Automatic fine grinding device for silicon carbide wafer

Abstract

The utility model provides an automatic fine grinding device for a silicon carbide wafer. The automatic fine grinding device for the silicon carbide wafer comprises a supporting plate, and a double-face grinding mechanism, a transmission mechanism and a positioning and clamping mechanism are arranged on the supporting plate; the double-face grinding mechanism comprises a supporting frame, the supporting frame is fixedly installed on a supporting plate, a hydraulic rod is fixedly installed on the supporting frame, and a supporting block is arranged above the supporting plate. According to the automatic fine grinding device for the silicon carbide wafer, the double-face grinding mechanism and the transmission mechanism are arranged to be in linkage fit, so that when the silicon wafer is ground, the upper grinding disc and the lower grinding disc can synchronously grind the upper face and the lower face of the silicon wafer, and the grinding efficiency is improved; and through the arrangement of the annular hollow pipe, when dust is generated during silicon wafer grinding, the dust suction nozzles annularly arranged on the inner side of the annular hollow pipe can suck away the dust in all directions, and the dust suction and removal efficiency is improved.

Description

Technical Field

[0001] The utility model belongs to the technical field of silicon wafer grinding, and particularly relates to an automatic fine grinding device for silicon carbide wafers. Background Art

[0002] A silicon wafer is made by purifying silicon elements, and then these pure silicon are made into long silicon ingots, which become the material for manufacturing quartz semiconductors of integrated circuits. Through processes such as photolithography, grinding, polishing, and slicing, polysilicon is melted and pulled into single-crystal silicon ingots, and then cut into thin wafers one by one.

[0003] The published patent CN219562643U discloses an automatic fine grinding device for silicon carbide wafers, including a machine body. The machine body is provided with a robotic arm, and the robotic arm is provided with a connecting plate and a clamping device, including: a hydraulic rod, which is used to control the gripper to perform clamping work. The arc-shaped gripper can more accurately fit the shape of the silicon carbide wafer, and the buffer layer can prevent the silicon carbide wafer from being damaged, having higher stability, thereby reducing mistakes during the grinding work and improving production efficiency. The automatic fine grinding device for silicon carbide wafers is provided with a dust removal device. The dust generated during the grinding work is sucked in from the air inlet by an air pump arranged on the machine body, and then the dust is discharged from the air outlet and recycled into the collection box, avoiding the generation of dust from affecting the grinding quality and reducing the impact of dust generation on the production environment and workers.

[0004] However, there are still deficiencies in the above structure. The above device can only grind one side of the silicon wafer during the grinding process, so the grinding efficiency is low, and the suction ports are only arranged on both sides of the silicon wafer, resulting in poor dust suction effect, and some dust generated during grinding will leak away.

[0005] Therefore, it is necessary to provide a new automatic fine grinding device for silicon carbide wafers to solve the above technical problems. Summary of the Utility Model

[0006] The technical problem solved by the utility model is to provide an automatic fine grinding device for silicon carbide wafers that can synchronously grind the upper and lower surfaces of the silicon wafer and fully suck and remove the dust generated during grinding.

[0007] To solve the above technical problems, the automatic fine grinding device for silicon carbide wafers provided by the utility model includes: a support plate, on which a double-sided grinding mechanism, a transmission mechanism, and a positioning and clamping mechanism are arranged;

[0008] The double-sided grinding mechanism includes a support frame, which is fixedly installed on the support plate. A hydraulic rod is fixedly installed on the support frame. Above the support plate, there is a support block. The output end of the hydraulic rod is fixedly connected to the support block. A rotating rod is rotatably installed on the support block. One end of the rotating rod is fixedly installed with an upper grinding disc. A first transmission wheel is fixedly sleeved on the rotating rod. A stepping motor is fixedly installed on the support block. The output end of the stepping motor is fixedly connected to one end of the rotating rod. An installation groove is formed on the support plate. A lower grinding disc is rotatably installed in the installation groove. A first rotating shaft is fixedly installed on the lower grinding disc. The lower grinding disc rotatably penetrates the support plate and is fixedly installed with the first rotating shaft;

[0009] The transmission mechanism includes a linkage rod, which is rotatably installed on the support block. A third transmission wheel is fixedly installed at one end of the linkage rod. A first transmission belt is wound between the third transmission wheel and the first transmission wheel. A fixed block is fixedly installed on the support plate. A rotating tube is rotatably installed on the fixed block. One end of the linkage rod extends into the rotating tube and is slidably connected to the rotating tube. A first gear is fixedly installed at the bottom end of the rotating tube. A second rotating shaft is rotatably installed on the support plate. A second gear and a fourth transmission wheel are fixedly sleeved on the second rotating shaft. The second gear meshes with the first gear. A second transmission belt is wound between the fourth transmission wheel and the first rotating shaft.

[0010] As a further solution of the present invention, the positioning and clamping mechanism includes a movable groove, which is formed on the installation groove. A screw rod is rotatably installed in the movable groove. A servo motor is fixedly installed on the support plate. The output end of the servo motor is fixedly connected to one end of the screw rod. Above the installation groove, there is an arc-shaped clamping rod. A translation block is fixedly installed on the arc-shaped clamping rod. The screw rod penetrates the translation block and is threadedly connected to the translation block.

[0011] As a further solution of the present invention, two limiting rods are fixedly installed on the arc-shaped clamping rod. Two limiting grooves are formed in the installation groove. The limiting rods are adapted to the limiting grooves.

[0012] As a further solution of the present invention, a ring-shaped hollow tube is fixedly installed on the support plate. The ring-shaped hollow tube is located above the installation groove. A plurality of dust suction nozzles are fixedly installed on the ring-shaped hollow tube. The plurality of dust suction nozzles are distributed in a surrounding manner along the inner side of the ring-shaped hollow tube. A dust suction machine is fixedly installed on the support plate. A dust suction pipe is fixedly installed on the dust suction machine. One end of the dust suction pipe is fixedly connected to the ring-shaped hollow tube.

[0013] As a further solution of the present invention, a limiting block is fixedly installed on the surface of the linkage rod. A limiting groove is formed on the inner wall of the rotating tube. The limiting block is adapted to the limiting groove.

[0014] As a further solution of the present invention, the upper grinding disc and the lower grinding disc are vertically symmetrically distributed, and the radial diameter of the upper grinding disc is equal to the radial diameter of the lower grinding disc.

[0015] Compared with the related art, the automatic fine grinding device for silicon carbide wafers provided by the present invention has the following beneficial effects:

[0016] 1. The utility model is provided with a double-sided grinding mechanism and a transmission mechanism, so that when grinding silicon wafers, the upper grinding disc and the lower grinding disc can grind the upper and lower surfaces of the silicon wafer synchronously, thereby improving the grinding efficiency;

[0017] 2. The utility model is provided with an annular hollow tube, so that when dust is generated by grinding silicon wafers, the dust suction nozzle arranged in an annular manner inside the annular hollow tube can suck away the dust in all directions, thereby improving the dust suction and dust removal efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.

[0019] Figure 1 This is a schematic diagram of the first three-dimensional structure of the automatic fine grinding device for silicon carbide wafers provided by the utility model;

[0020] Figure 2 This is a second three-dimensional structural schematic diagram of the automatic fine grinding device for silicon carbide wafers provided by the utility model;

[0021] Figure 3 This is a third three-dimensional structural schematic diagram of the automatic fine grinding device for silicon carbide wafers provided by the present invention;

[0022] Figure 4 This is a schematic diagram of the connecting rod and rotating tube structure of the automatic fine grinding device for silicon carbide wafers provided by the utility model.

[0023] In the figure: 1. Support plate; 2. Support frame; 201. Hydraulic rod; 202. Support block; 203. Rotating rod; 204. Upper grinding disc; 205. Transmission wheel 1; 206. Stepper motor; 3. Mounting slot; 301. Lower grinding disc; 302. Rotating shaft 1; 303. Transmission wheel 2; 4. Connecting rod; 401. Transmission wheel 3; 402. Transmission belt 1; 5. Fixed block; 501. Rotating tube; 502. Gear 1; 503. Rotating shaft 2; 504. Gear 2; 505. Transmission wheel 4; 506. Transmission belt 2; 6. Movable slot; 601. Screw; 602. Servo motor; 603. Arc clamping rod; 604. Translation block; 605. Limiting rod; 7. Annular hollow tube; 701. Dust nozzle; 702. Dust collector; 703. Dust tube. DETAILED DESCRIPTION

[0024] Please refer to the following in conjunction with Figures 1 to 4 , where Figure 1 is the first three-dimensional structure diagram of the automatic fine grinding device for silicon carbide wafers provided by the present utility model; Figure 2 is the second three-dimensional structure diagram of the automatic fine grinding device for silicon carbide wafers provided by the present utility model; Figure 3 is the third three-dimensional structure diagram of the automatic fine grinding device for silicon carbide wafers provided by the present utility model; Figure 4 is the structure diagram of the linkage rod and the rotating tube of the automatic fine grinding device for silicon carbide wafers provided by the present utility model. The automatic fine grinding device for silicon carbide wafers includes: a support plate 1, on which a double-sided grinding mechanism, a transmission mechanism and a positioning and clamping mechanism are provided;

[0025] The double-sided grinding mechanism includes a support frame 2, which is fixedly installed on the support plate 1. A hydraulic rod 201 is fixedly installed on the support frame 2. Above the support plate 1, there is a support block 202. The output end of the hydraulic rod 201 is fixedly connected to the support block 202. A rotating rod 203 is rotatably installed on the support block 202. One end of the rotating rod 203 is fixedly installed with an upper grinding disc 204. A first transmission wheel 205 is fixedly sleeved on the rotating rod 203. A stepping motor 206 is fixedly installed on the support block 202. The output end of the stepping motor 206 is fixedly connected to one end of the rotating rod 203. An installation groove 3 is opened on the support plate 1. A lower grinding disc 301 is rotatably installed in the installation groove 3. A first rotating shaft 302 is fixedly installed on the lower grinding disc 301. The lower grinding disc 301 rotates through the support plate 1 and is fixedly installed with a first rotating shaft 302;

[0026] The transmission mechanism includes a linkage rod 4, which is rotatably installed on the support block 202. One end of the linkage rod 4 is fixedly installed with a third transmission wheel 401. A first transmission belt 402 is wound between the third transmission wheel 401 and the first transmission wheel 205. A fixed block 5 is fixedly installed on the support plate 1. A rotating tube 501 is rotatably installed on the fixed block 5. One end of the linkage rod 4 extends into the rotating tube 501 and is slidably connected to the rotating tube 501. A first gear 502 is fixedly installed at the bottom end of the rotating tube 501. A second rotating shaft 503 is rotatably installed on the support plate 1. A second gear 504 and a fourth transmission wheel 505 are fixedly sleeved on the second rotating shaft 503. The second gear 504 meshes with the first gear 502. A second transmission belt 506 is wound between the fourth transmission wheel 505 and the first rotating shaft 302.

[0027] As Figure 2As shown, the positioning and clamping mechanism includes a movable groove 6, which is opened on the installation groove 3. A screw rod 601 is rotatably installed in the movable groove 6. A servo motor 602 is fixedly installed on the support plate 1, and the output end of the servo motor 602 is fixedly connected to one end of the screw rod 601. Above the installation groove 3, there is an arc-shaped clamping rod 603. A translation block 604 is fixedly installed on the arc-shaped clamping rod 603. The screw rod 601 passes through the translation block 604 and is threadedly connected to the translation block 604;

[0028] After the servo motor 602 is energized and runs to drive the screw rod 601 to rotate, the screw rod 601 drives the translation block 604 to move in parallel, and then the translation block 604 drives the arc-shaped clamping rod 603 to move to tightly clamp and position one side of the silicon wafer.

[0029] As Figure 2 shown, two limiting rods 605 are fixedly installed on the arc-shaped clamping rod 603. Two limiting grooves are opened in the installation groove 3, and the limiting rods 605 are adapted to the limiting grooves;

[0030] The limiting rods 605 sliding in the limiting grooves can play a limiting role on the arc-shaped clamping rod 603, so that the arc-shaped clamping rod 603 remains stable when being driven to move in parallel.

[0031] As Figure 1 shown, a ring-shaped hollow tube 7 is fixedly installed on the support plate 1. The ring-shaped hollow tube 7 is located above the installation groove 3. A plurality of dust suction nozzles 701 are fixedly installed on the ring-shaped hollow tube 7. The plurality of dust suction nozzles 701 are distributed in a surrounding manner along the inner side of the ring-shaped hollow tube 7. A dust suction machine 702 is fixedly installed on the support plate 1. A dust suction pipe 703 is fixedly installed on the dust suction machine 702. One end of the dust suction pipe 703 is fixedly connected to the ring-shaped hollow tube 7;

[0032] By setting the dust suction nozzles 701 in a ring shape, when dust is generated during the grinding of the silicon wafer, the dust suction machine 702 can operate to generate suction force, and then the dust suction nozzles 701 suck the dust into the dust collection box of the dust suction machine 702, improving the grinding operation environment.

[0033] As Figure 4 shown, a limiting block is fixedly installed on the surface of the linkage rod 4. A limiting groove is opened on the inner wall of the rotating tube 501, and the limiting block is adapted to the limiting groove;

[0034] Due to the limiting block fixedly installed on the surface of the linkage rod 4, when the linkage rod 4 rotates, it drives the limiting block to rotate, and then the limiting block acts on the limiting groove in the rotating tube 501, thereby driving the rotating tube 501 to rotate.

[0035] As Figure 1As shown, the upper polishing platen 204 and the lower polishing platen 301 are vertically symmetrically distributed, and the radial diameter of the upper polishing platen 204 is equal to the radial diameter of the lower polishing platen 301;

[0036] Due to the vertical symmetrical distribution of the upper polishing platen 204 and the lower polishing platen 301, the upper and lower surfaces are kept uniform when polishing the silicon wafer, improving the stability.

[0037] The working principle of the automatic fine grinding device for silicon carbide wafers provided by the present utility model is as follows:

[0038] First step: Place the silicon wafer on the lower polishing platen 301 in the installation groove 3, and then press one side of the silicon wafer tightly by the arc-shaped clamping rod 603 so that the silicon wafer is clamped and positioned. Then drive the support block 202 to move up and down by the hydraulic rod 201, so that the support block 202 drives the upper polishing platen 204 to press against the silicon wafer;

[0039] Second step: During grinding, energize and operate the stepping motor 206 to drive the rotating rod 203 to rotate. The rotating rod 203 can drive the upper polishing platen 204 and the first transmission wheel 205 to rotate synchronously. Then the first transmission wheel 205 drives the third transmission wheel 401 to rotate through the first transmission belt 402. The third transmission wheel 401 drives the rotating tube 501 to rotate through the linkage rod 4. Then the rotating tube 501 drives the first gear 502 to rotate. The second gear 504 meshing with the first gear 502 is driven to rotate in the reverse direction. Then after the second gear 504 drives the second rotating shaft 503 to rotate, the second rotating shaft 503 drives the fourth transmission wheel 505 to rotate. Then the fourth transmission wheel 505 drives the second transmission wheel 303 to rotate through the second transmission belt 506. The second transmission wheel 303 drives the lower polishing platen 301 to rotate through the first rotating shaft 302. Therefore, the clockwise rotation of the upper polishing platen 204 and the counterclockwise rotation of the lower polishing platen 301 are carried out synchronously, which is convenient for grinding the upper and lower surfaces of the silicon wafer at the same time, thus improving the grinding efficiency;

[0040] Third step: During the grinding process, start the dust collector 702 to make the dust collector 702 operate to generate a suction force, and suck away the dust generated by grinding by the dust suction nozzle 701 to improve the working environment.

[0041] It should be noted that the device structure and drawings of the present utility model mainly describe the principle of the present utility model. Based on the technical design principle, the settings of the power mechanism, power supply system and control system of the device are not fully described. However, on the premise that those skilled in the art understand the principle of the above-mentioned utility model, the specific power mechanism, power supply system and control system can be clearly obtained. The control mode of the application document is automatically controlled by a controller, and the control circuit of the controller can be realized by simple programming by those skilled in the art;

[0042] All the standard parts used can be purchased from the market, and can be customized according to the description in the specification and the drawings. The specific connection methods of each part all adopt conventional means such as bolts, rivets, welding, etc. that are mature in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art, and the components known to those skilled in the art, their structures and principles can all be known by those skilled in the art through technical manuals or through conventional experimental methods.

[0043] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention, or directly or indirectly applied. In other related technical fields, the scope of the present invention is defined by the appended claims and their equivalents, and is similarly included within the scope of the patent protection of the present invention.

Claims

1. An automatic fine grinding device for a silicon carbide wafer, characterized in that, Including: A support plate, on which a double-sided grinding mechanism, a transmission mechanism and a positioning and clamping mechanism are arranged; The double-sided grinding mechanism includes a support frame, the support frame is fixedly installed on the support plate, a hydraulic rod is fixedly installed on the support frame, a support block is arranged above the support plate, the output end of the hydraulic rod is fixedly connected with the support block, a rotating rod is rotatably installed on the support block, an upper grinding disc is fixedly installed at one end of the rotating rod, a first transmission wheel is fixedly sleeved on the rotating rod, a stepping motor is fixedly installed on the support block, the output end of the stepping motor is fixedly connected with one end of the rotating rod, an installation groove is opened on the support plate, a lower grinding disc is rotatably installed in the installation groove, a first rotating shaft is fixedly installed on the lower grinding disc, and the lower grinding disc rotatably penetrates through the support plate and is fixedly installed with the first rotating shaft; The transmission mechanism includes a linkage rod, the linkage rod is rotatably installed on the support block, a third transmission wheel is fixedly installed at one end of the linkage rod, a first transmission belt is wound between the third transmission wheel and the first transmission wheel, a fixed block is fixedly installed on the support plate, a rotating tube is rotatably installed on the fixed block, one end of the linkage rod extends into the rotating tube and is slidably connected with the rotating tube, a first gear is fixedly installed at the bottom end of the rotating tube, a second rotating shaft is rotatably installed on the support plate, a second gear and a fourth transmission wheel are fixedly sleeved on the second rotating shaft, the second gear is meshed with the first gear, and a second transmission belt is wound between the fourth transmission wheel and the first rotating shaft.

2. The automatic fine grinding device for silicon carbide wafers according to claim 1, characterized in that: The positioning and clamping mechanism includes a movable groove, the movable groove is opened on the installation groove, a screw rod is rotatably installed in the movable groove, a servo motor is fixedly installed on the support plate, the output end of the servo motor is fixedly connected with one end of the screw rod, an arc-shaped clamping rod is arranged above the installation groove, a translation block is fixedly installed on the arc-shaped clamping rod, and the screw rod penetrates through the translation block and is in threaded connection with the translation block.

3. The automatic fine grinding device for silicon carbide wafers according to claim 2, characterized in that: Two limiting rods are fixedly installed on the arc-shaped clamping rod, two limiting grooves are opened in the installation groove, and the limiting rods are adapted to the limiting grooves.

4. The automatic fine grinding device for silicon carbide wafers according to claim 1, wherein: A ring-shaped hollow tube is fixedly installed on the support plate, the ring-shaped hollow tube is located above the installation groove, a plurality of dust suction nozzles are fixedly installed on the ring-shaped hollow tube, the plurality of dust suction nozzles are distributed in a surrounding manner on the inner side of the ring-shaped hollow tube, a dust suction machine is fixedly installed on the support plate, and a dust suction pipe is fixedly installed on the dust suction machine, and one end of the dust suction pipe is fixedly connected with the ring-shaped hollow tube.

5. The automatic fine grinding device for silicon carbide wafers according to claim 1, characterized in that: A limiting block is fixedly installed on the surface of the linkage rod, a limiting groove is opened on the inner wall of the rotating tube, and the limiting block is adapted to the limiting groove.

6. The automatic fine grinding device for silicon carbide wafers according to claim 1, wherein: The upper grinding disc and the lower grinding disc are vertically symmetrically distributed, and the radial diameter of the upper grinding disc is equal to the radial diameter of the lower grinding disc.

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