Machining device for improving grinding quality of polycrystalline diamond

Abstract

The utility model discloses a processing device for improving the grinding quality of polycrystalline diamond, which comprises a first disc body and a second disc body, the second disc body is used for being mounted on the upper side of the first disc body, four limiting blind holes are annularly and uniformly distributed on the upper side surface of the first disc body, and a driving blind hole is arranged in the middle of the upper side of the second disc body. Threaded holes are formed in the positions, corresponding to the limiting blind holes, of the second disc body, adjusting pieces are connected into the threaded holes in a screwed mode, and the adjusting pieces stretch into the limiting blind holes respectively. By rotating the adjusting piece, the gap between the first disc body and the second disc body is adjusted, so that the machining stress of the corresponding position of the first disc body is changed, and therefore the effects that the grinding removal rate of the position with the high thickness is high, the grinding removal rate of the position with the low thickness is low, and finally finished product pieces are consistent in thickness are achieved.

Description

Technical Field

[0001] The utility model relates to the technical field of polycrystalline diamond grinding processing, in particular to a processing device for improving the grinding quality of polycrystalline diamond. Background Art

[0002] Polycrystalline diamond has important applications in the fields of precision manufacturing and heat dissipation devices due to its excellent performance. At present, the main product types of polycrystalline diamond are 2-inch, 4-inch, and 6-inch wafers. Due to the high hardness and large size of polycrystalline diamond, it is difficult to process.

[0003] Among them, grinding is the main process of polycrystalline diamond processing. Refer to Figure 8 , the current processing process is to install the polycrystalline diamond wafer at the bottom of the rotating disk on the lower side of the upper rotating device 50. The polycrystalline diamond wafer contacts the grinding disk 40. The grinding disk 40 rotates to work, and at the same time, the rotating device 50 drives the lower rotating disk to rotate. Through the relative movement between the polycrystalline diamond wafer and the grinding disk 40, the purpose of reducing the surface roughness of the polycrystalline diamond wafer and improving the surface flatness is achieved. However, the current method has certain defects. If there is a large thickness difference in the polycrystalline diamond wafer itself, the thickness difference can only be appropriately reduced after grinding, but cannot be completely eliminated. Therefore, the quality of the final product cannot be controlled with high precision. Summary of the Utility Model

[0004] The purpose of the utility model is to provide a processing device for improving the grinding quality of polycrystalline diamond. By improving the rotating disk, the force received by the polycrystalline diamond wafer during grinding is changed. For the wafer with a thickness difference, the position with a higher thickness receives a greater force during grinding, while the position with a lower thickness receives a smaller force during grinding. Finally, the grinding removal rate of the position with a higher thickness is high, and the grinding removal rate of the position with a lower thickness is low, and the final finished wafer achieves the effect of consistent thickness.

[0005] To achieve the above purpose, the utility model provides a processing device for improving the grinding quality of polycrystalline diamond, including a first disk body and a second disk body. The second disk body is used to be installed on the upper side of the first disk body. At least three limiting blind holes are annularly and evenly distributed on the upper side surface of the first disk body. A driving blind hole is arranged in the middle of the upper side of the second disk body. Threaded holes are arranged on the second disk body at positions corresponding to the limiting blind holes. Adjusting members are screwed into the threaded holes, and each adjusting member extends into each limiting blind hole.

[0006] An arc-shaped groove is arranged at the center of the upper side of the first disk body, and an arc-shaped protrusion is arranged at the center of the lower side of the second disk body. The arc-shaped protrusion and the arc-shaped groove are used for positioning cooperation.

[0007] Patterns are arranged on the lower side of the first disk body.

[0008] A handle structure is provided at the edge of the first disk body.

[0009] The handle structure is a handle installed on the edge of the first disk body or a notch provided on the edge of the first disk body.

[0010] A boss is provided in the middle of the upper side of the second disk body, and the driving blind hole is located in the middle of the boss.

[0011] Four to eight limiting blind holes are evenly distributed in a circular pattern on the upper side surface of the first disk body.

[0012] The present utility model has the following technical effects compared with the prior art:

[0013] The bottom of the first disk body of the present utility model is used to bond polycrystalline diamond wafers with glue, and the driving blind hole on the upper side of the second disk body is used for the rotating rod of the rotating device to be inserted. The processing device of the present utility model is rotated by driving the rotating rod. By rotating the adjusting member, the gap between the first disk body and the second disk body is adjusted to change the processing force at the corresponding position of the first disk body, so as to achieve a high grinding removal rate at the position with a high thickness and a low grinding removal rate at the position with a low thickness, and finally the finished wafer has a consistent thickness. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art:

[0015] Figure 1 It is a front view structural schematic diagram of the present utility model;

[0016] Figure 2 It is a three-dimensional structural schematic diagram of the present utility model;

[0017] Figure 3 It is Figure 1 the sectional structural schematic diagram of A-A in

[0018] Figure 4 It is a three-dimensional structural schematic diagram of the top view of the first disk body of the present utility model;

[0019] Figure 5 It is a three-dimensional structural schematic diagram of the bottom view of the first disk body of the present utility model;

[0020] Figure 6 It is a three-dimensional structural schematic diagram of the top view of the second disk body of the present utility model;

[0021] Figure 7 It is a three-dimensional structural schematic diagram of the bottom view of the second disk body of the present utility model;

[0022] Figure 8 It is a usage state diagram of the present utility model.

[0023] Reference numerals:

[0024] The first plate 10, the limiting blind hole 11, the arc groove 12, the texture 13, the handle structure 14;

[0025] The second plate 20 has a driving blind hole 21, a boss 22, a threaded hole 23, and an arc-shaped protrusion 24;

[0026] Adjustment member 30;

[0027] Grinding disc 40;

[0028] Rotating device 50 , rotating rod 51 . DETAILED DESCRIPTION

[0029] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, but should not be understood as limiting the present invention.

[0030] See also Figures 1-7 A processing device for improving the grinding quality of polycrystalline diamond includes a first disk body 10 and a second disk body 20. The second disk body 20 is used to be installed on the upper side of the first disk body 10. Four limiting blind holes 11 are evenly distributed in an annular manner on the upper side of the first disk body 10. A driving blind hole 21 is provided in the middle of the upper side of the second disk body 20. Threaded holes 23 are provided on the second disk body 20 at positions corresponding to the limiting blind holes 11. Adjusting parts 30 are screwed into the threaded holes 23, and each of the adjusting parts 30 extends into each of the limiting blind holes 11.

[0031] The bottom of the first plate 10 is used to glue the polycrystalline diamond sheet. The driving blind hole 21 on the upper side of the second plate 20 is used to insert the rotating rod 51 of the rotating device 50, which drives the processing device of the present invention to rotate. The driving blind hole 21 can be a circular hole or a polygonal hole.

[0032] The threaded hole 23 on the second plate body 20 is screwed with an adjusting member 30, which can be a hexagon socket screw or a hexagon socket screw. Figure 2 、 3 Each adjusting member 30 extends into each limiting blind hole 11, and plays the role of positioning the first plate 10 and adjusting the pressure of the first plate 10. Specifically, the aperture of the limiting blind hole 11 is slightly larger than the diameter of the adjusting member 30.

[0033] In the present application, by rotating the adjusting member 30, the gap between the first disk body 10 and the second disk body 20 is adjusted, so as to change the machining force at the corresponding position of the first disk body 10, so that the grinding removal rate at the position with a high thickness is high, and the grinding removal rate at the position with a low thickness is low, and finally the finished product sheet achieves a consistent thickness effect.

[0034] In one of the solutions, refer to Figure 3 、 4 、7, an arc-shaped groove 12 is provided at the center of the upper side of the first disk body 10, and an arc-shaped protrusion 24 is provided at the center of the lower side of the second disk body 20. Through the cooperation and positioning of the arc-shaped protrusion 24 and the arc-shaped groove 12, the centers of the first disk body 10 and the second disk body 20 are aligned.

[0035] In one of the solutions, refer to Figure 5 , a texture 13 is provided on the lower side of the first disk body 10 to improve the stability of the bonding of the first disk body 10 with the polycrystalline diamond sheet by glue. The texture 13 is a groove with a relatively shallow depth.

[0036] In one of the solutions, refer to Figure 2 、 4 , a handle structure 14 is provided at the edge of the first disk body 10 to facilitate the extraction of the first disk body 10.

[0037] Specifically, the handle structure 14 is two symmetric U-shaped handles installed at the edge of the first disk body 10, or a notch provided at the edge of the first disk body 10. In Figure 4 , a structure in which the handle structure 14 is a notch provided at the edge of the first disk body 10 is shown.

[0038] Refer to Figure 2 、 6 , a convex platform 22 is provided in the middle of the upper side of the second disk body 20, and a driving blind hole 21 is located in the middle of the convex platform 22. The convex platform 22 is provided to improve the structural strength of the second disk body 20.

[0039] Preferably, 4 to 8 limiting blind holes 11 are evenly distributed in a ring on the upper side surface of the first disk body 10.

[0040] The working principle or operation process of the present utility model is as follows:

[0041] Refer to Figure 2 、 8 , when starting processing, first fix the polycrystalline diamond sheet to the bottom of the first disk body 10. Taking the bottom of the first disk body 10 as a reference, measure the thickness of the polycrystalline diamond sheet, and record the thickness of the polycrystalline diamond sheet corresponding to the four limiting blind holes 11 to facilitate subsequent adjustment.

[0042] Assemble the first disk body 10 and the second disk body 20. First, adjust the lengths of the four adjusting members 30 exposed to be the same. Then, according to the recorded thickness of the polycrystalline diamond, adjust the corresponding adjusting members 30 accordingly. Increase the length of the adjusting member 30 exposed at the place with a high thickness, and decrease the length of the adjusting member 30 exposed at the place with a low thickness. After the adjustment is completed, place the entire processing device on the grinding equipment for processing.

Claims

1. A processing device for improving the grinding quality of polycrystalline diamond, characterized in that: It includes a first disk body (10) and a second disk body (20). The second disk body (20) is used to be installed on the upper side of the first disk body (10). At least three limiting blind holes (11) are evenly distributed in a ring on the upper side surface of the first disk body (10). A driving blind hole (21) is provided in the middle of the upper side of the second disk body (20). Threaded holes (23) are provided on the second disk body (20) at positions corresponding to the limiting blind holes (11). Adjusting members (30) are screwed into the threaded holes (23), and each of the adjusting members (30) extends into each of the limiting blind holes (11).

2. The processing device for improving the grinding quality of polycrystalline diamond according to claim 1, characterized in that: An arc-shaped groove (12) is provided at the center of the upper side of the first disk body (10), and an arc-shaped protrusion (24) is provided at the center of the lower side of the second disk body (20). The arc-shaped protrusion (24) is matched with the arc-shaped groove (12) for positioning.

3. The processing device for improving the grinding quality of polycrystalline diamond according to claim 1, wherein: Patterns (13) are provided on the lower side of the first disk body (10).

4. A processing device for improving the grinding quality of polycrystalline diamond according to claim 1, characterized in that: A handle structure (14) is provided at the edge of the first disk body (10).

5. The processing device for improving the grinding quality of polycrystalline diamond according to claim 4, characterized in that: The handle structure (14) is a handle installed on the edge of the first disk body (10), or a notch provided on the edge of the first disk body (10).

6. The processing device for improving the grinding quality of polycrystalline diamond according to claim 1, characterized in that: A boss (22) is provided in the middle of the upper side of the second disk body (20), and the driving blind hole (21) is located in the middle of the boss (22).

7. The processing device for improving the grinding quality of polycrystalline diamond according to claim 1, characterized in that: 4 to 8 limiting blind holes (11) are evenly distributed in a ring on the upper side surface of the first disk body (10).

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