Variable mask device and laser mass transfer mechanism
The light-transmitting area of the mask plate is adjusted by the variable mask device, which solves the problem that the fixed mask plate cannot fully cover the wafer, and realizes efficient use of the wafer, which is suitable for a variety of wafer patterns, and improves processing efficiency.
Patent Information
- Application Number
- CN202421785016.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-25
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-07-25
AI Technical Summary
In the prior art, the fixed mask plate cannot completely cover the wafer, resulting in waste of wafer chips, and replacing the mask plate increases the processing process, affecting efficiency.
The variable mask device is adopted to adjust the light transmittance area of the mask plate through the cooperation of the light blocking plate and the driving module to achieve effective utilization of the wafer and avoid replacing the mask plate of different sizes.
It improves the utilization rate and processing efficiency of wafers, and is suitable for various types of wafer patterns. It has a simple structure and has good application prospects.
Smart Images
Figure CN223155374U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical fields of laser processing and optical mask, and particularly relates to a variable mask device and a laser mass transfer mechanism. Background Technique
[0002] With the continuous development of technology, display has become one of the main channels for information transmission. The development of the display industry has been continuously expanding. Among them, Micro LED (micro light-emitting diode), as one of the most cutting-edge display technologies in the world today, has developed rapidly in terms of technology and industrialization promotion.
[0003] Micro LED generally refers to an LED array with a single size less than 50μm, which is an electroluminescent device that converts electrical energy into light energy. The Micro LED mass transfer technology mainly refers to the technology of quickly and accurately transferring the Micro LED array grown on the epitaxial substrate to the driving circuit substrate and forming good electrical connection and mechanical fixation with the driving circuit.
[0004] In the laser transfer technology, a mask plate matching the Micro LED chip is generally required for laser mass transfer. At present, the mask plate used in the mass transfer technology is a fixed mask plate. Due to the circular structure of the wafer and the existence of alignment marks on the wafer, the fixed mask plate cannot completely cover the wafer, resulting in the chips on the wafer not being fully utilized and wasting the wafer chips. Replacing with other mask plates will increase the processing process and affect the processing efficiency. Summary of the Utility Model
[0005] In view of one or more of the above defects or improvement requirements of the prior art, the utility model provides a variable mask device and a laser mass transfer mechanism, which can effectively improve the utilization rate of the wafer and the product applicability of the device.
[0006] To achieve the above object, in one aspect of the utility model, a variable mask device is provided, which includes a mask plate, a plurality of light blocking sheets arranged before or after the mask plate, and a driving module connected to the light blocking sheets. The plurality of light blocking sheets are separately arranged, and the light blocking sheets are used to block the laser from passing through;
[0007] Wherein, the mask plate includes a plurality of separately arranged laser transmission areas distributed in an array, and the areas on the mask plate other than the laser transmission areas are non-laser transmission areas;
[0008] The driving module is used to drive the plurality of light blocking sheets to move at least in the horizontal plane to block part of the area of the mask plate.
[0009] As a further improvement of the present utility model, the size of the laser transmission area is 50um×50um to 1mm×1mm.
[0010] As a further improvement of the present utility model, the mask plate includes a glass substrate and a light-blocking layer provided on the glass substrate to block the passage of laser light. A plurality of micro-channels penetrating the light-blocking layer are arranged in an array on the light-blocking layer. The micro-channels constitute the laser light transmission area, and the area outside the micro-channels on the light-blocking layer constitutes the non-laser transmission area.
[0011] As a further improvement of the present utility model, a plurality of the light-blocking sheets are arranged around the mask plate, and the driving module can drive the plurality of light-blocking sheets to move to block the outer ring area of the mask plate, so as to form a light-passing area in the middle of the mask plate.
[0012] As a further improvement of the present utility model, two light-blocking sheets are provided. The two light-blocking sheets are respectively in a right-angled L shape, are arranged in upper and lower layers, and the right angles of the two right-angled L-shaped light-blocking sheets are arranged opposite to each other.
[0013] As a further improvement of the present utility model, the lengths of the inner sides of the two L-shaped light-blocking sheets are respectively greater than the lengths of the four sides of the mask plate.
[0014] As a further improvement of the present utility model, four light-blocking sheets are provided, including two first light-blocking sheets arranged in parallel at intervals and two second light-blocking sheets arranged in parallel at intervals, and the first light-blocking sheet and the second light-blocking sheet are perpendicular to each other.
[0015] As a further improvement of the present utility model, the driving module includes a plurality of driving modules. Each light-blocking sheet corresponds to one driving module, and the driving module includes a lateral movement unit and / or a longitudinal movement unit.
[0016] As a further improvement of the present utility model, the driving module further includes a rotation driving unit, and the rotation driving unit is connected to the lateral movement unit or the longitudinal movement unit to drive the light-blocking sheet to rotate.
[0017] As a further improvement of the present utility model, the material of the light-blocking sheet is ceramic or metal material.
[0018] In another aspect of the present utility model, a laser mass transfer mechanism is provided, including a laser for emitting a laser beam, and the variable mask device, the wafer fixing device, and the substrate carrying device arranged in sequence along the laser beam emission direction.
[0019] As a further improvement of the present utility model, it further includes a wafer moving mechanism connected to the wafer fixing device and a substrate moving mechanism connected to the substrate carrying device. The wafer moving mechanism and the substrate moving mechanism are respectively at least used to drive the wafer and the substrate to move on a horizontal plane.
[0020] As long as the above-mentioned improved technical features do not conflict with each other, they can be combined with each other.
[0021] Generally speaking, compared with the prior art, the beneficial effects of the above technical solutions conceived by the present utility model include:
[0022] (1) For the variable mask device of the present utility model, by providing a light blocking plate for blocking the passage of laser light and connecting the light blocking plate to a driving module, when it is necessary to change the light transmission area and shape of the mask plate, the light blocking plate is moved to block part of the mask plate area, and the light transmission area of the mask plate is adjusted, thereby solving the problem that the fixed mask plate cannot effectively utilize the wafer. The present utility model does not need to replace mask plates of different sizes, improving work efficiency. Moreover, the variable mask device has strong applicability and can be used for wafers of various different types of patterns.
[0023] (2) For the laser mass transfer mechanism of the present utility model, it has a simple structure and reasonable design, and can effectively solve the problem that the fixed mask plate cannot effectively utilize the wafer. The present utility model does not need to replace masks of different sizes, improving work efficiency, and has good application prospects and promotion value. Description of the Drawings
[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model, the following will briefly introduce the drawings required to be used in the embodiments. Obviously, the drawings in the following description are only some embodiments of the present utility model. For those skilled in the art, without creative efforts, other drawings can also be obtained based on these drawings.
[0025] Figure 1 It is the overall structural schematic diagram of the variable mask plate device in the embodiment of the present utility model;
[0026] Figure 2 It is the structural schematic diagram of the light blocking plate blocking the mask plate in the embodiment of the present utility model;
[0027] Figure 3 It is the structural schematic diagram of dividing the area of the wafer in the embodiment of the present utility model;
[0028] In all the drawings, the same reference numerals denote the same technical features, specifically: 1. Mask; 101. Laser transmission area; 102. Non-laser transmission area; 2. Light-blocking plate; 3. Lateral movement unit; 4. Longitudinal movement unit; 5. Rotation drive unit; 6. Wafer; 7. Identification point; 8. Conventional mask coverage area; 9. Variable mask processing area; 10. Light-passing area; 11. Blocking area. Detailed implementation manners
[0029] In order to make the objectives, technical solutions and advantages of the present utility model clearer and more understandable, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present utility model and are not used to limit the present utility model. In addition, the technical features involved in the various implementation manners of the present utility model described below can be combined with each other as long as they do not conflict with each other.
[0030] In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present utility model.
[0031] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present utility model, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically and clearly defined.
[0032] In the present utility model, unless otherwise clearly specified and defined, the terms "mounted", "connected", "connected to", "fixed", etc. should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and may be the internal communication of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.
[0033] In the present utility model, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may be that the first feature is directly above or obliquely above the second feature, or merely indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature being "under", "beneath" and "underneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the horizontal height of the first feature is less than that of the second feature.
[0034] Embodiment:
[0035] Please refer to Figures 1 to 3 , in the variable mask device of the preferred embodiment of the present utility model, it includes a mask plate 1, a plurality of light blocking plates 2 arranged before or after the mask plate 1, and a driving module connected to the light blocking plates 2; wherein, the plurality of light blocking plates 2 are separately arranged, used to block the laser from passing through, and drive the plurality of light blocking plates 2 to move at least in the horizontal plane through the driving module, so as to block part of the area of the mask plate 1, adjust the light passing area 10 of the mask plate 1, and then the variable mask processing area 9 of the wafer 6 can be processed by using the mask plate 1, so as to effectively utilize the wafer 6 and improve work efficiency.
[0036] Specifically, as shown in Figure 1 , the mask plate 1 includes a plurality of separately arranged laser passing areas 101 distributed in an array, and a non-laser passing area 102 in the area of the mask plate 1 other than the laser passing area 101. During actual operation, the laser beam can pass through the laser passing area 101 to process the wafer 6, so as to transfer the chips on the wafer 6 to the substrate below.
[0037] Preferably, the size of the laser passing area 101 is 50um×50um to 1mm×1mm, and it is specifically selected according to actual production requirements.
[0038] More specifically, as one of the embodiments, the mask plate 1 includes a glass substrate and a light blocking layer provided on the glass substrate to block the laser from passing through, and a plurality of micro-channels penetrating the light blocking layer are arranged in an array on the light blocking layer. The micro-channels are used for the laser beam to pass through, and the micro-channels constitute the above-mentioned laser passing area 101; correspondingly, the area outside the micro-channels on the light blocking layer constitutes the non-laser passing area 102.
[0039] Furthermore, as shown in Figure 1 and Figure 2 , the light blocking plate 2 has the characteristics of light impermeability, low reflectivity, heat resistance, etc., so as to block part of the area of the mask plate 1 to form a blocking area 11, and form a light passing area 10 in the unblocked area of the mask plate 1, and then process the variable mask processing area 10 of the wafer 6 through the formed light passing area 10.
[0040] Preferably, the light shielding sheet 2 is made of ceramic or metal material.
[0041] Furthermore, a plurality of light shielding sheets 2 are arranged around the mask plate 1 to shield the outer peripheral area of the mask plate 1 and form a light passing area 10 in the middle of the mask plate 1. At the same time, the light shielding sheet 2 is connected to the driving module, and the driving module drives the plurality of light shielding sheets 2 to move at least in the horizontal plane, so as to shield a part of the mask plate 1 through the light shielding sheet 2, and when needed, drive the movement of the light shielding sheet 2 through the driving module to change the area size and shape of the light passing area 10.
[0042] As Figure 3 shown, the wafer 6 includes a plurality of conventional mask covering areas 8 and variable mask processing areas 9. Among them, the conventional mask covering areas 8 can be processed by passing a laser beam through the laser passing area 101 on the mask plate 1. This conventional mask covering area 8 is an area that does not require the light shielding sheet 2 to shield the mask plate 1 and can be directly processed by the size of the mask plate 1 itself. In addition, after processing each area, the conventional mask covering areas 8 can be processed one by one by moving the wafer 6 and the substrate.
[0043] As Figure 3 shown, generally a plurality of identification points 7 are also arranged on the wafer 6, Figure 3 only two are schematically shown in, and the actual setting is not limited to two. The plurality of identification points 7 are used for the positioning of the wafer 6, and when processing the wafer 6, the identification points 7 need to be avoided.
[0044] Among them, the variable mask processing area 9 is an area on the wafer 6 that needs to be processed through the cooperation of the mask plate 1 and the light shielding sheet 2. According to the size of the variable mask processing area 9, the variable mask processing area 9 can also be processed in multiple times. As Figure 3 shown in an example of a pattern of the variable mask processing area 9, the position of the light shielding sheet 2 can be moved twice, that is, the mask plate 1 and the light shielding sheet 2 are cooperatively processed twice. Of course, the pattern of the variable mask processing area 9 can be diversified, and the number of times of processing required and the position of the light shielding sheet movement during each processing can be selected according to different patterns.
[0045] In a specific embodiment of the present invention, as Figure 1 and Figure 2 shown, two light shielding sheets 2 are provided, and each light shielding sheet 2 is set as a right-angled L shape and arranged in upper and lower layers, and the right angles of the two right-angled L-shaped light shielding sheets 2 are arranged opposite to each other, so as to form a rectangular light passing area 10 with adjustable size in the middle of the mask plate 1 by using the right-angled sides of the L-shaped light shielding sheets 2. Furthermore, each driving module includes a lateral movement unit 3 and a longitudinal movement unit 4, so that both L-shaped light shielding sheets 2 can move horizontally and vertically.
[0046] Preferably, the lengths of the inner sides of the two L-shaped light-shielding plates 2 are respectively the same as the lengths of the four sides of the mask plate 1, so that the light-shielding plates 2 can better form the light-passing areas 10 of various patterns.
[0047] In another specific embodiment of the present invention, four light-shielding plates are provided, and the four light-shielding plates enclose a rectangle, including two first light-shielding plates and two second light-shielding plates; wherein, the two first light-shielding plates are arranged in parallel at intervals, and the two second light-shielding plates are also arranged in parallel at intervals. At the same time, the first light-shielding plates and the second light-shielding plates are arranged perpendicular to each other to enclose a rectangular light-passing area 10 in the middle, and by moving the four light-shielding plates in the corresponding directions, the position and size of the enclosed square are changed.
[0048] Preferably, the driving module includes a plurality of driving modules, and the number of the driving modules matches the number of the light-shielding plates 2, and each light-shielding plate 2 corresponds to a driving module. Specifically, the driving module includes a lateral moving unit 3 and / or a longitudinal moving unit 4 to drive the light-shielding plate 2 to move laterally and / or longitudinally through the lateral moving unit 3 and / or the longitudinal moving unit 4. That is, each driving module can be provided with only the lateral moving unit 3 or the longitudinal moving unit 4, so that all the light-shielding plates 2 move laterally / longitudinally, or some of the light-shielding plates 2 move laterally and some of the light-shielding plates 2 move longitudinally; of course, it can also be that both the lateral moving unit 3 and the longitudinal moving unit 4 are provided in each driving module, so that each light-shielding plate 2 can move laterally and longitudinally at the same time.
[0049] Preferably, the lateral moving unit 3 and / or the longitudinal moving unit 4 in the embodiment of the present invention are both electric sliding tables. Specifically, the driving execution parts in the lateral moving unit 3 and the longitudinal moving unit 4 can be motors or cylinders, and the lateral moving unit 3 and the longitudinal moving unit 4 can be conventional structures in the prior art, which will not be elaborated here.
[0050] Preferably, the driving module further includes a rotary driving unit 5, which is connected to the light-shielding plate 2 to drive the light-shielding plate 2 to rotate through the rotary driving unit 5. The rotary driving unit 5 is connected to the lateral moving unit 3 or the longitudinal moving unit 4, so that in actual application, the angle of the light-shielding plate 2 is adjusted by rotating the light-shielding plate 2, so that the straight-edge direction of the light-shielding plate 2 is consistent with the arrangement direction of the structure of the mask plate 1.
[0051] Further, the present utility model also provides a laser mass transfer mechanism, which specifically includes a laser for emitting a laser beam, and the above-mentioned variable mask device, wafer fixing device, and substrate carrying device sequentially arranged along the laser beam emission direction. Before transferring and processing the wafer 6 with chips, the wafer 6 is placed on the wafer fixing device, and the substrate is placed on the substrate carrying device. During processing, the laser beam is optically shaped, and the shaped laser beam passes through the laser transmission area 101 on the mask plate 1 to form a light spot. The light spot processes the wafer 6 with chips through an objective lens, and the transferred chips are received by the substrate below to complete the laser mass transfer of the chips.
[0052] Further, the laser mass transfer mechanism further includes a wafer moving mechanism connected to the wafer fixing device and a substrate moving mechanism connected to the substrate carrying device. The wafer moving mechanism and the substrate moving mechanism are respectively at least used to drive the wafer and the substrate to move on a horizontal plane. By setting the wafer moving mechanism and the substrate moving mechanism, when a certain area on the wafer needs to be laser-transferred and a certain position on the substrate receives the chips on the wafer, the wafer and the substrate can be horizontally moved to the required positions. At the same time, the wafer moving mechanism and the substrate moving mechanism can also accurately position the wafer and the substrate.
[0053] Further, after the processing of the area to be processed corresponding to one mask plate 1 is completed, the wafer fixing device can be moved by the wafer moving mechanism, and the substrate carrying device can be moved by the substrate moving mechanism to switch to the next area to be processed.
[0054] Further, the usage method of the present utility model for transferring chips by using the above-mentioned variable mask device is as follows:
[0055] (1) Calculate the positions to be transferred and processed according to the patterns of the chip wafer 6 to be transferred and the patterns of the chips pre-received on the substrate. It should be noted that generally, the patterns of the chips on the wafer 6 to be transferred are different from the patterns formed on the substrate after receiving the chips on the wafer, and it is determined according to actual needs.
[0056] As Figure 3 shown, according to the size of the wafer 6 and the specifications of the mask plate 1, the area on the wafer 6 that needs to be laser-transferred is divided into a conventional mask coverage area 8 and a variable mask processing area 9.
[0057] (2) Use the mask plate 1 and move the wafer 6 to transfer and process the conventional mask coverage area 8 of the wafer 6;
[0058] (3) Move the light-shielding plate 2 according to the size of the variable mask processing area 9 to change the light-passing area 10 of the mask plate 1, and transfer and process the variable mask processing area 9 of the wafer 6.
[0059] The driving module is controlled by the control software to drive the light-shielding plate 2 to move, adjust the light-passing area 10 of the mask plate 1, change the spot size and position passing through the mask plate 1, and complete the transfer processing of all chips on the wafer 6.
[0060] The variable mask device and the laser mass transfer mechanism in the present utility model have simple structures and reasonable designs, can effectively solve the problem that the fixed mask plate cannot effectively utilize the wafer, do not need to replace masks of different sizes, improve work efficiency, have strong product applicability, and have good application prospects and promotion values.
[0061] Those skilled in the art can easily understand that the above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.
Claims
1. A variable mask device, characterized in that, It includes a photomask, a plurality of light-blocking plates disposed before or after the photomask, and a driving module connected to the light-blocking plates. The plurality of light-blocking plates are separately disposed, and the light-blocking plates are used to block the passage of laser light; Among them, the photomask includes a plurality of separately disposed laser-transmitting regions arranged in an array, and the regions on the photomask other than the laser-transmitting regions are non-laser-transmitting regions; The driving module is used to drive the plurality of light-blocking plates to move at least in the horizontal plane to block a partial region of the photomask.
2. The variable mask device according to claim 1, wherein The size of the laser-transmitting region is 50um×50um to 1mm×1mm.
3. The variable mask device according to claim 1, characterized in that, The photomask includes a glass substrate and a light-blocking layer disposed on the glass substrate to block the passage of laser light. A plurality of micro-channels penetrating the light-blocking layer are arranged in an array on the light-blocking layer, and the micro-channels constitute the laser-transmitting regions, and the regions on the light-blocking layer other than the micro-channels constitute the non-laser-transmitting regions.
4. The variable mask device according to claim 1, characterized in that, The plurality of light-blocking plates surround the photomask, and the driving module can drive the plurality of light-blocking plates to move to block the outer ring region of the photomask to form a light-passing region in the middle of the photomask.
5. The variable mask device according to claim 1, characterized in that, The light-blocking plates are provided as two, and the two light-blocking plates are respectively right-angled L-shaped, and are arranged in upper and lower layers, and the right angles of the two right-angled L-shaped light-blocking plates are oppositely arranged.
6. The variable mask device according to claim 5, characterized in that, The lengths of the inner sides of the two L-shaped light-blocking plates are respectively greater than the lengths of the four sides of the photomask.
7. The variable mask device according to claim 1, characterized in that, The light-blocking plates are provided as four, including two first light-blocking plates arranged in parallel at intervals and two second light-blocking plates arranged in parallel at intervals, and the first light-blocking plates and the second light-blocking plates are perpendicular to each other.
8. The variable mask device according to claim 1, characterized in that, The driving module includes a plurality of driving modules, each light-blocking plate corresponds to one driving module, and the driving module includes a lateral moving unit and / or a longitudinal moving unit.
9. The variable mask device according to claim 8, wherein The driving module further includes a rotation driving unit, and the rotation driving unit is connected to the lateral moving unit or the longitudinal moving unit to drive the light-blocking plate to rotate.
10. The variable mask device according to claim 1, characterized in that, The material of the light-blocking plate is ceramic or metal.
11. A laser mass transfer mechanism, characterized in that, It includes a laser for emitting a laser beam, and a variable mask device, a wafer fixing device, and a substrate carrying device according to any one of claims 1 to 10 are sequentially arranged along the laser beam emission direction.
12. The laser mass transfer mechanism according to claim 11, wherein, It further includes a wafer moving mechanism connected to the wafer fixing device and a substrate moving mechanism connected to the substrate carrying device. The wafer moving mechanism and the substrate moving mechanism are respectively at least used to drive the wafer and the substrate to move in the horizontal plane.