Automatic bale breaker for wafers

Abstract

The utility model relates to the technical field of automatic wafer unpacking equipment, in particular to an automatic wafer unpacking machine. The utility model provides an automatic wafer bale breaker which comprises an AGV transfer trolley, a bearing platform, a first material taking mechanism, a second material taking mechanism, a film removing mechanism and a paper removing mechanism. The AGV transfer trolley is used for transferring the tray bearing the packaging box in the cache area to the bearing platform; the first material taking mechanism is used for grabbing the packaging box on the tray and transferring the packaging box to the second material taking mechanism; the second material taking mechanism is used for taking out the wafers in the packaging box and sequentially conveying the wafers to the film removing mechanism and the paper removing mechanism; the film removing mechanism is used for removing a protective bag sleeving the wafer, and the paper removing mechanism is used for removing dust-free paper on the two sides of the wafer. Through cooperation of the AGV transfer trolley, the first material taking mechanism, the second material taking mechanism, the film removing mechanism and the paper removing mechanism, wafers in the packaging box in the buffer area can be automatically taken out, manual intervention is not needed in the whole process, and the automation degree is high.

Description

Technical Field

[0001] The utility model relates to the technical field of automatic wafer unpacking equipment, in particular to an automatic wafer unpacking machine. Background Art

[0002] Solar cell wafers are the core component of solar cells. They are made by processing semiconductor material (usually silicon) into thin slices, which are then subjected to a series of processing steps to ultimately create devices that convert sunlight into electrical energy. Solar cell wafers typically come in stacks of multiple wafers and packaged in boxes. Existing technology often relies on manual removal of wafers from the packaging, resulting in low efficiency and high costs. Furthermore, manual handling increases the probability of wafer damage. Utility Model Content

[0003] (1) The problem to be solved by the present invention is that the conventional unpacking of wafers is mostly done manually, which is inefficient, costly, and easily damages the wafers.

[0004] (2) Technical solution

[0005] In order to solve the above technical problems, the embodiment of the present invention provides an automatic wafer unpacking machine, which is used to take out wafers stored in packaging boxes; wherein the packaging boxes are stacked on a pallet and located in a buffer area;

[0006] The wafer automatic unpacking machine includes: an AGV transfer vehicle, a carrying platform, a first material picking mechanism, a second material picking mechanism, a film removing mechanism and a paper removing mechanism;

[0007] The AGV transfer vehicle is used to transfer the pallet carrying the packaging box in the buffer area to the carrying platform;

[0008] The first picking mechanism is used to grab the packaging box on the pallet and transfer the packaging box to the second picking mechanism;

[0009] The second material taking mechanism is used to take out the wafers from the packaging box and sequentially transport the wafers to the film removing mechanism and the paper removing mechanism;

[0010] The film removal mechanism is used to remove the protective bag wrapped around the wafer, and the paper removal mechanism is used to remove the dust-free paper on both sides of the wafer.

[0011] Furthermore, the first material picking mechanism includes a first mechanical arm, a material picking box, a first suction cup and a first driving member;

[0012] The material taking box is arranged at the end of the first mechanical arm, and the first mechanical arm is used to drive the material taking box to move;

[0013] The material picking box has a first end and a second end opposite to each other, and the first end of the material picking box is open; the first suction cup is arranged in the material picking box, and the first driving member is arranged on the material picking box and connected to the first suction cup; the first suction cup can adsorb the packaging box, and the first driving member is used to drive the first suction cup to move between the first end and the second end of the material picking box.

[0014] Furthermore, the packaging box is provided with a box cover, which is provided on the packaging box and is used to open or close the packaging box;

[0015] The first material taking mechanism further includes a second suction cup;

[0016] The second suction cup is arranged in the material taking box body and is located on the top wall of the material taking box body. The second suction cup is used to absorb the box cover.

[0017] Furthermore, the packaging box and the box cover are fixed by adhesive tape;

[0018] The first material-retrieving mechanism further includes a tape cutting assembly, which is arranged on the material-retrieving box and is used for cutting the tape.

[0019] Furthermore, the tapping tape assembly includes a cutter head and a second driving member;

[0020] The second driving member is fixed on the material picking box, and the cutter head is arranged on the second driving member; openings are provided on both sides of the material picking box at positions matching the tape, and the second driving member drives the cutter head to extend into the material picking box through the openings and cut the tape or leave the material picking box.

[0021] Furthermore, the second material taking mechanism includes a mounting seat and a clamping assembly;

[0022] The clamping assembly includes a third driving member, a first clamping jaw and two second clamping jaws;

[0023] The first clamping jaw is connected to the third driving member, the third driving member and the two second clamping jaws are all provided on the mounting base, the two second clamping jaws are respectively located on both sides of the first clamping jaw, and the two second clamping jaws are both made of flexible material;

[0024] The third driving member is used to drive the first clamping jaw to move, so that the first clamping jaw can extend into the packaging box and clamp the wafers in the packaging box, and send the taken-out wafers to the two second clamping jaws.

[0025] Furthermore, the second material taking mechanism further includes a support assembly;

[0026] After the clamping assembly takes out the wafer, it can drive the wafer to flip into a horizontal state; the supporting assembly is arranged on the mounting seat and is used to support the wafer when the wafer is in a horizontal state.

[0027] Furthermore, the paper removal mechanism includes: a wafer conveying line, a first adsorption component, a second adsorption component, a third adsorption component and a robot;

[0028] The wafer conveying line is used to convey the wafers, and along the conveying direction of the wafer conveying line, the first adsorption assembly and the second adsorption assembly are sequentially arranged on the wafer conveying line;

[0029] The first adsorption component is used to remove the dust-free paper above the wafer;

[0030] The second adsorption component is used to adsorb the dust-free paper under the wafer;

[0031] The robot is used to remove the wafer when the second adsorption component adsorbs the dust-free paper under the wafer, so as to separate the wafer from the dust-free paper under the wafer;

[0032] After the robot takes away the wafer, the third adsorption component is used to take away the dust-free paper on the wafer conveying line.

[0033] Furthermore, the film removal mechanism includes a fourth driving member and a flexible clamping plate;

[0034] Two flexible splints are provided, and the two flexible splints are arranged opposite to each other;

[0035] The fourth driving member is connected to the two flexible splints and drives the two flexible splints to move closer to or away from each other.

[0036] Furthermore, it also includes a wafer appearance detection mechanism;

[0037] The wafer appearance inspection mechanism includes: a platform component, a first inspection component, and a second inspection component;

[0038] The platform assembly is used to place the wafer;

[0039] At least one first detection assembly is provided, and the first detection assembly is provided beside the platform assembly and is used to detect the periphery of the wafer, and the first detection assembly can move toward or away from the platform assembly;

[0040] The second detection component is arranged above the platform component and opposite to the platform component. The second detection component is used to detect the surface of the wafer. The second detection component can move towards or away from the platform component.

[0041] Beneficial effects of the utility model:

[0042] The automatic chip unpacking machine provided by the present invention is used to take out the chips stored in the packaging box; wherein, the packaging box is stacked on a pallet and is located in a buffer area; the automatic chip unpacking machine includes: an AGV transfer vehicle, a carrying platform, a first material picking mechanism, a second material picking mechanism, a film removal mechanism and a paper removal mechanism; the AGV transfer vehicle is used to transfer the pallet carrying the packaging box in the buffer area to the carrying platform; the first material picking mechanism is used to grab the packaging box on the pallet and transfer the packaging box to the second material picking mechanism; the second material picking mechanism is used to take out the chips in the packaging box and transport the chips to the film removal mechanism and the paper removal mechanism in turn; the film removal mechanism is used to remove the protective bag wrapped around the chip, and the paper removal mechanism is used to remove the dust-free paper on both sides of the chip.

[0043] Through the cooperation of the AGV transfer vehicle, the first material picking mechanism, the second material picking mechanism, the film removal mechanism and the paper removal mechanism, the chips in the packaging box in the buffer area can be automatically taken out without manual intervention throughout the process, with a high degree of automation. Compared with existing technologies, the production efficiency is higher and the production cost is lower. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the specific implementation methods of the utility model or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0045] Figure 1 A schematic structural diagram of a first material-retrieving mechanism provided in an embodiment of the present utility model;

[0046] Figure 2 A schematic structural diagram of a second material-retrieving mechanism provided in an embodiment of the present utility model;

[0047] Figure 3 The schematic diagram of the structure of the second material picking mechanism provided in the embodiment of the present invention when grabbing the wafer. Figure 3 In the figure, the wafer is in a horizontal state;

[0048] Figure 4 A schematic structural diagram of a paper removal mechanism provided in an embodiment of the present utility model;

[0049] Figure 5 Schematic diagram of the structure of the gripper grabbing the wafer;

[0050] Figure 6This is a schematic structural diagram of an appearance detection mechanism provided in an embodiment of the present utility model.

[0051] Icons: 11- material picking box; 12- first suction cup; 13- first driving member; 14- second suction cup; 15- cutter head; 16- second driving member;

[0052] 21-mounting seat; 22-first clamping jaw; 23-second clamping jaw; 24-third driving member; 25-support member; 26-sixth driving member;

[0053] 31 - wafer conveyor line; 32 - first adsorption assembly; 321 - first lateral displacement assembly; 322 - first vertical displacement assembly; 323 - third suction cup; 33 - second adsorption assembly; 331 - second vertical displacement assembly; 332 - fourth suction cup; 34 - third adsorption assembly; 341 - third lateral displacement assembly; 342 - third vertical displacement assembly; 343 - fifth suction cup; 35 - manipulator; 351 - seventh driving member; 352 - claw;

[0054] 41- platform assembly; 411- detection platform; 412- motor; 42- first detection assembly; 421- first detection camera; 422- first linear module; 423- first mounting bracket;

[0055] 51- chip; 52- dust-free paper. DETAILED DESCRIPTION

[0056] The following will clearly and completely describe the technical solutions of the present invention in conjunction with the embodiments. Obviously, the embodiments described are only a part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0057] like Figures 1 to 6 As shown, one embodiment of the present invention provides an automatic chip unpacking machine for taking out chips 51 stored in a packaging box; wherein the packaging boxes are stacked on a pallet and are located in a buffer area; the automatic chip unpacking machine includes: an AGV transfer vehicle, a carrying platform, a first material picking mechanism, a second material picking mechanism, a film removal mechanism and a paper removal mechanism; the AGV transfer vehicle is used to transfer the pallet carrying the packaging boxes in the buffer area to the carrying platform; the first material picking mechanism is used to grab the packaging box on the pallet and transfer the packaging box to the second material picking mechanism; the second material picking mechanism is used to take out the chips 51 in the packaging box, and transport the chips 51 to the film removal mechanism and the paper removal mechanism in turn; the film removal mechanism is used to remove the protective bag wrapped around the chip 51, and the paper removal mechanism is used to remove the dust-free paper 52 on both sides of the chip 51.

[0058] The automatic wafer unpacking machine proposed in this embodiment is used to remove the wafers 51 from the packaging box. When packing the wafers 51, dust-free paper 52 must be added on both sides of the wafers 51 to protect the wafers 51. Then, the wafers 51 and the dust-free paper 52 are placed together in a protective bag, and finally placed together in the packaging box. Therefore, the automatic wafer unpacking machine in this embodiment also removes the protective bag and dust-free paper 52 after removing the wafers 51. The wafers 51 removed by the automatic wafer unpacking machine in this embodiment can be directly transported to the subsequent process for use. Preferably, the wafers 51 in this embodiment refer to multiple wafers stacked together. The wafers 51 are stored in a packaging box, and several packaging boxes are stacked on a pallet. The production workshop is divided into a buffer area, and several pallets carrying packaging boxes are stored in the buffer area. Optionally, the pallet can be a wooden pallet or a plastic pallet, which can be transported by a forklift, or the pallet can be a pallet with running wheels at the bottom, which can be transported by a trailer.

[0059] In this embodiment, the automatic chip unpacking machine includes: an AGV (Automated Guided Vehicle) transfer vehicle, a carrying platform, a first material picking mechanism, a second material picking mechanism, a film removal mechanism, and a paper removal mechanism. The AGV transfer vehicle is a forklift that can move back and forth between a buffer area and the carrying platform, and is used to transfer pallets carrying packaging boxes in the buffer area to the carrying platform. The first material picking mechanism is located on the carrying platform and is used to remove the packaging boxes stacked on the pallet one by one in the order in which they were stacked, and then transfer the removed packaging boxes to the second material picking mechanism; the second material picking mechanism is used to remove the chips 51 from the packaging boxes; when grabbing the chips 51, the second material picking mechanism only grabs the chips 51 and the dust-free paper 52 on both sides of the chips 51. However, since a plastic protective bag is placed outside the chips 51 and the dust-free paper 52, the second material picking mechanism will remove the protective bag when grabbing the chips 51. After the second material-picking mechanism takes out the chip 51 from the packaging box, it will first be transported to the film-removing mechanism for film removal. The film-removing mechanism grabs the protective bag to separate the protective bag from the chip 51. During this process, the second material-picking mechanism always holds the chip 51 tightly; then, the second material-picking mechanism transports the chip 51 without the protective bag to the paper-removing mechanism. The paper-removing mechanism removes the dust-free paper 52 on both sides of the chip 51, and then the chip 51 can be output outward.

[0060] The automatic chip unpacking machine provided in this embodiment can automatically take out the chips 51 in the packaging box of the buffer area through the cooperation of the AGV transfer vehicle, the first material picking mechanism, the second material picking mechanism, the film removal mechanism and the paper removal mechanism. No human intervention is required throughout the process, and the degree of automation is high. Compared with the existing technology, the production efficiency is higher and the production cost is lower.

[0061] In this embodiment, the aforementioned support platform includes a fifth drive member, a support plate, and a base. The support plate is a plate-shaped structure that is rotatably mounted on the base. The fifth drive member is also mounted on the base and is in transmission connection with the support plate, and is used to drive the support plate to rotate on the base. By providing a rotatable support plate, when the first retrieving mechanism grabs a packaging box, the support plate can drive the tray located on the support plate to rotate according to the grabbing situation of the first retrieving mechanism, thereby reducing the travel of the first robotic arm of the first retrieving mechanism and facilitating the grabbing of the packaging box. At the same time, since the first robotic arm can grab the packaging box through the retrieving box body 11 without excessive movement, it can also reduce the space occupied by the wafer automatic unpacking machine and facilitate the layout of the automatic loading device.

[0062] The wafer automatic unpacking machine provided by the embodiment of the present invention is as follows: Figure 1 As shown, the first material picking mechanism includes a first robotic arm, a material picking box 11, a first suction cup 12 and a first driving member 13; the material picking box 11 is arranged at the end of the first robotic arm, and the first robotic arm is used to drive the material picking box 11 to move; the material picking box 11 has a first end and a second end relative to each other, and the first end of the material picking box 11 is open; the first suction cup 12 is arranged in the material picking box 11, and the first driving member 13 is arranged on the material picking box 11 and connected to the first suction cup 12; the first suction cup 12 can adsorb the packaging box, and the first driving member 13 is used to drive the first suction cup 12 to move between the first end and the second end of the material picking box 11.

[0063] The above-mentioned first material picking mechanism includes a first robotic arm, a material picking box 11, a first suction cup 12 and a first driving member 13. Among them, the first robotic arm is composed of multiple arm sections, and two adjacent arm sections can rotate or slide relative to each other. The structure and principle of the first robotic arm are conventional technologies in this field, so they are not described here. The material picking box 11 is arranged on the first robotic arm. The material picking box 11 can suck the packaging boxes stacked on the pallet into the material picking box 11. The first robotic arm is used to drive the material picking box 11 to move so that the material picking box 11 can remove the packaging boxes one by one in the stacking order. At the same time, the first robotic arm can also drive the material picking box 11 to transfer the packaging boxes to the second material picking mechanism. Optionally, the first material picking mechanism can also be provided with a conveyor belt, which can also achieve the purpose of transferring the packaging boxes to the second material picking mechanism. The material picking box 11 has a first end and a second end relative to each other, and the first end of the material picking box 11 is open, and the packaging box can enter the material picking box 11 through the first end of the material picking box 11, and be output outward through the first end of the material picking box 11; optionally, the first driving member 13 can be a telescopic cylinder such as an air cylinder or an oil cylinder. At this time, the first driving member 13 is arranged in the material picking box 11 and fixed to the second end of the material picking box 11, and the first suction cup 12 is connected to the first driving member 13, and the first suction cup 12 is arranged pointing to the first end of the material picking box 11. The first driving member 13 is used to drive the first suction cup 12 to move along the first end of the material picking box 11 to the second end in the material picking box 11, and to drive the first suction cup 12 to move along the second end of the material picking box 11 to the first end in the material picking box 11. During use, the first robotic arm drives the picking box 11 to move so that the first end of the picking box 11 is located at the packaging box. After the picking box 11 reaches the predetermined position, the first suction cup 12 is activated and sucks the packaging box. The first driving member 13 drives the first suction cup 12 to move toward the second end of the picking box 11, so that the packaging box enters the picking box 11 from the first end of the picking box 11; thereafter, the first robotic arm drives the picking box 11 to move so that the picking box 11 moves to the second picking mechanism. The first driving member 13 drives the first suction cup 12 to move toward the first end of the picking box 11 to push the packaging box out of the picking box 11 for subsequent operations. In this embodiment, the picking box 11, the first driving member 13 and the first suction cup 12 cooperate to grab the packaging box, which can protect the packaging box from damage and has higher reliability. The packaging box will not fall from the picking box 11.

[0064] In this embodiment, when the first driving member 13 is a telescopic cylinder, the first driving member 13 needs to be disposed within the material picking box 11, which will occupy the internal space of the material picking box 11. Therefore, preferably, the first driving member 13 is a linear module, which is disposed outside the material picking box 11. Two linear modules are provided, and the two linear modules are disposed opposite each other to improve the stability of the first suction cup 12. The slider of the linear module is connected to the first suction cup 12 through a long hole provided on the material picking box 11, and drives the first suction cup 12 to reciprocate within the material picking box 11. It should be noted that the extension direction of the long hole is parallel to the axial direction of the material picking box 11.

[0065] It is understandable that, in this embodiment, the first driving member 13 can also be configured as a combination of a driving motor, a gear, and a rack, which can also achieve the purpose of driving the first suction cup 12 to reciprocate between the first end and the second end of the material picking box 11 in this embodiment. Specifically, the rack is provided on the inner side wall of the material picking box 11 and is parallel to the circumferential direction of the material picking box 11. The gear is provided at the output end of the driving motor and meshes with the rack. The first suction cup 12 is fixed to the driving motor. The driving motor drives the gear to rotate, thereby achieving the purpose of driving the first suction cup 12 to move along the extension direction of the rack, thereby achieving the purpose of driving the first suction cup 12 to reciprocate between the first end and the second end of the material picking box 11.

[0066] It is understandable that, in this embodiment, the first picking mechanism can also cooperate with the gripper through the robotic arm, which can also achieve the purpose of taking the packaging boxes stacked in piles on the pallet one by one in a preset order in this embodiment.

[0067] The wafer automatic unpacking machine provided by the embodiment of the present invention is as follows: Figure 1 As shown, the packaging box is provided with a box cover, which is provided on the packaging box for opening or closing the packaging box; the first material picking mechanism also includes a second suction cup 14; the second suction cup 14 is provided in the material picking box body 11 and is located on the top wall of the material picking box body 11, and the second suction cup 14 is used to adsorb the box cover.

[0068] Furthermore, in this embodiment, the upper end of the packaging box is open, and the open end of the packaging box is provided with a lid for opening or closing the packaging box to protect the wafers 51 inside the packaging box. To enable separation of the lid from the packaging box, the first retrieving mechanism further includes a second suction cup 14. The second suction cup 14 is disposed within the retrieving box body 11 and is located on the top wall of the retrieving box body 11. The second suction cup 14 is used to suck up the lid above the packaging box after the packaging box enters the retrieving box body 11. In this way, when the packaging box is pushed out of the retrieving box body 11, the lid will not leave the retrieving box body 11 along with the packaging box.

[0069] Optionally, in this embodiment, the second suction cup 14 can suck up the box cover above the packaging box through its own strong suction force, or a telescopic cylinder such as a pneumatic cylinder, an oil cylinder or an electric cylinder can be provided to drive the second suction cup 14 to move toward or away from the box cover, so as to facilitate the second suction cup 14 to suck up the box cover, thereby separating the box cover from the packaging box and facilitating subsequent operations.

[0070] The wafer automatic unpacking machine provided by the embodiment of the present invention is as follows: Figure 1 As shown, the packaging box and the box cover are fixed by tape; the first material-retrieving mechanism also includes a tape cutting assembly, which is arranged on the material-retrieving box body 11 and is used to cut the tape.

[0071] Furthermore, in this embodiment, the packaging box and its lid are secured with tape to prevent separation during transport. To enhance the automation of the wafer unpacking machine, the first retrieving mechanism also includes a tape cutting assembly for automatically cutting the tape between the packaging box and its lid once the packaging box enters the retrieving box 11, facilitating subsequent separation of the lid from the packaging box by the second suction cup 14, thereby improving production efficiency.

[0072] The wafer automatic unpacking machine provided by the embodiment of the present invention is as follows: Figure 1 As shown, the tape cutting assembly includes a cutter head 15 and a second drive member 16; the second drive member 16 is fixed to the material picking box 11, and the cutter head 15 is provided on the second drive member 16; openings are provided on both sides of the material picking box 11 at positions matching the tape, and the second drive member 16 drives the cutter head 15 to extend into the material picking box 11 through the opening and cut the tape or leave the material picking box 11.

[0073] Specifically, in this embodiment, the tape cutting assembly includes a cutter head 15 and a second drive member 16. The cutter head 15 is used to cut the tape; the second drive member 16 can be a telescopic cylinder such as a pneumatic cylinder, an oil cylinder, or an electric cylinder. The second drive member 16 is fixedly mounted outside the retrieving box 11. The cutter head 15 is connected to the second drive member 16. Through the telescopic movement of the second drive member 16, the cutter head 15 can extend through the opening into the retrieving box 11 to cut the tape, or exit the retrieving box 11 through the opening to avoid interfering with the entry or ejection of the packaging box.

[0074] It can be understood that in this embodiment, the second driving member 16 can also be a motor, which drives the cutter head 15 to swing through the rocker arm, which can also achieve the purpose of driving the cutter head 15 in this embodiment to extend into the material collection box 11 through the opening to cut the tape or exit the material collection box 11 through the opening.

[0075] The wafer automatic unpacking machine provided by the embodiment of the present invention is as follows: Figure 2 and Figure 3As shown, the second material picking mechanism includes a mounting base 21 and a clamping assembly; the clamping assembly includes a third driving member 24, a first clamping jaw 22 and two second clamping jaws 23; the first clamping jaw 22 is connected to the third driving member 24, and the third driving member 24 and the two second clamping jaws 23 are all arranged on the mounting base 21, and the two second clamping jaws 23 are respectively located on both sides of the first clamping jaw 22, and the material of the two second clamping jaws 23 is a flexible material; the third driving member 24 is used to drive the first clamping jaw 22 to move, so that the first clamping jaw 22 can extend into the packaging box and clamp the chip 51 in the packaging box, and send the taken out chip 51 to the two second clamping jaws 23.

[0076] In this embodiment, the above-mentioned second material-picking mechanism includes a mounting seat 21 and a clamping assembly. The mounting seat 21 is in the shape of a plate or a frame structure, and is used to install the clamping assembly. The clamping assembly is used to take out the wafer 51 in the packaging box. Specifically, the clamping assembly includes a third driving member 24, a first clamping jaw 22 and a second clamping jaw 23. The third driving member 24 is fixed on the mounting seat 21, and the third driving member 24 is a telescopic cylinder such as an oil cylinder, an air cylinder or an electric cylinder. The first clamping jaw 22 is installed on the third driving member 24, and the third driving member 24 is used to drive the first clamping jaw 22 to move. There are two second clamping jaws 23, and the two second clamping jaws 23 are respectively arranged on both sides of the first clamping jaw 22, and the second clamping jaw 23 is made of a flexible material such as rubber or silicone. During use, the third drive member 24 first drives the first clamping jaw 22 to extend so that the first clamping jaw 22 can extend into the packaging box and clamp the wafer 51. After the first clamping jaw 22 clamps the wafer 51, the third drive member 24 begins to retract to remove the wafer 51 from the packaging box. Since the second clamping jaws 23 are located on both sides of the first clamping jaw 22, the third drive member 24 retracts to allow the wafer 51 to enter the operating area of the second clamping jaws 23. When the wafer 51 enters the operating area of the second clamping jaws 23, the two second clamping jaws 23 operate and clamp the wafer 51. At this time, the first clamping jaw 22 can be released or continue to clamp the wafer 51. In this embodiment, after the clamping assembly removes the wafer 51, the wafer 51 needs to be transported to other processes. To prevent surface wear of the wafer 51 during transportation, the second clamping jaw 23 is provided to clamp the wafer 51. However, during the process of removing the wafer 51 from the packaging box, the second clamping jaw 23 has a weak gripping force and cannot remove the wafer 51. Therefore, the first clamping jaw 22 is provided to clamp the wafer 51. The cooperation between the first clamping jaw 22 and the second clamping jaw 23 can protect the surface of the wafer 51 from scratches and other quality problems to the greatest extent.

[0077] In this embodiment, the second pick-up mechanism further comprises a robotic arm, with a mounting base 21 fixedly mounted at the end of the robotic arm. The robotic arm is capable of driving the mounting base 21 to move, thereby transporting the wafer 51 to a subsequent process. The robotic arm in this embodiment is comprised of multiple segments, with adjacent segments capable of relative rotation or sliding. The structure and principles of the robotic arm are conventional in the art and will not be further described herein.

[0078] The embodiment of the utility model provides an automatic unpacking machine for raw silicon wafers, such as Figure 2 and Figure 3 As shown, the second material-taking mechanism also includes a support assembly; after the clamping assembly takes out the chip 51, it can drive the chip 51 to flip into a horizontal state; the support assembly is arranged on the mounting seat 21, and is used to support the chip 51 when the chip 51 is in a horizontal state.

[0079] In this embodiment, when the gripping assembly removes the wafer 51, the wafer 51 is in a vertical position. In order to transport the wafer 51 to the subsequent process, the aforementioned robotic arm is required to drive the mounting base 21 to flip, thereby flipping the wafer 51 from the vertical position to the horizontal position. However, when the wafer 51 is in the horizontal position, the wafer 51 is easily broken if it is only clamped by one edge of the gripping assembly. At the same time, the load of the gripping assembly is large, and there is a risk that the wafer 51 may fall off. Therefore, the material removal device also includes a support assembly for supporting the wafer 51 when the wafer 51 is in the horizontal position to prevent the wafer 51 from breaking or falling off, thereby providing a certain degree of protection for the wafer 51.

[0080] In this embodiment, the support assembly includes a sixth drive member 26 and a support member 25. The sixth drive member 26 is fixed to the mounting base 21 and is a telescopic cylinder such as a pneumatic cylinder, an oil cylinder, or an electric cylinder. The support member 25 is connected to the sixth drive member 26. The sixth drive member 26 is used to drive the support member 25 to move so that the support member 25 moves below the wafer 51 and supports the wafer 51 when the wafer 51 is in a horizontal state. When the wafer 51 is in a vertical state, the support member 25 moves away from the wafer 51. The arrangement of the sixth drive member 26 in conjunction with the support member 25 provides a high degree of automation, can protect the wafer 51, and prevent the wafer 51 from breaking or falling off.

[0081] It can be understood that in this embodiment, the sixth driving member 26 can also be a motor, which drives the support member 25 to rotate. When the chip 51 is in a horizontal state, the support member 25 rotates to the bottom of the chip 51, which can also achieve the purpose of supporting the chip 51 in this embodiment.

[0082] The wafer automatic unpacking machine provided by the embodiment of the present invention is as follows: Figure 4 and Figure 5As shown, the paper removal mechanism includes: a chip conveying line 31, a first adsorption component 32, a second adsorption component 33, a third adsorption component 34 and a robot 35; the chip conveying line 31 is used to convey the chip 51, and along the conveying direction of the chip conveying line 31, the first adsorption component 32 and the second adsorption component 33 are sequentially arranged at the chip conveying line 31; the first adsorption component 32 is used to remove the dust-free paper 52 above the chip 51; the second adsorption component 33 is used to adsorb the dust-free paper 52 below the chip 51; the robot 35 is used to remove the chip 51 when the second adsorption component 33 adsorbs the dust-free paper 52 below the chip 51, so as to separate the chip 51 from the dust-free paper 52 below the chip 51; after the robot 35 takes away the chip 51, the third adsorption component 34 is used to remove the dust-free paper 52 on the chip conveying line 31.

[0083] In this embodiment, after the chip 51 is transported to the chip conveying line 31 of the paper removing mechanism via the second material picking mechanism, the conveying line drives the chip 51 to move in the direction of the first adsorption component 32 and the second adsorption component 33; the first adsorption component 32 can directly remove the dust-free paper 52 above the chip 51; and the chip 51 is stacked above the dust-free paper 52 below the chip 51. Therefore, when removing the dust-free paper 52 below the chip 51, the second adsorption component 33 and the robot 35 need to cooperate; specifically, the dust-free paper 52 below the chip 51 is first sucked by the second adsorption component 33, and then the chip 51 is taken away by the robot 35, so that the chip 51 is separated from the dust-free paper 52 below the chip 51. For ease of operation, the dust-free paper 52 above and below the wafer 51 is sequentially removed on the wafer conveyor line 31. The wafer conveyor line 31 is used to convey the wafer 51 so that the wafer 51 can be processed sequentially by the first adsorption assembly 32 and the second adsorption assembly 33. Accordingly, the first adsorption assembly 32 and the second adsorption assembly 33 are sequentially arranged on the wafer conveyor line 31 along the conveying direction of the wafer conveyor line 31. In addition to separating the wafer 51 from the dust-free paper 52 below the wafer 51, the robot 35 can also be responsible for transporting the wafer 51 to the next production cycle after the dust-free paper 52 is removed. Therefore, the specific position of the robot 35 is not limited.

[0084] Optionally, in this embodiment, the wafer conveyor line 31 is a conveyor belt. Furthermore, the wafer conveyor line 31 comprises two parallel conveyor belts, both conveying wafers 51 simultaneously to facilitate the arrangement of a paper removal mechanism or other components of the automatic wafer unpacking machine. Multiple barriers are provided at intervals on the conveyor belts to limit the position of the wafers 51 and prevent them from shifting due to inertia when the conveyor belts transition from operation to shutdown, potentially impacting production.

[0085] In this embodiment, the first suction assembly 32 includes a first vertical displacement assembly 322 and a third suction cup 323. The third suction cup 323 is a pneumatic suction cup that is connected to a vacuum source via a pipeline and suctions the dust-free paper 52 above the wafer 51 by vacuuming. The first vertical displacement assembly 322 is used to drive the third suction cup 323 to move vertically, thereby moving the suction cup closer to or farther away from the wafer 51 to suction the dust-free paper 52 above the wafer 51. To improve stability, multiple third suction cups 323 are preferably provided. When multiple third suction cups 323 are provided, all third suction cups 323 must be on the same plane. The first vertical displacement component 322 can adopt a telescopic cylinder such as an air cylinder or an oil cylinder, or a linear guide rail structure. For example, the first vertical displacement component 322 includes a guide rail, a slider, a mounting frame, a drive motor and a screw transmission assembly; the slide rail is vertically arranged, the slider is slidably mounted on the guide rail, the mounting frame is connected to the slider, and the third suction cup 323 is arranged on the mounting frame; the drive motor is connected to the slider through the screw transmission assembly, and drives the slider to slide on the guide rail, thereby achieving the purpose of the first vertical displacement component 322 being used to drive the third suction cup 323 to move vertically.

[0086] The above content mentioned that the first adsorption component 32 includes a first vertical displacement component 322, which is used to drive the third suction cup 323 to move vertically, thereby approaching or moving away from the chip 51 on the chip conveying line 31. Furthermore, in this embodiment, the first adsorption component 32 also includes a first lateral displacement component 321; the first lateral displacement component 321 is used to drive the first vertical displacement component 322 and the third suction cup 323 provided on the first vertical displacement component 322 to move laterally, so that the third suction cup 323 can move to the top of the chip conveying line 31, or so that the third suction cup 323 leaves the top of the chip conveying line 31, that is, the movement direction of the first lateral displacement component 321 is not parallel to the conveying direction of the chip conveying line 31. In this embodiment, the first adsorption component 32 is provided with the first lateral displacement component 321, which can realize the function of placing the dust-free paper 52 outside. Specifically, the paper removal mechanism in this embodiment further includes a first dust-free paper buffer station, which is used to buffer the removed dust-free paper 52. Therefore, the first lateral displacement assembly 321 drives the first vertical displacement assembly 322 and the third suction cup 323 provided on the first vertical displacement assembly 322 to move laterally, thereby causing the third suction cup 323 to move between the wafer conveyor line 31 and the first dust-free paper buffer station. When the third suction cup 323 moves above the wafer conveyor line 31, the third suction cup 323 can absorb the dust-free paper 52 above the stacked wafers 51; when the third suction cup 323 moves above the first dust-free paper buffer station, the third suction cup 323 can place the absorbed dust-free paper 52 in the first dust-free paper buffer station.

[0087] Optionally, in this embodiment, the first lateral displacement component 321 can adopt a telescopic cylinder such as a pneumatic cylinder or an oil cylinder, or a linear guide rail structure, for example, the first lateral displacement component 321 includes a guide rail, a slider, a mounting frame, a drive motor and a screw transmission assembly; the slide rail is arranged horizontally, preferably perpendicular to the conveying direction of the chip conveyor line 31, the slider is slidably installed on the guide rail, the mounting frame is connected to the slider, and the first vertical displacement component 322 is arranged on the mounting frame; the drive motor is connected to the slider through the screw transmission assembly, and drives the slider to slide on the guide rail, thereby achieving the purpose of the first lateral displacement component 321 being used to drive the first vertical displacement component 322 and the third suction cup 323 arranged on the first vertical displacement component 322 to move horizontally.

[0088] When in use, when the wafer conveyor line 31 conveys the wafer 51 to the predetermined position, the first lateral displacement assembly 321 operates, driving the first vertical displacement assembly 322 and the third suction cup 323 on the first vertical displacement assembly 322 to move in the direction close to the wafer conveyor line 31, so that the third suction cup 323 moves to above the wafer conveyor line 31; after the third suction cup 323 moves to above the wafer conveyor line 31, the first vertical displacement assembly 322 drives the third suction cup 323 to move downward, so that the third suction cup 323 adsorbs the dust-free paper 52 above the wafer 51; After the three suction cups 323 suck the dust-free paper 52, the first vertical displacement assembly 322 drives the third suction cup 323 to move upward, and the first lateral displacement assembly 321 drives the first vertical displacement assembly 322 and the third suction cup 323 on the first vertical displacement assembly 322 to move away from the wafer conveyor line 31, so that the third suction cup 323 moves to above the first dust-free paper buffer station. Thereafter, the first vertical displacement assembly 322 drives the third suction cup 323 to move downward, so that the third suction cup 323 places the dust-free paper 52 in the first dust-free paper buffer station. The position of the wafer 51 on the wafer conveyor line 31 can be monitored by, for example, a visual sensor or a proximity sensor, so as to control the operation of the first suction assembly 32.

[0089] In this embodiment, the second adsorption component 33 includes a second vertical displacement component 331 and multiple fourth suction cups 332; when the chip 51 is located on the chip conveyor line 31, the chip 51 is suspended on both sides perpendicular to the conveying direction; all the fourth suction cups 332 are distributed on both sides of the chip conveyor line 31 and are connected to the second vertical displacement component 331; the second vertical displacement is used to drive all the fourth suction cups 332 to move vertically at the same time, so that the fourth suction cups 332 can adsorb the dust-free paper 52 under the chip 51.

[0090] In this embodiment, after the chip 51 is placed on the chip conveyor line 31, the chip 51 is suspended on both sides perpendicular to the conveying direction of the chip conveyor line 31. In this way, all the fourth suction cups 332 are arranged on both sides of the chip conveyor line 31. When the chip 51 is conveyed to the second adsorption component 33, the second vertical displacement component 331 drives the fourth suction cup 332 to move upward, and the fourth suction cup 332 sucks the dust-free paper 52 under the chip 51. Then the chip 51 can be taken away by the robot 35.

[0091] Preferably, in this embodiment, since the dust-free paper 52 is made of flexible material, after the fourth suction cup 332 sucks the dust-free paper 52 under the chip 51, the second vertical displacement assembly 331 continues to operate to lift the dust-free paper 52 under the chip 51 together with the chip 51. At this time, the dust-free paper 52 under the chip 51 is bent downward on all sides under the action of gravity, as shown in the figure. In this way, the robot arm 35 can easily separate the chip 51 and the dust-free paper 52 under the chip 51.

[0092] Optionally, in this embodiment, the second vertical displacement assembly 331 may be a telescopic cylinder such as a pneumatic cylinder or an oil cylinder, and may also be configured with reference to the above-mentioned first vertical displacement assembly 322 , and its specific structure will not be described in detail here.

[0093] Optionally, in this embodiment, the third adsorption assembly 34 can be positioned opposite the second adsorption assembly 33, that is, along the conveying direction of the wafer conveyor line 31, the third adsorption assembly 34 and the second adsorption assembly 33 are positioned at the same location, on either side of the wafer conveyor line 31, to facilitate the arrangement of the paper removal mechanism. Alternatively, the third adsorption assembly 34 can also be positioned downstream of the second adsorption assembly 33. After the robot 35 removes the wafer 51, the wafer conveyor line 31 transports the dust-free paper 52 remaining on the wafer conveyor line 31 to the third adsorption assembly 34, where it is removed.

[0094] In this embodiment, the third adsorption assembly 34 includes a third lateral displacement assembly 341, a third vertical displacement assembly 342 and a fifth suction cup 343; the fifth suction cup 343 is arranged on the third vertical displacement assembly 342, and the third vertical displacement assembly 342 is arranged on the third lateral displacement assembly 341; the third lateral displacement assembly 341 is used to drive the third vertical displacement assembly 342 and the fifth suction cup 343 located on the third vertical displacement assembly 342 to move laterally, so that the fifth suction cup 343 can move to or away from above the chip conveying line 31; the third vertical displacement assembly 342 is used to drive the fifth suction cup 343 to move vertically, so that the fifth suction cup 343 is close to or away from the chip conveying line 31.

[0095] In this embodiment, preferably, the third adsorption component 34 is arranged opposite to the second adsorption component 33; the paper removal mechanism also includes a second dust-free paper buffer station, the above-mentioned first dust-free paper buffer station is used to buffer the dust-free paper 52 above the chip 51, and the second dust-free paper buffer station here is used to buffer the dust-free paper 52 below the chip 51. The structure of the third lateral displacement component 341 can refer to the structural setting of the first lateral displacement component 321, and the structure of the third vertical displacement component 342 can refer to the structural setting of the first vertical displacement component 322, so it will not be repeated here. The fifth suction cup 343 is driven to move by the third lateral displacement component 341 and the third vertical displacement component 342, so that the dust-free paper 52 remaining on the chip conveying line 31 can be transferred to the second dust-free paper buffer station.

[0096] The wafer automatic unpacking machine provided by the embodiment of the present invention is as follows: Figure 5 As shown, the manipulator 35 includes a second manipulator arm and a gripper; one end of the second manipulator arm is connected to the gripper and drives the gripper to move; the gripper includes a claw body 352 and a seventh driving member 351, the claw body 352 is L-shaped, two claw bodies 352 are provided, and the two claw bodies 352 are arranged opposite to each other, the seventh driving member 351 is connected to the two claw bodies 352, and drives the two claw bodies 352 to move closer to or away from each other.

[0097] In this embodiment, the robot 35 comprises a second robotic arm and a gripper. The second robotic arm is composed of multiple arms connected in sequence, either pivotally or slidingly (not shown in the accompanying drawings). The gripper is used to grasp wafers 51. The gripper includes two opposing L-shaped claws 352. The L-shape of the claws 352 allows for preliminary wafer sorting when grasping wafers 51, aligning them and facilitating subsequent steps.

[0098] The wafer automatic unpacking machine provided by the embodiment of the present invention has a film removal mechanism including a fourth driving member and a flexible splint; two flexible splints are provided, and the two flexible splints are arranged opposite to each other; the fourth driving member is connected to the two flexible splints, and drives the two flexible splints to move closer to or away from each other.

[0099] In this embodiment, the fourth driving member is a double-headed cylinder with flexible splints connected at both ends. The fourth driving member is used to drive the two flexible splints to move closer to or away from each other; when in use, the second material-picking mechanism transfers the chip 51 between the two flexible splints, and the fourth driving member drives the two flexible splints to move closer to each other and contact the protective bag outside the chip 51. Then the second material-picking mechanism moves to pull the chip 51 out. Since the flexible splint is in contact with the protective bag, the friction between the flexible splint and the protective bag is greater than the friction between the protective bag and the dust-free paper 52. Therefore, the chip 51 can be separated from the protective bag.

[0100] The wafer automatic unpacking machine provided by the embodiment of the present invention is as follows: Figure 6 As shown, it also includes a chip appearance detection mechanism; the chip appearance detection mechanism includes: a platform component 41, a first detection component 42, and a second detection component; the platform component 41 is used to place the chip 51; the first detection component 42 is provided with at least one group, the first detection component 42 is provided on the side of the platform component 41, and is used to detect the periphery of the chip 51, and the first detection component 42 can move in the direction close to or away from the platform component 41; the second detection component is provided above the platform component 41 and is arranged opposite to the platform component 41, the second detection component is used to detect the surface of the chip 51, and the second detection component can move in the direction close to or away from the platform component 41.

[0101] In this embodiment, the wafer appearance inspection mechanism is used to detect surface damage on wafer 51 to prevent subsequent production disruptions. The wafer appearance inspection mechanism is located between the film removal mechanism and the paper removal mechanism. After film removal, the second reclaimer mechanism transports wafer 51 to the wafer appearance inspection mechanism for appearance inspection.

[0102] The platform assembly 41 is used to place the wafer 51. After the film is removed from the wafer 51, the second material removal mechanism places the wafer 51 on the platform assembly 41. The first inspection assembly 42 is used to detect defects around the wafer 51. It is located next to the platform assembly 41 and can move toward or away from the platform assembly 41 to improve inspection efficiency while also preventing interference with the robot 35's handling of the wafer 51. If defects are found around the wafer 51, the appearance inspection device of the wafer 51 will alarm and transfer the wafer 51 to the NG (Not Good, product that does not meet quality standards) conveyor line. When the wafer 51 meets quality requirements, it can be transported to the next conveying process. All of these conveying operations are achieved by the robot 35. The second detection assembly is used to detect whether the placement angle of the wafer 51 meets preset requirements. It is located above the platform assembly 41 and is arranged opposite to the platform assembly 41. Similarly, the second detection assembly can move toward or away from the platform assembly 41, thereby improving the detection effect and avoiding affecting the robot 35's handling of the wafer 51. When the second detection assembly detects that there is a problem with the placement angle of the wafer 51 to be inspected, the robot 35 can re-grab and re-place it. It should be noted that the detection between the first detection assembly 42 and the second detection assembly is performed independently.

[0103] In this embodiment, the platform assembly 41 includes a motor 412 and a detection platform 411. The detection platform 411 is a flat plate structure, and is preferably a cross-shaped plate to avoid affecting the robot 35 in picking up and placing the wafer 51 to be detected. One side of the detection platform 411 is used to place the wafer 51 to be detected, and the other side is connected to the output shaft of the motor 412 through a structure such as a shaft and a coupling. Under the action of the motor 412, the detection platform 411 can rotate in a preset direction. The motor 412 can be a reduction motor 412 or a hydraulic motor. When in use, the motor 412 drives the detection platform 411 to rotate, thereby driving the wafer 51 to be detected placed above the detection platform 411 to rotate, thereby achieving defect detection on all sides of the wafer 51 to be detected, effectively reducing the number of first detection components 42 and reducing production costs.

[0104] The first inspection assembly 42 includes a first inspection camera 421, a first linear module 422, and a first mounting bracket 423. The first mounting bracket 423 is mounted on the first linear module 422, and the first inspection camera 421 is mounted on the first mounting bracket 423. During operation, the first linear module 422 drives the first mounting bracket 423 to slide, thereby driving the first inspection camera 421 mounted on the first mounting bracket 423 to slide, thereby enabling the first inspection camera 421 to move toward or away from the inspection platform 411. The number of first inspection cameras 421 can be set according to actual conditions. The first inspection assembly 42 includes at least one first inspection camera 421. The first linear module 422 includes a guide rail, a slider, and a drive assembly. The slider slides on the guide rail, and the drive assembly uses a stepper motor or servo motor in conjunction with a screw drive to drive the slider, which slides on the guide rail. Furthermore, in this embodiment, in order to improve stability, the first mounting frame 423 includes a beam, and a first linear module 422 is provided at both ends of the beam. The first detection camera 421 is arranged on the beam, and preferably the position of the first detection camera 421 on the beam is adjustable. When multiple first detection cameras 421 are provided, all first detection cameras 421 are arranged on the beam at intervals along the extension direction of the beam.

[0105] The second detection assembly includes a second detection camera, a second light source, and a second drive assembly. The second detection camera and the second light source are both mounted on the second drive assembly, with the second light source positioned on the side of the second detection camera closest to the platform assembly 41. The second light source is used to illuminate the second detection camera, thereby improving its detection performance. The second drive assembly can be a telescopic cylinder such as a pneumatic cylinder, an oil cylinder, or an electric cylinder, or a linear module.

[0106] In the description of this utility model, it should be noted that the terms "upper" and "lower" and other terms indicating orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of this utility model and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0107] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediate medium, or a connection between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances. In addition, in the description of the present invention, unless otherwise specified, "plurality" means two or more.

[0108] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A wafer automatic unpacking machine for taking out wafers (51) stored in a packaging box; wherein: The packaging boxes are stacked on a pallet and located in a buffer area; The automatic wafer unpacking machine is characterized in that it comprises: an AGV transfer vehicle, a carrying platform, a first material taking mechanism, a second material taking mechanism, a film removing mechanism and a paper removing mechanism; The AGV transfer vehicle is used to transfer the pallet carrying the packaging box in the buffer area to the carrying platform; The first picking mechanism is used to grab the packaging box on the pallet and transfer the packaging box to the second picking mechanism; The second material taking mechanism is used to take out the wafer (51) from the packaging box and sequentially transport the wafer (51) to the film removal mechanism and the paper removal mechanism; The film removal mechanism is used to remove the protective bag wrapped around the wafer (51), and the paper removal mechanism is used to remove the dust-free paper (52) on both sides of the wafer (51).

2. The automatic wafer unpacking machine according to claim 1, characterized in that: The first material-retrieving mechanism comprises a first mechanical arm, a material-retrieving box (11), a first suction cup (12) and a first driving member (13); The material taking box (11) is arranged at the end of the first mechanical arm, and the first mechanical arm is used to drive the material taking box (11) to move; The material picking box (11) has a first end and a second end opposite to each other, and the first end of the material picking box (11) is open; the first suction cup (12) is arranged in the material picking box (11), and the first driving member (13) is arranged on the material picking box (11) and connected to the first suction cup (12); the first suction cup (12) can absorb the packaging box, and the first driving member (13) is used to drive the first suction cup (12) to move between the first end and the second end of the material picking box (11).

3. The automatic wafer unpacking machine according to claim 2, characterized in that: The packing box is provided with a box cover, which is provided on the packing box and is used to open or close the packing box; The first material taking mechanism further includes a second suction cup (14); The second suction cup (14) is arranged in the material taking box (11) and is located on the top wall of the material taking box (11). The second suction cup (14) is used to absorb the box cover.

4. The automatic wafer unpacking machine according to claim 3, characterized in that: The packaging box and the box cover are fixed by adhesive tape; The first material-retrieving mechanism further comprises a tape cutting assembly, which is arranged on the material-retrieving box (11) and is used for cutting the tape.

5. The automatic wafer unpacking machine according to claim 4, characterized in that: The tapping tape assembly comprises a cutter head (15) and a second driving member (16); The second driving member (16) is fixed on the material taking box (11), and the cutter head (15) is arranged on the second driving member (16); openings are provided on both sides of the material taking box (11) at positions matching the tape, and the second driving member (16) drives the cutter head (15) to extend into the material taking box (11) through the openings and cut the tape or leave the material taking box (11).

6. The automatic wafer unpacking machine according to claim 1, characterized in that: The second material-retrieving mechanism comprises a mounting seat (21) and a clamping assembly; The clamping assembly comprises a third driving member (24), a first clamping jaw (22) and two second clamping jaws (23); The first clamping jaw (22) is connected to the third driving member (24), the third driving member (24) and the two second clamping jaws (23) are both arranged on the mounting seat (21), the two second clamping jaws (23) are respectively located on both sides of the first clamping jaw (22), and the material of the two second clamping jaws (23) is a flexible material; The third driving member (24) is used to drive the first clamping jaw (22) to move, so that the first clamping jaw (22) can extend into the packaging box and clamp the wafer (51) in the packaging box, and send the taken-out wafer (51) to the two second clamping jaws (23).

7. The automatic wafer unpacking machine according to claim 6, characterized in that: The second material taking mechanism further includes a support assembly; After the clamping assembly takes out the chip (51), it can drive the chip (51) to flip into a horizontal state; the supporting assembly is arranged on the mounting seat (21) and is used to support the chip (51) when the chip (51) is in a horizontal state.

8. The automatic wafer unpacking machine according to claim 1, characterized in that: The paper removal mechanism comprises: a wafer conveying line (31), a first adsorption component (32), a second adsorption component (33), a third adsorption component (34) and a robot (35); The wafer conveying line (31) is used to convey the wafer (51), and along the conveying direction of the wafer conveying line (31), the first adsorption component (32) and the second adsorption component (33) are sequentially arranged on the wafer conveying line (31); The first adsorption component (32) is used to remove the dust-free paper (52) above the wafer (51); The second adsorption component (33) is used to adsorb the dust-free paper (52) below the wafer (51); The robot (35) is used to remove the chip (51) when the second adsorption component (33) adsorbs the dust-free paper (52) below the chip (51), so as to separate the chip (51) from the dust-free paper (52) below the chip (51); After the robot (35) takes away the wafer (51), the third adsorption component (34) is used to take away the dust-free paper (52) on the wafer conveying line (31).

9. The automatic wafer unpacking machine according to claim 1, characterized in that: The film removal mechanism includes a fourth driving member and a flexible clamping plate; Two flexible splints are provided, and the two flexible splints are arranged opposite to each other; The fourth driving member is connected to the two flexible splints and drives the two flexible splints to move closer to or away from each other.

10. The automatic wafer unpacking machine according to claim 1, characterized in that: It also includes a wafer appearance inspection mechanism; The wafer appearance detection mechanism comprises: a platform component (41), a first detection component (42), and a second detection component; The platform assembly (41) is used to place a wafer (51); At least one group of the first detection components (42) is provided. The first detection components (42) are provided beside the platform component (41) and are used to detect the periphery of the wafer (51). The first detection components (42) can move in a direction close to or away from the platform component (41). The second detection component is arranged above the platform component (41) and is arranged opposite to the platform component (41). The second detection component is used to detect the surface of the wafer (51). The second detection component can move in a direction close to or away from the platform component (41).

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