Silicon wafer blow-drying device
By setting the first and second air knife on the silicon wafer transmission path, the blow-dry dead angle problem caused by silicon wafer offset is solved, and a comprehensive silicon wafer blow-drying effect is achieved.
Patent Information
- Application Number
- CN202422469231.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-12
- Publication Date
- 2025-08-01
- Estimated Expiration
- 2034-10-12
AI Technical Summary
During the transmission process of silicon wafers, some silicon wafers cannot be blown by the wind of the wind knife due to offset, affecting the drying effect.
The first air knife and the second air knife arranged along the length direction of the silicon wafer transmission path are adopted. The first air knife has n+1 air outlets in the width direction, and the second air knife has n air outlets in the width direction. The second air outlet can sweep through the area between the two adjacent first air outlets one by one to ensure that the entire silicon wafer passes within the air outlet range.
Even if the silicon wafer is offset on the transmission path, it can still ensure that the entire silicon wafer passes within the air outlet range, ensure the blow-drying effect, and avoid blow-drying blind spots.
Smart Images
Figure CN223179230U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of wafer drying, and particularly provides a wafer drying device. Background Art
[0002] In the production process of solar cells, wafers need to be dried after being processed and cleaned through specific processes. Usually, during the process of the wafer being conveyed by a conveying device, an air knife above the wafer conveying device blows air at the wafer to dry the wafer.
[0003] With the continuous increase of production capacity requirements, the width of the conveying device is getting wider and the number of wafers conveyed by the conveying device is increasing. To adapt to the increase in the width of the conveying equipment, it is necessary to increase the blowing width of the air knife. To avoid deformation of the air knife outlet structure due to excessive length dimension of the air knife outlet (i.e., the dimension along the width direction of the conveying device), the length of the air knife outlet is usually limited. To increase the blowing width of the air knife, an air knife with a length equivalent to the width of the conveying device is arranged above the conveying device. A plurality of strip-shaped air outlets are arranged in sequence along the length direction of the lower part of the air knife housing, or a plurality of air knives are arranged in sequence along the width direction above the conveying device, and a strip-shaped air outlet is arranged at the lower part of the housing of each air knife. The air inlet of the air knife is communicated with the air outlet of the fan. The wafers are first placed on the loading conveyor belt, and then the loading conveyor belt transports the wafers to the conveying device. The conveying device conveys multiple columns of wafers to move horizontally along its conveying direction, and the air flow generated by the fan is conveyed to the air knife and blown at the wafers on the conveying device through the air outlets of the air knife. Among them, the conveying path of the loading conveyor belt is perpendicular to the conveying path of the conveying device.
[0004] The loading conveyor belt is usually driven by a stepping motor, and the stepping motor is prone to losing steps. As a result, the wafers transported by the loading conveyor belt to the conveying device cannot be maintained in a specific position, and some wafers on the conveying device are likely to shift to the lower part of the part between two adjacent air outlets, and at least part of the chamfered parts of these wafers cannot be blown by the air blown out of the air outlets, and the expected air drying effect cannot be achieved.
[0005] Therefore, a new technical solution is needed in the art to solve the above problems. Summary of the Utility Model
[0006] The utility model aims to solve the above technical problems, that is, to solve the problem that at least part of the chamfered parts of the wafers on the conveying device cannot be blown by the air of the air knife due to offset.
[0007] The utility model provides a silicon wafer drying device, which includes a first air knife and a second air knife arranged along the length direction of the conveying path of the silicon wafer, and an air supply device for supplying air to the first air knife and the second air knife. Both the first air knife and the second air knife extend along the width direction of the conveying path. The first air knife has n + 1 first air outlets extending and arranged along the width direction of the conveying path, and the second air knife has n second air outlets extending and arranged along the width direction of the conveying path. The n second air outlets can sweep, one by one, the area on the conveying path that is swept by the part between two adjacent first air outlets; where n is a positive integer.
[0008] In a preferred technical solution of the above silicon wafer drying device, the first air knife includes a first housing, and n + 1 first cavities are formed in the first housing. The first cavities are communicated with the outlet of the air supply device, and n + 1 first air outlets are formed on the first housing. The n + 1 first air outlets are communicated with the n + 1 first cavities in a one-to-one correspondence.
[0009] In a preferred technical solution of the above silicon wafer drying device, the first air knife includes n + 1 first sub-air knives. The n + 1 first sub-air knives are arranged along the width direction of the conveying path. Each first sub-air knife extends along the width direction of the conveying path, and one first air outlet is formed on each first sub-air knife.
[0010] In a preferred technical solution of the above silicon wafer drying device, the second air knife includes a second housing, and n second cavities are formed in the second housing. The second cavities are communicated with the outlet of the air supply device, and n second air outlets are formed on the second housing. The n second air outlets are communicated with the n second cavities in a one-to-one correspondence.
[0011] In a preferred technical solution of the above silicon wafer drying device, the second air knife includes n second sub-air knives. The n second sub-air knives are arranged along the width direction of the conveying path. Each second sub-air knife extends along the width direction of the conveying path, and one second air outlet is formed on each second sub-air knife.
[0012] In the preferred technical solution of the above silicon wafer drying device, each of the first air outlets is formed by a long hole extending along the width direction of the conveying path; or each of the first air outlets is formed by a plurality of long holes extending along the width direction of the conveying path, and the plurality of long holes are arranged along the length direction of the conveying path; or each of the first air outlets is formed by a row of round holes arranged along the width direction of the conveying path; or each of the first air outlets is formed by a plurality of rows of round holes arranged along the width direction of the conveying path, and the plurality of rows of round holes are arranged along the length direction of the conveying path.
[0013] In the preferred technical solution of the above silicon wafer drying device, each of the second air outlets is formed by a long hole extending along the width direction of the conveying path; or each of the second air outlets is formed by a plurality of long holes extending along the width direction of the conveying path, and the plurality of long holes are arranged along the length direction of the conveying path; each of the second air outlets is formed by a row of round holes arranged along the width direction of the conveying path; or each of the second air outlets is formed by a plurality of rows of round holes arranged along the width direction of the conveying path, and the plurality of rows of round holes are arranged along the length direction of the conveying path.
[0014] In the preferred technical solution of the above silicon wafer drying device, in the case where each of the air outlets is formed by a plurality of long holes extending along the width direction of the conveying path and the plurality of long holes are arranged along the length direction of the conveying path, the blowing direction of at least one long hole forming each of the air outlets is along the vertical direction, and the blowing direction of at least one long hole forming each of the air outlets is inclined backward or forward along the conveying path.
[0015] In the preferred technical solution of the above silicon wafer drying device, the first air knife is arranged above and / or below the conveying path, and the second air knife is arranged above and / or below the conveying path.
[0016] In the preferred technical solution of the above silicon wafer drying device, the air supply device is a hot air supply device; and / or a filter is arranged upstream of the air supply device.
[0017] In the case of adopting the above technical solution, the silicon wafer drying device includes a first air knife and a second air knife arranged along the length direction of the conveying path of the silicon wafer and an air supply device for supplying air to the first air knife and the second air knife. Both the first air knife and the second air knife extend along the width direction of the conveying path. The first air knife has n + 1 first air outlets extending and arranged along the width direction of the conveying path, and the second air knife has n second air outlets extending and arranged along the width direction of the conveying path. The n second air outlets can sweep the area on the conveying path that is swept by the part between two adjacent first air outlets one by one; where n is a positive integer.
[0018] With such a setting, the area swept by the part between two adjacent first air outlets on the transmission path can be swept by the second air outlet. Even if the silicon wafer is offset on the transmission path, the entire silicon wafer can pass within the blowing range of the air outlet, ensuring the drying effect. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings, in which:
[0020] Figure 1 is a schematic structural diagram of a silicon wafer drying device according to the first embodiment of the present invention;
[0021] Figure 2 is a front view of the silicon wafer drying device according to the first embodiment of the present invention;
[0022] Figure 3 is a cross-sectional view taken along the A-A plane in Figure 2 ;
[0023] Figure 4 is Figure 3 an enlarged view of the partial area B in
[0024] Figure 5 is Figure 3 an enlarged view of the partial area C in
[0025] Figure 6 is a usage state diagram of the silicon wafer drying device according to the first embodiment of the present invention;
[0026] Figure 7 is a usage state diagram of the silicon wafer drying device according to the second embodiment of the present invention.
[0027] LIST OF REFERENCE NUMERALS:
[0028] 1, first air knife; 11, first housing; 12, partition; 13, first cavity; 14, first air outlet groove; 151, first round hole a; 152, first round hole b; 153, first round hole c; 2, second air knife; 21, second housing; 22, second cavity; 23, second air outlet groove; 241, second round hole a; 242, second round hole b; 243, second round hole c; 31, first connecting pipe; 32, second connecting pipe; 41, first air duct; 42, second air duct; 43, three-way pipe; 44, third air duct; 45, fourth air duct; 46, fifth air duct; 51, first hot air blower; 52, second hot air blower; 53, third hot air blower; 61, first filter; 62, second filter; 63, third filter; 7, conveying device; 71, bracket; 72, conveying roller; 8, silicon wafer. DETAILED DESCRIPTION OF THE EMBODIMENTS
[0029] First of all, those skilled in the art should understand that the embodiments described below are only used to explain the technical principles of the present utility model and are not intended to limit the protection scope of the present utility model.
[0030] It should be noted that in the description of the utility model, the terms indicating the direction or positional relationship such as "upper", "lower", "left", "right", etc. are based on the direction or positional relationship shown in the drawings. This is only for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation to the present utility model. In addition, the terms "first", "second", "third", "fourth", "fifth" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance.
[0031] In addition, it should also be noted that in the description of the present utility model, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection. It can be a direct connection or an indirect connection. For those skilled in the art, the specific meanings of the above terms in the present utility model can be understood according to specific situations.
[0032] Based on the problem that at least part of the chamfer of the silicon wafer on the conveying device mentioned in the background technology is prone to not being blown by the air knife due to offset, the present utility model provides a silicon wafer drying device. The silicon wafer drying device includes a first air knife and a second air knife arranged along the length direction of the conveying path of the silicon wafer and an air supply device for supplying air to the first air knife and the second air knife. Both the first air knife and the second air knife extend along the width direction of the conveying path. The first air knife has n + 1 first air outlets extending and arranged along the width direction of the conveying path, and the second air knife has n second air outlets extending and arranged along the width direction of the conveying path. The n second air outlets can sweep the area on the conveying path that is swept by the part between two adjacent first air outlets one by one; where n is a positive integer.
[0033] Through such a setting, the area on the conveying path that is swept by the part between two adjacent first air outlets can be swept by the second air outlets. Even if the silicon wafer is offset on the transmission path, the entire silicon wafer can pass within the blowing range of the air outlets, ensuring the drying effect.
[0034] The following refers to Figures 1 to 7 for a detailed introduction to the silicon wafer drying device of the present utility model. Among them, Figure 1 is a schematic structural diagram of the silicon wafer drying device of the first embodiment of the present utility model;
[0035] Figure 2 is a front view of the silicon wafer drying device of the first embodiment of the present utility model; Figure 3is along Figure 2 a sectional view taken along plane A-A in Figure 4 is Figure 3 an enlarged view of partial area B in Figure 5 is Figure 3 an enlarged view of partial area C in Figure 6 a usage state diagram of the silicon wafer drying device according to the first embodiment of the present invention; Figure 7 is a usage state diagram of the silicon wafer drying device according to the second embodiment of the present invention.
[0036] In the first embodiment of the present invention, as Figures 1 to 6 shown, the silicon wafer drying device includes a first air knife 1 and a second air knife 2. The first air knife 1 and the second air knife 2 are arranged along the length direction of the conveying path of the silicon wafer. Exemplarily, the first air knife 1 and the second air knife 2 are arranged along the conveying direction of the silicon wafer, and both the first air knife 1 and the second air knife 2 extend along the width direction of the conveying path.
[0037] The first air knife 1 includes a circular tubular first housing 11. A partition 12 is arranged inside the first housing 11. The partition 12 divides the interior of the first housing 11 into two first cavities 13. Two long strip-shaped first air outlet grooves 14 are arranged at the bottom of the first housing 11. The two first air outlet grooves 14 are arranged in one-to-one correspondence with the two first cavities 13 and are communicated with each other. The upper part of the first housing 11 is also connected to a first air pipe 41 through two first connecting pipes 31. The two first cavities 13 are respectively communicated with the inside of the first air pipe 41 through the two first connecting pipes 31. The air inlet end of the first air pipe 41 is communicated with the first interface of a three-way pipe 43.
[0038] The second air knife 2 includes a circular tubular second housing 21. A second cavity 22 is formed inside the second housing 21. A long strip-shaped second air outlet groove 23 is arranged at the bottom of the second housing 21. The second air outlet groove 23 is communicated with the second cavity 22. The upper part of the second housing 21 is also connected to a second air pipe 42 through two second connecting pipes 32. The second cavity 22 is communicated with the inside of the second air pipe 42 through the two second connecting pipes 32. The air inlet end of the second air pipe 42 is communicated with the second interface of the three-way pipe 43.
[0039] The third interface of the three-way pipe 43 is communicated with the outlet of a first hot air blower 51 through a third air pipe 44. The inlet of the first hot air blower 51 is communicated with the outlet of a first filter 61. The inlet of the first filter 61 is communicated with the atmospheric environment.
[0040] As Figure 3 and Figure 4As shown, at the bottom of the first air outlet groove 14, there is a row of first round holes a151 arranged along the width direction of the conveying path, a row of first round holes b152 arranged along the width direction of the conveying path, and a row of first round holes c153 arranged along the width direction of the conveying path. The row of first round holes a151, the row of first round holes b152, and the row of first round holes c153 are arranged along the length direction of the conveying path. The first round holes a151 extend obliquely downward in the reverse direction of the conveying direction of the silicon wafer from top to bottom, the first round holes b152 extend vertically downward from top to bottom, and the first round holes c153 extend obliquely downward along the conveying direction of the silicon wafer from top to bottom. The first round holes a151, the first round holes b152, and the first round holes c153 together form a first air outlet.
[0041] As Figure 3 and Figure 5 shown, at the bottom of the second air outlet groove 23, there is a row of second round holes a241 arranged along the width direction of the conveying path, a row of second round holes b242 arranged along the width direction of the conveying path, and a row of second round holes c243 arranged along the width direction of the conveying path. The row of second round holes a241, the row of second round holes b242, and the row of second round holes c243 are arranged along the length direction of the conveying path. The second round holes a241 extend obliquely downward in the reverse direction of the conveying direction of the silicon wafer from top to bottom, the second round holes b242 extend vertically downward from top to bottom, and the second round holes c243 extend obliquely downward along the conveying direction of the silicon wafer from top to bottom. The second round holes a241, the second round holes b242, and the second round holes c243 together form a second air outlet. Referring to Figure 3 the orientation shown, the left end of the second air outlet groove 23 is directly opposite to the middle area of the first air outlet groove 14 on the left side, and the right end of the second air outlet groove 23 is directly opposite to the middle area of the first air outlet groove 14 on the right side, so that the area swept by the part between the two first air outlets distributed on the left and right of the first air knife 1 on the conveying path can be swept by the second air outlet on the second air outlet groove 23, and thus the entire width area of the conveying path can be swept by the blown air.
[0042] As Figure 6As shown, in the working state, the first air knife 1 and the second air knife 2 of the silicon wafer drying device are located above the conveying device 7. The conveying device 7 includes two brackets 71 and conveying rollers 72 connected between the two brackets 71. A motor (not shown in the figure) for driving the rotation of the conveying rollers 72 is provided on the brackets 71. The feeding conveyor belt (not shown in the figure) conveys the silicon wafers 8 onto the conveying device 7. The silicon wafers 8 are arranged in 10 columns on the conveying device 7 and are translated along the conveying direction of the conveying device under the driving action of the conveying rollers 72. The first hot air blower 51 operates. The air in the atmospheric environment first enters the first filter 61, and the air filtered by the first filter 61 enters the first hot air blower 51 and is heated in the first hot air blower 51. The hot air flows through the third air duct 44 to the three-way pipe 43 under the drive of the first hot air blower 51. The hot air is divided into two parts at the three-way pipe 43 and flows to the first air knife 1 and the second air knife 2 through the first air duct 41 and the second air duct 42 respectively. The hot air flowing to the first air knife 1 is divided into two parts and flows into the two first cavities 13 respectively, and is blown out from the first air outlets on the two first air outlet grooves 14. The hot air flowing to the second air knife 2 flows into the second cavity 22 and is blown out from the second air outlets on the second air outlet groove 23. Since the area of the conveying path swept by the part between the left and right distributed first air outlets on the first air knife 1 can be swept by the second air outlets on the second air outlet groove 23, the entire width area of the conveying path can be swept by the blown air, and the upper and side parts of all the silicon wafers 8 moving on the conveying device 7 can be blown by the air. Then, all the blown silicon wafers 8 are turned over and placed under the first air knife 1 and / or the second air knife 2 of the conveying device 7, so as to realize the air drying of all surfaces of the silicon wafers 8.
[0043] The area of the conveying path swept by the part between two adjacent first air outlets can be swept by the second air outlets. Even if the silicon wafers 8 are offset on the conveying path, the entire silicon wafer can pass through within the blowing range of the air outlets, ensuring the drying effect. Each first air outlet is formed by a row of first round holes arranged along the width direction of the conveying path. Compared with the strip-shaped air outlet, the diameter of the round hole can be set to be larger than the width of the strip-shaped air outlet. When the air supply speed of the first hot air blower 51 remains unchanged, it can not only ensure a higher air outlet speed but also reduce the risk of blockage of the first air outlet. Similarly, the second air outlet is set to be formed by a row of second round holes arranged along the width direction of the conveying path, which can not only ensure a higher air outlet speed but also reduce the risk of blockage of the second air outlet. It should be noted that this is only a relatively preferred setting method, and adjustments can be made in actual applications. For example, each first air outlet is formed by a long strip hole with a length extending along the width direction of the conveying path, and / or each second air outlet is formed by a long strip hole with a length extending along the width direction of the conveying path.
[0044] The bottom of the first air outlet groove 14 and the bottom of the second air outlet groove 23 are respectively provided with three rows of first round holes and three rows of second round holes. Compared with only setting one row of round holes, this can improve the drying effect of the first air knife 1 and the second air knife 2 on the silicon wafer 8.
[0045] At the bottom of the first air outlet groove 14, there is formed a row of first round holes a151 arranged along the width direction of the conveying path, a row of first round holes b152 arranged along the width direction of the conveying path, and a row of first round holes c153 arranged along the width direction of the conveying path. A row of first round holes a151, a row of first round holes b152, and a row of first round holes c153 are arranged along the length direction of the conveying path. The first round hole a151 extends obliquely downward from top to bottom in the reverse direction of the conveying direction of the silicon wafer, the first round hole b152 extends vertically downward from top to bottom, and the first round hole c153 extends obliquely downward from top to bottom along the conveying direction of the silicon wafer.
[0046] Through such a setting, the first round hole a151 can make the hot air better blow to the front side part of the silicon wafer 8 that is about to move directly below it, the first round hole c153 can make the hot air better blow to the rear side part of the silicon wafer 8 that has just moved away from directly below it, and the first round hole b152 can make the hot air blow vertically to the top of the silicon wafer 8 directly below it, so that the hot air can blow to the silicon wafer 8 more comprehensively, reducing or even eliminating the dead angle of blowing and improving the air drying effect of the silicon wafer 8.
[0047] Similarly, at the bottom of the second air outlet groove 23, there is formed a row of second round holes a241 arranged along the width direction of the conveying path, a row of second round holes b242 arranged along the width direction of the conveying path, and a row of second round holes c243 arranged along the width direction of the conveying path. A row of second round holes a241, a row of second round holes b242, and a row of second round holes c243 are arranged along the length direction of the conveying path. The second round hole a241 extends obliquely downward from top to bottom in the reverse direction of the conveying direction of the silicon wafer, the second round hole b242 extends vertically downward from top to bottom, and the second round hole c243 extends obliquely downward from top to bottom along the conveying direction of the silicon wafer, having the same technical effect and will not be elaborated here.
[0048] It should be noted that the arrangement of the first round holes a151, b152, c153 at the bottom of the first air outlet groove 14 and the second round holes a241, b242, c243 at the bottom of the second air outlet groove 23 mentioned above is only a relatively preferred arrangement. Adjustments can be made in actual applications. For example, only the first round holes b152 and a151 mentioned above are formed at the bottom of the first air outlet groove 14, or only the first round holes b152 and c153 mentioned above are formed at the bottom of the first air outlet groove 14. Only the second round holes b242 and a241 mentioned above are formed at the bottom of the second air outlet groove 23, or only the second round holes b242 and c243 mentioned above are formed at the bottom of the second air outlet groove 23. In addition, when each first air outlet is formed by a row of first round holes arranged along the width direction of the conveying path or by a long hole with a length extending along the width direction of the conveying path, the first air outlet groove 14 can be not provided, and the first round holes or the long hole are directly formed at the bottom of the first housing 11. Similarly, when each second air outlet is formed by a row of second round holes arranged along the width direction of the conveying path or by a long hole with a length extending along the width direction of the conveying path, the second air outlet groove 23 can be not provided, and the second round holes or the long hole are directly formed at the bottom of the second housing 21.
[0049] In the second embodiment of the present utility model, as Figure 7 shown, different from the first embodiment, the silicon wafer drying device further includes two other first air knives 1, and the structures of these two first air knives 1 are the same as the structure of the first air knife 1 in the first embodiment. Two first cavities 13 of one of the first air knives 1 are respectively communicated with a first air duct 41 through two first connecting pipes 31. The air inlet end of the first air duct 41 is connected to the outlet of the second hot air blower 52 through a fourth air duct 45. The inlet of the second hot air blower 52 is communicated with the outlet of the second filter 62, and the inlet of the second filter 62 is communicated with the atmospheric environment. Two first cavities 13 of the other first air knife 1 are respectively communicated with a first air duct 41 through two first connecting pipes 31. The air inlet end of the first air duct 41 is connected to the outlet of the third hot air blower 53 through a fifth air duct 46. The inlet of the third hot air blower 53 is communicated with the outlet of the third filter 63, and the inlet of the third filter 63 is communicated with the atmospheric environment. The three first air knives 1 and one second air knife 2 are arranged in sequence along the conveying direction of the conveying device 7.
[0050] Through such an arrangement, the drying effect of the silicon wafer drying device on the silicon wafer 8 can be improved. It should be noted that the three first air knives 1 and one second air knife 2 can also be supplied with air by the same hot air blower.
[0051] In some other feasible embodiments, different from the above-described embodiments, the first air knife has three or more first air outlets, the second air knife has two or more second air outlets, the number of second air outlets is one less than the number of first air outlets, and the structure of the second air knife is substantially the same as that of the first air knife, that is, a plurality of partitions are provided in the second housing, the partitions divide the inside of the second housing into a plurality of second cavities, and a plurality of second air outlet grooves corresponding to and communicating with the second cavities are provided at the bottom of the second housing. A second air outlet is formed at the bottom of each second air outlet groove, and the second air outlets can respectively sweep over the areas on the conveying path that are swept by the portions between adjacent two first air outlets.
[0052] In some other feasible embodiments, different from the above-described embodiments, the first air knife is configured to include a plurality of first sub-air knives, the plurality of first sub-air knives are arranged along the width direction of the conveying path, each first sub-air knife extends along the width direction of the conveying path, and each first sub-air knife includes a first housing and a first cavity formed in the first housing, and a first air outlet is formed at the bottom of the first housing.
[0053] In some other feasible embodiments, different from the above-described embodiments, when the second air knife has two or more second air outlets, the second air knife is configured to include a plurality of second sub-air knives, the plurality of second sub-air knives are arranged along the width direction of the conveying path, each second sub-air knife extends along the width direction of the conveying path, and each second sub-air knife includes a second housing and a second cavity formed in the second housing, and a second air outlet is formed at the bottom of the second housing.
[0054] In another feasible embodiment, different from the first embodiment, the first air knife and the second air knife are located below the conveying device 7, the first air outlet and the second air outlet are respectively formed at the tops of the first air knife and the second air knife, and other structures are substantially the same as those in the first embodiment.
[0055] In another feasible embodiment, different from the first embodiment, the second air knife is located below the conveying device 7, the second air outlet is formed at the top of the second air knife, and other structures are substantially the same as those in the first embodiment. It should be noted that the first air knife can also be arranged below the conveying device 7, the first air outlet is formed at the top of the first air knife, and other structures are substantially the same as those in the first embodiment.
[0056] In some other feasible embodiments, different from the above-described embodiments, the hot air blower is replaced with a blower without a heating function, and the blower conveys normal temperature air to the first air knife and the second air knife to dry the silicon wafer 8 with normal temperature air. It should be noted that the blower can also be replaced with an air compressor, an air tank or other suitable air supply devices, etc.
[0057] So far, the technical solution of the present utility model has been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easily understood by those skilled in the art that the protection scope of the present utility model is obviously not limited to these specific embodiments. Without departing from the principle of the present utility model, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will all fall within the protection scope of the present utility model.
Claims
1. A silicon wafer drying device, characterized in that, It includes a first air knife and a second air knife arranged along the length direction of the transfer path of the silicon wafer, and an air supply device for supplying air to the first air knife and the second air knife. Both the first air knife and the second air knife extend along the width direction of the transfer path. The first air knife has n + 1 first air outlets extending and arranged along the width direction of the transfer path. The second air knife has n second air outlets extending and arranged along the width direction of the transfer path. The n second air outlets can sweep, one by one, the area on the transfer path that is swept by the part between two adjacent first air outlets. Wherein, n is a positive integer.
2. The silicon wafer drying device according to claim 1, wherein The first air knife includes a first housing. n + 1 first cavities are formed in the first housing. The first cavities are communicated with the outlet of the air supply device. n + 1 first air outlets are formed on the first housing. The n + 1 first air outlets are communicated with the n + 1 first cavities one by one.
3. The wafer drying device according to claim 1, characterized in that, The first air knife includes n + 1 first sub-air knives. The n + 1 first sub-air knives are arranged along the width direction of the transfer path. Each first sub-air knife extends along the width direction of the transfer path. One first air outlet is formed on each first sub-air knife.
4. The wafer drying device according to claim 1, characterized in that, The second air knife includes a second housing. n second cavities are formed in the second housing. The second cavities are communicated with the outlet of the air supply device. n second air outlets are formed on the second housing. The n second air outlets are communicated with the n second cavities one by one.
5. The wafer drying device according to claim 1, wherein, The second air knife includes n second sub-air knives. The n second sub-air knives are arranged along the width direction of the transfer path. Each second sub-air knife extends along the width direction of the transfer path. One second air outlet is formed on each second sub-air knife.
6. The silicon wafer drying device according to claim 1, characterized in that, Each first air outlet is formed by a long hole extending along the width direction of the transfer path; or Each first air outlet is formed by multiple long holes extending along the width direction of the transfer path, and the multiple long holes are arranged along the length direction of the transfer path; or Each first air outlet is formed by a row of round holes arranged along the width direction of the transfer path; or Each first air outlet is formed by multiple rows of round holes arranged along the width direction of the transfer path, and the multiple rows of round holes are arranged along the length direction of the transfer path.
7. The silicon wafer drying device according to claim 1, characterized in that, Each second air outlet is formed by a long hole extending along the width direction of the transfer path; or Each second air outlet is formed by multiple long holes extending along the width direction of the transfer path, and the multiple long holes are arranged along the length direction of the transfer path; Each second air outlet is formed by a row of round holes arranged along the width direction of the transfer path; or Each second air outlet is formed by multiple rows of round holes arranged along the width direction of the transfer path, and the multiple rows of round holes are arranged along the length direction of the transfer path.
8. The silicon wafer drying device according to claim 6 or 7, characterized in that, In the case where each of the air outlets is formed by a plurality of long holes extending in the width direction of the conveying path and the plurality of long holes are arranged in the length direction of the conveying path, the blowing direction of at least one long hole forming each air outlet is along the vertical direction, and the blowing direction of at least one long hole forming each air outlet is inclined backward or forward along the conveying path.
9. The silicon wafer drying device according to any one of claims 1 to 7, characterized in that, The first air knife is provided above and / or below the conveying path, and the second air knife is provided above and / or below the conveying path.
10. The silicon wafer drying device according to any one of claims 1 to 7, characterized in that, The air supply device is a hot air supply device; and / or a filter is provided upstream of the air supply device.