One-time punching progressive die for budding, salient point and radian of IGBT (Insulated Gate Bipolar Translator) substrate

Abstract

The utility model relates to the technical field of IGBT (Insulated Gate Bipolar Translator) substrate processing, in particular to an IGBT substrate budding, salient point and radian one-step punching progressive die, which comprises a bottom die holder, an upper die fixing plate is arranged above the top end of the outer wall of the bottom die holder, and an IGBT substrate to be processed is arranged between the bottom die holder and the upper die fixing plate. An upper die holder is fixed at the bottom end of the outer wall of the upper die fixing plate, a mounting groove is formed in one side, opposite to the upper die holder, of the bottom die holder, and die parts for respectively carrying out sprouting, salient point processing and radian processing on the IGBT substrate are respectively arranged in the mounting groove. A worker can fix a die for processing buds, salient points and radians in the mounting groove through bolts, and then drives the upper die holder to move up and down through the hydraulic rod, so that the upper die holder is matched with the bottom die holder to process the buds, the salient points and the radians of the IGBT substrate at one time when moving downwards; therefore, personnel do not need to respectively place the IGBT substrate on different dies for stamping processing.

Description

Technical Field

[0001] The utility model relates to the technical field of IGBT substrate processing, in particular to a continuous die for punching buds, bumps and radians of an IGBT substrate at one time. Background Art

[0002] IGBT substrates are silicon-based materials used to manufacture IGBT modules. IGBTs are semiconductor devices typically made of highly conductive materials that provide a current path for the device.

[0003] During the production of existing IGBT substrates, processes such as budding, bumping, and curvature are often required. The budding process generally refers to the process of forming concave and convex structures on the substrate. These structures are used to increase the surface area, improve heat dissipation or other electrical characteristics. The bump process refers to the protruding structure on the surface of the substrate, which may be used to contact or embed other components to achieve better electrical connection or physical fixation. The curvature process refers to the curved shape of the edge or specific area of the substrate, which may play an important role in electrical and mechanical performance.

[0004] The existing IGBT substrate processing processes such as budding, bumping and curvature processing are punched out by the cooperation of upper and lower stamping dies, but most of them are prepared separately through the dies, so personnel need to place the IGBT substrate on different dies for stamping processing. Each processing requires repositioning, which affects the processing efficiency of the IGBT substrate. Therefore, there are still certain shortcomings.

[0005] In summary, it is necessary to invent a continuous die for punching the sprouts, bumps and curvatures of an IGBT substrate at one time. Utility Model Content

[0006] To this end, the utility model provides a continuous die for punching out buds, bumps and curvatures of an IGBT substrate in one go, so as to solve the problem that some IGBT substrates are punched out by cooperating upper and lower stamping dies for budding, bumping and curvature processing, but are mostly prepared separately through dies, so that personnel need to place the IGBT substrates on different dies for stamping processing, and each processing requires repositioning, resulting in the problem that the processing efficiency of the IGBT substrate is affected.

[0007] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions: a continuous die for punching out buds, convex points and curvature of an IGBT substrate in one go, comprising a bottom die base, an upper die fixing plate is arranged above the top of the outer wall of the bottom die base, an IGBT substrate to be processed is arranged between the bottom die base and the upper die fixing plate, an upper die base is fixed to the bottom end of the outer wall of the upper die fixing plate, an installation groove is provided on the side opposite to the upper die base, and mold components for performing budding, convex points and curvature processing on the IGBT substrate are respectively installed in the installation groove.

[0008] Preferably, a bottom mold mounting block for placement is fixed to the bottom end of the outer wall of the bottom mold base, and a hydraulic rod is fixed to the center of the top end of the outer wall of the upper mold fixing plate.

[0009] Preferably, guide rods are fixed at the four corners of the top of the outer wall of the bottom mold base, and through holes are opened at the upper and lower ends of the outer wall of the upper mold fixing plate and at positions corresponding to the guide rods, and the outer walls of the guide rods are slidably connected to the inner walls of the through holes.

[0010] Preferably, the mold component includes a sprouting template, and the number of the sprouting templates is two, and the two sprouting templates are respectively arranged in installation grooves opened on the left side of the outer wall on the opposite side of the bottom mold base and the upper mold base.

[0011] Preferably, the sprouting template includes a first lower template, positioning blocks are fixed at both ends of the outer wall of the first lower template, the first lower template and the positioning blocks are slidably installed in the installation groove, and sprouting arc strips are fixed on the outer walls on opposite sides of the two first lower templates, and the sprouting arc strips fixed on the upper and lower first lower templates are arranged in a staggered manner.

[0012] Preferably, the mold component also includes a convex template and a first upper template, and the convex template and the first upper template are respectively installed in the installation grooves opened at the center of the outer wall on the opposite side of the bottom mold base and the upper mold base, and the convex template includes a second lower template, and the top end of the outer wall of the second lower template is fixed with a convex particle, and the bottom end of the outer wall of the first upper template is provided with a concave hole at the position corresponding to the convex particle.

[0013] Preferably, the mold component further includes a radian template and a second upper template, and the radian template and the second upper template are respectively installed in installation grooves opened at the center of the outer wall on the opposite side of the bottom mold base and the upper mold base.

[0014] Preferably, the curvature template includes a third lower template, the top of the outer wall of the third lower template is fixed with a curvature forming strip, and the bottom of the outer wall of the second upper template and the position corresponding to the curvature forming strip are provided with a curvature forming groove, and the curvature forming strip is used in conjunction with the curvature forming groove.

[0015] The beneficial effects of the utility model are:

[0016] In the utility model, three groups of mounting grooves are opened between the top of the bottom mold base and the upper mold base, and personnel can fix the molds used for processing sprouts, convex points and curvatures in the mounting grooves by bolts, and then use the hydraulic rod to drive the upper mold base to move up and down, so that the upper mold base can cooperate with the bottom mold base to process sprouts, convex points and curvatures on the IGBT substrate at one time when moving downward, so that personnel do not need to place the IGBT substrates on different molds for stamping processing, thereby improving processing efficiency and facilitating use by personnel. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the installation structure of the utility model in the front view direction;

[0018] Figure 2 This is a schematic diagram of the three-dimensional structure of the first lower template in the present invention when viewed from above;

[0019] Figure 3 This is a schematic diagram of the three-dimensional structure of the second lower template in the present invention when viewed from above;

[0020] Figure 4 It is a schematic diagram of the three-dimensional structure of the third lower template in the present utility model.

[0021] In the figure: 100, bottom mold base; 110, bottom mold mounting block; 200, upper mold fixing plate; 210, upper mold base; 220, hydraulic rod; 300, guide rod; 400, sprouting template; 410, first lower template; 411, sprouting arc strip; 412, positioning block; 500, convex point template; 501, second lower template; 502, convex particle; 510, first upper template; 600, radian template; 601, third lower template; 602, radian forming strip; 610, second upper template; 611, radian forming groove. DETAILED DESCRIPTION

[0022] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention and are not used to limit the present invention.

[0023] Refer to the attached Figure 1-4The utility model provides a continuous die for punching buds, bumps, and radians of an IGBT substrate at one time, comprising a bottom die base 100, an upper die fixing plate 200 being provided above the top of the outer wall of the bottom die base 100, a bottom die mounting block 110 for placement being fixed at the bottom end of the outer wall of the bottom die base 100, the fixed bottom die mounting block 110 being used to mount the bottom die base 100 on the bottom die fixing frame on the processing table, a hydraulic rod 220 being fixed at the center of the outer wall top of the upper die fixing plate 200, and the hydraulic rod 220 being provided to drive the upper die fixing plate 200 moves up and down, so that the upper mold base 210 and the bottom mold base 100 are in contact with or separated from each other. Guide rods 300 are fixed at the four corners of the top of the outer wall of the bottom mold base 100. Through holes are opened at the upper and lower ends of the outer wall of the upper mold fixing plate 200 and at positions corresponding to the guide rods 300. The outer walls of the guide rods 300 are slidably connected to the inner walls of the through holes. The guide rods 300 and the through holes are provided to limit the moving direction of the upper mold fixing plate 200 without affecting the up and down movement of the upper mold fixing plate 200.

[0024] An IGBT substrate to be processed is arranged between the bottom mold base 100 and the upper mold fixing plate 200, and an upper mold base 210 is fixed to the bottom end of the outer wall of the upper mold fixing plate 200. A mounting groove is provided on the opposite side of the bottom mold base 100 and the upper mold base 210, and mold components for performing sprouting, convex point and curvature processing on the IGBT substrate are respectively installed in the mounting groove. The mold component includes a sprouting template 400, and the number of sprouting templates 400 is two. The two sprouting templates 400 are respectively arranged in the mounting grooves provided on the left side of the outer wall on the opposite side of the bottom mold base 100 and the upper mold base 210. The sprouting template 400 includes a first lower template 410, and both ends of the outer wall of the first lower template 410 are fixed with positioning Block 412, the installed positioning block 412 is used to position and fix the first lower template 410 when it is installed in the installation groove. The first lower template 410 and the positioning block 412 are slidably installed in the installation groove. The outer walls of the two first lower templates 410 on the opposite sides are fixed with sprouting arc strips 411. The sprouting arc strips 411 fixed on the upper and lower first lower templates 410 are arranged in a staggered manner. When the upper mold fixing plate 200 and the upper mold base 210 move downward, the upper and lower first lower templates 410 will be docked together. The set sprouting arc strips 411 can clamp the IGBT substrate, so that the IGBT substrate is formed with a concave-convex structure, thereby completing the sprouting operation;

[0025] The mold component also includes a bump template 500 and a first upper template 510. The bump template 500 and the first upper template 510 are respectively installed in the installation grooves opened at the center of the outer wall of the opposite side of the bottom mold base 100 and the upper mold base 210. The bump template 500 includes a second lower template 501. The top of the outer wall of the second lower template 501 is fixed with a convex particle 502. The bottom end of the outer wall of the first upper template 510 and the position corresponding to the convex particle 502 are provided with a concave hole. Specifically, the second lower template 501 can be installed in the installation groove opened at the center position of the bottom mold base 100, and the first upper template 510 can be installed in the installation groove opened at the center position of the upper mold base 210. When the hydraulic rod 220 drives the upper mold base 210 to move downward, the provided convex particle 502 will cooperate with the concave hole to process the convex point on the IGBT substrate, thereby completing the convex point processing;

[0026] The mold components also include a radian template 600 and a second upper template 610. The radian template 600 and the second upper template 610 are respectively installed in the installation grooves opened at the center of the outer wall on the opposite side of the bottom mold base 100 and the upper mold base 210. The radian template 600 includes a third lower template 601. The top of the outer wall of the third lower template 601 is fixed with a radian forming strip 602. The bottom end of the outer wall of the second upper template 610 and the position corresponding to the radian forming strip 602 are provided with a radian forming groove 611. The radian forming strip 602 is used in conjunction with the radian forming groove 611. Specifically, personnel can install the third lower template 601 in the installation groove opened at the top right position of the bottom mold base 100, and the second upper template 610 can be installed in the installation groove opened at the right position of the upper mold base 210. When the hydraulic rod 220 drives the upper mold base 210 to move downward, the set radian forming strip 602 will cooperate with the radian forming groove 611 to process the IGBT substrate into a radian, thereby completing the radian processing.

[0027] The usage process of the present utility model is as follows: first, personnel can take out the first lower template 410, and install the two first lower templates 410 in the installation grooves opened on the left side of the bottom mold base 100 and the upper mold base 210 respectively, and the set first lower templates 410 can be fixed in the installation grooves respectively by bolts, and then personnel can take out the second lower template 501 and the first upper template 510, and then install the second lower template 501 in the installation groove opened at the top center of the bottom mold base 100, and the first upper template 510 can be installed in the installation groove opened at the bottom center of the upper mold base 210, and then fix it with bolts after the installation is completed, finally take out the third lower template 601 and the second upper template 610, and then install the third lower template 601 in the installation groove opened at the top right side of the bottom mold base 100, and the second upper template 610 can be installed in the installation groove opened at the bottom right side of the upper mold base 210, and then fix it with bolts after the installation is completed;

[0028] Then the personnel takes out the IGBT substrate to be processed and places the IGBT substrate between the bottom mold base 100 and the upper mold base 210. Then the personnel can control the hydraulic rod 220 so that the hydraulic rod 220 drives the upper mold fixing plate 200 and the upper mold base 210 to move downward. When the upper mold base 210 moves downward, the two first lower mold plates 410 can process the concave and convex structures of the IGBT substrate through the sprouting arc strips 411, thereby completing the sprouting operation. The convex particles 502 fixed on the top of the second lower mold plate 501 cooperate with the convex particles 502 fixed on the top of the second lower mold plate 501 to form a concave and convex structure. The concave hole opened at the bottom end of the first upper template 510 is used to process the convex points on the IGBT substrate, thereby completing the convex point processing, and the arc forming strip 602 fixed at the top end of the third lower template 601 cooperates with the arc forming groove 611 opened at the bottom end of the second upper template 610 to process the arc on the IGBT substrate, thereby completing the arc processing. After the processing is completed, the personnel can move the upper mold fixing plate 200 upward through the hydraulic rod 220 to reset it, and then the personnel can remove the processed IGBT substrate and then replace the IGBT substrate.

[0029] The above description is merely a preferred embodiment of the present invention. Anyone skilled in the art may utilize the above-described technical solutions to modify the present invention or create equivalent technical solutions. Therefore, any simple modification or equivalent replacement based on the technical solutions of the present invention falls within the scope of protection claimed by the present invention.

Claims

1. A continuous die for punching buds, bumps, and radians of an IGBT substrate in one step, comprising a bottom die base (100), an upper die fixing plate (200) being provided above the top of the outer wall of the bottom die base (100), an IGBT substrate to be processed being provided between the bottom die base (100) and the upper die fixing plate (200), characterized in that: An upper mold base (210) is fixed to the bottom end of the outer wall of the upper mold fixing plate (200), and a mounting groove is provided on the side of the bottom mold base (100) opposite to the upper mold base (210), and mold components for performing budding, convex point and curvature processing on the IGBT substrate are respectively installed in the mounting groove.

2. The continuous die for punching buds, bumps, and radians of an IGBT substrate according to claim 1, characterized in that: A bottom mold mounting block (110) for placement is fixed to the bottom end of the outer wall of the bottom mold base (100), and a hydraulic rod (220) is fixed at the center of the top end of the outer wall of the upper mold fixing plate (200).

3. The continuous die for punching buds, bumps, and radians of an IGBT substrate in one step according to claim 1, characterized in that: Guide rods (300) are fixed at the four corners of the top end of the outer wall of the bottom mold base (100), and through holes are opened at the upper and lower ends of the outer wall of the upper mold fixing plate (200) and at positions corresponding to the guide rods (300), and the outer walls of the guide rods (300) are slidably connected to the inner walls of the through holes.

4. The continuous die for punching buds, bumps, and radians of an IGBT substrate in one step according to claim 1, characterized in that: The mold component includes a sprouting template (400), and the number of the sprouting templates (400) is two. The two sprouting templates (400) are respectively arranged in the installation grooves opened on the left side of the outer wall of the bottom mold base (100) and the upper mold base (210) on the opposite side.

5. The continuous die for punching buds, bumps, and radians of an IGBT substrate according to claim 4, characterized in that: The sprouting template (400) includes a first lower template (410), both ends of the outer wall of the first lower template (410) are fixed with positioning blocks (412), the first lower template (410) and the positioning blocks (412) are slidably installed in the installation groove, and the outer walls of the two first lower templates (410) on the opposite sides are fixed with sprouting arc strips (411), and the sprouting arc strips (411) fixed on the upper and lower first lower templates (410) are arranged in a staggered manner.

6. The continuous die for punching buds, bumps, and radians of an IGBT substrate in one step according to claim 4, characterized in that: The mold component also includes a convex template (500) and a first upper template (510), and the convex template (500) and the first upper template (510) are respectively installed in the installation grooves opened at the center of the outer wall of the opposite side of the bottom mold base (100) and the upper mold base (210), and the convex template (500) includes a second lower template (501), and the top end of the outer wall of the second lower template (501) is fixed with a convex particle (502), and the bottom end of the outer wall of the first upper template (510) is provided with a concave hole at a position corresponding to the convex particle (502).

7. The continuous die for punching buds, bumps, and radians of an IGBT substrate in one step according to claim 4, characterized in that: The mold component also includes a radian template (600) and a second upper template (610), and the radian template (600) and the second upper template (610) are respectively installed in installation grooves opened at the center of the outer wall of the bottom mold base (100) and the upper mold base (210) on the opposite side.

8. The continuous die for punching buds, bumps, and radians of an IGBT substrate according to claim 7, characterized in that: The arc template (600) includes a third lower template (601), the top end of the outer wall of the third lower template (601) is fixed with an arc forming strip (602), and the bottom end of the outer wall of the second upper template (610) and the position corresponding to the arc forming strip (602) are provided with an arc forming groove (611), and the arc forming strip (602) and the arc forming groove (611) are used in conjunction with each other.

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