Detachable boat page and graphite boat

Abstract

The utility model relates to tubular coating equipment, and provides a detachable boat page and a graphite boat, the boat page comprises a first boat page body and a second boat page body, the first boat page body is provided with a plurality of mounting hole sites at intervals in the length direction, and the mounting hole sites penetrate through the first boat page body; the second boat page body is detachably arranged in the mounting hole position, the top surface of the second boat page body is lower than the top surface of the first boat page body, and the top surface of the second boat page body is suitable for placing a silicon wafer, so that the bottom of the silicon wafer is relatively positioned between the top surface of the second boat page body and the top surface of the first boat page body. The second boat page body is detachably mounted in the mounting hole position of the first boat page body, so that when the boat page is cleaned, the whole first boat page body does not need to be dismounted and cleaned, and only the second boat page body needs to be taken down from the first boat page body to be cleaned; the bottom surface of the silicon wafer is relatively located in the mounting hole position, thereby reducing the winding plating risk of the bottom surface of the silicon wafer, and reducing the subsequent grinding process of the bottom surface of the silicon wafer.

Description

Technical Field

[0001] The utility model relates to the field of tube coating equipment, and further relates to a detachable boat page and a graphite boat. Background Art

[0002] Tube coating equipment is a process equipment widely used in the manufacture of crystalline silicon photovoltaic cells. A graphite boat is a wafer carrier used in conjunction with tube coating equipment. At present, the horizontally wafer-loading graphite boat used in production has two structural defects:

[0003] 1. When silicon nitride film is coated on the surface of a silicon wafer, the graphite boat, as a carrier, will inevitably deposit a silicon nitride film. When the film thickness accumulates to a certain extent, it will affect the coating effect of the silicon wafer. First of all, the residue of silicon nitride will affect the electrical conductivity and thermal conductivity of the graphite boat. Poor electrical conductivity will lead to problems such as uneven potential between the electrodes and disordered electric field distribution during the coating process of the silicon wafer, thus affecting the uniformity and quality of the silicon nitride coating layer. Poor thermal conductivity will lead to unstable temperature control during the coating process of the silicon wafer, deviation in the kinetic energy and deposition concentration of the plasma, and further affect the structure and performance of the silicon nitride coating layer. Secondly, the accumulation of the silicon nitride film thickness on the surface of the graphite boat carrier will cause changes in the electric field strength between the electrodes, and then affect the coating speed and film thickness. When the silicon nitride deposited on the surface of the graphite boat is relatively thick, the electric field strength between the electrodes is high and the coating speed is fast. Especially at the contact between the silicon wafer and the graphite boat page, it is easier for the silicon wafer to deposit a thicker silicon nitride, resulting in a thicker film on the silicon wafer and the silicon wafer being whitish in color, which does not meet the quality standards. Therefore, in order to improve the coating efficiency and yield, when the graphite boat reaches the limit number of uses (120 times / boat), it must be forcibly disassembled and cleaned. The boat page is thin, long and fragile, making it inconvenient to clean. The cleaning is frequent (for a 24-hour operating equipment, it needs to be cleaned about once every 3-4 days), the cleaning cycle is long, and the disassembly and assembly are time-consuming, laborious and costly in terms of labor, resulting in low production efficiency.

[0004] 2. The existing horizontally wafer-loading graphite boat is provided with square grooves on the boat page. The silicon wafer is placed flat in the square grooves, and the top surface of the silicon wafer is higher than the overall boat page where it is located. Fine holes are penetrated through the bottom of the square grooves for discharging the air flow at the bottom of the silicon wafer. Although to a certain extent, it solves the problem that when evacuating, the air pressure above the silicon wafer quickly drops to the process pressure (usually between 1700-1800 mtorr), while there is still gas remaining at the lower part of the silicon wafer and there is no channel for it to be quickly discharged, forming an upper and lower pressure difference, resulting in abnormal conditions such as the silicon wafer flying up, falling off, and moving. However, due to some special reasons such as the convex points of the graphite boat not being on the same water side wall, defects in the silicon wafer material itself, improper control of process temperature and pressure, etc., if the silicon wafer breaks in the boat, the reserved drain holes will be completely exposed between the adjacent upper and lower anode plates, and the electromagnetic field is very likely to affect the existing magnetic field through the through holes, resulting in abnormal glow discharge, process failure, and even serious damage to the graphite boat. Summary of the Utility Model

[0005] In view of the above technical problems, the purpose of the present utility model is to provide a detachable boat page and a graphite boat. The second boat page body is detachably installed in the installation hole positions of the first boat page body. When cleaning the boat page, it is no longer necessary to disassemble and assemble the entire boat page body for cleaning. Only the second boat page body needs to be taken out for cleaning, which can solve the problems of low production efficiency caused by frequent boat cleaning and long cycle, as well as the time-consuming, laborious and labor-intensive disassembly and assembly of the boat; the bottom surface of the silicon wafer is placed inside and between the top surface of the first boat page body and the top surface of the second boat page body, avoiding the deposition of silicon nitride film on the bottom surface of the silicon wafer, reducing the risk of edge plating on the bottom surface of the silicon wafer, and reducing the subsequent grinding process of the bottom surface of the silicon wafer.

[0006] To achieve the above object, the present utility model provides a detachable boat page, including a first boat page body and a second boat page body. The first boat page body is adapted to be placed horizontally, and a plurality of installation hole positions are arranged at intervals in the length direction of the first boat page body, and the installation hole positions penetrate through the first boat page body;

[0007] The second boat page body is detachably arranged in the installation hole positions. The top surface of the second boat page body is lower than the top surface of the first boat page body. The top surface of the second boat page body is adapted to place the silicon wafer, so that the bottom of the silicon wafer is relatively located between the top surface of the second boat page body and the top surface of the first boat page body, and the bottom surface of the second boat page body is flush with the bottom surface of the first boat page body.

[0008] In some embodiments, the installation hole positions include a first installation groove and a second installation groove. The notch of the first installation groove is arranged on the top surface of the first boat page body. The notch of the second installation groove is arranged at the bottom of the first installation groove and the second installation groove penetrates through the bottom surface of the first boat page body. The notch of the second installation groove is smaller than the notch of the first installation groove;

[0009] The second boat page body includes a first installation part and a second installation part. The first installation part is adapted to be placed in the first installation groove and the bottom of the first installation part abuts against the bottom of the first installation groove. The top surface of the first installation part is lower than the top surface of the first boat page body. The second installation part is adapted to be placed in the second installation groove and the bottom surface of the second installation part is flush with the bottom surface of the first boat page body.

[0010] In some embodiments, a plurality of assembly holes are further provided on the second boat page body. Bumps are adapted to be installed in the assembly holes. The silicon wafer is adapted to be placed on the bumps. The highest point of the bumps is higher than the top surface of the second boat page body and lower than the top surface of the first boat page body.

[0011] In some embodiments, the distance between the highest point of the bump and the top surface of the first boat page body is not less than the thickness of the silicon wafer, so that the top surface of the silicon wafer does not exceed the top surface of the first boat page body.

[0012] In some embodiments, the distance between the highest point of the bump and the top surface of the first boat page body is equal to the thickness of the silicon wafer, so that the top surface of the silicon wafer is flush with the top surface of the first boat page body.

[0013] In some embodiments, the distance between the top surface of the second boat page body and the top surface of the first boat page body is 0.3 mm, and the distance between the highest point of the bump and the top surface of the first boat page body is 0.1 mm.

[0014] In some embodiments, a plurality of unloading blind holes are further provided on the top surface of the first boat page body. The unloading blind holes are arranged at the edge of the mounting hole position. The unloading blind holes communicate the top surface of the first boat page body and the top surface of the second boat page body, so that the air flow between the top surface of the second boat page body and the bottom surface of the silicon wafer is adapted to flow out through the unloading blind holes.

[0015] In some embodiments, the unloading blind holes are located at the four corners of the mounting hole position. The top of the unloading blind holes is located on the top surface of the first boat page body. The unloading blind holes do not penetrate the first boat page body and the bottom of the unloading blind holes is located at the bottom of the first mounting groove of the mounting hole position.

[0016] In some embodiments, the unloading blind holes are three-quarter arcs. The four corners of the silicon wafer are relatively located at the centers of the circles of the unloading blind holes, and the inner side walls of the unloading blind holes are vertically arranged.

[0017] According to another aspect of the present application, a graphite boat is further provided, including any one of the detachable boat pages, graphite connection blocks and ceramic rods in the above preferred embodiments. A plurality of the detachable boat pages are sequentially arranged at intervals in the vertical direction;

[0018] The graphite connection blocks are arranged at both horizontal ends of the first boat page body of the detachable boat page;

[0019] The ceramic rods vertically penetrate and connect a plurality of the first boat page bodies, and ceramic rings are further sleeved on the ceramic rods between adjacent first boat page bodies.

[0020] Compared with the prior art, the detachable boat page and graphite boat provided by the present utility model have at least one of the following beneficial effects:

[0021] 1. The second boat page body is detachably installed in the mounting hole positions of the first boat page body. When cleaning the boat page, there is no need to disassemble and assemble the entire first boat page body for cleaning. Just remove the second boat page body from the first boat page body for cleaning, which can solve the problems of low production efficiency caused by frequent boat cleaning with a long cycle, time-consuming, laborious, and labor-intensive disassembly and assembly of the boat; the bottom surface of the silicon wafer is relatively located inside the mounting hole positions and between the top surface of the first boat page body and the top surface of the second boat page body, avoiding the deposition of silicon nitride film on the bottom surface of the silicon wafer, reducing the risk of plating around on the bottom surface of the silicon wafer, and reducing the subsequent grinding process for the bottom surface of the silicon wafer.

[0022] 2. The highest point of the bump is higher than the top surface of the second boat page body and lower than the top surface of the first boat page body. The silicon wafer is suitable for being fixed above the bump and the bottom surface of the silicon wafer is located in the first installation groove. The bottom surface of the silicon wafer is lower than the top surface of the first boat page body, reducing the risk of film coating on the bottom surface of the silicon wafer and avoiding the problem of plating around on the bottom surface of the silicon wafer.

[0023] 3. The top surface of the silicon wafer is flush with the top surface of the first boat page body. The air flow can pass through the top surface of the silicon wafer more evenly, enabling more uniform film coating on the top surface of the silicon wafer, improving the stability of film coating on the top surface of the silicon wafer, and ensuring the film coating efficiency on the top surface of the silicon wafer; at the same time, the side wall and bottom surface of the silicon wafer are both located in the first installation groove, avoiding the risk of plating around on the side wall and bottom surface of the silicon wafer, and also avoiding the air flow directly blowing on the side wall of the silicon wafer, resulting in the silicon wafer shaking, and reducing the air flow entering the bottom surface of the silicon wafer.

[0024] 4. The unloading blind hole conducts the top surface of the first boat page body and the top surface of the second boat page body, enabling the air flow at the bottom surface of the silicon wafer to be discharged through the unloading blind hole, avoiding the formation of pressure difference between the top surface and the bottom surface of the silicon wafer, resulting in the up and down shaking or flying of the silicon wafer.

[0025] 5. The unloading blind holes are arranged at the four corners of the first installation groove, and the inner side walls of the unloading blind holes are vertically arranged, enabling the redundant gas to only rise vertically, avoiding the aggregation of the air flow at the bottom surface of the silicon wafer at the four corners of the first installation groove and generating eddy currents, enabling the air flow at the bottom surface of the silicon wafer to flow out through the unloading blind holes faster, and further avoiding the problem of flying wafers caused by the pressure difference between the top surface and the bottom of the silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above characteristics, technical features, advantages and their implementation manners of the present utility model will be further described below in a clear and understandable manner in combination with the drawings in the preferred embodiments.

[0027] Figure 1 is the overall view of the graphite boat;

[0028] Figure 2 is the sectional view of the detachable boat page;

[0029] Figure 3 is the electric field diagram of the detachable boat page;

[0030] Figure 4 It is the structural diagram of the first boat page body;

[0031] Figure 5 It is the structural diagram of the installation hole positions;

[0032] Figure 6 It is the structural diagram of the second boat page body;

[0033] Figure 7 It is the top view of the detachable boat page;

[0034] Figure 8 It is the installation sectional view of the first boat page body and the second boat page body.

[0035] Explanation of the reference numerals in the attached drawings:

[0036] The first boat page body 1, the installation hole positions 11, the first installation groove 111, the second installation groove 112, the unloading blind hole 12, the second boat page body 2, the first installation part 21, the second installation part 22, the assembly hole 23, the bump 24, the graphite connection block 3, the ceramic rod 4, the silicon wafer 5. Detailed implementation manners

[0037] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the specific implementation manners of the present invention will be described below with reference to the accompanying drawings. Obviously, the accompanying drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained according to these drawings, and other implementation manners can also be obtained.

[0038] For the sake of simplicity of the drawings, only the parts related to the utility model are schematically shown in each drawing, and they do not represent the actual structure of the product. In addition, for the sake of simplicity of the drawings and easy understanding, in some drawings, for the components with the same structure or function, only one of them is schematically shown, or only one of them is marked. In this article, "one" not only means "only this one", but also can mean "more than one" situation.

[0039] It should also be further understood that the term "and / or" used in the specification and claims of this application refers to any combination and all possible combinations of one or more of the related listed items, and includes these combinations.

[0040] In this text, it should be noted that unless otherwise clearly specified and defined, the terms "installation", "connection", and "linkage" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two components. For those of ordinary skill in the art, the specific meanings of the above terms in this utility model can be understood according to specific situations.

[0041] In addition, in the description of this application, the terms "first", "second", etc. are only used for distinguishing descriptions and cannot be understood as indicating or implying relative importance. It should be noted that the above embodiments can be freely combined as needed. The above are only the preferred embodiments of this utility model. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of this utility model, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of this utility model.

[0042] Refer to Figures 1 to 4 , this utility model provides a detachable boat page, including a first boat page body 1 and a second boat page body 2. The first boat page body 1 is adapted to be placed horizontally, and a plurality of mounting holes 11 are provided at intervals in the length direction of the first boat page body 1, and the mounting holes 11 penetrate through the first boat page body 1; the second boat page body 2 is detachably arranged in the mounting holes 11, the top surface of the second boat page body 2 is lower than the top surface of the first boat page body 1, and the top surface of the second boat page body 2 is adapted to place a silicon wafer 5, so that the bottom of the silicon wafer 5 is relatively located between the top surface of the second boat page body 2 and the top surface of the first boat page body 1, and the bottom surface of the second boat page body 2 is flush with the bottom surface of the first boat page body 1.

[0043] In this embodiment, the second boat page body 2 is detachably installed in the mounting holes 11 of the first boat page body 1. When cleaning the boat page, it is not necessary to disassemble and assemble the entire first boat page body 1 for cleaning. It is only necessary to remove the second boat page body 2 from the first boat page body 1 for cleaning, which can solve the problems of low production efficiency caused by frequent boat cleaning and long cycle, and time-consuming, laborious, and labor-intensive disassembly and assembly of the boat; the bottom surface of the silicon wafer 5 is relatively located inside the mounting holes 11 and between the top surface of the first boat page body 1 and the top surface of the second boat page body 2, avoiding the silicon nitride film being plated on the bottom surface of the silicon wafer 5, reducing the risk of plating around the bottom surface of the silicon wafer 5, and reducing the subsequent grinding process of the bottom surface of the silicon wafer 5.

[0044] Specifically, mounting hole positions 11 are provided at intervals in the length direction on the first boat page body 1. The mounting hole positions 11 are in a double-square shape. A second boat page body 2 is detachably mounted in the mounting hole positions 11. Above the top surface of the second boat page body 2 is suitable for placing a silicon wafer 5. During cleaning, only the second boat page body 2 needs to be removed from the first boat page body 1 for cleaning, without removing the entire first boat page body 1. It should be noted that the main concept of this application is to clean the second boat page body 2 in the deposition area of the silicon wafer 5 to ensure that the electric field and magnetic field at the position where the silicon wafer 5 is located are consistent, so that the deposition rate on the silicon wafer 5 is consistent. The silicon nitride coating deposited at other positions on the first boat page body 1 does not affect the electric field and magnetic field above the second boat page body 2, so it does not need to be taken into account. Reference Figures 4 to 6 , the mounting hole positions 11 include a first mounting groove 111 and a second mounting groove 112. Both the first mounting groove 111 and the second mounting groove 112 are square. The notch of the first mounting groove 111 is provided on the top surface of the first boat page body 1, and the first mounting groove 111 penetrates through the top surface of the first boat page body 1. The notch of the second mounting groove 112 is provided at the bottom of the first mounting groove 111 and the second mounting groove 112 penetrates through the bottom surface of the first boat page body 1. The notch of the second mounting groove 112 is smaller than the notch of the first mounting groove 111; the second boat page body 2 is in a boss shape and includes a first mounting portion 21 and a second mounting portion 22. The first mounting portion 21 is suitable for being placed in the first mounting groove 111 and the bottom of the first mounting portion 21 abuts against the bottom of the first mounting groove 111. The top surface of the first mounting portion 21 is lower than the top surface of the first boat page body 1. The second mounting portion 22 is suitable for being placed in the second mounting groove 112 and the bottom surface of the second mounting portion 22 is flush with the bottom surface of the first boat page body 1. The placement method of the mounting hole positions 11 is simple and fast, improving the disassembly and installation efficiency of the second boat page body 2, and thus reducing the cleaning time of the second boat page body 2. Above the top surface of the second boat page body 2 is suitable for placing a silicon wafer 5. A deposition area is formed on the top surface and a small area around the perimeter of the silicon wafer 5. After the second boat page body 2 is conveniently installed, disassembled and efficiently cleaned, the deposition rate above the second boat page body 2 is kept consistent, making the coating speed and film thickness of the silicon wafer 5 more uniform. Moreover, when the silicon wafer 5 is placed on the second boat page body 2, the bottom surface of the silicon wafer 5 is located inside the mounting hole positions 11 and is relatively below the top surface of the first boat page body 1, avoiding the direct airflow reaching the bottom surface of the silicon wafer 5 and reducing the probability of circumferential plating on the bottom surface of the silicon wafer 5. The size of the first placement groove is the same as the size of the silicon wafer 5, also avoiding the airflow blowing the silicon wafer 5 away and reducing the risk of the silicon wafer 5 flying off.

[0045] It should be noted that the side wall of the mounting hole positions 11 includes a first side wall, a second side wall and a third side wall. The first side wall is perpendicular to the top surface of the first boat page body 1, the second side wall is parallel to the top surface of the first boat page body 1, the third side wall is perpendicular to the bottom surface of the first boat page body 1, and the second side wall connects the bottom of the first side wall and the top of the second side wall.

[0046] Further, referring to Figure 6 and Figure 7 , a plurality of mounting holes 23 are also provided on the second boat page body 2. The mounting holes 23 are adapted to mount bumps 24. A silicon wafer 5 is adapted to be placed on the bumps 24. The highest point of the bumps 24 is higher than the top surface of the second boat page body 2 and lower than the top surface of the first boat page body 1.

[0047] In this embodiment, the highest point of the bumps 24 is higher than the top surface of the second boat page body 2 and lower than the top surface of the first boat page body 1. The silicon wafer 5 is adapted to be fixed above the bumps 24 and the bottom surface of the silicon wafer 5 is located in the first mounting groove 111. The bottom surface of the silicon wafer 5 is lower than the top surface of the first boat page body 1, reducing the risk of coating on the bottom surface of the silicon wafer 5 and avoiding the problem of overcoating on the bottom surface of the silicon wafer 5.

[0048] Specifically, the distance between the highest point of the bumps 24 and the top surface of the first boat page body 1 is not less than the thickness of the silicon wafer 5, so that the top surface of the silicon wafer 5 does not exceed the top surface of the first boat page body 1. The top surface of the silicon wafer 5 does not exceed the top surface of the first boat page body 1, so that the side wall of the silicon wafer 5 is also below the top surface of the first boat page body 1. The air flow does not directly blow on the side of the silicon wafer 5, avoiding the problem of overcoating on the side wall of the silicon wafer 5. At the same time, the side wall of the silicon wafer 5 is completely located in the first mounting groove 111, avoiding the air flow directly blowing on the side wall of the silicon wafer 5 causing the silicon wafer 5 to shake and also reducing the air flow entering the bottom surface of the silicon wafer 5. It should be noted that the bumps 24 are a placement structure for placing the silicon wafer 5, and it can also be other placement structures such as clamping points, which are all common technologies in the art and will not be further described in this application.

[0049] Preferably, referring to Figure 2 and Figure 8 , the distance between the highest point of the bumps 24 and the top surface of the first boat page body 1 is equal to the thickness of the silicon wafer 5, so that the top surface of the silicon wafer 5 is flush with the top surface of the first boat page body 1.

[0050] In this embodiment, the top surface of the silicon wafer 5 is flush with the top surface of the first boat page body 1. The air flow can pass through the top surface of the silicon wafer 5 more evenly, enabling more uniform coating on the top surface of the silicon wafer 5, improving the stability of coating on the top surface of the silicon wafer 5 and ensuring the coating efficiency on the top surface of the silicon wafer 5; at the same time, the side wall and the bottom surface of the silicon wafer 5 are both located in the first mounting groove 111, avoiding the risk of overcoating on the side wall and the bottom surface of the silicon wafer 5, and also avoiding the air flow directly blowing on the side wall of the silicon wafer 5 causing the silicon wafer 5 to shake and reducing the air flow entering the bottom surface of the silicon wafer 5.

[0051] Specifically, the top surface of the silicon wafer 5 is flush with the top surface of the first boat page body 1, and the bottom surface of the second boat page body 2 is flush with the bottom surface of the first boat page body 1, such that the distance between adjacent first boat page bodies 1 is equal to the distance between the bottom surface of the second boat page body 2 and the top surface of the silicon wafer 5, that is, the cross-section of the air flow is always equal, enabling the air flow to pass through the silicon wafer 5 in a laminar flow, making the air flow more stable and the deposition efficiency on the top surface of the silicon wafer 5 more uniform. The distance between the top surface of the second boat page body 2 and the top surface of the first boat page body 1 is 0.3 mm, and the distance between the highest point of the bump 24 and the top surface of the first boat page body 1 is 0.1 mm. In this embodiment, the thickness of the silicon wafer 5 is 0.2 mm. It should be noted that according to the different thicknesses of the silicon wafer 5, the sizes of the distances between the bump 24, the top surface of the second boat page body 2 and the top surface of the first boat page body 1 can also be adjusted, as long as the top surface of the silicon wafer 5 is parallel to the top surface of the first boat page body 1.

[0052] Further, referring to Figure 5 and Figure 7 , a plurality of unloading blind holes 12 are further provided on the top surface of the first boat page body 1. The unloading blind holes 12 are arranged at the edge of the mounting hole positions 11. The unloading blind holes 12 communicate the top surface of the first boat page body 1 and the top surface of the second boat page body 2, such that the air flow between the top surface of the second boat page body 2 and the bottom surface of the silicon wafer 5 is adapted to flow out through the unloading blind holes 12.

[0053] In this embodiment, the unloading blind holes 12 conduct the top surface of the first boat page body 1 and the top surface of the second boat page body 2, enabling the air flow between the bottom surface of the silicon wafer 5 and the top surface of the second boat page body 2 to be discharged through the unloading blind holes 12, avoiding the formation of a pressure difference between the top and bottom surfaces of the silicon wafer 5, which may cause the silicon wafer 5 to shake up and down or fly up.

[0054] Specifically, the unloading blind holes 12 are located at the four corners of the mounting hole positions 11. The tops of the unloading blind holes 12 are located on the top surface of the first boat page body 1. The unloading blind holes 12 do not penetrate through the first boat page body 1 and the bottoms of the unloading blind holes 12 are located at the bottom of the first mounting groove 111 of the mounting hole positions 11, which can discharge the air flow at the bottom of the silicon wafer 5 through the unloading blind holes 12 from the top of the first boat page body 1, effectively balancing the pressure difference between the top and bottom surfaces of the silicon wafer 5 and preventing the silicon wafer 5 from shaking or flying off. The unloading blind holes 12 are arranged on the side walls of the first mounting groove 111. The depth of the unloading blind holes 12 is the same as that of the first mounting groove 111. The unloading blind holes 12 do not penetrate through the first boat page body 1 and the bottoms of the unloading blind holes 12 are located at the bottom of the first mounting groove 111 of the mounting hole positions 11, so that the bottoms of the unloading blind holes 12 are flush with the top surface of the second boat page body 2, and the air flow between the top surface of the second boat page body 2 and the bottom surface of the silicon wafer 5 can reach the inside of the unloading blind holes 12 more smoothly and flow out through the inner side walls of the unloading blind holes 12, and the flow performance of the air flow is better. It should be noted that in a variant embodiment, the depth of the unloading blind holes 12 can also be less than that of the first mounting groove 111 and the bottoms of the unloading blind holes 12 are relatively located below the bottom surface of the silicon wafer 5, as long as it can connect the top surface of the first boat page body 1 and the bottom surface of the silicon wafer 5 so that the air flow at the bottom surface of the silicon wafer 5 can flow out through the unloading blind holes 12.

[0055] At the same time, the unloading blind holes 12 do not penetrate through the first boat page body 1. Even if the battery chip is broken, it does not affect the distribution of the electromagnetic field between the electrodes, and it also avoids the influence of the electromagnetic field on the existing magnetic field after passing through the unloading blind holes 12, improving the stability of the magnetic field in the graphite boat.

[0056] Preferably, the unloading blind holes 12 are three-quarter arcs, the four corners of the silicon wafer 5 are relatively located at the centers of the circles of the unloading blind holes 12, and the inner side walls of the unloading blind holes 12 are vertically arranged.

[0057] In this embodiment, the unloading blind holes 12 are arranged at the four corners of the first mounting groove 111, and the inner side walls of the unloading blind holes 12 are vertically arranged, so that the redundant gas can only rise vertically, avoiding the accumulation of the air flow at the bottom surface of the silicon wafer 5 at the four corners of the first mounting groove 111 and generating eddy currents, enabling the air flow at the bottom surface of the silicon wafer 5 to flow out through the unloading blind holes 12 more quickly, and further avoiding the problem of flying off caused by the pressure difference between the top and bottom surfaces of the silicon wafer 5.

[0058] Specifically, the unloading blind hole 12 is a three-quarter arc, and the four corners of the silicon wafer 5 cover the other quarter arc of the unloading blind hole 12. The inner side wall of the unloading blind hole 12 is vertically arranged, and the air flow reaching the unloading blind hole 12 directly flows out through the inner side wall of the unloading blind hole 12, greatly reducing the pressure at the four corners of the first installation groove 111 and preventing the air flow from generating eddy currents at the four corners of the first installation groove 111 and affecting the stability of the silicon wafer 5. It should be noted that the inner side wall of the unloading blind hole 12 includes but is not limited to being vertically arranged, and it can also have a certain curvature or be inclined, which plays a role in guiding and gathering the air flow and preventing the air flow from being blocked in the unloading blind hole 12. This is easy for those skilled in the art to think of, and no further limitation is made in this application here.

[0059] Further, referring to Figure 1 , the present application provides a graphite boat, which includes the detachable boat pages in any of the above embodiments, a graphite connection block 3, and a ceramic rod 4. A plurality of detachable boat pages are sequentially arranged at intervals in the vertical direction; the graphite connection block 3 is arranged at both horizontal ends of the first boat page body 1 of the detachable boat page; the ceramic rod 4 vertically penetrates and connects a plurality of first boat page bodies 1, and a ceramic ring is also sleeved on the ceramic rod 4 between adjacent first boat page bodies 1.

[0060] It should be noted that the above embodiments can be freely combined according to needs. The above are only the preferred embodiments of the present invention. It should be pointed out that for those of ordinary skill in the art, without departing from the principle of the present invention, several improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the present invention.

Claims

1. A detachable boat page, characterized in that, Comprising: A first boat page body, the first boat page body being adapted to be placed horizontally and having a plurality of mounting hole positions provided at intervals in the length direction of the first boat page body, the mounting hole positions penetrating through the first boat page body; A second boat page body, the second boat page body being detachably disposed in the mounting hole positions, the top surface of the second boat page body being lower than the top surface of the first boat page body, the top surface of the second boat page body being adapted to place a silicon wafer, such that the bottom of the silicon wafer is relatively located between the top surface of the second boat page body and the top surface of the first boat page body, and the bottom surface of the second boat page body being flush with the bottom surface of the first boat page body.

2. A detachable boat page according to claim 1, wherein the mounting hole positions include a first mounting groove and a second mounting groove, the notch of the first mounting groove being provided on the top surface of the first boat page body, the notch of the second mounting groove being provided at the bottom of the first mounting groove and the second mounting groove penetrating through the bottom surface of the first boat page body, and the notch of the second mounting groove being smaller than the notch of the first mounting groove; the second boat page body includes a first mounting portion and a second mounting portion, the first mounting portion being adapted to be placed in the first mounting groove and the bottom of the first mounting portion abutting against the bottom of the first mounting groove, the top surface of the first mounting portion being lower than the top surface of the first boat page body, and the second mounting portion being adapted to be placed in the second mounting groove and the bottom surface of the second mounting portion being flush with the bottom surface of the first boat page body.

3. A detachable boat page according to claim 1, wherein a plurality of assembly holes are further provided on the second boat page body, bumps are adapted to be installed in the assembly holes, the silicon wafer is adapted to be placed on the bumps, and the highest point of the bumps is higher than the top surface of the second boat page body and lower than the top surface of the first boat page body.

4. A detachable boat page according to claim 3, wherein the distance between the highest point of the bump and the top surface of the first boat page body is not less than the thickness of the silicon wafer, such that the top surface of the silicon wafer does not exceed the top surface of the first boat page body.

5. A detachable boat page according to claim 3, wherein the distance between the highest point of the bump and the top surface of the first boat page body is equal to the thickness of the silicon wafer, such that the top surface of the silicon wafer is flush with the top surface of the first boat page body.

6. A detachable boat page according to claim 5, wherein the distance between the top surface of the second boat page body and the top surface of the first boat page body is 0.3 mm, and the distance between the highest point of the bump and the top surface of the first boat page body is 0.1 mm.

7. A detachable boat page according to any one of claims 1-6, wherein a plurality of unloading blind holes are further provided on the top surface of the first boat page body, the unloading blind holes being provided at the edges of the mounting hole positions, the unloading blind holes communicating the top surface of the first boat page body and the top surface of the second boat page body, such that the air flow between the top surface of the second boat page body and the bottom surface of the silicon wafer is adapted to flow out through the unloading blind holes.

8. A detachable boat page according to claim 7, wherein The unloading blind holes are located at the four corners of the mounting hole positions. The tops of the unloading blind holes are located on the top surface of the first boat page body. The unloading blind holes do not penetrate through the first boat page body and the bottoms of the unloading blind holes are located at the bottoms of the first mounting grooves of the mounting hole positions.

9. A detachable boat page according to claim 8, wherein the unloading blind holes are three-quarter arcs, the four corners of the silicon wafer are relatively located at the centers of the circles of the unloading blind holes, and the inner side walls of the unloading blind holes are vertically arranged.

10. A graphite boat, characterized in that, Comprising: A detachable boat page according to any one of claims 1-9, wherein a plurality of the detachable boat pages are sequentially arranged at intervals in the vertical direction; A graphite connection block, which is arranged at both horizontal ends of the first boat page body of the detachable boat page; A ceramic rod, which vertically penetrates and connects a plurality of the first boat page bodies, and a ceramic ring is also sleeved on the ceramic rod between adjacent first boat page bodies.

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