Spot test equipment
By introducing the design of the switch station of the turntable drive slide station in the sampling test equipment, combined with the loading, testing and recycling mechanism, the problems of low efficiency and large space of existing equipment are solved, and efficient testing of semiconductor chips and reducing the equipment volume is achieved.
Patent Information
- Application Number
- CN202422266994.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-14
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2034-09-14
AI Technical Summary
The existing sampling equipment is inefficient in working efficiency and takes up a large space, so it is impossible to carry out the loading, testing and recycling of semiconductor chips at the same time.
A retrieval test equipment is designed, using a rotary table to drive the slide table to switch between the loading station, the test station and the discharge station. Combined with the loading, testing and recycling mechanism, it realizes the simultaneous loading, testing and recycling process of semiconductor chips, and reduces the space occupied by shortening the distance between each mechanism.
It improves the working efficiency of the sampling test equipment, reduces the equipment's space, and improves the scope of application and testing accuracy of the equipment.
Smart Images
Figure CN223155980U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor chip testing, in particular to a sampling testing device. Background Art
[0002] A semiconductor refers to a material whose electrical conductivity at room temperature is between that of a conductor and an insulator. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, a diode is a device made of a semiconductor. In the production process of semiconductor chips, it is necessary to test semiconductor chips. Currently, sampling testing devices are mainly used to test semiconductor chips. However, most of the existing sampling testing devices are single-station, which have the problems of low working efficiency and large occupied space.
[0003] Therefore, it is necessary to provide a new sampling testing device to solve the above technical problems. Summary of the Utility Model
[0004] The main purpose of the utility model is to provide a sampling testing device, aiming to solve the technical problems of low working efficiency and large occupied space of the existing sampling testing devices.
[0005] To achieve the above purpose, a sampling testing device proposed by the utility model includes:
[0006] A base, on which a turntable is arranged, and a loading station, a testing station and an unloading station are arranged around the circumferential direction of the turntable;
[0007] A plurality of wafer carriers, each of which is correspondingly arranged at the loading station, the testing station and the unloading station, and each wafer carrier can be switched from the loading station to the unloading station through the testing station;
[0008] A loading mechanism, which is arranged on one side of the loading station and is used to convey the workpiece to be tested to the wafer carrier located at the loading station;
[0009] A testing mechanism, which is arranged on one side of the testing station and is used to test the testing station;
[0010] A recycling mechanism, which is arranged on one side of the unloading station and is used to recycle the workpiece after being tested by the testing mechanism.
[0011] In an embodiment, the loading mechanism includes a transfer arm and a scanning camera for obtaining the position information of the workpiece to be tested. The scanning camera is arranged on the base and directly above the loading station, the transfer arm is rotatably arranged on the base around a first direction of the base, and an adsorption block is arranged on the transfer arm.
[0012] In one embodiment, the sampling and testing device further includes a lifting mechanism disposed below the blanking station. The lifting mechanism includes a mounting plate disposed on the base, a driving body disposed on the mounting plate, and a lifting block slidably disposed on the mounting plate. The wafer stage is provided with a bearing block that slides along the second direction of the base. The driving body drives the lifting block to slide through a cam, and further drives the bearing block to slide along the second direction of the base.
[0013] In one embodiment, the testing mechanism includes a bottom plate, a first sliding component, a second sliding component, a third sliding component, and a probe component. The first sliding component includes a first driving member and a first sliding table slidably disposed on the bottom plate. The first driving member drives the first sliding table to slide along the third direction of the base through a lead screw. The second sliding component includes a second driving member and a second sliding table slidably disposed on the first sliding table. The second driving member drives the second sliding table to slide along the first direction of the base through a lead screw. The third sliding component includes a third driving member and a probe holder slidably disposed on the second sliding table. The third driving member drives the probe holder to slide along the second direction of the base through a cam. The probe component includes a plurality of probe units, and each of the probe units is disposed on the probe holder.
[0014] In one embodiment, the testing mechanism further includes an integrating sphere camera and an observation camera. The integrating sphere camera is disposed directly above the testing station and is used for testing the optoelectronic parameters of the workpiece to be tested. The observation camera is slidably disposed on the base, and the observation camera can slide to directly above the testing station to obtain the position information of the workpiece to be tested and the probe units. Moreover, the first driving member, the second driving member, and the third driving member are all electrically connected to the observation camera.
[0015] In one embodiment, the probe component further includes an adjustment seat corresponding to each of the probe units one by one. Each of the probe units is movably disposed on the probe holder through the corresponding adjustment seat.
[0016] In one embodiment, the probe holder is provided with an abutting member. The abutting member includes a mounting block disposed on the probe holder and a roller rotatably disposed on the mounting block. The outer circumferential surface of the cam abuts against the outer circumferential surface of the roller.
[0017] In one embodiment, the third sliding component further includes a pressing member. The pressing member includes a mounting seat, a pressing block rotatably disposed on the mounting seat, and an elastic member connecting the mounting seat and the pressing block. The elastic member can drive the pressing block to rotate, and further drive the probe holder to slide along the second direction of the base, so that the cam abuts against the roller.
[0018] In one embodiment, the recycling mechanism includes a cartridge and a blowing block. The blowing block is provided with a blowing port, and the blowing block is arranged on the base with the blowing port facing the blanking station. The cartridge is arranged on the side of the blanking station away from the blowing block.
[0019] In one embodiment, the number of the wafer stages is eight, and the eight wafer stages are evenly arranged at intervals in the circumferential direction around the turntable. The turntable is further provided with a positioning station located between the loading station and the testing station. Each wafer stage can be sequentially switched from the loading station through the positioning station and the testing station to the blanking station, and a positioning camera electrically connected to the testing mechanism is arranged directly above the positioning station.
[0020] The technical solution of the present utility model drives the wafer stage to switch between the loading station, the testing station and the blanking station through the turntable, which can enable the loading process, the testing process and the recycling process of the semiconductor chip to be carried out simultaneously, thereby improving the working efficiency of the sampling and testing equipment. And by driving the wafer stage to switch stations through the turntable, the distance between each mechanism can be reduced, thereby reducing the occupied space of the sampling and testing equipment. In this embodiment, the loading mechanism is used to convey the workpiece to be tested to the wafer stage located at the loading station, the testing mechanism is used to test the workpiece to be tested, and the recycling mechanism is used to recycle the workpiece tested by the testing mechanism. The turntable is used to carry the wafer stage and is used to drive each wafer stage to switch from the loading station through the testing station to the blanking station. Each wafer stage is correspondingly arranged at the loading station, the testing station and the blanking station. That is to say, the loading station, the testing station and the blanking station are all provided with wafer stages. When the loading mechanism conveys the semiconductor chip to the wafer stage at the loading station, the testing mechanism can test the semiconductor chip on the wafer stage at the testing station, and the recycling mechanism can recycle the semiconductor chip on the wafer stage at the blanking station. That is, the sampling and testing equipment can enable the loading process, the testing process and the recycling process of the semiconductor chip to be carried out simultaneously, which can improve the working efficiency of the sampling and testing equipment. And, the sampling and testing equipment drives the wafer stage to switch between the loading station, the testing station and the blanking station through the turntable, which can reduce the distance between each mechanism, thereby reducing the occupied space of the sampling and testing equipment. The sampling and testing equipment is applied to the technical field of semiconductor chip testing. Description of the Drawings
[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present utility model or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present utility model. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on the structures shown in these drawings.
[0022] Figure 1 Schematic structural diagram of the sampling device in the embodiment provided by the present utility model;
[0023] Figure 2 For Figure 1 Another perspective schematic diagram;
[0024] Figure 3 For Figure 2 Enlarged view of part A of
[0025] Figure 4 Schematic connection diagram of the loading mechanism and the positioning camera in the embodiment provided by the present utility model;
[0026] Figure 5 Schematic connection diagram of the turntable, the wafer stage and the lifting mechanism in the embodiment provided by the present utility model;
[0027] Figure 6 Schematic structural diagram of the testing mechanism in the embodiment provided by the present utility model;
[0028] Figure 7 Schematic connection diagram of the probe base and the probe assembly in the embodiment provided by the present utility model;
[0029] Figure 8 Schematic connection diagram of the probe base, the third driving member and the pressing member in the embodiment provided by the present utility model.
[0030] Explanation of the reference numerals in the drawings:
[0031] 100, base; 110, turntable; 200, wafer stage; 210, carrier block; 300, loading mechanism; 310, transfer arm; 311, adsorption block; 320, scanning camera; 400, testing mechanism; 410, bottom plate; 411, slide rail; 420, first sliding assembly; 421, first driving member; 422, first slide; 423, slider; 430, second sliding assembly; 431, second driving member; 432, second slide; 440, third sliding assembly; 441, third driving member; 442, probe base; 443, abutting member; 4431, mounting block; 4432, roller; 444, pressing member; 4441, mounting seat; 4442, pressing block; 4443, elastic member; 450, probe assembly; 451, probe unit; 452, adjusting seat; 460, integrating sphere camera; 470, observation camera; 500, recovery mechanism; 510, material box; 520, blowing block; 521, blowing port; 600, lifting mechanism; 610, mounting plate; 620, lifting block; 700, positioning camera.
[0032] The realization, functional features and advantages of the object of the present utility model will be further described with reference to the embodiments and the accompanying drawings. Detailed implementation manners
[0033] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.
[0034] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present utility model are only used to explain the relative positional relationship and movement conditions between components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications will also change accordingly.
[0035] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present utility model, the descriptions of "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears throughout the text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or a solution that satisfies both A and B at the same time.
[0036] In addition, the technical solutions between the various embodiments of the present utility model can be combined with each other, but it must be based on the ability of those of ordinary skill in the art to implement. When the combination of technical solutions results in contradictions or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.
[0037] In the production process of semiconductor chips, it is necessary to test the semiconductor chips. At present, mainly sampling equipment is used to test the semiconductor chips. The specific operation is to place the semiconductor chips on the wafer stage, and then the test mechanism of the sampling equipment tests the semiconductor chips. However, most of the existing sampling equipment is single-station, that is, the loading, testing, and recycling of the sampling equipment need to be carried out at the same station. When the sampling equipment tests the semiconductor chips, each process needs to wait, which will affect the working efficiency of the sampling equipment; and most of the existing sampling equipment is horizontally placed, and a certain distance needs to be reserved between the various mechanisms of the sampling equipment, which will increase the occupied space of the sampling equipment.
[0038] The present utility model proposes a sampling equipment, aiming to solve the technical problems of low working efficiency and large occupied space of the existing sampling equipment.
[0039] Please refer toFigure 1 and Figure 2 In an embodiment of the present utility model, the sampling and testing device includes a base 100, a plurality of wafer carriers 200, a loading mechanism 300, a testing mechanism 400, and a recycling mechanism 500. A turntable 110 is provided on the base 100. The turntable 110 is provided with a loading station, a testing station, and a unloading station around its circumference. Each wafer carrier 200 is correspondingly arranged at the loading station, the testing station, and the unloading station, and each wafer carrier 200 can be switched from the loading station to the unloading station via the testing station; the loading mechanism 300 is arranged on one side of the loading station and is used to convey the workpiece to be tested onto the wafer carrier 200 located at the loading station; the testing mechanism 400 is arranged on one side of the testing station and is used to test the workpiece to be tested; the recycling mechanism 500 is arranged on one side of the unloading station and is used to recycle the workpiece after being tested by the testing mechanism 400. In a specific embodiment, the workpiece to be tested can be a semiconductor chip, and this embodiment will be described with a semiconductor chip.
[0040] The technical solution of the present utility model drives the wafer carrier 200 to switch between the loading station, the testing station, and the unloading station through the turntable 110, which can enable the loading process, the testing process, and the recycling process of the semiconductor chip to be carried out simultaneously, thereby improving the working efficiency of the sampling and testing device. And by driving the wafer carrier 200 to switch stations through the turntable 110, the distance between each mechanism can be reduced, thereby reducing the occupied space of the sampling and testing device. In this embodiment, the loading mechanism 300 is used to convey the workpiece to be tested onto the wafer carrier 200 located at the loading station, the testing mechanism 400 is used to test the workpiece to be tested, and the recycling mechanism 500 is used to recycle the workpiece after being tested by the testing mechanism 400. The turntable 110 is used to carry the wafer carrier 200 and is used to drive each wafer carrier 200 to switch from the loading station to the unloading station via the testing station. Each wafer carrier 200 is correspondingly arranged at the loading station, the testing station, and the unloading station. That is to say, the loading station, the testing station, and the unloading station are all provided with a wafer carrier 200. When the loading mechanism 300 conveys the semiconductor chip to the wafer carrier 200 at the loading station, the testing mechanism 400 can test the semiconductor chip on the wafer carrier 200 at the testing station, and the recycling mechanism 500 can recycle the semiconductor chip on the wafer carrier 200 at the unloading station. That is, the sampling and testing device can enable the loading process, the testing process, and the recycling process of the semiconductor chip to be carried out simultaneously, which can improve the working efficiency of the sampling and testing device. And, the sampling and testing device drives the wafer carrier 200 to switch between the loading station, the testing station, and the unloading station through the turntable 110, which can reduce the distance between each mechanism, thereby reducing the occupied space of the sampling and testing device. The sampling and testing device is applied to the technical field of semiconductor chip testing.
[0041] Please refer to Figure 4, in an embodiment of the present utility model, the loading mechanism 300 includes a transfer arm 310 and a scanning camera 320 for obtaining the position information of the workpiece to be measured. The scanning camera 320 is disposed on the base 100 and directly above the loading station. The transfer arm 310 is rotatably disposed on the base 100 about a first direction of the base 100, and an adsorption block 311 is provided on the transfer arm 310. Herein, the first direction refers to Figure 1 the direction indicated by X in
[0042] Please refer to Figure 5 , in an embodiment of the present utility model, the sampling device further includes a lifting mechanism 600 disposed below the unloading station. The lifting mechanism 600 includes a mounting plate 610 disposed on the base 100, a driving body disposed on the mounting plate 610, and a lifting block 620 slidably disposed on the mounting plate 610. A bearing block 210 that slides along a second direction of the base 100 is provided on the carrier table 200; the driving body drives the lifting block 620 to slide through a cam, and further drives the bearing block 210 to slide along the second direction of the base 100. Herein, the second direction refers to Figure 1 the direction indicated by Z in
[0043] Please refer to Figures 6 to 8, in an embodiment of the present utility model, the testing mechanism 400 includes a base plate 410, a first sliding assembly 420, a second sliding assembly 430, a third sliding assembly 440, and a probe assembly 450; the first sliding assembly 420 includes a first driving member 421 and a first sliding table 422 slidably disposed on the base plate 410, and the first driving member 421 drives the first sliding table 422 to slide along the third direction of the base 100 through a lead screw; the second sliding assembly 430 includes a second driving member 431 and a second sliding table 432 slidably disposed on the first sliding table 422, and the second driving member 431 drives the second sliding table 432 to slide along the first direction of the base 100 through a lead screw; the third sliding assembly 440 includes a third driving member 441 and a probe holder 442 slidably disposed on the second sliding table 432, and the third driving member 441 drives the probe holder 442 to slide along the second direction of the base 100 through a cam; the probe assembly 450 includes a plurality of probe units 451, and each probe unit 451 is disposed on the probe holder 442. Among them, the first direction refers to Figure 6 the direction indicated by X in Figure 6 , the second direction refers to Figure 6 the direction indicated by Z in
[0044] In this embodiment, the first driving member 421 drives the first sliding table 422 to slide along the third direction of the base 100, so as to drive the probe unit 451 to slide along the third direction of the base 100; the second driving member 431 drives the second sliding member to slide along the first direction of the base 100, so as to drive the probe unit 451 to slide along the first direction of the base 100; the third driving member 441 drives the probe base 442 to slide along the second direction of the base 100 through a cam, so as to drive the probe unit 451 to slide along the second direction of the base 100. By driving the first sliding table 422 to slide by the first driving member 421 and driving the second sliding table 432 to slide by the second driving member 431, it can adjust the position of the probe unit 451 in the third direction and the first direction to adapt to a variety of semiconductor chips with different test positions; by driving the probe base 442 to slide along the second direction of the base 100 by the third driving member 441, that is, by driving the probe base 442 to lift and lower by the third driving member 441, and then driving the probe unit 451 to lift and lower, it can adjust the position of the probe unit 451 in the second direction (i.e., the vertical direction) to adapt to a variety of semiconductor chips with different thicknesses. Each probe unit 451 is used to test the performance of semiconductor chips. By setting a plurality of probe units 451, the performance of a variety of different semiconductor chips can be tested, the applicable range of the testing mechanism 400 can be improved, and then the applicable range of the sampling and testing device can be improved. This testing device drives a plurality of probe units 451 of the probe assembly 450 through the first sliding assembly 420, the second sliding assembly 430 and the third sliding assembly 440 to slide along the third direction, the first direction and the second direction of the base 100, so that the probe unit 451 can be adjusted in position in the third direction, the first direction and the second direction to adapt to semiconductor chips with different test positions and different thicknesses, improve the applicable range of the testing mechanism 400, and then improve the applicable range of the sampling and testing device, and reduce the limitations of the sampling and testing device.
[0045] In a specific embodiment, to ensure the stability of the first sliding table 422, the second sliding table 432 and the probe base 442 during sliding, sliding rails 411 and sliders 423 connected in a sliding manner can be provided between the first sliding table 422 and the bottom plate 410, between the second sliding table 432 and the first sliding table 422, and between the probe base 442 and the second sliding table 432. And according to actual needs, the number of the sliding rails 411 and the sliders 423 can be set to be multiple. For example, the number of the sliding rails 411 is two, and the two sliding rails 411 are arranged at intervals. Two sliders 423 are correspondingly provided for the sliding rails 411 installed on the base and the sliding rails 411 installed on the first sliding table 422, and one slider 423 is correspondingly provided for the sliding rails 411 installed on the second sliding table 432.
[0046] It should be noted that both the cam drive structure and the lead screw drive structure have the characteristics of high precision. The first drive member 421 and the second drive member 431 drive the corresponding slide table to slide through the lead screw. The reason why the third drive member 441 drives the probe base 442 to slide through the cam is that, compared with the lead screw drive, the structure of the cam drive is simpler and occupies less space. That is, the third drive member 441 drives the probe base 442 to slide through the cam, which can simplify the structure of the test mechanism 400 and make the structure of the test mechanism 400 more compact, thereby reducing the occupied space of the sampling and testing equipment.
[0047] Please refer to Figure 1 and Figure 2 In an embodiment of the present invention, the test mechanism 400 further includes an integrating sphere camera 460 and an observation camera 470. The integrating sphere camera 460 is disposed directly above the test station and is used to perform optoelectronic parameter testing on the workpiece to be tested. The observation camera 470 is slidably disposed on the base 100. The observation camera 470 can slide directly above the test station to obtain the position information of the workpiece to be tested and the probe unit 451. Moreover, the first drive member 421, the second drive member 431, and the third drive member 441 are all electrically connected to the observation camera 470. Specifically, the integrating sphere camera 460 is used to perform optoelectronic parameter testing on semiconductor chips. Its specific structure can refer to the integrating sphere test mechanism 400 in the prior art. In a specific embodiment, the integrating sphere camera 460 can automatically adjust the light attenuation level, thereby completing the optoelectronic parameter testing of semiconductor chips under different brightness levels. Before testing the semiconductor chip, the observation camera 470 can obtain the position information of the workpiece to be tested and the probe unit 451, and transmit the obtained position information to an external controller. Subsequently, the external controller can adjust the position of the probe unit 451 according to its position information to ensure the testing accuracy. In a specific embodiment, the observation camera 470 is slidably disposed on the base 100 through a telescopic cylinder.
[0048] Please refer to Figure 6 and Figure 7, in an embodiment of the present utility model, the probe assembly 450 further includes an adjustment seat 452 provided in one-to-one correspondence with each probe unit 451. Each probe unit 451 is movably provided on the probe base 442 through the corresponding adjustment seat 452. The adjustment seat 452 is used to adjust the position of the corresponding probe unit 451 in the first direction, the second direction, and the third direction to ensure that the probe unit 451 is aligned with the test position of the semiconductor chip. It should be noted that the adjustment seat 452 is used to finely adjust the position of the probe unit 451 to ensure that the probe unit 451 is aligned with the test position of the semiconductor chip, which has a different function from that of the first sliding assembly 420, the second sliding assembly 430, and the third sliding assembly 440 in the present application to adjust the position of the probe assembly 450 in the third direction, the first direction, and the second direction, so that the testing mechanism 400 can adapt to semiconductor chips with different test positions and different thicknesses.
[0049] Please refer to Figure 7 , in an embodiment of the present utility model, the probe base 442 is provided with an abutting member 443. The abutting member 443 includes a mounting block 4431 provided on the probe base 442 and a roller 4432 rotatably provided on the mounting block 4431. The outer circumferential surface of the cam abuts against the outer circumferential surface of the roller 4432. The third driving member 441 drives the cam to rotate to drive the probe base 442 to move up and down. Among them, under the action of its own gravity, the probe base 442 makes the abutting member 443 always abut against the outer circumferential surface of the cam. Since the outer circumferential surface of the cam is an irregular arc surface, when the third driving member 441 drives the cam to rotate, it can push the abutting member 443 to make the probe base 442 move upward, and can also separate from the abutting member 443 to make the probe base 442 move downward under the action of its own gravity. By making the outer circumferential surface of the roller 4432 abut against the outer circumferential surface of the cam, that is, using rolling friction instead of sliding friction, it can reduce the friction force when the cam drives the probe base 442 to move up and down and extend the service life of the testing device.
[0050] Please refer to Figure 8, in an embodiment of the present utility model, the third sliding assembly 440 further includes a pressing member 444. The pressing member 444 includes a mounting seat 4441, a pressing block 4442 rotatably arranged on the mounting seat 4441, and an elastic member 4443 connecting the mounting seat 4441 and the pressing block 4442; the elastic member 4443 can drive the pressing block 4442 to rotate, and then drive the probe seat 442 to slide along the second direction of the base 100, so that the cam abuts against the roller 4432. In this embodiment, the base 100 is arranged on the third driving member 441, and the elastic member 4443 is always in a stretched state. When the third driving member 441 drives the cam to rotate and separates the cam from the abutting member 443, the elastic member 4443 can provide a pulling force to drive the pressing block 4442 to rotate, and then push the probe seat 442 to move downward. That is to say, when the probe seat 442 moves downward under its own gravity, it will also move downward under the push of the pressing member 444, which can make the abutting member 443 always abut against the cam, thereby avoiding the sudden dropping of the probe seat 442 and preventing damage to the testing device. In a specific embodiment, the elastic member 4443 can be a helical spring. To reduce the friction between the pressing block 4442 and the probe seat 442, a rotatable wheel body is arranged at one end of the pressing block 4442 away from the base 100.
[0051] Please refer to Figure 3 , in an embodiment of the present utility model, the recycling mechanism 500 includes a material box 510 and a blowing block 520. The blowing block 520 is provided with a blowing port 521. The blowing block 520 is arranged on the base 100 with the blowing port 521 facing the blanking station, and the material box 510 is arranged on one side of the blanking station away from the blowing block 520. In this embodiment, the recycling mechanism 500 is used to recycle the semiconductor chips tested by the testing mechanism 400. Specifically, after the testing mechanism 400 tests the semiconductor chips, the turntable 110 drives the wafer stage 200 to move from the testing station to the blanking station, and then the blowing block 520 blows air to the wafer stage 200 at the blanking station to blow the semiconductor chips on the wafer stage 200 at the blanking station into the material box 510, completing the recycling of the semiconductor chips. In a specific embodiment, to ensure that the blowing block 520 blows the semiconductor chips into the material box 510, the recycling mechanism 500 further includes a cover body. The cover body is arranged on one side of the blanking station away from the blowing block 520, and the material box 510 is arranged directly below the cover body.
[0052] In an embodiment of the present utility model, the number of the wafer stages 200 is eight, and the eight wafer stages 200 are evenly arranged at intervals in the circumferential direction around the turntable 110; the turntable 110 is further provided with a positioning station located between the loading station and the testing station, and each wafer stage 200 can be sequentially switched from the loading station to the unloading station through the positioning station and the testing station, and a positioning camera 700 electrically connected to the testing mechanism 400 is arranged directly above the positioning station. In this embodiment, the eight wafer stages 200 are evenly arranged at intervals in the circumferential direction around the turntable 110, that is, the angle between any two adjacent wafer stages 200 is 45°, and three of the four non-adjacent wafer stages 200 are respectively located at the loading station, the testing station, and the unloading station. That is to say, there is a wafer stage 200 at the positioning station between the loading station and the testing station, and a positioning camera 700 is arranged directly above the positioning station. The positioning camera 700 can obtain the position information of the semiconductor chip on the wafer stage 200 at the positioning station and transmit the obtained position information to an external controller. Subsequently, the external controller can adjust the position of the probe unit 451 according to its position information to ensure the testing accuracy.
[0053] The above is only an exemplary embodiment of the present utility model, and thus does not limit the patent scope of the present utility model. Any equivalent structural transformation made under the technical concept of the present utility model by using the content of the specification and drawings of the present utility model, or direct / indirect application in other related technical fields is included in the patent protection scope of the present utility model.
Claims
1. A sampling inspection device, characterized in that, Comprising: A base, on which a turntable is provided, and a loading station, a testing station and an unloading station are arranged around the circumferential direction of the turntable; A plurality of wafer carriers, each of the wafer carriers is correspondingly arranged at the loading station, the testing station and the unloading station, and each of the wafer carriers can be switched from the loading station to the unloading station through the testing station; A loading mechanism, which is arranged on one side of the loading station and is used for conveying a workpiece to be tested to the wafer carrier located at the loading station; A testing mechanism, which is arranged on one side of the testing station and is used for testing the testing station; A recycling mechanism, which is arranged on one side of the unloading station and is used for recycling the workpiece after being tested by the testing mechanism.
2. The sampling and testing device according to claim 1, characterized in that, The loading mechanism includes a transfer arm and a scanning camera for obtaining the position information of the workpiece to be tested. The scanning camera is arranged on the base and directly above the loading station. The transfer arm is rotatably arranged on the base around a first direction of the base, and an adsorption block is arranged on the transfer arm.
3. The sampling and testing device according to claim 2, wherein, The sampling and testing device further includes a lifting mechanism arranged below the unloading station. The lifting mechanism includes a mounting plate arranged on the base, a driving body arranged on the mounting plate, and a lifting block slidably arranged on the mounting plate. The wafer carrier is provided with a bearing block slidable along a second direction of the base; the driving body drives the lifting block to slide through a cam, and further drives the bearing block to slide along the second direction of the base.
4. The sampling and testing device according to claim 1, wherein, The testing mechanism includes a bottom plate, a first sliding component, a second sliding component, a third sliding component and a probe component; the first sliding component includes a first driving member and a first sliding table slidably arranged on the bottom plate, and the first driving member drives the first sliding table to slide along a third direction of the base through a lead screw; the second sliding component includes a second driving member and a second sliding table slidably arranged on the first sliding table, and the second driving member drives the second sliding table to slide along a first direction of the base through a lead screw; the third sliding component includes a third driving member and a probe seat slidably arranged on the second sliding table, and the third driving member drives the probe seat to slide along a second direction of the base through a cam; the probe component includes a plurality of probe units, and each of the probe units is arranged on the probe seat.
5. The sampling and testing device according to claim 4, wherein, The testing mechanism further includes an integrating sphere camera and an observation camera. The integrating sphere camera is arranged directly above the testing station and is used for performing optoelectronic parameter testing on the workpiece to be tested. The observation camera is slidably arranged on the base, and the observation camera can slide to directly above the testing station to obtain the position information of the workpiece to be tested and the probe units, and the first driving member, the second driving member and the third driving member are all electrically connected to the observation camera.
6. The sampling and testing device according to claim 5, characterized in that, The probe component further includes an adjustment seat correspondingly arranged for each of the probe units, and each of the probe units is movably arranged on the probe seat through the corresponding adjustment seat.
7. The sampling and testing device according to claim 4, wherein The probe base is provided with an abutting member, the abutting member includes a mounting block arranged on the probe base and a roller rotatably arranged on the mounting block, and the outer circumferential surface of the cam abuts against the outer circumferential surface of the roller.
8. The sampling and testing device according to claim 7, wherein, The third sliding assembly further includes a pressing member, the pressing member includes a mounting seat, a pressing block rotatably arranged on the mounting seat, and an elastic member connecting the mounting seat and the pressing block; the elastic member can drive the pressing block to rotate, thereby driving the probe base to slide along the second direction of the base, so that the cam abuts against the roller.
9. The sampling and testing device according to claim 1, characterized in that The recovery mechanism includes a material box and a blowing block, the blowing block is provided with a blowing port, the blowing block is arranged on the base with the blowing port facing the blanking station, and the material box is arranged on one side of the blanking station away from the blowing block.
10. The sampling and testing device according to any one of claims 1 to 9, characterized in that, The number of the wafer stages is eight, and the eight wafer stages are evenly arranged at intervals in the circumferential direction of the turntable; the turntable is further provided with a positioning station located between the loading station and the testing station, and each wafer stage can be sequentially switched from the loading station through the positioning station and the testing station to the blanking station, and a positioning camera electrically connected to the testing mechanism is arranged directly above the positioning station.