Pressing device for conductive film production
Through the design of the adjustment components and limiting plate structure, the problem of mold limit dislocation before hot pressing of the conductive film and circuit board is solved, and efficient hot pressing operation and convenient mold removal are achieved.
Patent Information
- Application Number
- CN202422076673.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-08-27
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2034-08-27
AI Technical Summary
The existing conductive film and circuit board are prone to misalignment when the mold is limited before hot pressing, resulting in multiple movements and reducing working efficiency.
The structural design of adjustment components, oblique sliders, first and second limit plates is adopted to ensure that the circuit board mold is accurately positioned before hot pressing and is easy to take out after hot pressing.
It improves the hot pressing efficiency of the conductive film and circuit board, ensures accurate position, reduces the difficulty of mold removal, and improves work efficiency.
Smart Images
Figure CN223125068U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of conductive film hot pressing, and particularly relates to a pressing device for conductive film production. Background Art
[0002] A conductive film is a thin film material with conductive properties. It can provide conductive characteristics on the surface of insulating materials and is usually used in fields such as touch screens, flexible circuits, solar cells, antistatic protection, and electromagnetic shielding of electronic products. Its main function is to provide good electrical contact between insulators and conductors, or to form a conductive layer on the surface that requires conductive properties.
[0003] When the conductive film is used in cooperation with a circuit board, a hot press is mostly used for the pressing operation. The existing operation method is to place the circuit board in a mold, then align the slot holes in the mold with the limit posts on the workbench of the hot press, and the side of the mold close to the operator abuts against the limit plate. Then, manually press the mold at multiple places from top to bottom, so that the limit posts enter the slot holes. Then, finely adjust and press the mold to ensure that the bottom of the mold is closely attached to the workbench surface, start the hot press to press, and finally take it out for inspection.
[0004] When limiting the position of the mold, the operator needs to hold the mold by hand and engage the slot holes in the mold with the limit posts on the workbench. Since there are no other limiting parts on the workbench and the mold is not made of transparent material, it is easy for the slot holes to be misaligned when being aligned and engaged with the limit posts, which further leads to the situation that the mold cannot be fixed and limited in time, and the mold needs to be moved multiple times. Moreover, after the hot pressing operation of the mold is completed, the bottom of the pressed mold is more likely to be closely attached to the workbench surface, resulting in friction between the slot holes of the mold and the limit posts on the workbench when the mold is taken out upwards, which is not convenient for taking out the mold and reduces the work efficiency.
[0005] Therefore, this application provides a pressing device for conductive film production to meet the requirements. Summary of the Utility Model
[0006] The technical problem to be solved by the utility model is to provide a pressing device for conductive film production to solve the problem that when the existing conductive film and circuit board need to limit the position of the mold before hot pressing operation, since there are no other limiting parts on the workbench and the mold is not made of transparent material, it is easy for the slot holes to be misaligned when being aligned and engaged with the limit posts, which further leads to the situation that the mold cannot be fixed and limited in time, and further causes the mold to be moved multiple times.
[0007] To solve the above technical problem, the utility model provides the following technical solutions:
[0008] A pressing device for producing a conductive film comprises a hot press body, a workbench is fixedly connected to the middle part of the hot press body, a first rotating column is fixedly connected to the top of the workbench; an adjusting component, the adjusting component is used to limit and fix a circuit board kit, the adjusting component is connected to the first rotating column; the adjusting component comprises a C-shaped clamp rotatably connected to the top of the first rotating column, one end of the C-shaped clamp is fixedly connected to an abutment block, the other end of the C-shaped clamp is rotatably mounted with a second rotating column, and a bearing strip is fixedly connected to the surface of the second rotating column.
[0009] Optionally, a hollow groove is provided on the surface of the C-shaped clamping plate, and a weakened groove is provided at the connection between the abutment block and the C-shaped clamping plate.
[0010] Optionally, a raised strip is installed at the other end of the C-shaped clamp, and a second rotating column is rotatably connected to the middle of the other end of the C-shaped clamp, and a supporting strip is fixedly connected to the second rotating column, and an inner groove is provided on the supporting strip near the top of the raised strip.
[0011] Optionally, an inclined slide is fixedly connected to the top of the workbench, a circuit board mold is slidably connected to the middle position of the top of the workbench, a first limit plate is fixedly connected to the top of the workbench, and a second limit plate is fixedly connected to the top of the workbench.
[0012] Optionally, the outer wall of the circuit board mold abuts against the inner wall of the first limiting plate, the outer wall of the circuit board mold abuts against the inner wall of the second limiting plate, and the bottom of the circuit board mold is slidably connected to the top of the inclined sliding plate.
[0013] Optionally, one end of the abutment block abuts against two ends of the inclined sliding plate, and an inner cavity is provided in the middle of the abutment block for limiting the position of the circuit board mold.
[0014] Optionally, the shape of the bearing strip matches the shape of the inner groove.
[0015] Compared with the prior art, the utility model has at least the following beneficial effects:
[0016] In the above scheme, by setting up the adjustment component, the device can be easily placed on the top of the workbench, and there is no need to calibrate the fixed position through limit columns and slots. After the hot pressing is completed, the circuit board mold can be quickly removed from the top of the workbench, thereby improving work efficiency.
[0017] By setting the inclined slide, the first limit plate and the second limit plate, there will be a preliminary limit when the circuit board mold is placed on the top of the workbench to ensure that the position of the circuit board mold is the same as the hot pressing point of the hot pressing equipment. The inclination of the inclined slide and the weight of the circuit board mold can be used to slide the circuit board mold into the limit position more conveniently, thereby improving the efficiency of picking and placing.
[0018] By providing the inclined sliding plate and the abutment block, the abutment block can gradually approach the circuit board mold during the sliding process of the circuit board mold, and the interaction force between the inner cavity of the abutment block and the circuit board mold can be used to further fix the circuit board mold.
[0019] By providing the raised strips, the bearing strips and the inner grooves, the circuit board mold is driven together when it moves, thereby driving the overall deflection of the adjustment component, thereby performing a secondary fixation on the circuit board mold before hot pressing, and further making it convenient and quick to remove the circuit board mold after the hot pressing is completed. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments of the present invention and, together with the description, further serve to explain the principles of the present invention and enable those skilled in the relevant art to make and use the present invention.
[0021] Figure 1 It is a schematic diagram of the three-dimensional structure of the conductive film production lamination device;
[0022] Figure 2 It is a schematic diagram of the three-dimensional structure of the workbench and the first limiting plate;
[0023] Figure 3 for Figure 2 A in the middle is an enlarged schematic diagram of the three-dimensional structure;
[0024] Figure 4 It is a schematic diagram of the three-dimensional structure of the circuit board mold and the adjustment component;
[0025] Figure 5 for Figure 4 The enlarged schematic diagram of the three-dimensional structure is shown at B in the middle.
[0026] [reference numerals]
[0027] 1. Hot press machine body; 2. Workbench; 3. Inclined slide plate; 4. Circuit board mold; 5. First limit plate; 6. Adjustment assembly; 7. Second limit plate; 601. C-type clamping plate; 602. Hollow groove; 603. Resistance block; 604. Raised strip; 605. Bearing strip; 606. Inner groove.
[0028] As shown in the figure, in order to clearly implement the structure of the embodiments of the present utility model, specific structures and devices are marked in the figure. However, this is only for illustrative purposes and is not intended to limit the present utility model to this specific structure, device, and environment. Those of ordinary skill in the art can adjust or modify these devices and environments according to specific needs. Detailed implementation manners
[0029] The following will describe in detail a lamination device for producing a conductive film provided by the present utility model in conjunction with the accompanying drawings and specific embodiments. At the same time, it should be noted here that in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments. For some well-known technologies, those skilled in the art can also adopt other alternative methods for implementation; moreover, the accompanying drawings are only for more specifically describing the embodiments and are not intended to specifically limit the present utility model.
[0030] It should be pointed out that in the specification, when referring to "an embodiment", "embodiment", "exemplary embodiment", "some embodiments", etc., it indicates that the described embodiment may include specific features, structures, or characteristics, but not necessarily every embodiment includes such specific features, structures, or characteristics. Additionally, when combining an embodiment to describe a specific feature, structure, or characteristic, implementing such a feature, structure, or characteristic in combination with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the relevant art.
[0031] Generally, terms can be understood at least in part from their use in the context. For example, at least in part depending on the context, the term "one or more" used herein can be used to describe any feature, structure, or characteristic in a singular sense, or can be used to describe a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood as not necessarily intended to convey a set of exclusive factors, but rather, at least in part depending on the context, allowing for the existence of other factors that may not be explicitly described.
[0032] It can be understood that the meanings of "on...", "above...", and "overhead of..." in the present utility model should be interpreted in the broadest manner, such that "on..." not only means "directly on" something, but also includes the meaning of being "on" something with intermediate features or layers therebetween, and "above..." or "overhead of..." not only means "above" or "overhead of" something, but also can include the meaning of being "above" or "overhead of" something with no intermediate features or layers therebetween.
[0033] In addition, spatial relative terms such as "under", "below", "lower part", "above", "upper part", etc. may be used in this text for convenience of description to describe the relationship between one element or feature and another or more elements or features, as shown in the accompanying drawings. The spatial relative terms are intended to cover different orientations during the use or operation of the device in addition to the orientation depicted in the drawings. The device can be oriented in other ways, and the spatial relative descriptive words used in this text can be correspondingly interpreted similarly.
[0034] As Figures 1 to 5 shown, an embodiment of the present utility model provides a pressing device for producing a conductive film, including a hot press main body 1. A workbench 2 is fixedly connected to the middle of the hot press main body 1. A first rotating column is fixedly connected to the top of the workbench 2; an adjusting assembly 6 is used to limit and fix the circuit board kit, and the adjusting assembly 6 is connected to the first rotating column. By providing the adjusting assembly 6, the device is convenient to place on the top of the workbench 2, and there is no need to calibrate and fix the position through the limit posts and slot holes. Moreover, after the hot pressing is completed, the circuit board mold 4 can be quickly taken out from the top of the workbench 2, improving the work efficiency.
[0035] As Figure 2 shown, an inclined slide plate 3 is fixedly connected to the top of the workbench 2. A circuit board mold 4 is slidably connected to the middle position at the top end of the workbench 2. A first limiting plate 5 is fixedly connected to the top of the workbench 2, and a second limiting plate 7 is fixedly connected to the top of the workbench 2. The outer wall of the circuit board mold 4 abuts against the inner wall of the first limiting plate 5, and the outer wall of the circuit board mold 4 abuts against the inner wall of the second limiting plate 7. The bottom of the circuit board mold 4 is slidably connected to the top of the inclined slide plate 3. By providing the inclined slide plate 3, the first limiting plate 5 and the second limiting plate 7, when the circuit board mold 4 is placed on the top of the workbench 2, there will be a preliminary limit, ensuring that the position of the circuit board mold 4 is the same as the hot pressing point of the hot pressing device, and using the inclination of the inclined slide plate 3, combined with the self-weight of the circuit board mold 4, the circuit board mold 4 can be more conveniently slid into the limiting position, improving the efficiency of taking and placing.
[0036] As Figures 3 to 5As shown, the adjustment component 6 includes a C-type clamp 601 rotatably connected to the top of the first rotating column, one end of the C-type clamp 601 is fixedly connected to a resistance block 603, the other end of the C-type clamp 601 is rotatably mounted with a second rotating column, the surface of the second rotating column is fixedly connected with a bearing bar 605, the surface of the C-type clamp 601 is provided with a hollow groove 602, a weakening groove is provided at the connection between the resistance block 603 and the C-type clamp 601, the other end of the C-type clamp 601 is installed with a raised bar 604, and the position of the bearing bar 605 close to the top of the raised bar 604 An inner groove 606 is provided, and the connection between the resistance block 603 and the C-shaped clamp 601 is a weakened part, so that when the C-shaped clamp 601 drives the resistance block 603 to rotate, it will first touch the inclined sliding plate 3 and continuously squeeze inward, so that the resistance block 603 is squeezed and also approaches the end of the circuit board mold 4. The inner cavity of the resistance block 603 makes the resistance block 603 gradually fit with the end of the circuit board mold 4. It will be subjected to a certain extrusion force, and the reaction force of the inner cavity will make the resistance block 603 and the end of the circuit board mold 4 fit more closely.
[0037] By providing the inclined slide plate 3 and the abutment block 603, the abutment block 603 can gradually approach the circuit board mold 4 during the sliding process of the circuit board mold 4. The interaction force between the inner cavity of the abutment block 603 and the circuit board mold 4 can be utilized to further fix the circuit board mold 4. Therefore, before the hot press machine performs hot pressing operation on the circuit board, the positions of the conductive film and the circuit board have been matched with the hot pressing plate, thereby improving the quality after the hot pressing operation.
[0038] By providing the raised strip 604, the bearing strip 605 and the inner groove 606, the circuit board mold 4 is driven together when moving, thereby driving the overall deflection of the adjustment component 6, and further enabling the circuit board mold 4 to play a secondary fixation before hot pressing, so that the circuit board mold 4 can be conveniently and quickly removed after the hot pressing operation is completed.
[0039] The working principle of the technical solution provided by the utility model is as follows: the operator places the conductive film on the circuit board, and clamps the circuit board in the groove of the circuit board mold 4, holds the circuit board mold 4 and pushes it forward from the top of the inclined slide plate 3, and the two ends of the circuit board mold 4 slide and rub with the first limit plates 5 on both sides, so as to start limiting the circuit board mold 4, and then pushes the circuit board mold 4 to slide forward, and when the end of the circuit board mold 4 in front of it abuts against the bearing bar 605, it continues to push forward. At this time, the bearing bar 605 will be driven by the circuit board mold 4 to move in a curve, and at the same time, through the second rotating column, the bearing bar 605 can always maintain the horizontal direction with the circuit board mold 4, ensuring that the end of the bearing bar 605 and the end of the circuit board mold 4 are always in a fit state. At the same time, the curved movement of the bearing bar 605 will drive the overall deflection of the adjustment component 6, so that the resistance block 603 begins to approach the two ends of the circuit board mold 4.
[0040] During the movement of the resistance block 603, it will first contact the two ends of the inclined slide plate 3. Since the contact point between the resistance block 603 and the C-shaped clamp 601 is a weakened part, the resistance block 603 will deflect when contacting the end of the inclined slide plate 3, and gradually fit with the end of the circuit board mold 4 along the shape of the end of the inclined slide plate 3. When the end of the resistance block 603 fits with the circuit board mold 4, the inner cavity set in the resistance block 603 will be compressed, and the force generated by the compression will react on the end of the resistance block 603, so that the resistance block 603 can fit tightly against the end of the circuit board mold 4. Then, the main switch of the hot press is pressed, and the hot press plate will fall vertically from top to bottom and contact the conductive film that has been fixed in position. Under the action of the pressure and temperature of the hot press plate, the conductive film will fit tightly against the circuit board. After hot pressing to the specified value, the hot press plate automatically rises and returns to its original position, and the hot pressing operation is completed.
[0041] After the hot pressing is completed, hold the position of the hollow groove 602 and move the resistance block 603 out of the fitting state, which will cause the adjustment component 6 to rotate in the clockwise direction as a whole, and the bearing bar 605 will also be driven to deflect, thereby pushing the circuit board mold 4 to slide out from the second limit plate 7, and use the inclination angle of the inclined slide plate 3 to ensure the speed of sliding out, and finally take out the circuit board and observe the hot pressing position.
[0042] The present invention covers any substitution, modification, equivalent method and scheme made on the essence and scope of the present invention. In order to make the public have a thorough understanding of the present invention, specific details are described in detail in the following preferred embodiments of the present invention, and those skilled in the art can fully understand the present invention without the description of these details. In addition, in order to avoid unnecessary confusion about the essence of the present invention, well-known methods, processes, procedures, components and circuits are not described in detail.
[0043] The above are only the preferred embodiments of the present utility model. It should be noted that for those of ordinary skill in the art, without departing from the principle of the present utility model, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the protection scope of the present utility model.
Claims
1. A pressing device for producing a conductive film, comprising a hot press main body, characterized in that, A workbench is fixedly connected to the middle of the hot press body, and a first rotating column is fixedly connected to the top of the workbench; An adjusting component, the adjusting component is used to limit and fix the circuit board kit, and the adjusting component is connected to the first rotating column; The adjustment assembly includes a C-shaped clamp plate rotatably connected to the top of the first rotating column, one end of the C-shaped clamp plate is fixedly connected to an interference block, the other end of the C-shaped clamp plate is rotatably mounted with a second rotating column, and the surface of the second rotating column is fixedly connected to a bearing strip.
2. The lamination device for producing a conductive film according to claim 1, wherein A hollow groove is provided on the surface of the C-shaped clamping plate, and a weakened groove is provided at the connection between the abutment block and the C-shaped clamping plate.
3. The laminating device for producing a conductive film according to claim 1, wherein, A raised strip is installed at the other end of the C-shaped clamping plate, and an inner groove is formed at a position of the bearing strip close to the top of the raised strip.
4. The laminating device for producing a conductive film according to claim 1, characterized in that, The top of the workbench is fixedly connected with an inclined slide plate, the middle position of the top of the workbench is slidably connected with a circuit board mold, the top of the workbench is fixedly connected with a first limit plate, and the top of the workbench is fixedly connected with a second limit plate.
5. The laminating device for producing a conductive film according to claim 4, characterized in that, The outer wall of the circuit board mold abuts against the inner wall of the first limiting plate, the outer wall of the circuit board mold abuts against the inner wall of the second limiting plate, and the bottom of the circuit board mold is slidably connected to the top of the inclined slide plate.
6. The laminating device for producing a conductive film according to claim 4, characterized in that, One end of the abutment block abuts against two ends of the inclined slide plate, and an inner cavity is provided in the middle of the abutment block for limiting the position of the circuit board mold.
7. The laminating device for producing a conductive film according to claim 3, wherein, The shape of the bearing strip is matched with the shape of the inner groove.