Semiconductor wafer cleaning equipment

Abstract

The utility model discloses semiconductor wafer cleaning equipment which comprises a recycling tank and a supporting frame, the supporting frame is installed at the top end of the recycling tank, a rotating frame is arranged in the supporting frame, a plurality of sets of spraying pipes are installed on the inner wall of the rotating frame, the spraying pipes extend into the rotating frame and are communicated with the rotating frame, and the spraying pipes are communicated with the recycling tank. And a plurality of sets of spray heads are installed on the side wall of the spraying pipe at equal intervals, a liquid inlet pipe is installed on one side of the rotating frame and movably connected with the supporting frame, and a plurality of sets of limiting wheels are movably installed on the portion, on the other side of the rotating frame, of the side wall of the supporting frame. According to the semiconductor wafer cleaning device, the contact area between the semiconductor wafers and cleaning liquid is increased by conveniently spraying and cleaning the semiconductor wafers in a surrounding manner and conveniently rotating the semiconductor wafers circumferentially, multiple groups of semiconductor wafers can be conveniently input and cleaned at the same time, the cleaned semiconductor wafers can be conveniently output, and the cleaning effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of cleaning equipment, in particular to a semiconductor wafer cleaning device. Background Technique

[0002] A wafer refers to a silicon chip used for manufacturing semiconductor integrated circuits. Since its shape is circular, it is called a wafer. A wafer is a carrier for producing integrated circuits. Generally, a wafer refers to a single-crystalline silicon wafer. The single-crystalline silicon wafer is drawn and refined from ordinary silica sand, and after a series of measures such as dissolution, purification, and distillation, a single-crystalline silicon rod is formed. After the single-crystalline silicon rod is polished and sliced, a silicon wafer is formed. Simply put, a chip is cut from a wafer. The larger the wafer, the more chips can be cut. After the initial processing of a semiconductor wafer, it is necessary to clean the dust and other impurities on its surface. In order to better clean the semiconductor wafer, a semiconductor wafer cleaning device is proposed.

[0003] As disclosed in a semiconductor wafer cleaning device with the authorization announcement number CN221086571U, which includes a bottom plate and a housing. The housing is sleeved outside the bottom plate, and a water storage cavity is formed between the housing and the bottom plate. A placement plate is provided inside the water storage cavity. A plurality of support plates are installed on the outer side surface of the placement plate. The outer end faces of the support plates are all bent downward to form connecting parts. Fixed seats are provided on the outer sides of the connecting parts. Rubber blocks are embedded on the opposite faces of the fixed seats. The rubber blocks are all higher than the support plates. The top surface of the housing is bent inward to form a downward pressing part in a ring structure.

[0004] Although it realizes a simple structure, the vibration energy generated by the transducer acts on deionized water. The deionized water in vibration can quickly clean the surface of the crystalline silicon, and the motor can drive the crystalline silicon to rotate. The friction with the deionized water during the rotation process can further increase the cleaning effect. At the same time, the crystalline silicon can be exposed through the descending downward pressing part, which is convenient for taking and placing.

[0005] However, it does not solve the problem that the existing cleaning equipment is not conducive to conveniently spraying and cleaning the semiconductor wafer in a circumferential manner and conveniently rotating the semiconductor wafer circumferentially to increase the contact area between the semiconductor wafer and the cleaning liquid. It is not conducive to inputting multiple groups of semiconductor wafers for cleaning at the same time and outputting the cleaned semiconductor wafers, which affects the cleaning effect. Content of the Utility Model

[0006] The purpose of the utility model is to provide a semiconductor wafer cleaning device to solve the problems proposed in the above background technique that the cleaning equipment is not convenient for conveniently spraying and cleaning the semiconductor wafer in a circumferential manner and conveniently rotating the semiconductor wafer circumferentially to increase the contact area between the semiconductor wafer and the cleaning liquid, which is not conducive to inputting multiple groups of semiconductor wafers for cleaning at the same time and outputting the cleaned semiconductor wafers, affecting the cleaning effect.

[0007] To achieve the above object, the present utility model provides the following technical solutions: A semiconductor wafer cleaning device, including a recovery tank and a support frame. A support frame is installed at the top of the recovery tank. A rotating frame is arranged inside the support frame. A plurality of spraying pipes are installed on the inner wall of the rotating frame, and the spraying pipes extend into the rotating frame and are communicated with the rotating frame. A plurality of nozzles are installed at equal intervals on the side wall of the spraying pipes. A liquid inlet pipe is installed on one side of the rotating frame, and the liquid inlet pipe is movably connected with the support frame. A plurality of limiting wheels are movably installed on the side wall of the support frame on the other side of the rotating frame, and the limiting wheels are slidably connected with the rotating frame. A pulley assembly is installed on the surface of the liquid inlet pipe. A driving motor is installed on the side wall of the support frame below the liquid inlet pipe, and the pulley assembly is connected with the output end of the driving motor. A connecting pipe is arranged inside the liquid inlet pipe. A movable sleeve is installed at one end of the connecting pipe close to the liquid inlet pipe, and the connecting pipe is movably connected with the liquid inlet pipe through the movable sleeve.

[0008] Preferably, a carrier is installed on the side wall of the recovery tank. Two tracks are installed at the top of the carrier, and the tracks extend into the rotating frame.

[0009] Preferably, walking frames are arranged on the side walls of the tracks. Two waterproof motors are installed on one side of each walking frame.

[0010] Preferably, walking wheels are installed at the output ends of the waterproof motors, and the walking wheels are slidably connected with the tracks. A bearing plate is arranged between the two tracks.

[0011] Preferably, two support wheels are movably installed at the upper and lower ends of each walking frame, and the support wheels are slidably connected with the tracks. A connecting block is arranged between the two waterproof motors, and the bearing plate is connected with the connecting block.

[0012] Preferably, a rotating seat is installed at the top of the bearing plate. A rotating motor is installed on the inner wall of the rotating seat. A worm is installed at the output end of the rotating motor.

[0013] Preferably, a movable shaft is movably installed inside the rotating seat on one side of the worm, and the movable shaft extends outside the rotating seat. A worm gear is sleeved on the surface of the movable shaft inside the rotating seat, and the worm is meshed with the worm gear.

[0014] Preferably, three rotating disks are installed on the surface of the movable shaft outside the rotating seat. A plurality of placement grooves are installed at equal intervals on the surface of each rotating disk.

[0015] Compared with the prior art, the beneficial effects of the present utility model are as follows: This cleaning device not only realizes convenient circumferential spraying to clean semiconductor wafers and convenient circumferential rotation of semiconductor wafers to increase the contact area between the semiconductor wafers and the cleaning liquid, facilitates the simultaneous input of multiple groups of semiconductor wafers for cleaning and the output of the cleaned semiconductor wafers, but also improves the cleaning effect;

[0016] (1) The waterproof motor drives the traveling wheels to rotate, the traveling wheels drive the traveling frame to move, two groups of traveling frames drive the bearing plate to move through the connecting blocks, the bearing plate drives the rotating seat, the rotating disk and the semiconductor wafer to move, so as to move the semiconductor wafer into the interior of the rotating frame. The external cleaning liquid enters the interior of the rotating frame through the connecting pipe and the liquid inlet pipe, and passes through the rotating frame and the spraying pipe to be sprayed out from the nozzles. The cleaning liquid is used to clean the semiconductor wafer. The driving motor drives the pulley assembly to move, and the pulley assembly drives the rotating frame, the spraying pipe and the nozzles to rotate in a circle through the liquid inlet pipe. The limiting wheel provides limiting support for the rotating frame, so that the nozzles can perform circumferential spraying cleaning on the semiconductor wafer to improve the cleaning effect. The waste liquid after cleaning flows into the recovery tank, and the recovery tank collects it. When the liquid inlet pipe rotates, the connecting pipe remains stationary, and the movable sleeve provides movable support for the connecting pipe and the liquid inlet pipe, realizing convenient circumferential spraying cleaning of the semiconductor wafer, facilitating the simultaneous input of multiple groups of semiconductor wafers for cleaning, and improving the cleaning effect;

[0017] (2) The rotating motor drives the worm to rotate, the worm drives the worm wheel to rotate, the worm wheel drives the movable shaft to rotate, and the worm wheel drives multiple groups of rotating disks and semiconductor wafers to rotate synchronously to increase the contact area between the semiconductor wafers and the cleaning liquid. There are several holes inside the rotating disk, and the cleaning liquid flows out through these holes after cleaning the semiconductor wafer. When the semiconductor wafer is cleaned, the waterproof motor is reversely turned on, and the waterproof motor can drive the bearing plate to drive the cleaned semiconductor wafer out for convenient taking by personnel, realizing convenient circumferential rotation of the semiconductor wafer to increase the contact area between the semiconductor wafer and the cleaning liquid, and facilitating the output of the cleaned semiconductor wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 is the three-dimensional structure schematic diagram of the present utility model;

[0019] Figure 2 is the three-dimensional structure schematic diagram of the rotating frame of the present utility model;

[0020] Figure 3 is the front cross-sectional structure schematic diagram of the rotating frame of the present utility model;

[0021] Figure 4 is the three-dimensional structure schematic diagram of the track of the present utility model;

[0022] Figure 5 This is a front - view sectional structure schematic diagram of the rotating base of the present utility model.

[0023] In the figure: 1, recovery tank; 2, support frame; 3, carrier frame; 4, track; 5, carrier plate; 6, rotating disk; 7, placement groove; 8, rotating frame; 9, limiting wheel; 10, connecting pipe; 11, liquid inlet pipe; 12, driving motor; 13, pulley assembly; 14, spraying pipe; 15, nozzle; 16, waterproof motor; 17, walking wheel; 18, walking frame; 19, rotating base; 20, rotating motor; 21, worm; 22, movable shaft; 23, worm gear; 24, movable sleeve; 25, support wheel; 26, connecting block. Specific embodiments

[0024] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Based on the embodiments in the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present utility model.

[0025] Please refer to Figures 1-5 , an embodiment provided by the present utility model: A semiconductor wafer cleaning device, including a recovery tank 1 and a support frame 2. A support frame 2 is installed at the top of the recovery tank 1. A rotating frame 8 is arranged inside the support frame 2. A plurality of groups of spraying pipes 14 are installed on the inner wall of the rotating frame 8, and the spraying pipes 14 extend into the interior of the rotating frame 8 and communicate with the rotating frame 8. A plurality of groups of nozzles 15 are installed at equal intervals on the side wall of the spraying pipe 14. A liquid inlet pipe 11 is installed on one side of the rotating frame 8, and the liquid inlet pipe 11 is movably connected to the support frame 2. A plurality of groups of limiting wheels 9 are movably installed on the side wall of the support frame 2 on the other side of the rotating frame 8, and the limiting wheels 9 are slidably connected to the rotating frame 8. A pulley assembly 13 is installed on the surface of the liquid inlet pipe 11. A driving motor 12 is installed on the side wall of the support frame 2 below the liquid inlet pipe 11. The driving motor 12 plays a role of power driving, and the pulley assembly 13 is connected to the output end of the driving motor 12. A connecting pipe 10 is arranged inside the liquid inlet pipe 11. One end of the connecting pipe 10 close to the liquid inlet pipe 11 is installed with a movable sleeve 24, and the connecting pipe 10 is movably connected to the liquid inlet pipe 11 through the movable sleeve 24;

[0026] First, connect the external cleaning liquid pipeline to the connecting pipe 10, connect the device to an external controller and external circuit, place the semiconductor wafers to be cleaned in the placement slots 7 in sequence. Then, turn on the waterproof motor 16. The waterproof motor 16 drives the walking wheels 17 to rotate. Under the sliding fit of the support wheels 25 and the track 4, the walking wheels 17 drive the walking frame 18 to move. The two groups of walking frames 18 drive the bearing plate 5 to move through the connecting block 26. The bearing plate 5 drives the rotating base 19, the rotating disk 6 and the semiconductor wafer to move, so as to move the semiconductor wafer into the rotating frame 8. The external cleaning liquid enters the inside of the rotating frame 8 through the connecting pipe 10 and the liquid inlet pipe 11, and sprays out from the nozzle 15 through the rotating frame 8 and the spraying pipe 14. The cleaning liquid is used to clean the semiconductor wafer. At the same time, turn on the driving motor 12. The driving motor 12 drives the pulley assembly 13 to move. Under the movable connection of the liquid inlet pipe 11 and the support frame 2 and the fixed connection of the liquid inlet pipe 11 and the rotating frame 8, the pulley assembly 13 drives the rotating frame 8, the spraying pipe 14 and the nozzle 15 to rotate in a circle through the liquid inlet pipe 11. The limiting wheel 9 provides limiting support for the rotating frame 8. Thus, the nozzle 15 sprays and cleans the semiconductor wafer in a circumferential manner to improve the cleaning effect. The waste liquid after cleaning flows into the recovery tank 1, and the recovery tank 1 collects it. When the liquid inlet pipe 11 rotates, the connecting pipe 10 remains stationary. The movable sleeve 24 provides movable support for the connecting pipe 10 and the liquid inlet pipe 11, realizing convenient circumferential spraying and cleaning of the semiconductor wafer, facilitating the simultaneous input of multiple groups of semiconductor wafers for cleaning, and improving the cleaning effect;

[0027] A bearing frame 3 is installed on the side wall of the recovery tank 1. Two groups of tracks 4 are installed at the top of the bearing frame 3, and the tracks 4 extend into the inside of the rotating frame 8. Walking frames 18 are arranged on the side walls of the tracks 4. Two groups of waterproof motors 16 are installed on one side of each walking frame 18, and the waterproof motors 16 play a role in power driving;

[0028] Walking wheels 17 are installed at the output ends of the waterproof motors 16, and the walking wheels 17 are slidably connected to the tracks 4. A bearing plate 5 is arranged between the two groups of tracks 4. Two groups of support wheels 25 are movably installed at the upper and lower ends of the walking frame 18, and the support wheels 25 are slidably connected to the tracks 4. Connecting blocks 26 are arranged between the two groups of waterproof motors 16, and the bearing plate 5 is connected to the connecting block 26;

[0029] A rotating base 19 is installed at the top of the bearing plate 5. A rotating motor 20 is installed on the inner wall of the rotating base 19, and the rotating motor 20 plays a role in power driving. A worm 21 is installed at the output end of the rotating motor 20;

[0030] Inside the rotating seat 19 on one side of the worm 21, a movable shaft 22 is movably installed, and the movable shaft 22 extends to the outside of the rotating seat 19. A worm wheel 23 is sleeved on the surface of the movable shaft 22 inside the rotating seat 19, and the worm 21 meshes with the worm wheel 23. Three rotating disks 6 are installed on the surface of the movable shaft 22 outside the rotating seat 19, and a plurality of placement grooves 7 are installed at equal intervals on the surface of the rotating disks 6;

[0031] Turn on the rotating motor 20. The rotating motor 20 drives the worm 21 to rotate. Under the mutual meshing of the worm 21 and the worm wheel 23, the worm 21 drives the worm wheel 23 to rotate. The worm wheel 23 drives the movable shaft 22 to rotate. The worm wheel 23 drives a plurality of rotating disks 6 and the semiconductor wafer to rotate synchronously to increase the contact area between the semiconductor wafer and the cleaning liquid. A number of holes are provided inside the rotating disk 6, and the cleaning liquid flows out through the holes after cleaning the semiconductor wafer. After the semiconductor wafer is cleaned, reverse-turn on the waterproof motor 16, and the waterproof motor 16 can drive the carrier plate 5 to output the cleaned semiconductor wafer, which is convenient for personnel to take, realizing convenient circumferential rotation of the semiconductor wafer to increase the contact area between the semiconductor wafer and the cleaning liquid, and facilitating the output of the cleaned semiconductor wafer.

[0032] Working principle: First, connect the external cleaning liquid pipeline to the connecting pipe 10, connect the device to an external controller and an external circuit, place the semiconductor wafers to be cleaned in the placement groove 7 in sequence. The waterproof motor 16 drives the walking wheels 17 to rotate, the walking wheels 17 drive the walking frame 18 to move, the two groups of walking frames 18 drive the bearing plate 5 to move through the connecting block 26, and the bearing plate 5 drives the rotating seat 19, the rotating disk 6 and the semiconductor wafers to move, so as to move the semiconductor wafers into the rotating frame 8. The external cleaning liquid enters the inside of the rotating frame 8 through the connecting pipe 10 and the liquid inlet pipe 11, and sprays out from the nozzle 15 through the rotating frame 8 and the spray pipe 14. The cleaning liquid is used to clean the semiconductor wafers. The driving motor 12 drives the pulley assembly 13 to move, and the pulley assembly 13 drives the rotating frame 8, the spray pipe 14 and the nozzle 15 to rotate in a circle through the liquid inlet pipe 11. The limiting wheel 9 provides limiting support for the rotating frame 8, so that the nozzle 15 sprays and cleans the semiconductor wafers in a surrounding manner to improve the cleaning effect. The waste liquid after cleaning flows into the recovery tank 1, and the recovery tank 1 collects it. When the liquid inlet pipe 11 rotates, the connecting pipe 10 remains stationary, and the movable sleeve 24 provides movable support for the connecting pipe 10 and the liquid inlet pipe 11. The rotating motor 20 drives the worm 21 to rotate, the worm 21 drives the worm gear 23 to rotate, the worm gear 23 drives the movable shaft 22 to rotate, and the worm gear 23 drives multiple groups of rotating disks 6 and semiconductor wafers to rotate synchronously to increase the contact area between the semiconductor wafers and the cleaning liquid. A number of holes are provided inside the rotating disk 6, and the cleaning liquid flows out through these holes after cleaning the semiconductor wafers. When the semiconductor wafers are cleaned, reverse the waterproof motor 16, and the waterproof motor 16 can drive the bearing plate 5 to output the cleaned semiconductor wafers, which is convenient for personnel to take, thus completing the use of the semiconductor wafer cleaning equipment.

Claims

1. A semiconductor wafer cleaning device, comprising a recovery tank (1) and a support frame (2), characterized in that: A support frame (2) is installed at the top of the recovery tank (1). A rotating frame (8) is arranged inside the support frame (2). A plurality of spray pipes (14) are installed on the inner wall of the rotating frame (8), and the spray pipes (14) extend into the rotating frame (8) and are communicated with the rotating frame (8). A plurality of spray heads (15) are installed at equal intervals on the side wall of the spray pipe (14). A liquid inlet pipe (11) is installed on one side of the rotating frame (8), and the liquid inlet pipe (11) is movably connected with the support frame (2). A plurality of limiting wheels (9) are movably installed on the side wall of the support frame (2) on the other side of the rotating frame (8), and the limiting wheels (9) are slidably connected with the rotating frame (8). A pulley assembly (13) is installed on the surface of the liquid inlet pipe (11). A driving motor (12) is installed on the side wall of the support frame (2) below the liquid inlet pipe (11), and the pulley assembly (13) is connected with the output end of the driving motor (12). A connecting pipe (10) is arranged inside the liquid inlet pipe (11). A movable sleeve (24) is installed at one end of the connecting pipe (10) close to the liquid inlet pipe (11), and the connecting pipe (10) is movably connected with the liquid inlet pipe (11) through the movable sleeve (24).

2. The semiconductor wafer cleaning device according to claim 1, characterized in that: A carrier frame (3) is installed on the side wall of the recovery tank (1). Two sets of tracks (4) are installed at the top of the carrier frame (3), and the tracks (4) extend into the rotating frame (8).

3. A semiconductor wafer cleaning device according to claim 2, characterized in that: Walking frames (18) are arranged on the side walls of the tracks (4). Two sets of waterproof motors (16) are installed on one side of each walking frame (18).

4. A semiconductor wafer cleaning device according to claim 3, characterized in that: Walking wheels (17) are installed at the output ends of the waterproof motors (16), and the walking wheels (17) are slidably connected with the tracks (4). A bearing plate (5) is arranged between the two sets of tracks (4).

5. A semiconductor wafer cleaning device according to claim 3, characterized in that: Two sets of support wheels (25) are movably installed at the upper and lower ends of each walking frame (18), and the support wheels (25) are slidably connected with the tracks (4). A connecting block (26) is arranged between the two sets of waterproof motors (16), and the bearing plate (5) is connected with the connecting block (26).

6. The semiconductor wafer cleaning device according to claim 4, wherein: A rotating seat (19) is installed at the top of the bearing plate (5). A rotating motor (20) is installed on the inner wall of the rotating seat (19). A worm (21) is installed at the output end of the rotating motor (20).

7. A semiconductor wafer cleaning device according to claim 6, wherein: A movable shaft (22) is movably installed inside the rotating seat (19) on one side of the worm (21), and the movable shaft (22) extends outside the rotating seat (19). A worm gear (23) is sleeved on the surface of the movable shaft (22) inside the rotating seat (19), and the worm (21) is meshed with the worm gear (23).

8. A semiconductor wafer cleaning device according to claim 6, characterized in that: Three rotating discs (6) are installed on the surface of the movable shaft (22) outside the rotating seat (19). A plurality of placing grooves (7) are installed at equal intervals on the surface of each rotating disc (6).

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