Semiconductor chip cutting equipment

Abstract

The utility model discloses semiconductor chip cutting equipment, and relates to the technical field of semiconductor chip production. The device comprises a rack, a transverse moving frame, a vertical moving frame and a longitudinal moving frame, the transverse moving frame and the vertical moving frame are arranged on the rack in a sliding mode, the longitudinal moving frame is arranged on the transverse moving frame in a sliding mode, the transverse moving frame, the vertical moving frame and the longitudinal moving frame slide along the X axis, the Z axis and the Y axis respectively, a rotating disc is arranged on the longitudinal moving frame in a rotating mode, and a fixing piece used for fixing or unfixing a semiconductor chip is arranged on the rotating disc. A cutter shaft is rotationally arranged on the vertical moving frame, a plurality of cutter holders are arranged on the cutter shaft in a sliding mode, blades are arranged on the cutter holders, the cutter holder located in the middle is a first holder, and the other cutter holders are second holders. When the semiconductor chip cutting device is used, a semiconductor chip is cut at equal intervals through the multiple blades, so that the operation frequency is reduced, operation is convenient, meanwhile, the cutting efficiency is improved, meanwhile, the cutting distance can be adjusted, the use flexibility is improved, and therefore the semiconductor chip cutting device is more practical.

Description

Technical Field

[0001] The present application relates to the technical field of semiconductor chip production, and particularly relates to a semiconductor chip cutting device. Background Art

[0002] Semiconductor chips are the core components of modern electronic technology. From a technical perspective, they are manufactured on semiconductor materials through a series of complex processes. During the production process of semiconductor chips, they need to be cut. In the prior art, the cutting blade of the cutting device is usually only one, and the semiconductor chip needs to be operated multiple times during cutting, which is rather troublesome and reduces the cutting efficiency at the same time. Therefore, a semiconductor chip cutting device is proposed. Content of the Utility Model

[0003] The purpose of the present application is to solve the technical problem that the cutting blade of the cutting device is usually only one, and the semiconductor chip needs to be operated multiple times during cutting, which is rather troublesome and reduces the cutting efficiency at the same time. The present application provides a semiconductor chip cutting device.

[0004] The present application specifically adopts the following technical solutions to achieve the above purpose:

[0005] A semiconductor chip cutting device includes a frame, a transverse moving frame and a vertical moving frame that are both slidably arranged on the frame, and a longitudinal moving frame that is slidably arranged on the transverse moving frame. The transverse moving frame, the vertical moving frame and the longitudinal moving frame slide along the X-axis, Z-axis and Y-axis respectively. A turntable is rotatably arranged on the longitudinal moving frame, and a fixing member for fixing or releasing the fixation of the semiconductor chip is arranged on the turntable. A cutter shaft is rotatably arranged on the vertical moving frame, and a plurality of tool holders are slidably arranged on the cutter shaft. Blades are arranged on the tool holders. The tool holder in the middle is the first seat, and the remaining tool holders are all second seats. A driving member acting on the plurality of tool holders is arranged on the vertical moving frame, and it is used to drive the plurality of second seats to slide synchronously and equidistantly.

[0006] Further, the fixing member includes a fixing ring and a fixing tube that are both arranged on the turntable. A cavity and a plurality of annular cavities are formed on the fixing ring. The annular cavities are communicated with the cavity through a plurality of through holes. One end of the fixing tube is communicated with the cavity, and the other end is communicated with a vacuum pumping device.

[0007] Further, a plurality of arc-shaped plates are slidably arranged on the turntable, and a driving part acting on the plurality of arc-shaped plates and driving them to slide synchronously is arranged on the turntable.

[0008] Further, the driving part includes an annular plate rotatably arranged on the turntable. A convex block is arranged on the arc-shaped plate, and a plurality of strip-shaped grooves that are the same in number as the convex blocks and correspond to them one by one are formed on the annular plate. The convex block is slidably matched with the strip-shaped groove.

[0009] Further, the driving member includes a moving frame disposed on the vertical moving frame. A driving block corresponding to and in one-to-one correspondence with the number of tool holders is slidably disposed on the moving frame. A convex rod and a limiting rod are respectively disposed on the opposite sides of the driving block. A driving rod is rotatably disposed on the moving frame. A plurality of annular grooves corresponding to and in one-to-one correspondence with the number of convex rods are formed on the driving rod. The convex rod is slidably engaged with the annular groove. The plurality of annular grooves are inclined and distributed from the middle to both sides with the inclination angle gradually increasing. A limiting groove is formed on the tool holder, and the free end of the limiting rod is located in the limiting groove.

[0010] Further, the moving frame is slidably disposed on the vertical moving frame. A groove is formed on the tool holder, and a convex strip inserted and engaged with the groove is disposed on the tool shaft.

[0011] Further, a communicating accommodation cavity and a sliding groove are formed on the tool shaft. A positive and negative lead screw is rotatably disposed in the accommodation cavity. Two moving blocks are slidably disposed in the accommodation cavity. The two moving blocks are respectively in threaded engagement with the positive and negative threaded sections of the positive and negative lead screw. An elastic member slidably engaged with the sliding groove is disposed on the moving block. The two elastic members respectively abut and overlap with the first and last second seats.

[0012] Further, the elastic member includes a wedge-shaped block slidably disposed on the moving block. The wedge-shaped block is slidably engaged with the sliding groove and abuts and overlaps with the second seat. A return spring is disposed between the wedge-shaped block and the moving block.

[0013] The beneficial effects of the present application are as follows: When the present application is in use, the semiconductor chip is cut at equal intervals by a plurality of blades, thereby reducing the number of operations. While the operation is convenient, the cutting efficiency is also improved. At the same time, the cutting spacing can be adjusted to improve the flexibility of use. Therefore, it is more practical. Description of the Drawings

[0014] Figure 1 is a three-dimensional structure diagram of the present application;

[0015] Figure 2 is a three-dimensional structure diagram of a part of the present application;

[0016] Figure 3 is the present application Figure 2 of the three-dimensional sectional view;

[0017] Figure 4 is the present application Figure 3 of the enlarged view at A;

[0018] Figure 5 is the present application Figure 2 of the three-dimensional sectional view from another perspective;

[0019] Figure 6 is a three-dimensional structure diagram of a part of the present application;

[0020] Figure 7 is a three-dimensional sectional view of the present application Figure 6 ;

[0021] Figure 8 is an enlarged view of position B in the present application Figure 7 ;

[0022] Figure 9 is an enlarged view of position C in the present application Figure 7 ;

[0023] Figure 10 is another three-dimensional sectional view of the present application from a different perspective Figure 6 ;

[0024] Figure 11 is an enlarged view of position D in the present application Figure 10 ;

[0025] Reference numerals: 1, frame; 2, transverse moving frame; 3, vertical moving frame; 4, longitudinal moving frame; 5, turntable; 6, cutter shaft; 7, tool holder; 8, blade; 9, fixing ring; 10, fixing tube; 11, cavity; 12, annular cavity; 13, through hole; 14, arc plate; 15, ring plate; 16, convex block; 17, strip groove; 18, moving frame; 19, driving block; 20, convex rod; 21, limiting rod; 22, driving rod; 23, annular groove; 24, limiting groove; 25, groove; 26, rib; 27, accommodating cavity; 28, sliding groove; 29, positive and negative lead screw; 30, moving block; 31, wedge block; 32, return spring. Detailed implementation manners

[0026] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present application.

[0027] As shown in Figures 1-11As shown in the figure, a semiconductor chip cutting device proposed in an embodiment of the present application includes a frame 1, a transverse moving frame 2 and a vertical moving frame 3 that are both slidably arranged on the frame 1, and a longitudinal moving frame 4 that is slidably arranged on the transverse moving frame 2. The transverse moving frame 2, the vertical moving frame 3 and the longitudinal moving frame 4 slide along the X-axis, Z-axis and Y-axis respectively. A turntable 5 is rotatably arranged on the longitudinal moving frame 4. The turntable 5 is in a horizontal direction. A fixing member for fixing or releasing the fixation of the semiconductor chip is arranged on the turntable 5. A tool shaft 6 is rotatably arranged on the vertical moving frame 3. The tool shaft 6 is in a horizontal direction. A plurality of tool holders 7 are slidably arranged on the tool shaft 6. The tool holders 7 slide in the horizontal direction. In this embodiment, the number of tool holders 7 is an odd number, specifically five. A blade 8 is arranged on the tool holder 7. The blade 8 is in a vertical direction. The tool holder 7 located in the middle is the first seat, and the remaining plurality of tool holders 7 are all second seats. A driving member acting on the plurality of tool holders 7 is arranged on the vertical moving frame 3, and it is used to drive the plurality of second seats to slide synchronously and equidistantly. The equidistant sliding here means driving the plurality of second seats to slide synchronously until the plurality of tool holders 7 are equidistantly distributed;

[0028] In the initial state, the transverse moving frame 2, the vertical moving frame 3 and the longitudinal moving frame 4 are all in the initial positions. The plurality of tool holders 7 are sequentially in contact and lapped. The distance between adjacent two blades 8 is relatively small. When in use, the semiconductor chip to be cut is horizontally placed on the fixing member, and the semiconductor chip is fixed by the fixing member. The vertical moving frame 3 is driven to slide down to the limit position, the transverse moving frame 2 is driven to slide to the limit position, the tool shaft 6 is driven to rotate, driving the plurality of tool holders 7 and the plurality of blades 8 to rotate together. When the semiconductor chip passes through the plurality of rotating blades 8, the semiconductor chip is cut equidistantly by the plurality of rotating blades 8, thereby reducing the number of operations. While the operation is convenient, the cutting efficiency is also improved. Then the longitudinal moving frame 4 is driven to slide, and then the transverse moving frame 2 is driven to slide to the initial position to perform the second cutting on the semiconductor chip. The operation is repeated until the semiconductor chip is cut in the X-axis direction. Then the turntable 5 is driven to rotate by ninety degrees, and then the operation is repeated until the semiconductor chip is cut in the Y-axis direction, so that the semiconductor chip forms a plurality of relatively independent individuals. Finally, the semiconductor chip is released from the fixing by the fixing member, and the semiconductor chip can be taken away from the fixing member. The plurality of second seats can be driven to slide synchronously and equidistantly by the driving member, the plurality of tool holders 7 are equidistantly distributed, the adjacent two tool holders 7 are away from each other, and the distance between the adjacent two blades 8 is increased, thereby adjusting the cutting pitch and improving the use flexibility;

[0029] In summary, when the present application is in use, the semiconductor chip is cut equidistantly by the plurality of blades 8, thereby reducing the number of operations. While the operation is convenient, the cutting efficiency is also improved. At the same time, the cutting pitch can be adjusted to improve the use flexibility. Therefore, it is more practical.

[0030] As Figures 2-4As shown, in some embodiments, the fixing member includes a fixing ring 9 and a fixing tube 10 both disposed on the turntable 5. The fixing ring 9 and the fixing tube 10 are both fixed on the turntable 5. The fixing ring 9 is in a horizontal direction and coaxially distributed with the turntable 5. A cavity 11 and a plurality of annular cavities 12 are formed on the fixing ring 9. The annular cavities 12 and the cavity 11 are vertically spaced apart. The plurality of annular cavities 12 form a concentric circle structure. The annular cavities 12 and the cavity 11 are communicated through a plurality of through holes 13. The through holes 13 are in a vertical direction. One end of the fixing tube 10 is communicated with the cavity 11, and the other end is communicated with a vacuum pumping device (not shown in the accompanying drawings of the specification).

[0031] Referring to the above, during use, the semiconductor chip to be cut is horizontally placed on the fixing ring 9, and the vacuum pumping device is driven to work. The air in the annular cavity 12, the through hole 13, the cavity 11 and the fixing tube 10 is pumped out and forms a negative pressure state, so that the semiconductor chip is tightly adsorbed on the fixing tube 10 to fix the semiconductor chip. On the contrary, air is sent into the fixing tube 10 through the vacuum pumping device, and the air enters the cavity 11, the through hole 13 and the annular cavity 12, and the negative pressure state is released to release the fixing of the semiconductor chip.

[0032] As Figure 2 shown, in some embodiments, a plurality of arc-shaped plates 14 are slidably disposed on the turntable 5. The arc-shaped plates 14 are in a vertical direction and slide in a horizontal direction. The plurality of arc-shaped plates 14 are annularly arrayed around the axis of the turntable 5. A driving portion for acting on the plurality of arc-shaped plates 14 and driving them to slide synchronously is provided on the turntable 5. Here, the synchronous sliding refers to synchronously approaching or departing from the axis of the turntable 5.

[0033] Referring to the above, in the initial state, the plurality of arc-shaped plates 14 are all away from the axis of the turntable 5. When the semiconductor chip to be cut is horizontally placed on the fixing ring 9, the driving portion drives the plurality of arc-shaped plates 14 to synchronously approach the axis of the turntable 5 until the plurality of arc-shaped plates 14 all abut and overlap with the semiconductor chip to position the semiconductor chip and make the semiconductor chip and the turntable 5 coaxially distributed, so as to avoid deviation during subsequent cutting. On the contrary, when the semiconductor chip cutting is completed, the driving portion drives the plurality of arc-shaped plates 14 to synchronously depart from the axis of the turntable 5.

[0034] As Figure 4 shown, in some embodiments, the driving portion includes an annular plate 15 rotatably disposed on the turntable 5. The annular plate 15 is in a horizontal direction and coaxially distributed with the turntable 5. A convex block 16 is provided on the arc-shaped plate 14. The convex block 16 is in a vertical direction and fixed on the arc-shaped plate 14. A plurality of strip-shaped grooves 17 identical in number and corresponding one-to-one to the convex blocks 16 are formed on the annular plate 15. The strip-shaped grooves 17 have an initial point and a limit point distributed oppositely. The plurality of strip-shaped grooves 17 are annularly arrayed around the axis of the annular plate 15. The convex block 16 is slidably engaged with the strip-shaped groove 17.

[0035] Referring to the above, in the initial state, the bump 16 is located at the initial point of the strip groove 17, and the plurality of arc-shaped plates 14 are all away from the axis of the turntable 5. When in use, the ring plate 15 is driven to rotate forward, and the bump 16 slides from the initial point to the limit point, thereby driving the arc-shaped plate 14 to approach the axis of the turntable 5. On the contrary, when the ring plate 15 is driven to rotate in reverse, the bump 16 slides from the limit point to the initial point, thereby driving the arc-shaped plate 14 to move away from the axis of the turntable 5.

[0036] As Figures 1-8 As shown, in some embodiments, the driving member includes a moving frame 18 provided on the vertical moving frame 3. A plurality of driving blocks 19 which are the same in number as and correspond to the tool holders 7 one by one are slidably provided on the moving frame 18. The driving blocks 19 slide in the horizontal direction. A convex rod 20 and a limiting rod 21 are respectively provided on the opposite sides of the driving blocks 19. The convex rod 20 and the limiting rod 21 are both in the vertical direction and are respectively fixed on the top and bottom of the driving blocks 19. A driving rod 22 is rotatably provided on the moving frame 18. The driving rod 22 is in the horizontal direction. A plurality of annular grooves 23 which are the same in number as and correspond to the convex rods 20 one by one are formed in the driving rod 22. The convex rod 20 is slidably engaged with the annular groove 23. The plurality of annular grooves 23 are inclined from the middle to both sides and the inclination angle gradually increases. A limiting groove 24 is formed in the tool holder 7. The structure of the limiting groove 24 is annular. The free end of the limiting rod 21 is located in the limiting groove 24;

[0037] Referring to the above, in the initial state, the plurality of tool holders 7 are sequentially abutted and lapped, and the distance between adjacent two blades 8 is small. The plurality of driving blocks 19 are sequentially abutted and lapped, and the distance between adjacent two convex rods 20 is small. When in use, the driving rod 22 is driven to rotate forward, and the plurality of convex rods 20 slide in their respective corresponding annular grooves 23, and the distance between adjacent two convex rods 20 increases, and the distance between adjacent two driving blocks 19 increases. The limiting rod 21 is driven to move together by the sliding of the driving block 19. Through the cooperation of the limiting rod 21 and the limiting groove 24, the second seat is driven to slide, so as to drive the plurality of second seats to slide synchronously until the plurality of tool holders 7 are equidistantly distributed. On the contrary, when the driving rod 22 is driven to rotate in reverse, the plurality of convex rods 20 slide in their respective corresponding annular grooves 23, and the distance between adjacent two convex rods 20 decreases, and adjacent two driving blocks 19 are abutted and lapped. The limiting rod 21 is driven to move together by the sliding of the driving block 19. Through the cooperation of the limiting rod 21 and the limiting groove 24, the second seat is driven to slide, so as to drive the plurality of second seats to slide synchronously until the plurality of tool holders 7 are sequentially abutted and lapped.

[0038] As Figures 1-11 As shown, in some embodiments, the moving frame 18 is slidably provided on the vertical moving frame 3. The moving frame 18 slides in the vertical direction. A groove 25 is formed in the tool holder 7. The groove 25 is formed along the axial direction of the tool holder 7. A convex strip 26 which is in plug-in fit with the groove 25 is provided on the tool shaft 6. The convex strip 26 is in the horizontal direction and is fixed on the outer surface of the tool shaft 6;

[0039] Referring to the above, during use, the moving frame 18 is in the initial position and close to the tool shaft 6. The free end of the limiting rod 21 is located in the limiting groove 24. A plurality of tool holders 7 are all located on the tool shaft 6. The convex strip 26 and the groove 25 are inserted and matched. When the tool shaft 6 rotates, through the cooperation of the convex strip 26 and the groove 25, the tool holder 7 is driven to rotate together. As time goes by, the degree of wear of the blade 8 will also increase. Therefore, it is necessary to disassemble the tool holder 7 and replace the blade 8. The specific operation is as follows: Drive the moving frame 18 to slide to the extreme position and away from the tool shaft 6. The free end of the limiting rod 21 exits the limiting groove 24, so that the tool holder 7 slides off the tool shaft 6, and the convex strip 26 exits the groove 25, then the disassembly of the tool holder 7 can be realized. After that, install the tool holder 7 with a new blade 8, make the convex strip 26 correspond to and be inserted into the groove 25, and make the tool holder 7 completely located on the tool shaft 6. When a plurality of tool holders 7 are all installed, drive the moving frame 18 to slide to the initial position, and the free ends of the plurality of limiting rods 21 are respectively located in the plurality of limiting grooves 24.

[0040] As Figure 9 shown, in some embodiments, a communicating receiving cavity 27 and a sliding groove 28 are formed on the tool shaft 6. The receiving cavity 27 and the sliding groove 28 are both formed along the length direction of the tool shaft 6. A forward and reverse lead screw 29 is rotatably arranged in the receiving cavity 27. The forward and reverse lead screw 29 is in the horizontal direction. Two moving blocks 30 are slidably arranged in the receiving cavity 27. The moving blocks 30 slide in the horizontal direction. The two moving blocks 30 are respectively in threaded cooperation with the forward and reverse threaded sections of the forward and reverse lead screw 29. An elastic member that is slidably engaged with the sliding groove 28 is arranged on the moving block 30. The sliding direction of the elastic member is perpendicular to the sliding direction of the moving block 30. The two elastic members respectively abut and overlap with the first and last second seats;

[0041] Referring to the above, during use, the two moving blocks 30 move away from each other, and the elastic members are completely retracted into the receiving cavity 27. The elastic members are in the initial position and in a compressed state. When a plurality of tool holders 7 are all installed, drive the forward and reverse lead screw 29 to rotate forward. The two moving blocks 30 respectively slide synchronously and reversely towards each other due to the forward and reverse thread action. The elastic members return to the natural state and slide to the extreme position. The elastic members are slidably engaged with the sliding groove 28. The two elastic members respectively abut and overlap with the first and last second seats, thereby driving a plurality of tool holders 7 to abut and overlap in sequence and be located at the central position of the tool shaft 6, so as to facilitate driving the moving frame 18 to slide to the initial position later. The free ends of the plurality of limiting rods 21 are respectively located in the plurality of limiting grooves 24, which is more convenient to use. After that, drive the forward and reverse lead screw 29 to rotate reversely. The two moving blocks 30 respectively slide synchronously and reversely away from each other due to the forward and reverse thread action. The elastic members are completely retracted into the receiving cavity 27. The elastic members slide to the initial position and are in a compressed state.

[0042] As Figure 9As shown, in some embodiments, the elastic member includes a wedge block 31 slidably disposed on the moving block 30. The sliding direction of the wedge block 31 is perpendicular to the sliding direction of the moving block 30. The wedge block 31 is slidably engaged with the chute 28 and is in contact and overlap with the second seat. A return spring 32 is disposed between the wedge block 31 and the moving block 30. Two ends of the return spring 32 are fixedly connected to the wedge block 31 and the moving block 30 respectively;

[0043] Referring to the above, in use, the wedge block 31 and the return spring 32 are both retracted into the receiving cavity 27. The wedge block 31 is in the initial position and the return spring 32 is compressed. When the positive and negative lead screw 29 rotates forward, the wedge block 31 slides to the limit position and is slidably engaged with the chute 28, and the return spring 32 returns to the natural state. The two wedge blocks 31 are respectively in contact and overlap with the first and last second seats. On the contrary, when the positive and negative lead screw 29 rotates reversely, through the transitional action of the inclined plane, the wedge block 31 is forced to slide to the initial position, the return spring 32 is compressed, and the wedge block 31 and the return spring 32 are both retracted into the receiving cavity 27.

[0044] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A semiconductor chip cutting device, comprising a frame (1), a transverse moving frame (2) and a vertical moving frame (3) which are both slidably arranged on the frame (1), and a longitudinal moving frame (4) slidably arranged on the transverse moving frame (2). The transverse moving frame (2), the vertical moving frame (3) and the longitudinal moving frame (4) slide along the X-axis, Z-axis and Y-axis respectively, and is characterized in that, A turntable (5) is rotatably arranged on the longitudinal moving frame (4), and a fixing member for fixing or releasing the fixing of the semiconductor chip is arranged on the turntable (5). A tool shaft (6) is rotatably arranged on the vertical moving frame (3), and a plurality of tool holders (7) are slidably arranged on the tool shaft (6). A blade (8) is arranged on the tool holder (7). The tool holder (7) located in the middle is the first seat, and the remaining plurality of tool holders (7) are all second seats. A driving member acting on the plurality of tool holders (7) is arranged on the vertical moving frame (3), and it is used to drive the plurality of second seats to slide synchronously and equidistantly.

2. The semiconductor chip cutting device according to claim 1, characterized in that, The fixing member includes a fixing ring (9) and a fixing tube (10) both arranged on the turntable (5). A cavity (11) and a plurality of annular cavities (12) are formed in the fixing ring (9). The annular cavities (12) are communicated with the cavity (11) through a plurality of through holes (13). One end of the fixing tube (10) is communicated with the cavity (11), and the other end is communicated with a vacuum pumping device.

3. The semiconductor chip cutting device according to claim 1, characterized in that, A plurality of arc-shaped plates (14) are slidably arranged on the turntable (5), and a driving part acting on the plurality of arc-shaped plates (14) and driving them to slide synchronously is arranged on the turntable (5).

4. The semiconductor chip cutting device according to claim 3, characterized in that, The driving part includes an annular plate (15) rotatably arranged on the turntable (5). A convex block (16) is arranged on the arc-shaped plate (14). A plurality of strip-shaped grooves (17) identical in number and corresponding one by one to the convex blocks (16) are formed in the annular plate (15). The convex block (16) is slidably matched with the strip-shaped groove (17).

5. The semiconductor chip cutting device according to claim 1, wherein The driving member includes a moving frame (18) arranged on the vertical moving frame (3). A plurality of driving blocks (19) identical in number and corresponding one by one to the tool holders (7) are slidably arranged on the moving frame (18). A convex rod (20) and a limiting rod (21) are respectively arranged on the opposite sides of the driving block (19). A driving rod (22) is rotatably arranged on the moving frame (18). A plurality of annular grooves (23) identical in number and corresponding one by one to the convex rods (20) are formed in the driving rod (22). The convex rod (20) is slidably matched with the annular groove (23). The plurality of annular grooves (23) are inclinedly distributed from the middle to both sides, and the inclination angle gradually increases. A limiting groove (24) is formed in the tool holder (7), and the free end of the limiting rod (21) is located in the limiting groove (24).

6. The semiconductor chip cutting device according to claim 5, wherein, The moving frame (18) is slidably arranged on the vertical moving frame (3). A groove (25) is formed in the tool holder (7), and a convex strip (26) inserted and matched with the groove (25) is arranged on the tool shaft (6).

7. The semiconductor chip cutting device according to claim 5, wherein A communicated accommodating cavity (27) and a sliding groove (28) are formed in the tool shaft (6). A forward and reverse lead screw (29) is rotatably arranged in the accommodating cavity (27). Two moving blocks (30) are slidably arranged in the accommodating cavity (27). The two moving blocks (30) are respectively in threaded cooperation with the forward and reverse threaded sections of the forward and reverse lead screw (29). Elastic members slidably matched with the sliding groove (28) are arranged on the moving blocks (30). The two elastic members respectively abut and overlap with the first and last second seats.

8. The semiconductor chip cutting device according to claim 7, wherein, The elastic member includes a wedge block (31) slidably disposed on the moving block (30). The wedge block (31) is slidably engaged with the chute (28) and abuts and overlaps with the second seat. A return spring (32) is disposed between the wedge block (31) and the moving block (30).

Images