Silicon wafer double-sided automatic laser processing equipment

Abstract

The utility model relates to a silicon wafer double-sided automatic laser processing device which comprises a main machine unit and a basket feeding and discharging assembly. The main machine unit comprises a first main machine assembly and a second main machine assembly which are the same in structure and composition. The first main machine assembly and the second main machine assembly are located on the two sides of the flower basket feeding and discharging assembly in the X-axis direction respectively. According to the utility model, through the structural arrangement that the basket feeding and discharging assembly is matched with the two host assemblies, the double-sided processing of the silicon wafer can be met, and the feeding and discharging process is relatively flow.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer laser processing, in particular to a double-sided automatic laser processing device for silicon wafers. Background Art

[0002] With the development of semiconductor technology, the demand for high-performance and high-integration semiconductor chips is increasing, and the manufacturing difficulty of chips is also increasing. Semiconductor chips are usually fabricated by depositing integrated circuit element structures on a whole substrate wafer, then performing wafer dicing, and finally packaging each diced die.

[0003] After a large number of searches, it is found that the existing Chinese patent publication number CN215393222U discloses a wafer laser dicing device based on the linkage of a galvanometer and a platform, including a laser, a beam expander, a polarization element, a first reflector, a second reflector, a third reflector, a fourth reflector, a beam shaper, a two-dimensional scanning galvanometer, a telecentric field lens, an X-axis moving platform, a Z-direction moving mechanism, a wafer stage, a Y-axis moving platform, a wafer pre-alignment and transfer system, a camera system, and a computer. The laser, the polarization element, the beam shaper, the two-dimensional scanning galvanometer, the X-axis moving platform, the Y-axis moving platform, the Z-direction moving mechanism, the wafer stage, and the wafer transfer and pre-alignment system are controlled by a computer. The utility model can adjust the laser polarization state and the beam energy distribution form incident on the wafer surface according to different wafer dicing processes, improving the adaptability and dicing quality of the wafer.

[0004] In summary, the problems existing in the prior art are as follows:

[0005] The existing wafer laser dicing devices generally can only dice and process one side of the wafer. When double-sided processing is required, manual or robotic arm flipping is needed, but the single-channel processing method has low efficiency.

[0006] In view of the above defects, the designer actively conducts research and innovation to create a double-sided automatic laser processing device for silicon wafers, making it more valuable in the industry. Summary of the Utility Model

[0007] To solve any of the above technical problems, the purpose of the utility model is to provide a double-sided automatic laser processing device for silicon wafers.

[0008] To achieve the above purpose, the utility model adopts the following technical solutions:

[0009] The double-sided automatic laser processing device for silicon wafers includes a main unit and a flower basket loading and unloading assembly;

[0010] The main unit includes a first main component and a second main component with the same structural composition. The first main component and the second main component are respectively located on both sides of the flower basket loading and unloading component along the X-axis direction;

[0011] The first main component or the second main component includes a main frame, a galvanometer processing component, a motion platform component, and a fixture component;

[0012] The motion platform component includes a marble base, a Y-axis motion module, an X-axis motion module, a Z-axis motion module, and a marble column. The marble base is installed on the main frame. The Y-axis motion module installed on the marble base drives the upper X-axis motion module to move in the Y-axis direction. The X-axis motion module drives the upper fixture component to move in the X-axis direction. A marble column is installed on one side of the marble base along the negative Y-axis direction. A Z-axis motion module is installed on the marble column. The Z-axis motion module drives the galvanometer processing component to move in the Z-axis direction;

[0013] The flower basket loading and unloading component includes a flower basket loading and unloading frame, an X-axis handling synchronous belt, a rotary handling component, a lower conveyor belt, an upper conveyor belt, a flipping component, a wafer return component, and a flower basket lifting mechanism;

[0014] On one side of the flower basket loading and unloading frame along the positive Y-axis direction, two X-axis handling synchronous belts are provided. A flipping component is installed on the flower basket loading and unloading frame between the two X-axis handling synchronous belts. A lower conveyor belt and an upper conveyor belt are installed on the flower basket loading and unloading frame on the side of the X-axis handling synchronous belt along the negative Y-axis direction from bottom to top. Both the lower conveyor belt and the upper conveyor belt drive the wafer flower basket to move in the Y-axis direction. A flower basket lifting mechanism is installed on the flower basket loading and unloading frame on the side of the lower conveyor belt or the upper conveyor belt along the positive Y-axis direction. The flower basket lifting mechanism drives the transition conveyor belt to move in the Z-axis direction. The transition conveyor belt drives the wafer flower basket to move along the Y-axis direction. A wafer return component is installed on the square wafer machine frame on the side of the flower basket lifting mechanism along the positive Y-axis direction. A rotary handling component is installed on the flower basket loading and unloading frame between the wafer return component and the flower basket lifting mechanism.

[0015] As a further improvement of the present utility model, a laser power supply component is installed on the marble column on the side of the galvanometer processing component along the negative Y-axis direction, and a first gas circuit component is installed on the main frame below the marble base.

[0016] As a further improvement of the present utility model, the galvanometer processing component includes a scanning galvanometer, a light box component, and a manual camera component. The light box component is installed on the driving end of the Z-axis motion module. A scanning galvanometer is installed on one side of the light box component. The manual camera component is installed on the scanning galvanometer through a manual camera mounting bracket.

[0017] As a further improvement of the present utility model, the fixture assembly includes fixture side plates, an upper fixture bottom plate, a lower fixture bottom plate, a fixture adsorption platform, a fixture rear plate, and a fixture front plate. The upper fixture bottom plate is located directly above the lower fixture bottom plate. Fixture side plates, a fixture rear plate, and a fixture front plate are installed between the upper fixture bottom plate and the lower fixture bottom plate. A fixture adsorption platform is installed on the upper fixture bottom plate.

[0018] As a further improvement of the present utility model, an adsorption flange is installed in the middle of the fixture front plate, a filter plate is installed inside the adsorption flange, and toggle clamps are installed on both sides of the fixture front plate on both sides of the adsorption flange through toggle clamp mounting blocks.

[0019] As a further improvement of the present utility model, a plurality of notches are formed in the fixture adsorption platform, and movable guide blocks are movably installed in the notches. The movable guide blocks include movable blocks and guide blocks. The movable blocks are movably installed in the notches, and guide blocks are installed on the inner sides of the movable blocks.

[0020] As a further improvement of the present utility model, a plurality of gaps are formed in the fixture adsorption platform, and a positioning cylinder assembly is installed on the upper fixture bottom plate on one side of the gap. The positioning cylinder assembly includes a positioning cylinder and a positioning block, and the positioning cylinder drives the inner positioning block to move towards the gap.

[0021] As a further improvement of the present utility model, a touch screen, a sensor, a speed regulator assembly, and a second gas circuit assembly are installed on the flower basket loading and unloading rack.

[0022] As a further improvement of the present utility model, the flipping assembly includes a flipping lifting mechanism, a flipping cylinder, and flipping connecting rods. The flipping lifting mechanism installed on the flower basket loading and unloading rack drives the flipping cylinder to move in the Z-axis direction. The flipping cylinder drives the flipping connecting rods to flip between two X-axis handling synchronous belts, and a plurality of flipping suction cups are installed on the flipping connecting rods.

[0023] As a further improvement of the present utility model, the silicon wafer return assembly includes a silicon wafer return Y-axis module and silicon wafer return adsorption fingers. The silicon wafer return Y-axis module installed on the flower basket loading and unloading rack drives the upper silicon wafer return adsorption fingers to move in the Y-axis direction through a silicon wafer return adsorption finger mounting block. A planar adsorption assembly is installed on the flower basket loading and unloading rack below the silicon wafer return Y-axis module. The planar adsorption assembly includes a planar adsorption base, a planar adsorption intermediate plate, and a planar adsorption top seat from bottom to top. A planar adsorption lifting cylinder is installed on the planar adsorption base, and the planar adsorption lifting cylinder drives the upper planar adsorption intermediate plate to move in the Z-axis direction. Planar adsorption top seats are installed on both sides of the planar adsorption intermediate plate along the X-axis direction, and the two planar adsorption top seats are located on both sides of the silicon wafer return adsorption fingers along the X-axis direction.

[0024] By means of the above solution, the present utility model has at least the following advantages:

[0025] With the structural arrangement of the flower basket loading and unloading component in combination with two main machine components, the present utility model can meet the double-sided processing of silicon wafers, and the loading and unloading process is relatively smooth.

[0026] With the double-channel processing method of the present utility model, the processing speed is greatly improved and the finished products are of good quality.

[0027] Existing wafer laser cutting equipment generally can only perform cutting processing on one side of the wafer. When double-sided processing is required, manual or robotic arm flipping is needed, but the single-channel processing method has relatively low efficiency.

[0028] The above description is only an overview of the technical solution of the present utility model. In order to be able to understand the technical means of the present utility model more clearly and implement it in accordance with the content of the specification, the following takes the preferred embodiments of the present utility model and describes them in detail in conjunction with the drawings as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present utility model, and therefore should not be regarded as a limitation of the scope. For those of ordinary skill in the art, without creative efforts, other relevant drawings can also be obtained based on these drawings.

[0030] Figure 1 is a structural schematic diagram of a double-sided automatic laser processing equipment for silicon wafers of the present utility model;

[0031] Figure 2 is Figure 1 a structural schematic diagram of the first main machine component or the second main machine component in

[0032] Figure 3 is Figure 2 a structural schematic diagram after removing the main machine frame in

[0033] Figure 4 is Figure 3 a structural schematic diagram of the galvanometer processing component in

[0034] Figure 5 is Figure 3 a structural schematic diagram of the motion platform component in

[0035] Figure 6 is Figure 3 a structural schematic diagram of the fixture component in

[0036] Figure 7 is Figure 1 a structural schematic diagram of the flower basket loading and unloading component in

[0037] Figure 8 is Figure 7 a schematic structural diagram of the X-axis handling synchronous belt and the flipping component in

[0038] Figure 9 is Figure 7 a schematic structural diagram of the planar adsorption component and the wafer return component in

[0039] Among them, the meanings of the reference numerals in the figures are as follows.

[0040] The first mainframe component 1, the cassette loading and unloading component 2, the second mainframe component 3, the mainframe rack 4, the galvanometer processing component 5, the laser power supply component 6, the motion platform component 7, the first gas circuit component 8, the fixture component 9, the scanning galvanometer 10, the light box component 11, the manual camera component 12, the manual camera mounting bracket 13, the Y-axis motion module 14, the X-axis motion module 15, the Z-axis motion module 16, the marble column 17, the toggle clamp 18, the toggle clamp mounting block 19, the fixture side plate 20, the fixture upper bottom plate 21, the fixture lower bottom plate 22, the fixture adsorption platform 23, the fixture rear plate 24, the moving guide block 25, the positioning cylinder component 26, the fixture front plate 27, the adsorption flange 28, the cassette loading and unloading rack 29, the X-axis handling synchronous belt 30, the planar adsorption component 31, the rotary handling component 32, the lower conveyor belt 33, the transition conveyor belt 34, the upper conveyor belt 35, the touch screen 36, the wafer cassette 37, the sensor 38, the flipping component 39, the speed regulator component 40, the wafer return component 41, the second gas circuit component 42, the cassette lifting mechanism 43, the flipping lifting mechanism 44, the flipping cylinder 45, the flipping connecting rod 46, the flipping suction cup 47, the wafer return Y-axis module 48, the wafer return adsorption finger mounting block 49, the wafer return adsorption finger 50, the planar adsorption base 51, the planar adsorption lifting cylinder 52, the planar adsorption intermediate plate 53, the planar adsorption top seat 54. Specific embodiments

[0041] The following combines the drawings and embodiments to further describe in detail the specific embodiments of the present invention. The following embodiments are used to illustrate the present invention, but are not used to limit the scope of the present invention.

[0042] To enable those skilled in the art to better understand the solution of the present utility model, the technical solutions in the embodiments of the present utility model will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments. Usually, the components of the embodiments of the present utility model described and shown in the accompanying drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiments of the present utility model provided in the accompanying drawings is not intended to limit the scope of the present utility model to be protected, but only represents the selected embodiments of the present utility model. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative efforts belong to the scope of protection of the present utility model.

[0043] As Figures 1 to 9 shown, a double-sided automatic laser processing device for silicon wafers includes a main machine unit and a cassette loading and unloading assembly 2. The main machine unit includes a first main machine assembly 1 and a second main machine assembly 3 with the same structural composition. The first main machine assembly 1 and the second main machine assembly 3 are respectively located on both sides of the cassette loading and unloading assembly 2 along the X-axis direction.

[0044] I. The first main machine assembly 1 or the second main machine assembly 3 includes a main machine frame 4, a galvanometer processing assembly 5, a motion platform assembly 7, and a fixture assembly 9.

[0045] The motion platform assembly 7 includes a marble base, a Y-axis motion module 14, an X-axis motion module 15, a Z-axis motion module 16, and a marble column 17. The marble base is installed on the main machine frame 4. The Y-axis motion module 14 installed on the marble base drives the upper X-axis motion module 15 to move in the Y-axis direction. The X-axis motion module 15 drives the upper fixture assembly 9 to move in the X-axis direction. A marble column 17 is installed on one side of the marble base along the negative Y-axis direction. A Z-axis motion module 16 is installed on the marble column 17. The Z-axis motion module 16 drives the galvanometer processing assembly 5 to move in the Z-axis direction;

[0046] A laser power supply assembly 6 is installed on the marble column 17 on the side of the galvanometer processing assembly 5 along the negative Y-axis direction. A first gas circuit assembly 8 is installed on the main machine frame 4 below the marble base.

[0047] The galvanometer processing assembly 5 includes a scanning galvanometer 10, a light box assembly 11, and a manual camera assembly 12. The light box assembly 11 is installed on the driving end of the Z-axis motion module 16. A scanning galvanometer 10 is installed on one side of the light box assembly 11. The manual camera assembly 12 is installed on the scanning galvanometer 10 through a manual camera mounting bracket 13.

[0048] The fixture assembly 9 includes a fixture side plate 20, a fixture upper bottom plate 21, a fixture lower bottom plate 22, a fixture adsorption platform 23, a fixture rear plate 24, and a fixture front plate 27. The fixture upper bottom plate 21 is directly above the fixture lower bottom plate 22. The fixture side plate 20, the fixture rear plate 24, and the fixture front plate 27 are installed between the fixture upper bottom plate 21 and the fixture lower bottom plate 22. The fixture adsorption platform 23 is installed on the fixture upper bottom plate 21.

[0049] An adsorption flange 28 is installed in the middle of the fixture front plate 27. A filter plate is installed inside the adsorption flange 28 to filter impurities. Elbow clamps 18 are installed on both sides of the fixture front plate 27 on both sides of the adsorption flange 28 through elbow clamp mounting blocks 19.

[0050] A number of notches are formed in the fixture adsorption platform 23. Movable guide blocks 25 are installed in the notches. The movable guide blocks 25 include movable blocks and guide blocks. The movable blocks are movably installed in the notches, and the guide blocks are installed on the inner sides of the movable blocks.

[0051] A number of gaps are formed in the fixture adsorption platform 23. A positioning cylinder assembly 26 is installed on the fixture upper bottom plate 21 on one side of the gap. The positioning cylinder assembly 26 includes a positioning cylinder and a positioning block. The positioning cylinder drives the inner positioning block to move towards the gap. The gap left on the fixture adsorption platform 23 gives enough movement space for the positioning cylinder assembly 26.

[0052] Second, the flower basket loading and unloading assembly 2 includes a flower basket loading and unloading machine frame 29, an X-axis handling synchronous belt 30, a rotary handling assembly 32, a lower conveyor belt 33, an upper conveyor belt 35, a flipping assembly 39, a wafer return transmission assembly 41, and a flower basket lifting mechanism 43.

[0053] On one side of the flower basket loading and unloading rack 29 along the positive Y-axis direction, there are two X-axis handling synchronous belts 30. On the flower basket loading and unloading rack 29 between the two X-axis handling synchronous belts 30, a flipping assembly 39 is installed. On the flower basket loading and unloading rack 29 on the negative Y-axis side of the X-axis handling synchronous belt 30, a lower conveyor belt 33 and an upper conveyor belt 35 are installed from bottom to top in sequence. Both the lower conveyor belt 33 and the upper conveyor belt 35 drive the wafer flower basket 37 to move in the Y-axis direction. On the flower basket loading and unloading rack 29 on the positive Y-axis side of the lower conveyor belt 33 or the upper conveyor belt 35, a flower basket lifting mechanism 43 is installed. The flower basket lifting mechanism 43 drives the transition conveyor belt 34 to move in the Z-axis direction, and the transition conveyor belt 34 drives the wafer flower basket 37 to move along the Y-axis direction. On the wafer slicing machine rack 47 on the positive Y-axis side of the flower basket lifting mechanism 43, a wafer return transmission assembly 41 is installed. On the flower basket loading and unloading rack 29 between the wafer return transmission assembly 41 and the flower basket lifting mechanism 43, a rotary handling assembly 32 is installed. The rotary handling assembly 32 is located obliquely above the transition conveyor belt 34 and is used to handle wafers, transporting the wafers in the wafer flower basket 37 into the first main machine assembly 1 or the second main machine assembly 3, or transporting the processed wafers from the first main machine assembly 1 or the second main machine assembly 3 back to the flower basket loading and unloading assembly 2.

[0054] A touch screen 36, a sensor 38, a speed regulator assembly 40, and a second gas circuit assembly 42 are installed on the flower basket loading and unloading rack 29. The sensor 38 is placed above the upper conveyor belt 35 and the transition conveyor belt 34 to detect the wafers in the wafer flower basket 37.

[0055] The flipping assembly 39 includes a flipping lifting mechanism 44, a flipping cylinder 45, and a flipping connecting rod 46. The flipping lifting mechanism 44 installed on the flower basket loading and unloading rack 29 drives the flipping cylinder 45 to move in the Z-axis direction. The flipping cylinder 45 drives the flipping connecting rod 46 to flip between the two X-axis handling synchronous belts 30. A number of flipping suction cups 47 are installed on the flipping connecting rod 46.

[0056] The silicon wafer return assembly 41 includes a silicon wafer return Y-axis module 48 and a silicon wafer return suction finger 50. The silicon wafer return Y-axis module 48 installed on the flower basket loading and unloading frame 29 drives the upper silicon wafer return suction finger 50 to move in the Y-axis direction through the silicon wafer return suction finger mounting block 49. A plane suction assembly 31 is installed on the flower basket loading and unloading frame 29 below the silicon wafer return Y-axis module 48. The plane suction assembly 31 includes a plane suction base 51, a plane suction middle plate 53 and a plane suction top seat 54 from bottom to top. A plane suction lifting cylinder 52 is installed on the plane suction base 51. The plane suction lifting cylinder 52 drives the upper plane suction middle plate 53 to move in the Z-axis direction. Plane suction top seats 54 are installed on both sides of the plane suction middle plate 53 along the X-axis direction, and the two plane suction top seats 54 are located on both sides of the silicon wafer return suction finger 50 along the X-axis direction.

[0057] A number of silicon wafer baskets 37 are placed on the upper conveyor belt 35 in sequence, and the silicon wafer baskets 37 to be processed are transferred to the transition conveyor belt 34. During the lifting process of the basket lifting mechanism 43, the silicon wafers in the silicon wafer basket 37 are transferred to the silicon wafer return assembly 41 through the silicon wafer return assembly 41, and then the silicon wafers on the silicon wafer return assembly 41 are transported to the first host assembly 1 or the second host assembly 3 for processing through the rotating transport assembly 32. After processing, the silicon wafers are placed on the silicon wafer return assembly 41 through the rotating transport assembly 32, and the silicon wafer return assembly 41 drives the silicon wafers to move toward the silicon wafer basket 37 and put back into the silicon wafer basket 37.

[0058] When flipping is required, the silicon wafer is placed on the X-axis transport synchronous belt 30 on one side through the rotating transport component 32 on one side, and transferred to the flipping component 39 in the middle to flip the silicon wafer and then flip it to the X-axis transport synchronous belt 30 on the other side. Thereafter, the silicon wafer is transported to the first main component 1 or the second main component 3 for processing through the rotating transport component 32 on the other side.

[0059] Finally, the silicon wafer basket 37 filled with processed square wafers is docked with the lower conveyor belt 33 through the transition conveyor belt 34 , so that the silicon wafer basket 37 is transferred to the lower conveyor belt 33 .

[0060] The utility model can meet the double-sided processing of silicon wafers through the structural setting of the basket loading and unloading components with two main machine components, and the loading and unloading process is relatively smooth. The dual-channel processing method greatly improves the processing speed and produces good finished products. Existing wafer laser cutting equipment can generally only cut and process one side of the wafer. When processing both sides is required, manual or robotic arm flipping is required, but the single-channel processing method is relatively inefficient.

[0061] In the description of the present utility model, it should be understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present utility model. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first", "second", etc. may explicitly or implicitly include one or more of such features. In the description of the present utility model, unless otherwise specified, the meaning of "a plurality" is two or more.

[0062] In the description of the present utility model, it should be noted that unless otherwise clearly specified and defined, the terms "mounted", "connected", and "coupled" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be a direct connection or an indirect connection through an intermediate medium; it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood through specific circumstances.

[0063] The above description is only a preferred embodiment of the present utility model and is not used to limit the present utility model. It should be pointed out that for those of ordinary skill in the art, without departing from the technical principle of the present utility model, several improvements and modifications can still be made, and these improvements and modifications should also be regarded as the protection scope of the present utility model.

Claims

1. Double-sided automatic laser processing equipment for silicon wafers, comprising a main unit and a cassette loading and unloading assembly (2); Characterized in that: The main unit includes a first main component (1) and a second main component (3) with the same structural composition. The first main component (1) and the second main component (3) are respectively located on both sides of the cassette loading and unloading assembly (2) along the X-axis direction; The first main component (1) or the second main component (3) includes a mainframe rack (4), a galvanometer processing component (5), a motion platform component (7) and a fixture component (9); The motion platform component (7) includes a marble base, a Y-axis motion module (14), an X-axis motion module (15), a Z-axis motion module (16) and a marble column (17). The marble base is installed on the mainframe rack (4). The Y-axis motion module (14) installed on the marble base drives the upper X-axis motion module (15) to move in the Y-axis direction. The X-axis motion module (15) drives the upper fixture component (9) to move in the X-axis direction. A marble column (17) is installed on one side of the marble base along the negative Y-axis direction. A Z-axis motion module (16) is installed on the marble column (17). The Z-axis motion module (16) drives the galvanometer processing component (5) to move in the Z-axis direction; The cassette loading and unloading assembly (2) includes a cassette loading and unloading rack (29), an X-axis handling synchronous belt (30), a rotary handling component (32), a lower conveyor belt (33), an upper conveyor belt (35), a flipping component (39), a silicon wafer return component (41) and a cassette lifting mechanism (43); On one side of the cassette loading and unloading rack (29) along the positive Y-axis direction, two X-axis handling synchronous belts (30) are provided. A flipping component (39) is installed on the cassette loading and unloading rack (29) between the two X-axis handling synchronous belts (30). A lower conveyor belt (33) and an upper conveyor belt (35) are successively installed on the cassette loading and unloading rack (29) on the side of the X-axis handling synchronous belt (30) along the negative Y-axis direction from bottom to top. Both the lower conveyor belt (33) and the upper conveyor belt (35) drive the silicon wafer cassette (37) to move in the Y-axis direction. A cassette lifting mechanism (43) is installed on the cassette loading and unloading rack (29) on the side of the lower conveyor belt (33) or the upper conveyor belt (35) along the positive Y-axis direction. The cassette lifting mechanism (43) drives the transition conveyor belt (34) to move in the Z-axis direction. The transition conveyor belt (34) drives the silicon wafer cassette (37) to move along the Y-axis direction. A silicon wafer return component (41) is installed on the square wafer rack (47) on the side of the cassette lifting mechanism (43) along the positive Y-axis direction. A rotary handling component (32) is installed on the cassette loading and unloading rack (29) between the silicon wafer return component (41) and the cassette lifting mechanism (43).

2. The double-sided automatic laser processing equipment for silicon wafers according to claim 1, wherein, A laser power supply assembly (6) is installed on the marble column (17) on the negative Y-axis side of the galvanometer processing assembly (5), and a first gas circuit assembly (8) is installed on the mainframe rack (4) below the marble base.

3. The double-sided automatic laser processing equipment for silicon wafers according to claim 1, characterized in that, The galvanometer processing assembly (5) includes a scanning galvanometer (10), a light box assembly (11) and a manual camera assembly (12). The light box assembly (11) is installed on the driving end of the Z-axis motion module (16). A scanning galvanometer (10) is installed on one side of the light box assembly (11). The manual camera assembly (12) is installed on the scanning galvanometer (10) through a manual camera mounting bracket (13).

4. The double-sided automatic laser processing equipment for silicon wafers according to claim 1, characterized in that, The fixture assembly (9) includes fixture side plates (20), a fixture upper bottom plate (21), a fixture lower bottom plate (22), a fixture adsorption platform (23), a fixture rear plate (24) and a fixture front plate (27). The fixture upper bottom plate (21) is located directly above the fixture lower bottom plate (22). Fixture side plates (20), a fixture rear plate (24) and a fixture front plate (27) are installed between the fixture upper bottom plate (21) and the fixture lower bottom plate (22). A fixture adsorption platform (23) is installed on the fixture upper bottom plate (21).

5. The double-sided automated laser processing equipment for silicon wafers according to claim 4, wherein, An adsorption flange (28) is installed in the middle of the fixture front plate (27). A filter plate is installed inside the adsorption flange (28). Elbow clamps (18) are installed on both sides of the fixture front plate (27) of the adsorption flange (28) through elbow clamp mounting blocks (19).

6. The double-sided automated laser processing equipment for silicon wafers according to claim 4, wherein, A number of notches are provided on the fixture adsorption platform (23). Moving guide blocks (25) are movably installed in the notches. The moving guide blocks (25) include moving blocks and guide blocks. The moving blocks are movably installed in the notches, and guide blocks are installed on the inner sides of the moving blocks.

7. The double-sided automatic laser processing equipment for silicon wafers according to claim 4, wherein A number of gaps are provided on the fixture adsorption platform (23). A positioning cylinder assembly (26) is installed on the fixture upper bottom plate (21) on one side of the gap. The positioning cylinder assembly (26) includes a positioning cylinder and a positioning block. The positioning cylinder drives the inner positioning block to move towards the gap.

8. The double-sided automatic laser processing equipment for silicon wafers according to claim 1, wherein A touch screen (36), a sensor (38), a speed regulator assembly (40) and a second gas circuit assembly (42) are installed on the flower basket loading and unloading rack (29).

9. The double-sided automatic laser processing equipment for silicon wafers according to claim 1, characterized in that, The flipping assembly (39) includes a flipping lifting mechanism (44), a flipping cylinder (45) and a flipping connecting rod (46). The flipping lifting mechanism (44) installed on the flower basket loading and unloading rack (29) drives the flipping cylinder (45) to move in the Z-axis direction. The flipping cylinder (45) drives the flipping connecting rod (46) to flip between the two X-axis handling synchronous belts (30). A number of flipping suction cups (47) are installed on the flipping connecting rod (46).

10. The double-sided automated laser processing equipment for silicon wafers according to claim 1, characterized in that, The silicon wafer return component (41) includes a silicon wafer return Y-axis module (48) and silicon wafer return adsorption fingers (50). The silicon wafer return Y-axis module (48) installed on the cassette loading and unloading rack (29) drives the upper silicon wafer return adsorption fingers (50) to move in the Y-axis direction through a silicon wafer return adsorption finger mounting block (49). A planar adsorption component (31) is installed on the cassette loading and unloading rack (29) below the silicon wafer return Y-axis module (48). The planar adsorption component (31) sequentially includes a planar adsorption base (51), a planar adsorption intermediate plate (53), and a planar adsorption top seat (54) from bottom to top. A planar adsorption lifting cylinder (52) is installed on the planar adsorption base (51), and the planar adsorption lifting cylinder (52) drives the upper planar adsorption intermediate plate (53) to move in the Z-axis direction. Planar adsorption top seats (54) are installed on both sides of the planar adsorption intermediate plate (53) along the X-axis direction, and the two planar adsorption top seats (54) are located on both sides of the silicon wafer return adsorption fingers (50) along the X-axis direction.

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