PCB bonding pad structure

Abstract

The utility model relates to the technical field of PCBs (printed circuit boards), in particular to a PCB bonding pad structure, which comprises a pad body, a through hole for a pin of a plug connector to penetrate through is arranged in the middle of the pad body, an annular groove is arranged on the end face of the pad body, the circle center of the annular groove coincides with that of the through hole, and the annular groove is sleeved on the outer side of the through hole. Wherein the middle of the disc body extends outwards in the radial direction to form a shielding part, the shielding part covers the upper portion of the annular groove, a tin inlet channel is formed between the shielding part and the far end of the annular groove, and under the limitation of the shielding part, the annular groove and the tin inlet channel form a notch structure with the cross section of an L-shaped structure. The structure is used for storing solder paste, that is, the solder paste enters the annular groove along the tin inlet channel during wave soldering, and part of the solder paste is stored and subsequently solidified through the annular groove, so that the contact area between the solder paste and a bonding pad is increased, the tensile force between the solder paste and the bonding pad is improved, and the problem that the solder paste falls off is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB boards, in particular to a solder pad structure of a PCB board. Background Technique

[0002] A printed circuit board (PCB) is an indispensable component in electronic devices. It provides support for electronic components and realizes electrical connections between components. According to different structures, PCB boards can be divided into single-sided boards, double-sided boards, and multi-layer boards. During the manufacturing process of PCB boards, in order to fix and realize the electrical connection of electronic components, copper foil is usually mounted on the PCB substrate to form solder pads. Subsequently, solder paste is coated on the copper foil, and the solder paste's adhesiveness and conductivity are utilized to fix and electrically connect the electronic components to the PCB board.

[0003] However, there are some problems in the existing PCB board manufacturing technology. During the soldering process, if the through-hole of the connector pin on the solder pad is not fully penetrated with tin, or the contact area between the solder pad and the solder paste is small, it will lead to insufficient tensile force of the solder pad or the solder paste is likely to fall off from the solder pad. The insufficient tensile force of the solder pad and the falling off of the solder paste not only affect the performance of the connector, but also affect the normal use of the device.

[0004] Based on this, in order to further improve the connection stability of the existing solder pad to the solder paste, we propose a solder pad structure of a PCB board. Content of the Utility Model

[0005] The purpose of the utility model is to solve the above-mentioned drawbacks in the existing technology, and to propose a solder pad structure of a PCB board.

[0006] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0007] Design a solder pad structure of a PCB board, including a disk body. A through-hole for the insertion of the pin of the connector is provided in the middle of the disk body. An annular groove is provided on the end face of the disk body. The annular groove coincides with the center of the through-hole and is sleeved outside the through-hole;

[0008] Wherein, the middle part of the disk body extends radially outward to form a shielding part. The shielding part covers the annular groove and forms a tin inlet channel between the distal end of the annular groove.

[0009] Furthermore, the outer side edge of the shielding part is bent towards the bottom edge of the annular groove to form a bending part.

[0010] Furthermore, a chamfering part is provided on the distal side edge of the disk body where the annular groove is located. The chamfering part is inclined towards the bottom edge of the annular groove.

[0011] Furthermore, a number of tin-penetrating holes are also distributed on the end face of the shielding part.

[0012] Further, every three of the tin-penetrating holes are grouped together, and multiple groups of tin-penetrating holes are circumferentially distributed on the end surface of the shielding portion with the central axis of the disk body as the center of the circle.

[0013] For the PCB pad structure proposed by the present utility model, the beneficial effect is that: under the restriction of the shielding portion in the present utility model, the annular groove and the tin inlet channel form a notch structure with an L-shaped cross-section, and this structure is used to store solder paste. That is, during wave soldering, the solder paste enters the above-mentioned annular groove along the tin inlet channel, and the annular groove is used to store part of the solder paste and subsequent solidification, so as to increase the contact area with the pad, thereby enhancing the tensile force with the pad and avoiding the problem of solder paste falling off. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 is a perspective view of the present utility model;

[0015] Figure 2 is a top view of the present utility model;

[0016] Figure 3 is Figure 2 a schematic cross-sectional structure view along A-A.

[0017] In the figure: 1. Disk body; 11. Through hole; 12. Annular groove; 13. Shielding portion; 14. Tin inlet channel; 15. Bending portion; 16. Chamfering portion; 17. Tin-penetrating hole. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0018] Next, the technical solutions in the embodiments of the present utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all of the embodiments.

[0019] Referring to Figures 1-3 to an embodiment of the present utility model, it discloses a PCB pad structure, which is used to solve the problem that the current pad is not in sufficient contact with the solder paste, resulting in a small tensile force of the pad and the solder paste being easily detached from the pad. Specifically, the pad structure includes a disk body 1, the disk body 1 is of a circular structure, and a through hole 11 for inserting the pins of the plug-in component is provided in the middle of the disk body 1. An annular groove 12 is provided on the end surface of the disk body 1, and the annular groove 12 coincides with the center of the through hole 11 and is sleeved outside the through hole 11;

[0020] Among them, a shielding portion 13 extends radially outward from the middle of the disk body 1, the shielding portion 13 covers above the annular groove 12, and a tin inlet channel 14 is formed between the shielding portion 13 and the distal end of the annular groove 12.

[0021] Specifically, in the present utility model, under the restriction of the shielding portion 13, the annular groove 12 and the solder inlet channel 14 form a notch structure with an L-shaped cross-section. This structure is used to store solder paste. That is, during wave soldering, the solder paste enters the above-mentioned annular groove 12 along the solder inlet channel 14. The annular groove 12 is used to store part of the solder paste and for subsequent solidification, thereby increasing the contact area with the pad, enhancing the pulling force with the pad, and avoiding the problem of solder paste dropping.

[0022] In some embodiments, the outer side edge of the shielding portion 13 in the present utility model is bent towards the bottom edge of the annular groove 12 to form a bending portion 15. The purpose of designing the bending portion 15 is to guide the solder paste when it enters, so that the solder paste can smoothly enter the annular groove 12 along the above-mentioned solder inlet channel 14. In addition, since the bending portion 15 also covers a certain height of the annular groove 12, the bending portion 15 can also play a role in blocking and limiting the entering solder paste, further enhancing the contact stability between the solder paste and the pad.

[0023] Furthermore, in this embodiment, a chamfer portion 16 is provided on the distal side edge of the disk body 1 located in the annular groove 12. The chamfer portion 16 is inclined towards the bottom edge of the annular groove 12. Obviously, those skilled in the art know that the function of the chamfer portion 16 in this embodiment is also to guide the solder paste to ensure the smooth inflow of the solder paste.

[0024] In some embodiments, a number of solder-passing holes 17 are also distributed on the end face of the shielding portion 13. As a further preference, in this embodiment, every three solder-passing holes 17 form a group, and multiple groups of solder-passing holes 17 are circumferentially distributed on the end face of the shielding portion 13 with the central axis of the disk body 1 as the center. That is to say, in this embodiment, by adopting the design of multiple solder-passing holes 17, firstly, the solder paste entering the interior of the annular groove 12 can overflow along the solder-passing holes 17 and converge with the outer solder paste. In this way, an interleaved connection form can be further formed between the solder paste and the pad, greatly enhancing the stability of solder paste solidification, and thus ensuring the welding stability of the connector.

[0025] The above is only the preferred specific embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present utility model, according to the technical solution of the present utility model and its inventive concept, makes equivalent substitutions or changes, and should be covered within the protection scope of the present utility model.

Claims

1. A PCB pad structure, comprising a pad body (1), characterized in that: A through hole (11) for inserting the pins of the connector is provided in the middle of the disk body (1), and a ring groove (12) is formed on the end face of the disk body (1). The ring groove (12) coincides with the center of the through hole (11) and is sleeved outside the through hole (11). Among them, a shielding portion (13) extends radially outward from the middle of the disk body (1), and the shielding portion (13) covers above the ring groove (12), and a solder inlet channel (14) is formed between the shielding portion (13) and the distal end of the ring groove (12).

2. The pad structure of a PCB board according to claim 1, characterized in that: The outer side edge of the shielding portion (13) is bent toward the bottom edge of the ring groove (12) to form a bending portion (15).

3. A PCB pad structure according to claim 1, wherein: A chamfer portion (16) is provided on the distal side edge of the disk body (1) where the ring groove (12) is located, and the chamfer portion (16) is inclined toward the bottom edge of the ring groove (12).

4. A PCB pad structure according to claim 1, characterized in that: A plurality of tin-permeating holes (17) are also distributed on the end face of the shielding portion (13).

5. A PCB pad structure according to claim 4, characterized in that: Every three of the tin-permeating holes (17) form a group, and multiple groups of tin-permeating holes (17) are circumferentially distributed on the end face of the shielding portion (13) with the central axis of the disk body (1) as the center of the circle.

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