolonged. Therefore, the film deposition quality is improved; and the supporting piece can be replaced later, the maintenance period is prolonged, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductors, in particular to a wafer support device and a thin film deposition device. Background Art

[0002] In the field of semiconductor manufacturing, especially when it comes to thin film deposition technology, Thermal Atomic Layer Deposition (Thermal ALD), as a technology for precisely controlling the thickness of thin films, is widely used. However, in such devices, due to their special process conditions, they often do not have functions such as conventional Remote Plasma Source cleaning (RPS). As the deposition process progresses, thin films will gradually accumulate layer by layer inside the reaction chamber. When these thin films accumulate to a certain thickness, they will affect the key mechanical components inside the device. One of the most significant problems is the so-called "PIN jamming" phenomenon. The PIN jamming problem mainly occurs in components with relative movement, such as between the Lift PIN for supporting the wafer and the heating plate. There are two basic types of Lift PINs: one is passive or fixed PIN, which has no built-in driving element and its movement completely depends on the lifting of the heating plate; the other is active PIN, which is usually equipped with driving devices such as cylinders and motors at the bottom and can move independently of the heating plate. In the case of fixed PINs, due to the lack of sufficient driving force, only relying on its own weight or additional weights to perform relative movement, when the deposited thin film gradually thickens, the gap between the PIN and the heating plate will become smaller and smaller, and eventually the PIN may get stuck. PIN jamming not only causes problems such as fragments and sliding during wafer processing, but also leads to abnormal process data, seriously affecting production efficiency and product quality. More troublesome is that the existing fixed PIN design cannot immediately issue a warning signal when the PIN jamming phenomenon occurs. Usually, it is necessary to infer reversely by observing the change of process parameters, and the real confirmation can only be achieved when the device is opened for maintenance. This process not only takes time but also may miss the best repair opportunity, further exacerbating the severity of the problem. Summary of the Utility Model

[0003] Embodiments of the utility model provide a wafer support device and a thin film deposition device, aiming to solve the problem that the existing fixed PIN gets stuck and affects wafer processing.

[0004] In a first aspect, the utility model provides a wafer support device, comprising:

[0005] A weight member, on which there are at least three mounting holes;

[0006] At least three support members, the number of the support members matching the number of the mounting holes, the bottom end of the support member being detachably fixed in the mounting hole, and the top end of the support member being used for supporting a wafer.

[0007] Further, the wafer support device further includes a loosening prevention component, the bottom end of the support member passing through the mounting hole, and the loosening prevention component being connected to the bottom end of the support member.

[0008] Further, the wafer support device further includes a loosening prevention component, the bottom end of the support member passing through the mounting hole, and the loosening prevention component being connected to the bottom end of the support member.

[0009] Further, the loosening prevention component includes a pre-tightening member, and the pre-tightening member presses the bottom end of the support member upward.

[0010] Further, the loosening prevention component further includes a fixing member and a flat top member, the pre-tightening member being elastic, the flat top member abutting against the bottom end of the support member, two ends of the pre-tightening member respectively abutting against the flat top member and the fixing member, and the fixing member being fixed on the weight member and compressing the pre-tightening member.

[0011] Further, a positioning boss is further provided on the weight member, the positioning boss protruding away from the support member, a positioning hole is formed in the positioning boss, the positioning hole is communicated with the mounting hole, and the loosening prevention component is arranged in the positioning hole.

[0012] Further, the weight member is a disk; and / or,

[0013] The weight member is a disk, and the mounting holes are uniformly distributed along the circumferential direction of the disk.

[0014] Further, the disk is a disk, and the mounting holes are uniformly distributed along the circumferential direction of the disk.

[0015] Further, a mounting boss is further provided on the weight member, the mounting boss protruding towards the support member, and the mounting hole is formed in the mounting boss.

[0016] Further, a guiding inlet for guiding the support member to enter is provided on the mounting boss, the guiding inlet is arranged at the inlet of the mounting hole and communicated with the mounting hole, and the guiding inlet gradually narrows towards the mounting hole.

[0017] Further, the support member has at least one first support section and at least one second support section along its axial direction, and the diameters of the first support section and the second support section are different.

[0018] In a second aspect, the present utility model further provides a thin film deposition device, which includes a cavity, a heating plate, and a wafer support device. The heating plate and the wafer support device are disposed in the cavity. The wafer support device is the above-mentioned wafer support device. The heating plate is provided with a through hole, and a support member passes through the through hole.

[0019] Furthermore, an inner lining sleeve is also disposed in the cavity, a weight member is disposed on the inner lining sleeve, and a positioning notch for positioning the weight member is formed on one side of the inner lining sleeve facing the weight member.

[0020] The present utility model provides a wafer support device and a thin film deposition device. The wafer support device includes a weight member and at least three support members. The weight member is provided with at least three mounting holes, the number of the mounting holes is the same as the number of the support members, the support members are respectively mounted into the mounting holes in a one-to-one correspondence, the bottom end of the support member is detachably connected to the mounting hole, the top end of the support member supports the wafer, and all the support members share one weight member. Compared with the existing heavy hammers independently configured for each PIN, the weight can be designed to be heavier, the mass of the weight member is much greater than the mass of the heavy hammer, it can overcome greater friction, ensure smooth movement of the support member relative to the heating plate, greatly reduce the probability of PIN jamming, avoid wafer fragmentation and sliding, thereby improving the quality of thin film deposition; moreover, the support member can be replaced later, the maintenance cycle can be extended, and the production efficiency can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for describing the embodiments will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present utility model. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0022] Figure 1 Shows a schematic diagram of the wafer support device according to an embodiment of the present utility model when the heating plate descends;

[0023] Figure 2 Shows a schematic diagram of the wafer support device according to an embodiment of the present utility model when the heating plate ascends;

[0024] Figure 3 Shows a top view schematic diagram of the weight member of the wafer support device according to an embodiment of the present utility model;

[0025] Figure 4 Shows Figure 3 Schematic diagram of the A-A cross-section of;

[0026] Figure 5 Shows Figure 4 Enlarged view of part B of;

[0027] Figure 6 Shows the assembly schematic diagram of the anti-loosening component of the wafer support device according to an embodiment of the present utility model;

[0028] Figure 7 Shows the exploded schematic diagram of the wafer support device according to an embodiment of the present utility model;

[0029] Figure 8 Shows Figure 7 The enlarged view of part C of

[0030] Reference numerals:

[0031] 1. Support member; 11. First support section; 12. Second support section; 2. Weight member; 21. Mounting boss; 211. Mounting hole; 212. Inlet; 22. Positioning boss; 221. Positioning hole; 221a. Upper hole; 221b. Lower hole; 3. Anti-loosening component; 31. Pre-tightening member; 32. Flat-top member; 33. Fixing member; 4. Heating plate; 41. Through hole; 5. Inner lining sleeve; 51. Positioning notch; 6. Cavity. Detailed implementation manners

[0032] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present utility model.

[0033] The directional terms mentioned in the present utility model, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "side", etc., are only references to the directions in the attached drawings. Therefore, the directional terms used are for explaining and understanding the present utility model, rather than for limiting the present utility model. In addition, in the drawings, structures that are similar or the same are denoted by the same reference numerals.

[0034] During the deposition process of the thin film deposition equipment, thin films will gradually accumulate layer by layer inside the reaction chamber. As the deposition process progresses, the thin films will accumulate on the contact surface between the fixed PIN and the heating plate hole. When the deposited thin film gradually thickens, the gap between the PIN and the through hole of the heating plate will become smaller and smaller, increasing the friction force. At this time, relying only on the weight of the PIN itself or an additional weight hammer is not enough to overcome the friction force, and ultimately the PIN may be stuck.

[0035] An embodiment of the present utility model provides a wafer support device and a thin film deposition apparatus, which solve the problem that the existing fixed PIN is stuck, affecting wafer processing. By sharing a weight member among multiple support members, the weight member can be designed to be heavier, capable of overcoming greater frictional force, ensuring smooth movement of the support member relative to the heating plate, and avoiding PIN jamming.

[0036] To solve the above PIN jamming problem, the specific idea of the embodiment of the present utility model is as follows:

[0037] By designing a common weight member as the weight component, each support member, i.e., PIN, is installed on this weight member, and all PINs share one weight member. In this way, the volume of the weight member is larger relative to an independent weight hammer, making full use of the space inside the chamber. Then its weight can be designed to be heavier, capable of overcoming greater frictional force, ensuring smooth relative movement of the PIN and the through-hole of the heating plate, and thus avoiding PIN jamming.

[0038] To better understand the above technical solution, the following will describe the above technical solution in detail in conjunction with the specification drawings and specific implementation manners.

[0039] Please refer to Figures 1-8 , an embodiment of the present utility model shows a wafer support device, including a weight member 2 and support members 1. The weight member 2 is provided with at least three mounting holes 211; at least three support members 1, the number of the support members 1 matches the number of the mounting holes 211, the bottom end of the support member 1 is detachably fixed in the mounting hole 211, and the top end of the support member 1 is used to support the wafer.

[0040] Referring to Figure 1 and Figure 2 , specifically, the wafer support device is arranged in a cavity 6 of a reaction chamber. A heating plate 4 is arranged in the cavity 6, and the heating plate 4 can move up and down in the cavity 6 to cooperate with wafer processing. Among them, the heating plate 4 includes a plate body and a lifting shaft arranged at the bottom of the plate body, and the lifting movement of the lifting shaft drives the plate body to move up and down in the cavity 6. A through-hole 41 is formed in the plate body of the heating plate 4, and the support member 1 of the wafer support device, i.e., PIN, penetrates through the through-hole 41 of the heating plate 4.

[0041] In the process of the process, first, the heating plate 4 descends to the initial position, the support member 1 protrudes above the plate body of the heating plate 4, and the manipulator places the wafer on the top end of the support member 1, and the top end of the support member 1 supports the wafer; then the heating plate 4 rises to the processing position, the support member 1 retracts into the through-hole 41 of the heating plate 4, and the heating plate 4 heats the wafer.

[0042] Ideally, the support member 1 can move smoothly in the through-hole 41 of the heating plate 4 under the action of gravity. However, as the deposition process progresses, the thin film accumulates in the through-hole 41 of the heating plate 4, increasing the friction force, making it difficult for the support member 1 to move smoothly in the through-hole 41 of the heating plate 4. When the friction force increases to be greater than the gravity of the support member 1, the gravity of the support member 1 is no longer sufficient to overcome the friction force, resulting in jamming. The support member 1 cannot smoothly extend out of the through-hole 41 of the heating plate 4 or retract into the through-hole 41 of the heating plate 4. During the upward movement of the heating plate 4, if pin jamming occurs and all the support members 1 cannot fully retract into the through-hole 41 of the heating plate 4, a situation of one high and one low will occur, leading to wafer sliding and affecting wafer processing. During the downward movement of the heating plate 4, if pin jamming occurs, the support member 1 cannot smoothly extend out of the through-hole 41 of the heating plate 4, and the support member 1 may even break at the weak point, resulting in wafer fragmentation and product loss.

[0043] Therefore, in this embodiment, a weight member 2 is provided to significantly increase the weight of the support member 1. Specifically, a central hole is provided in the center of the weight member 2, and the lifting shaft of the heating plate 4 passes through the central hole. The weight member 2 is located below the plate body of the heating plate 4. The weight member 2 has an upper surface and a lower surface. Mounting holes 211 are formed on the upper surface of the weight member 2. The number of mounting holes 211 matches the number of support members 1 and the number of through-holes 41 of the heating plate 4, and at least three are provided. Of course, it can be understood that other numbers are also possible. In this embodiment, the number of mounting holes 211 and the number of support members 1 are both three. The three support members 1 are fixedly mounted on the three mounting holes 211 one by one. The support member 1 is detachably connected to the mounting hole 211 to facilitate the maintenance and replacement of the support member 1. For example, the mounting hole 211 is a threaded hole, and the support member 1 is provided with threads. The support member 1 is installed and fixed by threading the threads on the support member 1 with the threaded hole. When maintaining and replacing the support member 1, it is not necessary to remove the entire heating plate 4. Only by screwing the support member 1 can the installation and disassembly be completed. The installation and replacement are convenient, avoiding the cumbersome installation and debugging process of disassembling and assembling the heating plate 4.

[0044] The three support members 1 are all fixed to the same weight member 2, and the weight member 2 is used to drive the relative movement of the support member 1 and the through hole 41 of the heating plate 4. Compared with the existing structure where a weight is independently configured on each PIN, that is, three weights are respectively configured for three PINs, in this embodiment, only one weight member 2 is provided, and the three support members 1 share one weight member 2. In this way, the weight member 2 can make full use of the cavity space between the three support members 1, and the weight member 2 can be designed to be larger. The larger the volume of the weight member 2, the heavier its weight can be designed. Therefore, the mass of the weight member 2 in this embodiment is much larger than the mass of the weight, greatly increasing the weight, thus being able to overcome greater frictional force and avoid PIN jamming. In addition, since the three support members 1 are all mounted on the same weight member 2, when the support member 1 and the heating plate 4 perform relative movement, the three support members 1 move synchronously, with good stability and not easily shifting.

[0045] Through this embodiment, the weight of the support member 1 is greatly increased by the weight member 2, enabling the support member 1 to move smoothly relative to the through hole 41 of the heating plate 4, avoiding the situation of PIN jamming, preventing wafer fragments and sliding chips, improving the quality of thin film deposition, while also extending the time for opening the cavity to replace the support member 1, extending the maintenance cycle, and improving production efficiency.

[0046] In one embodiment, the wafer support device further includes a loosening prevention assembly 3. The bottom end of the support member 1 passes through the mounting hole 211, and the loosening prevention assembly 3 is connected to the bottom end of the support member 1. Specifically, during the lifting process of the heating sheet, the support member 1 will be affected by frictional force and may become loose. Therefore, in order to prevent the support member 1 from loosening and enhance the connection stability and reliability of the support member 1, the mounting hole 211 is designed as a through hole, and the bottom end of the support member 1 can extend out of the mounting hole 211. The loosening prevention assembly 3 is provided outside the mounting hole 211 to connect the bottom end of the support member 1, and the loosening prevention assembly 3 is used to fasten the bottom end of the support member 1 to prevent it from loosening and improve the connection stability and reliability. It should be noted that the structure of the loosening prevention assembly 3 in this embodiment can be various, for example, bolts, nuts, clamps, etc. No matter what structure it is, as long as it can fasten the bottom end of the support member 1 and increase its rigidity, it is not limited here.

[0047] In this embodiment, the anti-loosening component 3 includes a pre-tightening member 31, and the pre-tightening member 31 presses upward against the bottom end of the support member 1. Specifically, the anti-loosening component 3 includes a pre-tightening member 31 for providing a pre-tightening force. The pre-tightening force refers to a force applied in advance, and its purpose is to enhance the fastening degree between the support member 1 and the weighting member 2, ensuring that the support member 1 can maintain close contact when bearing an external load, that is, the frictional force. The pre-tightening member 31 abuts against the bottom end of the support member 1 and continuously applies an upward pressure to press the support member 1 and provide the pre-tightening force. Thus, the bottom end of the pre-tightening member 31 is pressed against the weighting member 2 under the action of the pre-tightening force, strengthening the support member 1 and improving its structural stiffness, so that it will not loosen even when subjected to frictional force, and the connection reliability is improved. It should be noted that the structure of the pre-tightening member 31 in this embodiment can be various, for example, bolts, nuts, bearings, elastic elements, etc., which are not limited herein.

[0048] Refer to Figure 5 and Figure 6 , in a specific implementation, the anti-loosening component 3 further includes a fixing member 33 and a flat top member 32. The pre-tightening member 31 has elasticity. The flat top member 32 abuts against the bottom end of the support member 1. The two ends of the pre-tightening member 31 respectively abut against the flat top member 32 and the fixing member 33, and the fixing member 33 is fixed on the weighting member 2 and compresses the pre-tightening member 31. Specifically, the fixing member 33 in this embodiment is an anti-loosening set screw, the pre-tightening member 31 is a disc spring, and the flat top member 32 is a flat washer. The disc spring is a flat spring with good elastic recovery ability. The upper and lower surfaces of the flat washer are both flat planes, and the bottom end of the support member 1 can be avoided from tilting by supporting through the flat planes. Specifically, the assembly positions from top to bottom are the flat washer, the disc spring, and the anti-loosening set screw. The flat washer abuts against the bottom end of the support member 1 at the topmost position. The disc spring is located below the flat washer, and the anti-loosening set screw is below the disc spring and fixes the disc spring to the weighting member 2. During installation, the support member 1 is screwed downward into the installation hole 211, and the bottom end of the support member 1 passes through the installation hole 211 and presses down the flat washer. After the flat washer is subjected to the downward pressure, it compresses the disc spring. The disc spring is in a compressed state and generates an upward elastic force. The elastic force acts on the flat washer, and the flat washer acts on the bottom end of the support member 1 to provide the pre-tightening force, pressing the bottom end of the support member 1 upward and tightly in the installation hole 211, thereby preventing the support member 1 from loosening.

[0049] Refer to Figure 5 and Figure 6, in this embodiment, a positioning boss 22 is further provided on the weight member 2. The positioning boss 22 protrudes away from the support member 1. A positioning hole 221 is formed in the positioning boss 22. The positioning hole 221 communicates with the mounting hole 211, and the anti-loosening assembly 3 is disposed in the positioning hole 221. Specifically, in order to facilitate the installation of the anti-loosening assembly 3, a positioning boss 22 is convexly formed on the lower surface of the weight member 2. The number of the positioning bosses 22 matches the number of the mounting holes 211, and the positions of the positioning bosses 22 correspond to the positions of the mounting holes 211. A positioning hole 221 for installing the anti-loosening assembly 3 is formed in the positioning boss 22. The positioning hole 221 communicates with the mounting hole 211, facilitating the bottom end of the support member 1 to pass through into the positioning hole 221 to be connected with the anti-loosening assembly 3. Specifically, since the anti-loosening assembly 3 includes an anti-loosening set screw, a disc spring and a flat washer, for adaptation to the installation, the positioning hole 221 is designed as two holes, the upper hole 221a and the lower hole 221b, with different diameters. The upper hole 221a is smaller and the lower hole 221b is larger. Both the upper hole 221a and the lower hole 221b communicate with the mounting hole 211. The upper hole 221a is used to accommodate the disc spring and the flat washer, and the lower hole 221b is used to install the anti-loosening set screw. During actual installation, the flat washer is placed into the upper hole 221a, the disc spring is placed below the flat washer, and the anti-loosening set screw is screwed into the lower hole 221b, thereby fixing the disc spring and the flat washer in the positioning boss 22. The structure is simple and the installation is convenient.

[0050] In one embodiment, the weight member 2 is a disc body. Specifically, the weight member 2 is designed as a weight disc with a disc body structure. The weight disc can be made of aluminum alloy material. Compared with the hammer body structure of the weight, on the one hand, its thickness is less than that of the hammer body and is relatively thinner, which can save the space at the bottom of the heating disc 4; on the other hand, its volume is larger and it can be designed to be heavier, which can reduce the probability of PIN jamming to a greater extent. It can be understood that the disc body structure can be disc bodies of various shapes, such as a circular disc, an elliptical disc, etc., which are not limited herein.

[0051] Refer to Figure 3 , in one embodiment, the weight member 2 is a circular disc, and the mounting holes 211 are uniformly distributed along the circumferential direction of the circular disc. Specifically, the number of the mounting holes 211 in this embodiment is three, and the three mounting holes 211 are uniformly distributed along the circumferential direction of the circular disc, that is, each mounting hole 211 is spaced 120 degrees apart, which can prevent the support member 1 from tilting due to uneven force during the movement relative to the heating disc 4.

[0052] Continue to refer to Figure 5, in one embodiment, the weight member 2 is further provided with a mounting boss 21, the mounting boss 21 protrudes towards the support member 1, and the mounting hole 211 is formed in the mounting boss 21. Specifically, in order to further improve the stability of the support member 1, a mounting boss 21 is further provided on the upper surface of the weight member 2. The number of the mounting bosses 21 matches the number of the support members 1. The mounting boss 21 protrudes relative to the upper surface of the weight member 2 and has a certain height. The mounting hole 211 is formed in the mounting boss 21, and the support member 1 is fixedly arranged in the mounting hole 211 of the mounting boss 21. The support member 1 is supported by the mounting boss 21, increasing the contact area for fixing the support member 1, thereby improving the stability and reliability of the support member 1. In actual processing, the mounting boss 21 and the positioning boss 22 are arranged back to back up and down. The mounting boss 21 is provided with the mounting hole 211, and the positioning boss 22 is provided with the positioning hole 221. The mounting hole 211 and the positioning hole 221 are in through communication up and down. The structure is simple, the processing is convenient, and the cost is low.

[0053] Continue to refer to Figure 5 , in this embodiment, the mounting boss 21 is provided with a guiding inlet 212 for guiding the support member 1 to enter. The guiding inlet 212 is arranged at the inlet of the mounting hole 211 and is communicated with the mounting hole 211. The guiding inlet 212 gradually narrows towards the mounting hole 211. Specifically, in order to facilitate the installation of the support member 1, a guiding inlet 212 is provided at the inlet of the mounting hole 211, that is, a guiding inlet 212 with a diameter larger than that of the mounting hole 211 is provided on the upper surface of the mounting boss 21. The guiding inlet 212 is communicated with the mounting hole 211 to guide the support member 1 to enter. The guiding inlet 212 gradually narrows inward, so that the joint surface between the guiding inlet 212 and the mounting hole 211 is an inclined surface, that is, the whole guiding inlet 212 is in the shape of a flared opening, which is convenient for guiding the support member 1 to enter, facilitating installation and replacement, and improving the installation efficiency.

[0054] Refer to Figure 7 and Figure 8, in one embodiment, the support member 1 has at least one first support section 11 and at least one second support section 12 along its axial direction, and the diameters of the first support section 11 and the second support section 12 are different. Specifically, the traditional PIN design is usually a solid cylinder, and there is a large frictional contact area between it and the through hole 41 of the heating plate 4. In order to reduce the frictional contact area, the support member 1 in this embodiment has an overall bamboo joint structure. The outer surface of the support member 1 with the bamboo joint structure is no longer a continuous cylindrical surface, but a surface composed of a plurality of protrusions and depressions. Specifically, the support member 1 has a segmented structure, and it has a plurality of support sections in its axial direction, that is, the length direction, including at least one first support section 11 and one second support section 12. The diameter of the first support section 11 is larger, that is, the first support section 11 is a protruding surface, and the diameter of the second support section 12 is smaller, that is, the second support section 12 is a concave surface. In this way, a smaller contact surface is formed between each "bamboo joint" (that is, the protruding first support section 11), rather than a complete cylindrical surface contacting the through hole 41 of the heating plate 4. Due to the reduction of the contact area, the frictional force is also reduced, which makes it easier for the support member 1 to pass through the through hole 41 of the heating plate 4 when the heating plate 4 moves up and down, avoiding PIN jamming.

[0055] An embodiment of the present invention further provides a thin film deposition device, including a chamber 6, a heating plate 4, and a wafer support device. The heating plate 4 and the wafer support device are arranged in the chamber 6. The wafer support device is the above-mentioned wafer support device, and the heating plate 4 is provided with a through hole 41, and the support member 1 passes through the through hole 41. Specifically, the wafer support device has been described in detail in the above embodiment. For the sake of simplicity of the specification, it will not be repeated here.

[0056] Through this embodiment, by adopting the wafer support device of this embodiment, the weight is greatly increased by the weight member 2, which can overcome greater frictional force, effectively ensure the smooth relative movement of the support member 1 and the heating plate 4, avoid PIN jamming, thereby preventing the wafer from slipping and fragmenting, avoiding product loss, improving the quality of thin film deposition, and moreover, it can extend the maintenance cycle and improve production efficiency.

[0057] Referring to Figure 1 and Figure 2 , in one embodiment, a lining sleeve 5 is further arranged in the chamber 6, the weight member 2 is arranged on the lining sleeve 5, and a positioning notch 51 for positioning the weight member 2 is opened on one side of the lining sleeve 5 facing the weight member 2. Specifically, the lining sleeve 5 is arranged on the inner wall of the chamber 6, and a positioning notch 51 is opened on the upper surface of the lining sleeve 5. The position of the positioning notch 51 corresponds to the position of the positioning boss 22 on the weight member 2. The positioning boss 22 can cooperate with the positioning notch 51, and the positioning boss 22 is snapped into the positioning notch 51 to realize the positioning of the entire wafer support device, improving its reliability and stability.

[0058] An embodiment of the present utility model further provides an abnormal detection method for a wafer support device, which is applied to the thin film deposition equipment in the above embodiment. The method is used to detect abnormalities in the wafer support device in the thin film deposition equipment, and the method includes steps: S1 - S2.

[0059] S1. Obtain the operation information of the heating plate 4;

[0060] S2. Determine whether the wafer support device is abnormal according to the operation information, and issue an alarm when the wafer support device is abnormal.

[0061] In this embodiment, since the machine will not receive information immediately when the PIN jamming occurs currently, but can only infer whether the PIN jamming occurs through the abnormal reverse analysis of process parameters. Only after opening the chamber can the PIN situation be truly confirmed, and by this time the product may have been lost. For this reason, this embodiment indirectly monitors the situation of the support member 1 by monitoring the operation information of the heating plate 4. Because there is relative movement between the heating plate 4 and the support member 1, and if the support member 1 has a PIN jam, it will be reflected on the heating plate 4. Therefore, by monitoring the operation information of the heating plate 4, the situation of the support member 1 is indirectly monitored. If the operation information of the heating plate 4 is normal, it means that the support member 1 is normal and there is no PIN jam phenomenon; if the operation information of the heating plate 4 is abnormal, it means that the support member 1 is also abnormal and there is a PIN jam phenomenon, and an alarm is issued in time to avoid losing too many product wafers.

[0062] In one embodiment, the step S1 specifically includes: when the heating plate 4 is in the rising stage, obtain the heating power of the heating plate 4, where the operation information includes the heating power.

[0063] Specifically, usually the heating plate 4 heats the wafer after rising to the processing position. If the heating plate 4 has a PIN jam during the rising process, it will cause the wafer to slide, and the wafer is not on the heating plate 4, then the heating plate 4 cannot be heated normally, and the heating power of the heating plate 4 will be abnormal. Then obtaining the operation information of the heating power of the heating plate 4 can be used to judge whether there is a PIN jam. Specifically, pre-obtain the output power curve of the heating power of the heating plate 4 under normal conditions, and compare the currently obtained output power curve of the heating power with the output power curve of the heating power under normal conditions. If the deviation between the two is too large, it means that the wafer is not on the heating plate 4 and the wafer has shifted and slid, and then it is judged that the support member 1 has a PIN jam. At this time, the chamber can be opened to further check whether there is a PIN jam, and the risk of product wafer loss can be effectively avoided in time.

[0064] In one embodiment, step S1 specifically includes: when the heating plate 4 is in the descending stage, obtaining the torque value of the heating plate 4, where the operation information includes the torque value.

[0065] Specifically, usually after the heating plate 4 finishes heating, it will descend back to the initial position. If the heating plate 4 gets stuck with the PIN during the descending process, it will cause the PIN to break at the weak point, the heating plate 4 cannot descend normally, and the heating plate 4 will also be stuck. The torque of the lifting drive component of the heating plate 4, that is, the motor, will be abnormal, and the motor torque will gradually increase until the PIN breaks and reaches the maximum value. Then, obtaining the operation information of the motor torque value can be used to determine whether there is a situation of PIN jamming. Specifically, pre-test the torque value of the heating plate 4 when the PIN is jammed, set a warning torque value accordingly, compare the currently obtained motor torque value with the warning torque value. If the current torque value is greater than the warning torque value, it means that the support 1 has a situation of PIN jamming. At this time, the cavity can be opened to further check whether the PIN is jammed, and the risk of product sheet loss can be effectively avoided in a timely manner.

[0066] As described above, the above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of various equivalent modifications or replacements, and these modifications or replacements should all be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.

Claims

1. A wafer support device, characterized in that, Comprising: A weight member provided with at least three mounting holes. The weight member is a disc, and the mounting holes are evenly distributed along the circumferential direction of the disc. At least three support members. The number of the support members matches the number of the mounting holes. The bottom end of the support member is detachably fixed in the mounting hole, and the top end of the support member is used to support a wafer. The support member has at least one first support section and at least one second support section along its axial direction, and the diameters of the first support section and the second support section are different.

2. The wafer support device according to claim 1, wherein The wafer support device further includes a loosening prevention assembly. The bottom end of the support member passes through the mounting hole, and the loosening prevention assembly is connected to the bottom end of the support member.

3. The wafer support device according to claim 2, characterized in that, The loosening prevention assembly includes a pre-tightening member that presses the bottom end of the support member upward.

4. The wafer support device according to claim 3, wherein The loosening prevention assembly further includes a fixing member and a flat top member. The pre-tightening member has elasticity. The flat top member abuts against the bottom end of the support member. Two ends of the pre-tightening member respectively abut against the flat top member and the fixing member. The fixing member is fixed on the weight member and compresses the pre-tightening member.

5. The wafer support device according to claim 2, characterized in that, The weight member is further provided with a positioning boss that protrudes away from the support member. A positioning hole is formed in the positioning boss, and the positioning hole communicates with the mounting hole. The loosening prevention assembly is arranged in the positioning hole.

6. The wafer support device according to any one of claims 1-5, characterized in that, The weight member is further provided with a mounting boss that protrudes towards the support member. The mounting hole is formed in the mounting boss.

7. The wafer support device according to claim 6, wherein The mounting boss is provided with a guiding inlet for guiding the support member to enter. The guiding inlet is arranged at the inlet of the mounting hole and communicates with the mounting hole. The guiding inlet gradually narrows towards the mounting hole.

8. A thin film deposition device, characterized in that, Comprising a cavity, a heating plate and a wafer support device. The heating plate and the wafer support device are arranged in the cavity. The wafer support device is the wafer support device according to any one of claims 1-7. The heating plate is provided with a through hole, and the support member passes through the through hole.

9. The thin film deposition apparatus according to claim 8, wherein, A lining sleeve is further arranged in the cavity. The weight member is arranged on the lining sleeve. A positioning notch for positioning the weight member is formed on one side of the lining sleeve facing the weight member.

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