Grinding equipment for processing single crystal wafer

Abstract

The utility model relates to the technical field of precision machining, and discloses a grinding device for processing a single crystal wafer, which comprises a grinding box, a box body is fixedly arranged at the top of the grinding box, a limiting pipe is movably arranged in the box body, a spring II is fixedly arranged between the limiting pipe and the box body, and the spring II is fixedly arranged on the box body. A second motor is fixedly installed on the left side of the box body, and a cam is fixedly installed at the output end of the second motor. Compared with the traditional equipment, the equipment has the advantages that the cam, the limiting pipe, the motor II and the spring II are matched, so that cooling liquid indirectly flows into the top of the grinding head through the water outlet pipe, the thermal stress caused by heat generated by friction and cutting can be effectively reduced, the dimensional stability and precision of the grinding head are kept, and the service life of the grinding head is prolonged. Therefore, the processing precision of the single crystal wafer is improved; and meanwhile, the temperature of a grinding area can be remarkably reduced, single crystal wafer hot cracks caused by high temperature are avoided, and the surface quality is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of precision machining, and more specifically, the utility model relates to a grinding device for single wafer machining. Background Art

[0002] A grinding device for single wafer machining is a mechanical device specifically designed for high-precision planar grinding and polishing of single wafers (such as silicon wafers, germanium wafers, etc.). These devices play a crucial role in fields such as semiconductor manufacturing, optoelectronic technology, and microelectronic packaging, and are used to improve the surface quality of single wafers to achieve the required flatness, surface finish, and dimensional accuracy. During the planar grinding process of the existing single wafer master wafer, the high temperature problem caused by the intense friction between the grinding head and the single wafer cannot be ignored. It not only easily leads to defects such as grinding cracks, blasting, and stress concentration in the single wafer, significantly increasing the defective product rate, but also increases the grinding working hours and electricity consumption, driving up the production cost. At the same time, frequent high-temperature operations accelerate the wear and depreciation of the grinding device. Summary of the Utility Model

[0003] In order to overcome the deficiencies of the prior art, the utility model provides a grinding device for single wafer machining, which has the advantage of facilitating continuous cooling of the grinding head.

[0004] To achieve the above object, the utility model provides the following technical solution: A grinding device for single wafer machining, including a grinding box, a box body is fixedly installed on the top of the grinding box, a limiting tube is movably installed inside the box body, a second spring is fixedly installed between the limiting tube and the box body, a second motor is fixedly installed on the left side of the box body, an output end of the second motor is fixedly installed with a cam, and the cam is movable inside the box body, a water outlet pipe is fixedly installed at the bottom of the box body, and the water outlet pipe penetrates through the inside of the grinding box;

[0005] A second support column is fixedly installed on the top of the grinding box, a water tank is fixedly installed on the top of the second support column, a sliding groove is fixedly installed between the water tank and the box body, and a grinding mechanism is fixedly installed inside the grinding box.

[0006] As a preferred technical solution of the utility model, a first motor is fixedly installed at the bottom of the grinding box, an output end of the first motor is fixedly installed with a rotating table, a sliding groove is opened inside the rotating table, a sleeve block is movably installed inside the sliding groove, a bidirectional lead screw is threadedly sleeved inside the sleeve block, and both ends of the bidirectional lead screw penetrate through the inside of the rotating table, one end of the bidirectional lead screw is fixedly installed with a turntable, and a handrail is fixedly installed on the outer surface of the turntable;

[0007] A moving plate is fixedly installed at the top of the sleeve block. A telescopic rod is fixedly installed inside the moving plate. One end of the telescopic rod is fixedly installed with an arc-shaped clamping block. A first spring is fixedly installed between the arc-shaped clamping block and the moving plate. A glass door is movably installed on the front of the grinding box. A door handle is fixedly installed on the front of the glass door.

[0008] As a preferred technical solution of the present utility model, the grinding mechanism is fixedly installed inside the grinding box. The grinding mechanism includes a servo motor fixed to the top of the grinding box. The output end of the servo motor is fixedly installed with a cylinder. The bottom of the cylinder is fixedly installed with a grinding head.

[0009] As a preferred technical solution of the present utility model, a first support column is fixedly installed on the top of the grinding box. The top of the first support column is fixedly installed with a support cover.

[0010] As a preferred technical solution of the present utility model, a motor protection cover is fixedly installed on the outer surface of the first motor. Heat dissipation holes are formed inside the motor protection cover, and the heat dissipation holes are arranged in a circumferential array.

[0011] As a preferred technical solution of the present utility model, columns are fixedly installed at the bottom of the grinding box. The bottom of the columns is fixedly installed with a base, and the base and the columns are grouped in pairs, with a total of four groups at the bottom of the grinding box.

[0012] As a preferred technical solution of the present utility model, an anti-slip pad is fixedly installed inside the arc-shaped clamping block, and the anti-slip pad is made of rubber material.

[0013] Compared with the prior art, the beneficial effects of the present utility model are as follows:

[0014] 1. Compared with traditional equipment, through the cooperation between the cam, the limit tube, the second motor and the second spring, the present utility model facilitates the indirect inflow of the coolant to the top of the grinding head through the water outlet pipe, which can effectively reduce the thermal stress caused by the heat generated by friction and cutting, maintain the dimensional stability and precision of the grinding head, thereby improving the processing precision of the single crystal wafer; at the same time, it can significantly reduce the temperature in the grinding area, avoid the thermal cracks of the single crystal wafer caused by high temperature, ensure the surface quality, and the continuous cooling can also extend the service life of the grinding head, slow down the wear process accelerated by high temperature, and maintain the hardness of the grinding head material to ensure the lasting stability of the grinding performance.

[0015] 2. Compared with traditional equipment, this utility model drives the arc-shaped clamping block to limit and clamp the single crystal wafer through the cooperation between the sleeve block and the moving plate, ensuring that the single crystal wafer is evenly stressed, improving the clamping stability. Regardless of the shape of the single crystal wafer, precise fixation can be achieved, guaranteeing the processing accuracy. At the same time, the direct contact area with the single crystal wafer is reduced, effectively reducing the risk of surface damage and scratches, protecting precious materials, meeting the requirements of high-precision processing. Combined with a precision positioning mechanism, the single crystal wafer can be positioned quickly and accurately, shortening the preparation time and improving the overall processing efficiency. Its design is convenient for cleaning and maintenance, reducing dust residue, keeping the equipment clean, prolonging the service life of the clamping block, and reducing operating costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a front three-dimensional external structure schematic diagram of this utility model;

[0017] Figure 2 is a schematic diagram of the internal structure of the grinding box of this utility model;

[0018] Figure 3 is a schematic cross-sectional structure diagram of the grinding box of this utility model;

[0019] Figure 4 is a schematic diagram of the clamping block mechanism of this utility model;

[0020] Figure 5 is a schematic cross-sectional structure diagram of the connecting pipe of this utility model.

[0021] In the figure: 1. Grinding box; 2. Glass door; 3. Door handle; 4. First support column; 5. Servo motor; 6. Water tank; 7. Column; 8. Base; 9. First motor; 10. Motor protection cover; 11. Heat dissipation holes; 12. Rotating table; 13. Cylinder; 14. Grinding head; 15. Water outlet pipe; 16. Support cover; 17. Sleeve block; 18. Moving plate; 19. First spring; 20. Telescopic rod; 21. Arc-shaped clamping block; 22. Anti-slip pad; 23. Bidirectional lead screw; 24. Turntable; 25. Handrail; 26. Chute; 27. Second motor; 28. Box body; 29. Second support column; 30. Second spring; 31. Cam; 32. Limit pipe. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0022] Next, the technical solutions in the embodiments of this utility model will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, rather than all of the embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of this utility model.

[0023] As Figures 1 to 5As shown in the figure, the utility model provides a grinding device for single wafer processing, which includes a grinding box 1. A box body 28 is fixedly installed on the top of the grinding box 1. A limiting tube 32 is movably installed inside the box body 28. A second spring 30 is fixedly installed between the limiting tube 32 and the box body 28. A second motor 27 is fixedly installed on the left side of the box body 28. The output end of the second motor 27 is fixedly installed with a cam 31, and the cam 31 is movably inside the box body 28. A water outlet pipe 15 is fixedly installed at the bottom of the box body 28, and the water outlet pipe 15 penetrates into the inside of the grinding box 1;

[0024] A second support column 29 is fixedly installed on the top of the grinding box 1. A water tank 6 is fixedly installed on the top of the second support column 29. A sliding groove 26 is fixedly installed between the water tank 6 and the box body 28. A grinding mechanism is fixedly installed inside the grinding box 1.

[0025] When the staff needs to cool down the grinding head 14 during long-term work, first fill the water tank 6 with coolant. At this time, the coolant enters the inside of the sliding groove 26 through the water tank 6. Then turn on the second motor 27, drive the cam 31 to rotate through the second motor 27, and squeeze the limiting tube 32 through the cam 31, and squeeze the second spring 30 through the limiting tube 32, so that the sliding groove 26, the limiting tube 32 and the water outlet pipe 15 do not coincide. At this time, the coolant cannot enter the inside of the limiting tube 32 through the sliding groove 26. When the cam 31 does not squeeze the limiting tube 32, at this time, the limiting tube 32 is squeezed by the second spring 30, so that the limiting tube 32, the sliding groove 26 and the water outlet pipe 15 coincide. Now the coolant enters the inside of the limiting tube 32 through the sliding groove 26, and then enters the inside of the water outlet pipe 15 through the limiting tube 32. The coolant is discharged through the water outlet pipe 15 to cool down the grinding head 14, thus completing the cooling of the grinding head 14.

[0026] It is necessary to cool down the grinding head 14 during long-term operation. The coolant enters the inside of the chute 26 through the water tank 6, and then the second motor 27 is turned on. The second motor 27 drives the cam 31 to rotate. By squeezing the limiting tube 32 through the cam 31, the spring two 30 is squeezed through the limiting tube 32, so that the chute 26, the limiting tube 32 and the water outlet pipe 15 do not coincide. At this time, the coolant cannot enter the inside of the limiting tube 32 through the chute 26. When the cam 31 does not squeeze the limiting tube 32, the spring two 30 squeezes the limiting tube 32 at this time, so that the limiting tube 32, the chute 26 and the water outlet pipe 15 coincide. Now the coolant enters the inside of the limiting tube 32 through the chute 26, and then enters the inside of the water outlet pipe 15 through the limiting tube 32. The coolant discharged through the water outlet pipe 15 cools down the grinding head 14 inside. Compared with traditional equipment, through the cooperation between the cam 31, the limiting tube 32, the second motor 27 and the spring two 30, this equipment facilitates the indirect flow of the coolant into the top of the grinding head 14 through the water outlet pipe 15, which can effectively reduce the thermal stress caused by the heat generated by friction and cutting, maintain the dimensional stability and accuracy of the grinding head, and thus improve the processing accuracy of the single crystal wafer. At the same time, it can also significantly reduce the temperature in the grinding area, avoid thermal cracks in the single crystal wafer caused by high temperature, ensure the surface quality, and the continuous cooling can also extend the service life of the grinding head, slow down the wear process accelerated by high temperature, and maintain the hardness of the grinding head material, ensuring the lasting stability of the grinding performance.

[0027] Wherein, a first motor 9 is fixedly installed at the bottom of the grinding box 1, the output end of the first motor 9 is fixedly installed with a rotating table 12, a chute 26 is opened inside the rotating table 12, a sleeve block 17 is movably installed inside the chute 26, a bidirectional lead screw 23 is threadedly sleeved inside the sleeve block 17, and both ends of the bidirectional lead screw 23 penetrate through the inside of the rotating table 12. One end of the bidirectional lead screw 23 is fixedly installed with a turntable 24, and a handrail 25 is fixedly installed on the outer surface of the turntable 24;

[0028] The top of the sleeve block 17 is fixedly installed with a moving plate 18, the inner side of the moving plate 18 is fixedly installed with a telescopic rod 20, one end of the telescopic rod 20 is fixedly installed with an arc-shaped clamping block 21, a first spring 19 is fixedly installed between the arc-shaped clamping block 21 and the moving plate 18, a glass door 2 is movably installed on the front of the grinding box 1, and a doorknob 3 is fixedly installed on the front of the glass door 2.

[0029] Before grinding the single crystal wafer, it is necessary to position and clamp the single crystal wafer. Hold the door handle 3 by hand, and drive the glass door 2 through the door handle 3 to open the interior of the grinding box 1. Then, place the single crystal wafer on the top of the rotating table 12. Now, hold the handrail 25 and rotate it. Drive the turntable 24 to rotate through the handrail 25. Drive the bidirectional lead screw 23 to rotate inside the sleeve block 17 through the turntable 24, so that the two sleeve blocks 17 move towards the outer surface of the single crystal wafer. Then, drive the moving plate 18 to move through the sleeve block 17. Drive the telescopic rod 20 and the first spring 19 to move synchronously through the moving plate 18. Drive the arc-shaped clamping block 21 to move through the first spring 19 and the telescopic rod 20. Position and clamp the single crystal wafer through the arc-shaped clamping block 21, thus completing the positioning and clamping of the single crystal wafer.

[0030] Before grinding the single crystal wafer, it is necessary to position and clamp the single crystal wafer. Hold the door handle 3 by hand, and drive the glass door 2 through the door handle 3 to open the interior of the grinding box 1. Then, place the single crystal wafer on the top of the rotating table 12. Now, hold the handrail 25 and rotate it. Drive the turntable 24 to rotate through the handrail 25. Drive the bidirectional lead screw 23 to rotate inside the sleeve block 17 through the turntable 24, so that the two sleeve blocks 17 move towards the outer surface of the single crystal wafer. Then, drive the moving plate 18 to move through the sleeve block 17. Drive the telescopic rod 20 and the first spring 19 to move synchronously through the moving plate 18. Drive the arc-shaped clamping block 21 to move through the first spring 19 and the telescopic rod 20. Position and clamp the single crystal wafer through the arc-shaped clamping block 21. Compared with traditional equipment, this equipment drives the arc-shaped clamping block 21 to position and clamp the single crystal wafer through the cooperation between the sleeve block 17 and the moving plate 18. In this way, the single crystal wafer ensures uniform force, improves clamping stability, can achieve precise fixation regardless of the shape of the single crystal wafer, guarantees processing accuracy. At the same time, it reduces the direct contact area with the single crystal wafer, effectively reduces the risk of surface damage and scratches, protects precious materials, meets the requirements of high-precision processing. Combined with a precision positioning mechanism, it quickly and accurately completes the positioning of the single crystal wafer, shortens the preparation time, improves the overall processing efficiency. Its design is convenient for cleaning and maintenance, reduces dust residue, keeps the equipment clean, extends the service life of the clamping block, and reduces operating costs.

[0031] Among them, the grinding mechanism is fixedly installed inside the grinding box 1. The grinding mechanism includes a servo motor 5 fixed on the top of the grinding box 1. The output end of the servo motor 5 is fixedly installed with a cylinder 13. The bottom of the cylinder 13 is fixedly installed with a grinding head 14.

[0032] The staff turns on the cylinder 13, and the cylinder 13 pushes the grinding head 14 to slowly descend. When the grinding head 14 contacts the single crystal wafer, the servo motor 5 is turned on, and the servo motor 5 drives the cylinder 13 and the grinding head 14 to rotate inside the grinding box 1. The single crystal wafer is ground by the grinding head 14, which facilitates the rapid grinding of the single crystal wafer, improves the grinding efficiency of the single crystal wafer, and improves the processing efficiency of the single crystal wafer.

[0033] Among them, a first support column 4 is fixedly installed on the top of the grinding box 1, and a support cover 16 is fixedly installed on the top of the first support column 4.

[0034] Through the cooperation between the first support column 4 and the support cover 16, it is convenient to provide support for the servo motor 5, avoid the shaking of the servo motor 5 during use, and improve the stability of the servo motor 5 during use.

[0035] Among them, a motor protection cover 10 is fixedly installed on the outer surface of the first motor 9, heat dissipation holes 11 are opened inside the motor protection cover 10, and the heat dissipation holes 11 are in a circumferential array form.

[0036] Since the heat dissipation holes 11 are in a circumferential array form inside the motor protection cover 10, it is convenient to dissipate heat from the first motor 9 through the heat dissipation holes 11, ensure the stability of the first motor 9 during use, and improve the use efficiency of the first motor 9.

[0037] Among them, a column 7 is fixedly installed at the bottom of the grinding box 1, a base 8 is fixedly installed at the bottom of the column 7, and the base 8 and the column 7 are in pairs, with a total of four groups at the bottom of the grinding box 1.

[0038] Since the base 8 and the column 7 are in pairs and there are a total of four groups at the bottom of the grinding box 1, through the cooperation between the column 7 and the base 8, it is convenient to support the grinding box 1, reduce the shaking of the grinding box 1 during operation, and ensure the efficiency of the grinding box 1 during use.

[0039] Among them, an anti-slip pad 22 is fixedly installed on the inner side of the arc-shaped clamping block 21, and the anti-slip pad 22 is made of rubber material.

[0040] Since the anti-slip pad 22 is made of rubber material inside the arc-shaped clamping block 21, it is convenient to increase the friction between the anti-slip pad 22 and the single crystal wafer, facilitate the rapid positioning and fixing of the single crystal wafer, and improve the efficiency of positioning and fixing the single crystal wafer.

[0041] The working principle and usage process of the present utility model:

[0042] The staff needs to cool down the grinding head 14 during long-term operation. First, fill the water tank 6 with coolant. At this time, the coolant enters the inside of the chute 26 through the water tank 6. Then, turn on the second motor 27, and drive the cam 31 to rotate through the second motor 27. Then, squeeze the limiting tube 32 through the cam 31, and squeeze the second spring 30 through the limiting tube 32, so that the chute 26, the limiting tube 32, and the water outlet pipe 15 do not coincide. At this time, the coolant cannot enter the inside of the limiting tube 32 through the chute 26. When the cam 31 does not squeeze the limiting tube 32, at this time, squeeze the limiting tube 32 through the second spring 30, so that the limiting tube 32, the chute 26, and the water outlet pipe 15 coincide. Now, the coolant enters the inside of the limiting tube 32 through the chute 26, and then enters the inside of the water outlet pipe 15 through the limiting tube 32. The coolant is discharged through the water outlet pipe 15 to cool down the grinding head 14, thus completing the cooling of the grinding head 14.

[0043] It should be noted that before grinding a single crystal wafer, the staff needs to limit, clamp, and fix the single crystal wafer. Hold the door handle 3 by hand, and drive the glass door 2 to open the inside of the grinding box 1 through the door handle 3. Then, place the single crystal wafer on the top of the rotating table 12. Now, hold the handrail 25 and rotate it. Drive the turntable 24 to rotate through the handrail 25, drive the bidirectional lead screw 23 to rotate inside the sleeve block 17 through the turntable 24, so that the two sleeve blocks 17 move towards the outer surface of the single crystal wafer. Then, drive the moving plate 18 to move through the sleeve block 17, drive the telescopic rod 20 and the first spring 19 to move synchronously through the moving plate 18, and drive the arc-shaped clamping block 21 to move through the first spring 19 and the telescopic rod 20. Limit, clamp, and fix the single crystal wafer through the arc-shaped clamping block 21, thus completing the limit, clamping, and fixing of the single crystal wafer.

[0044] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device.

[0045] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A grinding device for single-wafer processing, comprising a grinding box (1), characterized in that: A box body (28) is fixedly installed at the top of the grinding box (1). A limiting pipe (32) is movably installed inside the box body (28). A second spring (30) is fixedly installed between the limiting pipe (32) and the box body (28). A second motor (27) is fixedly installed on the left side of the box body (28). The output end of the second motor (27) is fixedly installed with a cam (31), and the cam (31) is movably installed inside the box body (28). A water outlet pipe (15) is fixedly installed at the bottom of the box body (28), and the water outlet pipe (15) penetrates through the inside of the grinding box (1). A second support column (29) is fixedly installed at the top of the grinding box (1). A water tank (6) is fixedly installed at the top of the second support column (29). A sliding groove (26) is fixedly installed between the water tank (6) and the box body (28). A grinding mechanism is fixedly installed inside the grinding box (1).

2. The lapping device for single wafer processing according to claim 1, wherein: A first motor (9) is fixedly installed at the bottom of the grinding box (1). The output end of the first motor (9) is fixedly installed with a rotating table (12). A sliding groove (26) is formed inside the rotating table (12). A sleeve block (17) is movably installed inside the sliding groove (26). A bidirectional lead screw (23) is threadedly sleeved inside the sleeve block (17), and both ends of the bidirectional lead screw (23) penetrate through the inside of the rotating table (12). One end of the bidirectional lead screw (23) is fixedly installed with a turntable (24). A handrail (25) is fixedly installed on the outer surface of the turntable (24). A moving plate (18) is fixedly installed at the top of the sleeve block (17). A telescopic rod (20) is fixedly installed inside the moving plate (18). An arc-shaped clamping block (21) is fixedly installed at one end of the telescopic rod (20). A first spring (19) is fixedly installed between the arc-shaped clamping block (21) and the moving plate (18). A glass door (2) is movably installed on the front surface of the grinding box (1). A door handle (3) is fixedly installed on the front surface of the glass door (2).

3. A grinding device for single wafer processing according to claim 1, characterized in that: The grinding mechanism is fixedly installed inside the grinding box (1). The grinding mechanism includes a servo motor (5) fixed at the top of the grinding box (1). The output end of the servo motor (5) is fixedly installed with a cylinder (13). A grinding head (14) is fixedly installed at the bottom of the cylinder (13).

4. A grinding device for single wafer processing according to claim 1, characterized in that: A first support column (4) is fixedly installed at the top of the grinding box (1). A support cover (16) is fixedly installed at the top of the first support column (4).

5. The lapping equipment for single wafer processing according to claim 2, wherein: A motor protection cover (10) is fixedly installed on the outer surface of the first motor (9). Heat dissipation holes (11) are formed inside the motor protection cover (10), and the heat dissipation holes (11) are arranged in a circumferential array.

6. The lapping equipment for single wafer processing according to claim 1, characterized in that: A column (7) is fixedly installed at the bottom of the grinding box (1). A base (8) is fixedly installed at the bottom of the column (7), and the base (8) and the column (7) are grouped in pairs, with a total of four groups at the bottom of the grinding box (1).

7. A grinding device for single wafer processing according to claim 2, characterized in that: An anti-slip pad (22) is fixedly installed on the inner side of the arc-shaped clamping block (21), and the anti-slip pad (22) is made of rubber material.

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