Quartz wafer corrosion device

Abstract

A quartz wafer corrosion device comprises a box body, a cleaning pool and a corrosion pool are arranged on the box body, a left supporting frame and a right supporting frame are arranged on the two sides of the box body, a left electric sliding rail and a right electric sliding rail which are parallel are arranged on the left supporting frame and the right supporting frame, and a sliding block on the left electric sliding rail is fixedly connected with a sliding block on the right electric sliding rail through a supporting plate. A vertical supporting plate is arranged on one side of the supporting plate, an upper supporting plate is connected to the top of the vertical supporting plate, a left vertical sliding rail and a right vertical sliding rail are arranged between the supporting plate and the upper supporting plate and on the two sides of the vertical supporting plate, a telescopic air cylinder is arranged on the upper supporting plate, and an output shaft of the telescopic air cylinder penetrates through the upper supporting plate to be connected with a supporting sliding plate. The two ends of the supporting sliding plate are slidably connected with the left vertical sliding rail and the right vertical sliding rail, a rotating motor is arranged on the supporting sliding plate, an output shaft of the rotating motor penetrates through the supporting sliding plate to be connected with a rotating shaft, and the rotating shaft penetrates through the supporting plate to be connected with a placing mechanism.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer processing, in particular to a quartz wafer etching device. Background Art

[0002] Quartz crystals are the core components of quartz crystal resonators and oscillators. Frequency is a key parameter in the quartz crystal processing process. The frequency and thickness of a quartz crystal are inversely proportional, meaning that thinner crystals produce higher frequencies.

[0003] Quartz wafer thickness can generally be processed by grinding or etching. Etching is generally the final thickness treatment process. Existing quartz wafer etching equipment is used to etch wafers. During use, the crystal wafers are manually placed in a wafer basket, which is then placed in a tank of etching liquid and shaken to etch the wafers. After etching, the wafer basket is placed in a cleaning tank and shaken for cleaning. This results in high labor intensity and low production efficiency. Utility Model Content

[0004] The technical problem to be solved by the utility model is to provide a quartz wafer etching device.

[0005] The technical solution adopted by the utility model to solve the technical problem is:

[0006] The lifting mechanism is a bottom end of the lifting mechanism, and the lifting mechanism is a bottom end of the lifting mechanism, and the lifting mechanism is a bottom end of the lifting mechanism, and the lifting mechanism is a bottom end of the lifting mechanism.

[0007] In one embodiment, the placement mechanism is a cage.

[0008] In one embodiment, the placement mechanism includes a placement block.

[0009] In one embodiment, the placement block is provided with a plurality of through holes for placement, and a support ring is extended inwardly from the lower end of the placement through hole.

[0010] In one embodiment, both ends of the left electric slide rail and the right electric slide rail extend out of both ends of the box.

[0011] In one embodiment, both ends of the left electric slide rail and the right electric slide rail are provided with limiting blocks.

[0012] In one embodiment, a heating device is provided in the corrosion tank.

[0013] In one embodiment, a corrosion liquid storage tank is provided outside the box body, and the corrosion liquid storage tank is connected to the corrosion tank through a circulation pipe.

[0014] In one embodiment, a circulation pump is provided on the circulation pipe.

[0015] In one embodiment, a controller is provided on the box body, and the controller is electrically connected to the circulation pump, the heating device, the left electric slide rail, the right electric slide rail, the telescopic cylinder, and the rotating motor.

[0016] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0017] The utility model is provided with a cleaning pool and a corrosion pool on a box body, a left support frame and a right support frame are provided on both sides of the box body, and a parallel left electric slide rail and a right electric slide rail are provided on the left support frame and the right support frame, and the slider on the left electric slide rail is fixedly connected with the slider on the right electric slide rail through a support plate, a vertical support plate is provided on one side of the support plate, and an upper support plate is connected to the top of the vertical support plate, and a left vertical slide rail and a right vertical slide rail are provided between the support plate and the upper support plate and on both sides of the vertical support plate, a telescopic cylinder is provided on the upper support plate, and the output shaft of the telescopic cylinder passes through the upper support plate and is connected to the supporting slide plate, and both ends of the supporting slide plate are connected to the left vertical slide rail and the right vertical slide rail. The vertical slide rails are slidably connected, and a rotating motor is provided on the supporting slide plate. The output shaft of the rotating motor passes through the supporting slide plate and is connected to a rotating shaft, and the rotating shaft passes through the supporting plate and is connected to a placing mechanism. Thus, by placing the wafer basket or wafer in the placing mechanism, and then through the operation of the left electric slide rail, the right electric slide rail, and the telescopic cylinder, the wafer basket or the placing mechanism for the wafer can be automatically rotated alternately between the etching liquid pool and the cleaning pool. At the same time, through the operation of the rotating motor, the wafer basket or the placing mechanism for the wafer can realize 360° automatic rotation, and the cleaning and etching are more uniform, thereby replacing manual operation, improving work efficiency, and reducing the labor intensity of workers. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic structural diagram of Example 1 of the present utility model;

[0019] Figure 2 For this utility model Figure 1 Schematic diagram of the top view structure;

[0020] Figure 3 This is a structural diagram of embodiment 2 of the utility model.

[0021] In the figure: 10. Box body, 11. Cleaning tank, 12. Corrosion tank, 13. Left support frame, 14. Right support frame, 15. Left electric slide, 16. Right electric slide, 17. Limiting block, 20. Support plate, 21. Vertical support plate, 22. Upper support plate, 23. Left vertical slide, 24. Right vertical slide, 25. Telescopic cylinder, 26. Support slide, 27. Rotating motor, 28. Rotating shaft, 30. Placement block, 31. Through hole, 32. Support ring. DETAILED DESCRIPTION

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Example 1

[0024] like Figure 1-2 As shown, this embodiment includes a box body 10, on which a cleaning pool 11 and a corrosion pool 12 are provided. In this embodiment, a heating device is provided in the corrosion pool 12; thus, when the temperature of the corrosion liquid is low, the heating device prevents the corrosion liquid in the corrosion pool 12 from freezing.

[0025] A corrosive liquid storage tank is provided outside the box body 10, and the corrosive liquid storage tank is connected to the corrosion tank 12 through a circulation pipe, and a circulation pump is provided on the circulation pipe; when the weather is cold, the circulation pump can prevent the corrosive liquid from freezing.

[0026] A left support frame 13 and a right support frame 14 are provided on both sides of the box body 10. Parallel left electric slide rails 15 and right electric slide rails 16 are provided on the left support frame 13 and the right support frame 14. The slider on the left electric slide rail 15 and the slider on the right electric slide rail 16 are fixedly connected by a support plate 20. Thus, through the synchronous operation of the left electric slide rail 15 and the right electric slide rail 16, the support plate 20 is driven to reciprocate on the left electric slide rail 15 and the right electric slide rail 16 of the support plate.

[0027] Limiting blocks 17 are provided at both ends of the left electric slide rail 15 and the right electric slide rail 16 . Thus, the limiting blocks 17 can prevent the support plate 20 from sliding out of the left electric slide rail 15 and the right electric slide rail 16 .

[0028] A vertical support plate 21 is provided on one side of the support plate 20, and an upper support plate 22 is connected to the top of the vertical support plate 21. A left vertical slide rail 23 and a right vertical slide rail 24 are provided between the support plate 20 and the upper support plate 22 and on both sides of the vertical support plate 21. A telescopic cylinder 25 is provided on the upper support plate 22, and the output shaft of the telescopic cylinder 25 passes through the upper support plate 22 and is connected to a supporting slide plate 26. The two ends of the supporting slide plate 26 are slidably connected to the left vertical slide rail 23 and the right vertical slide rail 24; thus, through the operation of the telescopic cylinder 25, the supporting slide plate 26 can be lifted and lowered on the left vertical slide rail 23 and the right vertical slide rail 24.

[0029] A rotating motor 27 is provided on the support slide 26. The output shaft of the rotating motor 27 passes through the support slide 26 and is connected to a rotating shaft 28. The rotating shaft 28 passes through the support plate 20 and is connected to a placement mechanism. The placement mechanism includes a placement block 30. The placement block 30 is provided with a plurality of through holes 31 for placement. A support ring 32 extends inward from the lower end of the placement through hole 31. Thus, the wafer basket is placed in the through hole 31 and is supported in the through hole 31 by the support ring 32.

[0030] Both ends of the left electric slide 15 and the right electric slide 16 extend out of the two ends of the box body 10; in this embodiment, a wafer basket delivery device and a wafer basket retrieval device are respectively provided on both sides of the box body 10 (the wafer basket device and the wafer basket retrieval device include robotic arms); thus, the wafer basket is placed on the placement mechanism by the wafer basket delivery device, and then the placement mechanism alternates between the etching tank 12 and the cleaning tank 11. At the same time, the operation of the rotating motor 27 enables the wafer basket or the placement mechanism for wafer placement to achieve 360° automatic rotation, thereby achieving more uniform cleaning and etching.

[0031] In addition, a controller is provided on the box body 10 , and the controller is electrically connected to the circulation pump, the heating device, the left electric slide rail 15 , the right electric slide rail 16 , the telescopic cylinder 25 , and the rotating motor 27 .

[0032] Therefore, the working principle of the present utility model is as follows;

[0033] First, the wafer basket containing quartz wafers is placed in the through hole 31 supported by the support ring 32 through the wafer basket feeding device, and then the left electric slide 15 and the right electric slide 16 drive the support plate 20 to be located above the corrosion tank 12, and then the telescopic cylinder 25 is operated, so that the telescopic cylinder 25 descends on the left vertical slide 23 and the right vertical slide 24, driving the wafer basket on the placement block 30 to be immersed in the corrosion tank 12 for corrosion, and at the same time, the rotating motor 27 is operated to drive the placement block 30 to rotate, so that the wafers in the wafer basket are fully and evenly corroded. After the wafers are corroded, the telescopic cylinder 25 is operated, so that the telescopic cylinder 25 ascends on the left vertical slide 23 and the right vertical slide 24, and the left electric slide 15 and the right electric slide The rail 16 drives the support plate 20 to be located above the cleaning tank 11; the telescopic cylinder 25 operates, causing the telescopic cylinder 25 to descend on the left vertical slide rail 23 and the right vertical slide rail 24, driving the wafer basket on the placement block 30 to be immersed in the cleaning tank 11 for cleaning, and at the same time, the rotary motor 27 operates, driving the placement block 30 to rotate, so that the wafers in the wafer basket are cleaned. After cleaning, the telescopic cylinder 25 operates, causing the telescopic cylinder 25 to rise on the left vertical slide rail 23 and the right vertical slide rail 24, and the left electric slide rail 15 and the right electric slide rail 16 drive the support plate 20 to move to one end of the wafer basket removal device, and the wafer basket after etching and cleaning is removed by the wafer basket removal device. This step is repeated to etch and clean the quartz wafers.

[0034] Example 2

[0035] The difference between this embodiment and embodiment 1 is that: in this embodiment, the placement mechanism is a cage;

[0036] The working principle of this utility model is as follows:

[0037] First, place the quartz wafer in the mesh box. The left electric slide 15 and the right electric slide 16 drive the support plate 20 to be located above the corrosion tank 12. The telescopic cylinder 25 is operated, so that the telescopic cylinder 25 descends on the left vertical slide 23 and the right vertical slide 24, driving the mesh box to be immersed in the corrosion tank 12. At the same time, the rotary motor 27 is operated to drive the mesh box to rotate, so that the wafer in the mesh box is fully and evenly corroded. After the wafer is corroded, the telescopic cylinder 25 is operated, so that the telescopic cylinder 25 ascends on the left vertical slide 23 and the right vertical slide 24, and the left electric slide 15 and the right electric slide 16 drive the support plate 20 to be located above the corrosion tank 12. Above the washing tank 11; the telescopic cylinder 25 runs, causing the telescopic cylinder 25 to descend on the left vertical slide rail 23 and the right vertical slide rail 24, driving the wafers in the mesh box to be cleaned in the washing tank 11, and at the same time the rotary motor 27 runs, driving the mesh box to rotate, so that the wafers in the mesh box are cleaned. After cleaning, the telescopic cylinder 25 runs, causing the telescopic cylinder 25 to rise on the left vertical slide rail 23 and the right vertical slide rail 24, and the left electric slide rail 15 and the right electric slide rail 16 drive the support plate 20 to move to one end, open the mesh box, and take out the corroded and cleaned wafers. Repeat this step to corrode and clean the quartz wafers.

[0038] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the technical solutions of the present invention have been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present invention.

Claims

1. A quartz wafer etching device, comprising a housing (10), wherein the housing (10) is provided with a cleaning tank (11) and an etching tank (12), characterized in that: A left support frame (13) and a right support frame (14) are provided on both sides of the box body (10), and parallel left electric slide rails (15) and right electric slide rails (16) are provided on the left support frame (13) and the right support frame (14), and the slider on the left electric slide rail (15) and the slider on the right electric slide rail (16) are fixedly connected via a support plate (20), and a vertical support plate (21) is provided on one side of the support plate (20), and an upper support plate (22) is connected to the top of the vertical support plate (21), and a space between the support plate (20) and the upper support plate (22) and on the vertical support plate (21) is provided. A left vertical slide rail (23) and a right vertical slide rail (24) are provided on both sides of the upper support plate (22); a telescopic cylinder (25) is provided on the upper support plate (22); an output shaft of the telescopic cylinder (25) passes through the upper support plate (22) and is connected to a support slide plate (26); two ends of the support slide plate (26) are slidably connected to the left vertical slide rail (23) and the right vertical slide rail (24); a rotating motor (27) is provided on the support slide plate (26); an output shaft of the rotating motor (27) passes through the support slide plate (26) and is connected to a rotating shaft (28); and the rotating shaft (28) passes through the support plate (20) and is connected to a placement mechanism.

2. The quartz wafer etching device according to claim 1, wherein: The placement mechanism is a net cage.

3. The quartz wafer etching device according to claim 1, wherein: The placement mechanism comprises a placement block (30).

4. The quartz wafer etching device according to claim 3, wherein: The placement block (30) is provided with a plurality of through holes (31) for placement, and a support ring (32) is extended inwardly from the lower end of the placement through hole (31).

5. The quartz wafer etching device according to claim 1, wherein: Both ends of the left electric slide rail (15) and the right electric slide rail (16) extend out of both ends of the box body (10).

6. The quartz wafer etching device according to claim 4, wherein: Limiting blocks (17) are provided at both ends of the left electric slide rail (15) and the right electric slide rail (16).

7. The quartz wafer etching device according to claim 1, wherein: A heating device is provided in the corrosion pool (12).

8. The quartz wafer etching device according to claim 1, wherein: A corrosive liquid storage tank is provided outside the box (10), and the corrosive liquid storage tank is connected to the corrosive tank (12) through a circulation pipe.

9. The quartz wafer etching device according to claim 1, wherein: A circulation pump is provided on the circulation pipe.

10. The quartz wafer etching device according to claim 1, wherein: The box (10) is provided with a controller, and the controller is electrically connected to the circulation pump, the heating device, the left electric slide rail (15), the right electric slide rail (16), the telescopic cylinder (25), and the rotating motor (27).

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