Laser processing device for large silicon wafer

Abstract

The utility model discloses a laser processing device for a large silicon wafer. The device comprises a rack (1), a conveying mechanism (2) and a laser mechanism (6) are arranged on the rack (1), and the laser mechanism (6) is arranged above the conveying mechanism (2); a silicon wafer clamping mechanism (3) is arranged on the conveying mechanism (2); the silicon wafer clamping mechanism (3) comprises a clamping bottom plate (301) arranged on the conveying mechanism (2), and two ends of the clamping bottom plate (301) are respectively provided with a right-angle positioning chuck (4) and a movable chuck (5); a movable guide rail (302) is arranged in the middle of the clamping bottom plate (301), and the movable chuck (5) is arranged on the movable guide rail (302); and gaps are formed at the included angles of the positioning chuck (4) and the movable chuck (5). According to the utility model, stable clamping of the silicon wafer can be realized, the silicon wafer is prevented from falling off in the processing process, and the silicon wafer clamping device has the advantages of high stability and strong safety.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon wafer processing, in particular to a laser processing device for large silicon wafers. Background Art

[0002] Photovoltaic silicon wafers are the core components of solar panels, capable of converting solar energy into electricity. During the production and processing of photovoltaic silicon wafers, they are marked after the silicon ingots are sliced, cleaned, and before sorting and inspection. Serial numbers, batch numbers, and other information are engraved on the wafers to track the incoming wafers. When problems arise, the specific production batch and source can be quickly located, facilitating quality tracing and problem solving. Laser marking technology utilizes a high-energy-density laser beam to illuminate the surface of the silicon wafer, leaving a mark. This marking method does not require contact with the wafer surface, avoiding the scratches and contamination that can occur with traditional mechanical marking. For example, a Chinese utility model patent with authorization announcement number CN218341245U discloses a silicon wafer laser marking device, comprising a chassis, a built-in control host, a marking platform mounted on the top of the chassis, a workbench mounted on the marking platform, a limiter mounted on the workbench, a laser marking assembly mounted above the workbench, the laser marking assembly mounted on the chassis, and a visual positioning assembly connected to the control host to identify the center position of the silicon wafer. When laser marking the silicon wafer in this utility model patent, the silicon wafer is placed on the limiter and only two mutually perpendicular limit bumps are used to roughly position the silicon wafer. Although this method is convenient, it is not stable for the silicon wafer and is easily affected by disturbance factors such as vibration in the environment, and the silicon wafer is easily offset. Utility Model Content

[0003] The purpose of the utility model is to provide a laser processing device for large silicon wafers. The utility model can stably clamp the silicon wafers and prevent them from falling during processing, and has the advantages of high stability and strong safety.

[0004] The technical solution of the utility model is as follows: a laser processing device for large silicon wafers, comprising a frame, wherein the frame is provided with a conveying mechanism and a laser mechanism, and the laser mechanism is arranged above the conveying mechanism; the conveying mechanism is provided with a silicon wafer clamping mechanism; the silicon wafer clamping mechanism comprises a clamping base plate arranged on the conveying mechanism, and a right-angled positioning chuck and a movable chuck are respectively provided at both ends of the clamping base plate; a movable guide rail is provided in the middle of the clamping base plate, and the movable chuck is arranged on the movable guide rail.

[0005] In the above-mentioned laser processing device for large silicon wafers, the positioning chuck is arranged on the clamping base plate through a first chuck plate; first convex edges are provided on both sides of the first chuck plate, and a first clamping block is provided on the first convex edge.

[0006] In the aforementioned laser processing device for large silicon wafers, the movable chuck is arranged on the clamping base plate through a second chuck plate; second convex edges are provided on both sides of the second chuck plate, and a second clamping block is provided on the second convex edge; a movable block is provided at the bottom of the second chuck plate, and the movable block is embedded in the movable guide rail.

[0007] In the aforementioned laser processing device for large silicon wafers, a positioning protrusion is provided at the end of the clamping base plate, and the side wall of the positioning chuck abuts against the side wall of the positioning protrusion.

[0008] In the aforementioned laser processing device for large silicon wafers, a limiting protrusion is provided at the end of the clamping base plate, and the side wall of the movable chuck abuts against the side wall of the limiting protrusion.

[0009] The aforementioned laser processing device for large silicon wafers, the transport mechanism includes a linear guide rail arranged in the middle of the frame, a linear motor is provided on the linear guide rail, a transport base plate is provided on the linear motor, a cylinder is vertically provided on the transport base plate, and a connecting plate is provided on the telescopic end of the cylinder; the silicon wafer clamping mechanism is provided on the connecting plate.

[0010] The aforementioned laser processing device for large silicon wafers, wherein the laser mechanism includes an adjustment seat arranged on the upper part of the frame, and a laser is provided on the adjustment seat.

[0011] In the aforementioned laser processing device for large silicon wafers, a first spacer is provided between the first convex edge and the first clamping block.

[0012] In the aforementioned laser processing device for large silicon wafers, a second spacer is provided between the second convex edge and the second clamping block.

[0013] Compared with the prior art, the present invention clamps the silicon wafer between the positioning chuck and the movable chuck of the silicon wafer clamping mechanism when in use. First, the silicon wafer is placed against the positioning chuck, and then the movable chuck is moved by the movable guide rail so that the movable chuck and the positioning chuck clamp the silicon wafer. Then the conveying mechanism moves to move the silicon wafer to the bottom of the laser mechanism for laser processing. The gap at the angle between the positioning chuck and the movable chuck can prevent the sharp corners of the square silicon wafer from colliding with the silicon wafer clamping mechanism when clamping, and can largely avoid the silicon wafer from being broken when clamping. The present invention can achieve stable clamping of the silicon wafer, prevent the silicon wafer from falling during processing, and has the advantages of high stability and strong safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a structural diagram of the utility model;

[0015] Figure 2 It is a structural diagram of the transport mechanism;

[0016] Figure 3This is a schematic diagram of the structure of the silicon wafer clamping mechanism Figure 1 ;

[0017] Figure 4 This is a schematic diagram of the structure of the silicon wafer clamping mechanism Figure 2 ;

[0018] Figure 5 This is an exploded view of the silicon wafer clamping mechanism.

[0019] The marks in the accompanying drawings are: 1-frame, 2-transport mechanism, 201-linear guide, 202-linear motor, 203-transport base plate, 204-cylinder, 205-connecting plate, 3-silicon wafer clamping mechanism, 301-clamping base plate, 302-movable guide rail, 303-positioning protrusion, 304-limiting protrusion, 4-positioning chuck, 401-first chuck plate, 402-first flange, 403-first clamping block, 404-first pad, 5-movable chuck, 501-second chuck plate, 502-second flange, 503-second clamping block, 504-movable block, 505-second pad, 6-laser mechanism, 601-adjustment seat, 602-laser. DETAILED DESCRIPTION

[0020] The present invention will be further described below with reference to the accompanying drawings and embodiments, but they are not intended to limit the present invention.

[0021] Example: Laser processing device for large silicon wafer, the structure is as follows Figure 1 and Figure 2 As shown, it includes a frame 1, on which a conveying mechanism 2 and a laser mechanism 6 are provided, and the laser mechanism 6 is arranged above the conveying mechanism 2; the conveying mechanism 2 includes a linear guide rail 201 arranged in the middle of the frame 1, and slider guide rails are also fixed on both sides of the linear guide rail 201, and a slider is provided on the slider guide rail, and a linear motor 202 is provided on the linear guide rail 201, and a conveying base plate 203 is fixed on the linear motor 202 and the slider, and the conveying base plate 203 is moved by the linear motor 202, and a cylinder 204 is vertically provided on the conveying base plate 203, and a connecting plate 205 is provided on the telescopic end of the cylinder 204; an optical axis is also vertically passed through the two ends of the connecting plate 205 through an optical axis support seat, and the bottom end of the optical axis is fixed on the connecting plate 205; the silicon wafer clamping mechanism 3 is provided on the connecting plate 205. The laser mechanism 6 includes an adjustment seat 601 disposed on the upper portion of the frame 1. A threaded rod is provided in the middle of the adjustment seat 601 for slightly adjusting the height of a laser 602. The laser 602 is mounted on the adjustment seat 601. A silicon wafer clamping mechanism 3 for clamping a silicon wafer is fixed to the transport mechanism 2.

[0022] Silicon wafer clamping mechanism 3 Figures 3 to 5As shown, the silicon wafer clamping mechanism 3 includes a clamping base plate 301 arranged on the conveying mechanism 2, and the two ends of the clamping base plate 301 are equilateral trapezoids, and the width of the middle section is thinner than that of the two ends. The two ends of the clamping base plate 301 are respectively provided with a right-angled positioning chuck 4 and a movable chuck 5. In addition to clamping the silicon wafer together with the movable chuck 5, the positioning chuck 4 also plays a role in positioning the position of the silicon wafer; a movable guide rail 302 is provided in the middle of the clamping base plate 301, and the movable chuck 5 is arranged on the movable guide rail 302, and the movable chuck 5 can achieve the clamping effect through the movable guide rail 302; gaps are provided at the corners of the positioning chuck 4 and the movable chuck 5. There is a certain stress concentration at the sharp corners of the square silicon wafer. If the sharp corners are hit, it is easy to cause the silicon wafer to break. The setting of the gap can prevent the sharp corners of the square silicon wafer from colliding with the silicon wafer clamping mechanism 3 when clamping, which can largely avoid the silicon wafer from breaking when clamping.

[0023] The positioning chuck 4 is mounted on the clamping base 301 via a first chuck plate 401. First flanges 402 are provided on both sides of the first chuck plate 401. First clamping blocks 403 are fixed to the first flanges 402 via bolts. The inner bottom edge of the first clamping block 403 is an inclined surface that can clamp the silicon wafer. During the clamping process, the side surface of the silicon wafer contacts the inner sidewall of the first flange 402, and the upper side of the silicon wafer is slightly lower than the bottom edge of the inclined surface, effectively clamping the silicon wafer. A first pad 404 is provided between the first flange 402 and the first clamping block 403. The first pad 404 is used to clamp thicker silicon wafers. Different numbers of first pads 404 can be used between the first flange 402 and the first clamping block 403 depending on the thickness of the silicon wafer. The end of the clamping base plate 301 is provided with a positioning protrusion 303. The sidewall of the positioning chuck 4 contacts the sidewall of the positioning protrusion 303. The positioning protrusion 303 can play a certain positioning role in the installation of the positioning chuck 4. The movable chuck 5 is installed on the clamping base plate 301 via a second chuck plate 501. The second chuck plate 501 has second flanges 502 on both sides. A second clamping block 503 is fixed to the second flange 502 by bolts. The shape of the second clamping block 503 is the same as that of the first clamping block 403 and plays the same role as the first clamping block 403. A second spacer 505 is provided between the second flange 502 and the second clamping block 503. The shape of the second spacer 505 is the same as that of the first spacer 404 and plays the same role as the first spacer 404. A convex-shaped movable block 504 is fixed to the bottom of the second chuck plate 501 via countersunk screws. The movable block 504 is embedded in the movable guide rail 302. The shape of the movable guide rail 302 matches the shape of the movable block 504, and the outer end of the movable guide rail 302 is connected to the outside. The end of the clamping base plate 301 is provided with a limiting protrusion 304. The sidewalls of the movable chuck 5 contact the sidewalls of the limiting protrusion 304, which acts as a limit for the movable chuck 5. When installing the movable chuck 5, the movable block 504 is first inserted into the movable guide rail 302 from the outer end. After moving it inward a certain distance, the movable chuck 5 is mounted on the movable block 504 via countersunk screws. Then, the second spacer 505 and the second clamping block 503 are installed in sequence. In addition, the silicon wafer clamping mechanism 3 of the present invention can also be used to clamp round silicon wafers.

[0024] Working principle: When the utility model is in use, the silicon wafer is clamped between the positioning chuck 4 and the movable chuck 5 of the silicon wafer clamping mechanism 3. First, the silicon wafer is placed against the positioning chuck 4, and then the movable chuck 5 is moved by the movable guide rail 302, so that the movable chuck 5 and the positioning chuck 4 clamp the silicon wafer, and then the conveying mechanism 2 moves to move the silicon wafer to the bottom of the laser mechanism 6 for laser processing; the gap at the corner between the positioning chuck 4 and the movable chuck 5 can prevent the sharp corners of the square silicon wafer from colliding with the silicon wafer clamping mechanism 3 when clamping, and can largely avoid the silicon wafer from being broken when clamping; the utility model can achieve stable clamping of the silicon wafer, prevent the silicon wafer from falling during processing, and has the advantages of high stability and strong safety.

[0025] The above embodiments merely represent implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. Furthermore, in these embodiments, the terms "up," "down," "left," "right," "front," and "back" merely represent relative positions and do not represent absolute positions. It should be noted that a person skilled in the art could make various modifications and improvements without departing from the concept of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.

Claims

1. A laser processing device for large silicon wafers, comprising a frame (1), a conveying mechanism (2) and a laser mechanism (6) provided on the frame (1), wherein the laser mechanism (6) is arranged above the conveying mechanism (2); characterized in that: The transport mechanism (2) is provided with a silicon wafer clamping mechanism (3); the silicon wafer clamping mechanism (3) comprises a clamping base plate (301) provided on the transport mechanism (2), and a right-angled positioning chuck (4) and a movable chuck (5) are respectively provided at both ends of the clamping base plate (301); a movable guide rail (302) is provided in the middle of the clamping base plate (301), and the movable chuck (5) is provided on the movable guide rail (302); and gaps are provided at the angles between the positioning chuck (4) and the movable chuck (5).

2. The laser processing apparatus for large silicon wafers according to claim 1, wherein: The positioning chuck (4) is arranged on the clamping base plate (301) through a first chuck plate (401); first convex edges (402) are provided on both sides of the first chuck plate (401), and a first clamping block (403) is provided on the first convex edge (402).

3. The laser processing apparatus for large silicon wafers according to claim 1, wherein: The movable chuck (5) is arranged on the clamping base plate (301) through a second chuck plate (501); second flanges (502) are provided on both sides of the second chuck plate (501), and a second clamping block (503) is provided on the second flange (502); a movable block (504) is provided at the bottom of the second chuck plate (501), and the movable block (504) is embedded in the movable guide rail (302).

4. The laser processing apparatus for large silicon wafers according to claim 1, wherein: A positioning protrusion (303) is provided at the end of the clamping base plate (301), and the side wall of the positioning chuck (4) is in conflict with the side wall of the positioning protrusion (303).

5. The laser processing apparatus for large silicon wafers according to claim 1, wherein: A limiting protrusion (304) is provided at the end of the clamping base plate (301), and the side wall of the movable clamping disc (5) is in conflict with the side wall of the limiting protrusion (304).

6. The laser processing apparatus for large silicon wafers according to claim 1, wherein: The transport mechanism (2) comprises a linear guide rail (201) arranged in the middle of the frame (1); a linear motor (202) is provided on the linear guide rail (201); a transport base plate (203) is provided on the linear motor (202); a cylinder (204) is vertically provided on the transport base plate (203); a connecting plate (205) is provided on the telescopic end of the cylinder (204); and the silicon wafer clamping mechanism (3) is provided on the connecting plate (205).

7. The laser processing apparatus for large silicon wafers according to claim 1, wherein: The laser mechanism (6) comprises an adjustment seat (601) arranged on the upper part of the frame (1); a laser (602) is provided on the adjustment seat (601).

8. The laser processing apparatus for large silicon wafers according to claim 2, wherein: A first cushion block (404) is provided between the first convex edge (402) and the first clamping block (403).

9. The laser processing apparatus for large silicon wafers according to claim 3, wherein: A second cushion block (505) is provided between the second convex edge (502) and the second clamping block (503).

Images