Heating disc mechanism and thin film deposition equipment thereof

Abstract

The utility model discloses a heating disc mechanism and a film deposition device thereof, the heating disc mechanism comprises a heating disc carrier and a plurality of heating wire assemblies embedded in the heating disc carrier, the heating disc carrier is provided with a heating surface, the heating wire assemblies extend from the center of the heating surface to the edge of the heating surface, and the heating wire assemblies are arranged in the heating disc carrier. The heating wire units extend from the edge of the heating surface to the center of the heating surface and are sequentially connected end to end. According to the heating disc mechanism provided by the utility model, the heating wire units are uniformly embedded in the heating disc carrier, so that the uniformity of the surface temperature of the heating disc is improved. The heating wire unit adopts the structural design that at least two layers are stacked, the problem of cold points caused by breakpoints existing at the electric connecting end is avoided, and at least two sets of heating wire assemblies are arranged, so that the problem of power failure and downtime of the heating disc caused by faults of a single heating wire is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of heating equipment, in particular to a heating disk mechanism and thin film deposition equipment thereof. Background Art

[0002] Heating plates are a common heating mechanism used in the chambers of semiconductor coating equipment. The uniformity of the heating plate's surface temperature can affect coating quality. Because the purge channel on the heating plate at the bottom of the chamber in semiconductor coating equipment is located, this can lead to uneven surface temperatures on the heating plate when the resistance wire is heated, further impacting the uniformity of heating at the bottom of the chamber. Utility Model Content

[0003] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a heating disk mechanism and a thin film deposition device thereof to solve the technical problem of uneven surface temperature of the heating disk of the prior semiconductor equipment.

[0004] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0005] An embodiment of the present utility model provides a heating plate mechanism, which includes: a heating plate carrier and a heating wire assembly embedded in the heating plate carrier, the heating plate carrier having a heating surface, and the heating wire assembly is composed of a plurality of heating wire units connected end to end in sequence, extending from the center of the heating surface to the edge of the heating surface, and then extending from the edge of the heating surface to the center of the heating surface.

[0006] The extending shapes of the plurality of heating wire units are the same, and they are arranged symmetrically with respect to the center of the heating surface.

[0007] Wherein, the heating surface is a circular surface.

[0008] Wherein, the heating plate carrier is also provided with a docking plug, and both ends of the heating wire assembly are fixedly connected to the docking plug.

[0009] The heating wire unit is spirally stacked in at least two layers in the thickness direction of the heating plate.

[0010] Wherein, both ends of the heating wire unit extend from the heating surface, and the ends extending from the heating surface are fixedly connected to the docking plug. An insulating block is also provided between the docking plug and the heating surface, and the ends of the heating wire assembly are insulated by the insulating block.

[0011] The docking plug includes a docking mounting block and a protective cover, wherein the protective cover is clamped to the docking mounting block, and the docking mounting block is provided with a cable socket for an external cable and a heating wire socket for plugging into the electrical connection end of the heating wire assembly.

[0012] The heating wire unit is a structure in which two heating wires are spirally nested in the same direction.

[0013] Wherein, the heating wire assembly is composed of at least two groups of heating wire units distributed in inner and outer rings on the heating surface.

[0014] An embodiment of the present invention further provides a thin film deposition device, which includes the heating plate mechanism described above.

[0015] The heating plate mechanism of this utility model evenly embeds the heating wire units within the heating plate carrier, thereby improving the uniformity of the heating plate surface temperature. The heating wire units are designed with at least two stacked layers to avoid the problem of cold spots caused by breakpoints at the electrical connection ends. The presence of at least two groups of heating wire units also prevents power outages and downtime caused by a single heating wire failure.

[0016] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In addition, in order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the overall structure of the heating plate mechanism according to an embodiment of the present invention.

[0018] Figure 2 This is an exploded view of the heating plate mechanism according to an embodiment of the present invention.

[0019] Figure 3 This is a top view of the heating plate mechanism according to an embodiment of the present invention.

[0020] Figure 4 for Figure 3 Middle BB section view.

[0021] Figure 5 This is a schematic diagram of the structure of the heating wire unit of the heating plate mechanism of the present invention.

[0022] Figure 6 for Figure 1 Schematic diagram of the enlarged structure of part A in the middle.

[0023] Figure 7 for Figure 4 Schematic diagram of the enlarged structure of part B in the middle.

[0024] Figure 8 4 is a flow chart of the dual-channel temperature control process of the heating plate mechanism of this embodiment.

[0025] Description of reference numerals:

[0026] Heating plate mechanism 100, heating plate carrier 1, heating wire assembly 2, docking plug 3, cable 4, heating surface 10, center 11, edge 12, lower heating wire 21, upper heating wire 22, electrical connection end 211, electrical connection end 212, first part 201, second part 202, protective cover 31, insulating block 32, and docking mounting block 33. DETAILED DESCRIPTION

[0027] In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below with reference to the accompanying drawings and specific implementation methods.

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts shall fall within the scope of protection of the present invention.

[0029] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships described in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0030] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, "plurality" means two or more, unless otherwise specifically defined.

[0031] In this utility model, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can mean connected, detachably connected, or integrated; they can mean mechanically connected or electrically connected; they can mean directly connected or indirectly connected through an intermediate medium; they can mean internal communication between two components or an interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0032] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0033] Throughout this specification, reference to terms such as "one embodiment," "some embodiments," "examples," "specific examples," or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with that embodiment or example are included in at least one embodiment or example of the present invention. Throughout this specification, the schematic representations of the above terms should not be construed as necessarily referring to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

[0034] Heating plates are a common heating mechanism used in chamber heating in semiconductor coating equipment. The uniformity of the heating plate's surface temperature can affect coating quality. Because purge channels are provided on the heating plate at the bottom of the chamber, semiconductor coating equipment can cause uneven surface temperatures on the heating plate when the resistance wire is heating, further affecting the uniformity of heating at the bottom of the chamber. Furthermore, the end of existing single heating wires is connected to an external power cable, resulting in disconnected cold spots, which can also lead to uneven surface temperatures on the heating plate. Therefore, based on the aforementioned requirements, this embodiment provides a heating plate mechanism 100.

[0035] See also Figures 1 to 7 This embodiment discloses a heating plate mechanism 100, comprising a heating plate carrier 1 and a heating wire assembly 2 embedded within the heating plate carrier 1. The heating plate carrier 1 has a heating surface 10. The heating wire assembly 2 comprises a plurality of heating wire units 20 connected end to end, extending from the center 11 of the heating surface 10 toward the edge 12 of the heating surface 10, and then from the edge 12 of the heating surface 10 toward the center 11 of the heating surface 10. From a top view, the heating wire assembly 2, consisting of the plurality of heating wire units 20, is arranged in a circular, wavy pattern below the heating surface 10.

[0036] The heating plate operates by generating heat through embedded heating wires, which are then transferred to the heating plate carrier 1, thereby heating the workpiece in contact therewith. In this embodiment, the heating wire assembly 20 extends back and forth between the edge 12 and the center 11 of the heating surface 10. This ensures that the heating wires of the heating wire assembly 20 are evenly embedded within the heating plate carrier 1, thereby improving the uniformity of the surface temperature of the heating plate carrier 1.

[0037] Please refer again Figure 4 , one heating wire assembly 20 includes: a first portion 201 extending from the center to the edge of the heating surface 10, and a second portion 202 connected to the end of the first portion 201 and extending from the edge of the heating surface 10 to the center. Among them, the first portion 201 and the second portion 202 are both arc-shaped. It can be understood that the heating wire assembly 20 composed of the first portion 201 and the second portion 202 is not Figure 4 The shape shown is limited to this, and it can also be any other shape that extends back and forth from the edge of the heating surface 10 to the center, the purpose of which is to allow the heating wires to be evenly distributed in the heating plate carrier 1.

[0038] In this embodiment, several groups of heating wire assemblies 20 together form a wavy annular heating wire assembly 2. Each heating wire assembly 20 is an integrally formed structure. During processing, the heating wire assembly 2 is formed by bending a single heating wire along the aforementioned extension direction. It is understood that in other embodiments, the heating wire assembly 2 can be composed of any number of heating wire units 20, and the extension of each heating wire unit 20 can be the same shape or different shapes.

[0039] It should be noted that the single heating wire of the heating wire unit 20 can be a straight rod or an arc-shaped rod structure, or can also be a spiral structure. In other words, the heating wire assembly 2 can be a single heating wire bent according to the above structure, or can also be a heating spring wire bent along the above direction.

[0040] In this embodiment, the extension shapes of the plurality of heating wire units 20 are the same and are arranged in a central symmetric manner with respect to the center of the heating surface 10. The central symmetry mentioned here means that on the plane of the heating surface 10, with the vertical direction of the center of the heating surface 10 as the rotation axis, after the heating wire assembly 2 rotates once about the rotation axis at the same central angle, the axial projection of the heating wire assembly 2 still coincides with the initial state. Figure 4 As shown, there are five heating wire units 20, and the central angle of the central symmetric rotation is 72°. After each rotation of 72°, the projection of the heating wire assembly 2 is still in a coincidence with the initial position, that is, a central rotationally symmetric structure.

[0041] In this embodiment, the heating surface 10 is a circular surface, and the corresponding heating wire units 20 have the same structure, shape and size.

[0042] The heating plate carrier 1 is further provided with a docking plug 3, and both electrical connection ends of the heating wire assembly 2 are fixedly connected to the docking plug 3. The docking plug 3 is connected to the heating plate carrier 1, specifically, the docking plug 3 is connected to the heating plate carrier 1 by screws.

[0043] Please refer again Figure 4 and Figure 7 The heating wire assembly 2 is spirally stacked in at least two layers in the thickness direction of the heating plate carrier 1, namely an upper heating wire 22 and a lower heating wire 21. The upper heating wire 22 and the lower heating wire 21 are spirally stacked.

[0044] Compared to a heating wire assembly with a single layer of heating wire, this embodiment utilizes a heating wire design with at least two layers of stacked spirals. This has the advantage that, at the electrical connection ends 211 and 212 of the heating wire, since the connection ends 211 and 212 are respectively electrically connected to the positive and negative poles of an external power source, they must be spaced apart. A single layer of heating wire would inevitably have a breakpoint at the gap, resulting in a cold spot at the corresponding location of the heating plate carrier 1, ultimately affecting the temperature uniformity of the heating surface 10. In this embodiment, however, a heating wire design with two or more layers of spiral structure eliminates breakpoints at the electrical connection ends, thereby reducing the impact of cold spots caused by breakpoints.

[0045] Among them, the two electrical connection ends 211 and 212 of the heating wire unit 20 are both extended from the heating surface 10, and the ends extending from the heating surface 10 are fixedly connected to the docking plug 3. An insulating block 32 is also provided between the docking plug 3 and the heating surface 10, and the two electrical connection ends of the heating wire assembly 2 are insulated and separated by the insulating block 32.

[0046] Please refer again Figure 2 and Figure 6 The docking plug 3 includes a mounting block 33 and a protective cover 31. The protective cover 31 is snapped onto the mounting block 33. The mounting block 33 is provided with a cable inlet for the external cable 4 and a heating wire inlet for the end of the heating wire assembly 2. An insulating block 32 is connected to the bottom of the mounting block 33. The docking plug 3 electrically connects the electrical connection end of the heating wire assembly 2 to the external power cord, facilitating quick and easy subsequent power cord replacement.

[0047] Furthermore, the heating wire assembly 2 is a structure in which two heating wires are spirally nested in the same direction. That is, the heating wire assembly 2 is a structure in which two heating wires of identical structure and shape are nested in the same direction according to the above structural requirements, and their ends are commonly connected to a docking plug 3. The reason for adopting a design of at least two groups of heating spring wires with identical structure and extending in the same direction and nested is to avoid equipment downtime caused by burning or breaking of the heating wires in the heating disk mechanism 100 during long-term operation. Such a broken heating wire will cause a sudden change in the temperature of the heating disk mechanism 100, thereby affecting the quality of thin film deposition. In this embodiment, the design of two groups of heating wires in parallel can avoid the occurrence of the above situation and ensure the quality of thin film deposition.

[0048] In another embodiment, in order to avoid the negative impact of a sudden temperature change of the heating disk mechanism 100 caused by the breakage or burning of the heating wire, the heating wire assembly 2 is composed of at least two groups of two heating wires distributed in an inner and outer ring shape on the heating surface 10. That is, it can also be composed of at least two heating wires (or heating spring wires) distributed in an inner and outer ring shape on the heating surface 10. It is understandable that, as in another embodiment, the heating wire assembly 2 can also be composed of at least two groups of heating wire modules distributed in an inner and outer ring shape on the heating surface 10, and a single heating wire module can be a nested structure of at least two spiral heating wires with the same structure and shape.

[0049] See also Figure 8 , which is a flow chart of the dual-channel temperature control process of the heating disk mechanism of this embodiment. When the heating disk mechanism 100 is working normally, the two sets of parallel heating wire assemblies 2 are energized and heated at the same time. The two are started synchronously so that the heating disk reaches the set temperature value. It is assumed that their respective normal working powers are P1 and P2. When the thin film deposition equipment is started, the current actual temperature t and the rated powers P1 and P2 of the dual-channel resistance wires are collected in real time, and the actual temperature value t is compared with the process set temperature value T. The relationship between the temperature t and the set process temperature T is judged, that is, whether t=T is established. If T=t, the current dual-channel heating wires continue to operate with their respective working powers P1 and P2 unchanged. If not, that is, when t<T, it is further judged whether P1=0 or P2=0 is established. If P1=0 or P2=0, it means that one of the resistance wires is damaged and cannot work normally. The other undamaged heating wire is adjusted to increase the power operation so that the temperature of the heating plate is quickly restored to the set temperature T. After the processing is completed, the power is turned off to repair the heating disk. If the judgment that P1=0 or P2=0 is not established, that is, both the dual-channel heating wires are working, then the manual indicates that the device is currently in the initial heating stage, so return to the first step to obtain the current working temperature t again and make subsequent judgments.

[0050] During the wafer processing, when one set of heating wire assemblies 2 is damaged and cannot work, the other heating wire assembly 2 connected in parallel with it continues to work. At this time, its power needs to be increased to reach the rated power in order to maintain the current working temperature of the heating disk. If any set of heating wires is damaged, the heating disk needs to be replaced or repaired after completing a processing process. During a wafer processing, if a single heating wire is damaged and causes a sudden change in the temperature of the heating disk, the current wafer will be scrapped, resulting in a large economic loss. The dual parallel heating wire assembly design of this embodiment can keep one of the heating wire assemblies working in an increased power mode in this case until the current wafer processing is completed, and then the heating disk mechanism can be repaired or replaced, thereby avoiding wafer scrapping.

[0051] An embodiment of the present invention further provides a thin film deposition device, which includes the heating plate mechanism 100 as described above.

[0052] The heating plate mechanism and thin film deposition apparatus of this embodiment evenly embed the heating wire units within the heating plate carrier, thereby improving the uniformity of the heating plate surface temperature. The heating wire units utilize a stacked structure of at least two layers to avoid cold spots caused by breakpoints at the electrical connection ends. Furthermore, the provision of at least two groups of heating wire units prevents power outages and downtime caused by a single heating wire failure.

[0053] The above examples are merely used to further illustrate the technical content of the present invention for easier understanding by the reader. However, they do not limit the implementation of the present invention to these examples. Any technical extension or reinvention based on the present invention is protected by the present invention. The scope of protection of the present invention shall be determined by the claims.

Claims

1. A heating plate mechanism, characterized in that: include: A heating plate carrier and a heating wire assembly embedded in the heating plate carrier, wherein the heating plate carrier has a heating surface, and the heating wire assembly is composed of a plurality of heating wire units connected end to end and extending from the center of the heating surface to the edge of the heating surface and then from the edge of the heating surface to the center of the heating surface.

2. The heating plate mechanism according to claim 1, characterized in that: The extension shapes of the plurality of heating wire units are all the same, and are centrally symmetrically arranged about the center of the heating surface.

3. The heating plate mechanism according to claim 2, characterized in that: The heating surface is a circular surface.

4. The heating plate mechanism according to claim 1, wherein: The heating disc carrier is also provided with a docking plug, and both electrical connection ends of the heating wire assembly are fixedly connected to the docking plug.

5. The heating plate mechanism according to claim 1, wherein: The heating wire unit is spirally stacked in at least two layers in the thickness direction of the heating plate carrier.

6. The heating plate mechanism according to claim 5, characterized in that: Both electrical connection ends of the heating wire assembly extend from the heating surface, and the ends extending from the heating surface are fixedly connected to the docking plug. An insulating block is also provided between the docking plug and the heating surface, and the electrical connection ends of the heating wire assembly are insulated by the insulating block.

7. The heating plate mechanism according to claim 6, characterized in that: The docking plug includes: a docking installation block and a protective cover, the protective cover is clamped on the docking installation block, and the docking installation block is provided with a cable socket for an external cable and a heating wire socket for an external electrical connection end of the heating wire assembly.

8. The heating plate mechanism according to any one of claims 1 to 7, characterized in that: The heating wire assembly is a structure in which two heating wires are spirally nested in the same direction.

9. The heating plate mechanism according to any one of claims 1 to 7, characterized in that: The heating wire assembly is composed of at least two groups of heating wire units distributed in inner and outer rings on the heating surface.

10. A thin film deposition device, characterized in that: The thin film deposition apparatus comprises the heating plate mechanism according to any one of claims 1 to 9.

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