Microwave plasma cleaning device and chip mounter

Abstract

The utility model discloses a microwave plasma cleaning device and a chip mounter, and the device comprises a microwave generation source, an inert gas storage assembly, and a plasma ionization assembly which is communicated with the microwave generation source through a pipeline. Wherein the microwave generation source is used for generating microwaves, the inert gas storage assembly is communicated with the plasma ionization assembly, the plasma ionization assembly comprises a shell, a nozzle and a plasma generation unit installed in the shell, the nozzle is communicated with the inert gas storage assembly, and the nozzle is communicated with the inert gas storage assembly. The plasma generation unit is used for being matched with microwaves from a microwave generation source so as to excite the spray head to generate plasmas. According to the chip mounter, a microwave plasma cleaning function is combined into the chip mounter, oxidation of a welding layer can be reduced as much as possible, the microwave plasma cleaning device is additionally arranged in the chip mounter, so that oxidation of the welding layer can be improved, the chip mounting quality can be improved, the chip performance is improved, and the chip yield is increased.

Description

Technical Field

[0001] The utility model belongs to the technical field of equipment for chip mounting, and particularly relates to a microwave plasma cleaning device and a chip mounter. Background Art

[0002] For the chip mounting of some power devices, it is necessary to bond the chip to a substrate with a solder layer printed on the surface. The solder layer is generally nano silver or nano copper. Usually, the solder layer on the substrate has been printed onto the substrate by a screen printer before entering the chip mounter. Due to the characteristics of the solder layer itself, it will be oxidized to a certain extent during the printing process and the transportation process to the chip mounter, and a certain oxide layer will be generated on the surface. This oxide layer may affect the chip mounting effect and have a greater impact on the subsequent sintering process. Ultimately, it will reduce the performance of the chip or directly lead to the scrapping of the chip.

[0003] Therefore, before bonding the chip to the substrate with a solder layer printed on the surface, it is necessary to clean the solder layer of the substrate for subsequent installation and use.

[0004] The utility model with the application number 201910003127 discloses an SMT chip mounter cleaning machine, which includes a base, a cleaning tank and a liquid storage tank. The middle part of the upper surface of the base is fixedly connected with the cleaning tank by bolts, and the upper surfaces of both sides of the cleaning tank on the base are fixedly connected with the liquid storage tank by bolts; through the second electric telescopic rod fixedly arranged on the fixing seat in the cleaning tank, when the user starts the water pump through the controller to clean the SMT chip through the nozzle, the distance between the nozzle and the SMT chip can be adjusted through the bracket. At the same time, through the motor arranged on one side of the pressing plate, the roller is driven by the motor to drive the SMT chip to change the cleaning position in the cleaning tank.

[0005] Its defect is that the above SMT chip mounter cleaning machine adopts the traditional water washing and spraying cleaning method, the oxide layer of the solder layer is not removed thoroughly enough, and the performance of the chip after chip mounting is low. At present, there is an urgent need for a chip mounter with a low process temperature, small physical sputtering, and capable of cleaning optical or thin film products. Summary of the Utility Model

[0006] Aiming at the technical problem that the existing chip mounter cleaning machine adopts the traditional water washing and spraying cleaning method and the oxide layer of the solder layer is not removed thoroughly enough, the utility model provides a microwave plasma cleaning device and a chip mounter. By adding a microwave plasma cleaning device to the chip mounter, the utility model can improve the oxidation of the solder layer on the substrate, thereby improving the chip mounting quality, further improving the performance of the chip, and increasing the chip yield.

[0007] In order to solve the above technical problems, the utility model adopts the following technical solutions:

[0008] A microwave plasma cleaning device includes a microwave generator, an inert gas storage component, and a plasma ionization component connected to the microwave generator through a pipeline;

[0009] Among them, the microwave generator is used to generate microwaves. The inert gas storage component is connected to the plasma ionization component. The plasma ionization component includes a housing, a nozzle, and a plasma generation unit installed in the housing. The nozzle is connected to the inert gas storage component. The plasma generation unit is used to cooperate with the microwaves from the microwave generator to excite the nozzle to generate plasma.

[0010] Furthermore, one end of the housing is a large end for connection and fixation, and the other end is a small end. An inert gas inlet is provided on the side of the housing, and the inert gas inlet is close to the small end.

[0011] In addition, the present utility model also claims protection for a chip mounter installed with the above-mentioned microwave plasma cleaning device. The chip mounter further includes a gantry platform, a material transfer component, a chip mounting component slidably installed on the gantry platform, and a base provided under the gantry platform;

[0012] Among them, the gantry platform includes two rail devices arranged in parallel on the base, and a moving cross beam located between the two rail devices. The two ends of the moving cross beam are slidably matched with the rail devices. Driving devices for driving the moving cross beam to move along the length direction of the rail devices are installed on the two rail devices. The material transfer component is used to move the substrate to be processed, and the chip mounting component is used to process the substrate from the material transfer component.

[0013] Furthermore, the housing of the microwave plasma cleaning device is installed on one side of the rail device, and the housing of the microwave plasma cleaning device is located upstream of the material transfer component.

[0014] Furthermore, the material transfer device is located between the two rail devices. The material transfer device includes a conveyor belt structure and a substrate placement plate placed on the upper part of the conveyor belt structure. The conveyor belt structure is fixed to the upper part of the base through a mounting frame.

[0015] Furthermore, the housing of the microwave plasma cleaning device further includes a laser sensor. The laser sensor is fixed on the side of the housing facing the material transfer component. The laser sensor is used to detect whether the solder layer on the substrate is directly below the nozzle.

[0016] Furthermore, the middle part of the base is a hollow structure, and the middle part of the base is used to place the microwave generator.

[0017] Further, the chip mounting component is mounted on the moving cross beam. The chip mounting component is used to attach the chip to the solder layer of the substrate, and the chip mounting component is located above the conveyor belt structure.

[0018] Further, a chip picking station is also provided on the base. The chip picking station is used to place the processed chips, and the chip picking station is arranged near the material transmission component.

[0019] Compared with the prior art, the beneficial effects of this solution are as follows:

[0020] The chip mounter of the present invention is equipped with a microwave plasma cleaning device, including a microwave generating source, an inert gas storage component, and a plasma ionization component communicated with the microwave generating source through a pipeline. Microwaves corresponding to the plasma wavelength are generated by the microwave generating source and reach the nozzle part through the transmission pipeline, thereby exciting the nozzle to generate plasma. Finally, the plasma is sprayed onto the surface of the substrate to be cleaned through the inert gas connected to the nozzle. The inert gas can prevent the surface of the substrate from being oxidized again.

[0021] The present invention combines the microwave plasma cleaning function into the chip mounter, which can minimize the oxidation of the solder layer on the substrate. By adding a microwave plasma cleaning device to the chip mounter, the present invention can improve the oxidation of the solder layer, thereby improving the quality of chip mounting, further enhancing the performance of the chip, and increasing the chip yield. Description of the Drawings

[0022] Figure 1 Schematic structural diagram of the chip mounter of the present invention;

[0023] Figure 2 Another schematic structural diagram of the chip mounter of the present invention;

[0024] Figure 3 Front view of the chip mounter of the present invention;

[0025] Figure 4 Schematic structural diagram of a kind of plasma ionization component;

[0026] Figure 5 Another schematic structural diagram of the plasma ionization component.

[0027] Reference numerals are as follows: microwave plasma cleaning device 1, microwave generating source 11, plasma ionization component 12, housing 3, large end 31, small end 32, gas injection hole 33, laser sensor 34, inert gas inlet 35, gantry platform 4, moving cross beam 41, chip mounting component 42, slide rail device 43, material transmission component 5, base 6, chip picking station 61. Detailed Embodiments

[0028] The present invention will be described in further detail below with reference to the accompanying drawings.

[0029] A microwave plasma cleaning device comprises a microwave generating source, an inert gas storage component and a plasma ionization component connected to the microwave generating source through a pipeline;

[0030] Wherein, the microwave generating source is used to generate microwaves, and the inert gas storage component is connected to the plasma ionization component, such as Figure 4 and Figure 5 As shown, the plasma ionization assembly includes a shell, a nozzle and a plasma generating unit installed in the shell. The nozzle is connected to the inert gas storage assembly. The plasma generating unit is used to cooperate with microwaves from a microwave generating source to excite the nozzle to generate plasma.

[0031] According to a specific embodiment provided by the present invention, the placement machine of the present invention is equipped with a microwave plasma cleaning device on the gantry. Microwaves of a corresponding plasma wavelength are generated by a microwave generator and reach the nozzle part through a transmission pipe, thereby exciting the nozzle to generate plasma. Finally, the plasma is sprayed onto the surface of the substrate for cleaning through an inert gas connected to the nozzle. The inert gas can prevent the surface of the substrate from being oxidized again. The inert gas can be nitrogen, which is stored in an inert gas storage component. The inert gas storage component can be a nitrogen tank.

[0032] Plasma cleaning equipment, also known as plasma cleaning machines or plasma surface treatment equipment, is a new high-tech technology that utilizes plasma to achieve results unattainable by conventional cleaning methods. Plasma is a state of matter, also known as the fourth state of matter, distinct from the three common states of solid, liquid, and gas. Plasma is formed when sufficient energy is applied to a gas to ionize it. The "active" components of a plasma include ions, electrons, atoms, reactive groups, excited nuclides (metastable states), and photons. Plasma cleaning machines utilize the properties and physical effects of these active components to treat sample surfaces, achieving cleaning, coating, and other purposes.

[0033] The utility model combines the microwave plasma cleaning function with the chip placement machine of power devices, which can reduce the oxidation of the solder layer as much as possible. The utility model improves the oxidation of the solder layer by adding a microwave plasma cleaning device to the chip placement machine, thereby improving the quality of the chip placement, thereby improving the performance of the chip and increasing the chip yield.

[0034] Furthermore, one end of the shell is a large end for connection and fixation, and the other end is a small end. An inert gas inlet is provided on the side of the shell, and the inert gas inlet is close to the small end. An air jet hole is provided on the side of the small end toward the base to facilitate plasma ejection.

[0035] In addition, the present utility model also claims protection for a mounter, as Figures 1-3 shown, which is equipped with the above-mentioned microwave plasma cleaning device. The mounter further includes a gantry platform, a material transmission component, a chip mounting component slidably mounted on the gantry platform, and a base disposed below the gantry platform;

[0036] Among them, the gantry platform includes two rail devices arranged parallel to each other on the base, and a moving crossbeam located between the two rail devices. The two ends of the moving crossbeam are slidably engaged with the rail devices, and a driving device for driving the moving crossbeam to move along the length direction of the rail devices is installed on the two rail devices. The material transmission component is used to move the substrate to be processed, and the chip mounting component is used to process the substrate from the material transmission component.

[0037] According to a specific embodiment provided by the present utility model, the housing is horizontally arranged. The gantry platform is used to provide sliding power to the moving crossbeam. The chip mounting component is mounted on the moving crossbeam and is used to attach the chip to the substrate. The chip mounting component is located above the conveyor belt structure. In this way, the chip mounting component on the moving crossbeam can move along the rail device driven by the rail device. The transportation direction of the material transmission component is parallel to the length direction of the moving crossbeam. The lower part of the gantry platform is fixed on the base. Specifically, the gantry platform includes two rail devices arranged parallel to each other on the base. The rail device can adopt an existing track structure. The two ends of the moving crossbeam are slidably engaged with the rail device, and the driving device can adopt a mature existing structure such as a linear motor.

[0038] Furthermore, the housing of the microwave plasma cleaning device is installed on one side of the rail device. The length direction of the housing is arranged along the transportation direction of the material transmission component. The housing is located directly above the material transmission component, and the housing of the microwave plasma cleaning device is located at the upstream position of the material transmission component. In this way, the substrate on the material transmission component can be first cleaned by the microwave plasma cleaning device and then undergo chip mounting.

[0039] Furthermore, the specific structure of a material transmission device is disclosed in this embodiment. The material transmission device is located between the two rail devices. The material transmission device includes a conveyor belt structure and a substrate placement plate placed on the upper part of the conveyor belt structure. The conveyor belt structure is fixed to the upper part of the base through a mounting frame. The specific shapes of the conveyor belt structure and the mounting frame are not limited in this embodiment. The conveyor belt structure can use an existing structure, and the mounting frame is based on the standard that it can mount the conveyor belt structure.

[0040] Further, the housing of the microwave plasma cleaning device further includes a laser sensor, which is fixed on the side of the housing facing the material transfer component. The laser sensor is used to detect whether the solder layer on the substrate is directly below the nozzle. In this way, the microwave plasma cleaning device will only be started when the solder layer on the substrate is detected directly below the nozzle.

[0041] Further, the middle part of the base is a hollow structure, and the middle part of the base is used to place the microwave generator.

[0042] Further, a material taking station is also arranged on the base. The material taking station is used to place the chips to be bonded, and the material taking station is arranged near the material transfer component.

[0043] Using a chip mounter, the chip mounting process includes the following steps:

[0044] (a) Prepare the substrate. The substrate placement plate containing the substrate is transported into the chip mounter through the material transfer component. When the solder layer of the substrate is directly below the nozzle, the material transfer component stops running;

[0045] (b) Clean the substrate. Turn on the microwave generator to generate microwaves. Open the valve of the inert gas storage component. The nozzle generates plasma and sprays it onto the position of the solder layer of the substrate for cleaning;

[0046] (c) Start chip mounting. The material transfer component starts to run, transports the substrate placement plate to the chip mounting component, and moves the chips to be bonded placed at the material taking station to the solder layer of the substrate through the chip mounting component for chip mounting.

[0047] Finally, it should be noted that: in the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "vertical", "upper", "lower", "horizontal", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention.

[0048] In the description of the present invention, it should also be noted that unless otherwise clearly specified and limited, the terms "set", "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0049] The above are only the preferred embodiments of the present utility model and are not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present utility model shall be included within the protection scope of the present utility model.

Claims

1. A microwave plasma cleaning device, characterized in that: It includes a microwave generating source, an inert gas storage component, and a plasma ionization component communicated with the microwave generating source through a pipeline; Among them, the microwave generating source is used to generate microwaves. The inert gas storage component is communicated with the plasma ionization component. The plasma ionization component includes a housing, a nozzle, and a plasma generating unit installed in the housing. The nozzle is communicated with the inert gas storage component. The plasma generating unit is used to cooperate with the microwaves from the microwave generating source to excite the nozzle to generate plasma.

2. The microwave plasma cleaning device according to claim 1, characterized in that: One end of the housing is a large end for connection and fixation, and the other end is a small end. An inert gas inlet is provided on the side of the housing, and the inert gas inlet is close to the small end.

3. A mounter, characterized in that: A microwave plasma cleaning device according to claim 1 or 2 is installed. The mounter further includes a gantry platform, a material transfer component, a chip mounting component slidably mounted on the gantry platform, and a base provided below the gantry platform; Among them, the gantry platform includes two rail devices arranged parallel to each other on the base, and a moving cross beam located between the two rail devices. The two ends of the moving cross beam are slidably matched with the rail devices. A driving device for driving the moving cross beam to move along the length direction of the rail devices is installed on the two rail devices. The material transfer component is used to move the substrate to be processed, and the chip mounting component is used to process the substrate from the material transfer component.

4. The mounter according to claim 3, characterized in that: The housing of the microwave plasma cleaning device is installed on one side of the rail device, and the housing of the microwave plasma cleaning device is located upstream of the material transfer component.

5. A mounter according to claim 3 or 4, characterized in that: The material transfer device is located between the two rail devices. The material transfer device includes a conveyor belt structure and a substrate placement plate placed on the upper part of the conveyor belt structure. The conveyor belt structure is fixed to the upper part of the base through a mounting frame.

6. The pick-and-place machine according to claim 5, wherein: The housing of the microwave plasma cleaning device further includes a laser sensor. The laser sensor is fixed on the side of the housing facing the material transfer component. The laser sensor is used to detect whether the solder layer on the substrate is directly below the nozzle.

7. A mounter according to claim 3 or 6, characterized in that, The middle part of the base is a hollow structure, and the middle part of the base is used to place the microwave generating source.

8. A mounter according to claim 7, characterized in that, The chip mounting component is installed on the moving cross beam. The chip mounting component is used to attach the chip to the solder layer of the substrate. The chip mounting component is located above the conveyor belt structure.

9. A mounter according to claim 8, characterized in that, A material taking station is further provided on the base. The material taking station is used to place the chips to be attached. The material taking station is arranged close to the material transfer component.

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