Wafer rotation type laser direct writing exposure equipment

Abstract

The utility model discloses wafer rotation type laser direct writing exposure equipment, which comprises a base provided with a first guide rail; the multiple workbenches are movably connected to the multiple first guide rails, each workbench comprises a bearing disc, and each workbench is configured to be capable of driving a to-be-scanned piece placed on the bearing disc to move in the first direction; the exposure assembly is configured to scan the piece to be scanned; the alignment assembly is configured to calibrate the position of the to-be-scanned piece on the bearing disc; each workbench comprises a rotating mechanism used for driving a to-be-scanned piece to rotate. The equipment adopts central alignment and rotary exposure to replace a traditional linear reciprocating alignment exposure mode, so that vibration is effectively avoided under the condition that an additional anti-vibration structure is not added, resonance caused by reciprocating motion of double workbenches is avoided under the condition of the double workbenches, and the alignment precision and the exposure precision are greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of exposure equipment, in particular to a wafer rotary laser direct writing exposure equipment. Background Art

[0002] With the development of wafer direct writing technology, in order to pursue exposure efficiency, the production capacity can be improved by increasing the number of wafer worktables. For example, the patent document with publication number CN109709775A discloses an exposure device and exposure method, which adopts a dual-table wafer exposure structure.

[0003] Higher wafer exposure precision requires higher vibration damping performance from the equipment. Traditional single-wafer exposure uses linear scanning, requiring the bottom carrier to perform linear reciprocating motion at a constant speed. This movement causes the bottom guide rail to vibrate, a vibration that has no effect on the serial motion of a single table. However, when adding a workbench, the two tables operate in parallel. The simultaneous linear reciprocating motion of the two tables causes mechanical vibration, which in turn causes resonance in the bottom guide rail. This resonance can affect wafer processing alignment and exposure accuracy. Utility Model Content

[0004] The purpose of the utility model is to provide a wafer rotary laser direct writing exposure device, which adopts center alignment and rotary exposure on the basis of double tables, replacing the traditional linear reciprocating alignment exposure mode.

[0005] The utility model is achieved through the following technical solutions:

[0006] A wafer rotary laser direct writing exposure device, comprising:

[0007] a base, wherein the base is provided with a first guide rail;

[0008] a plurality of workbenches, each of which is movably connected to the plurality of first guide rails, the workbenches including a carrier plate, each of which is configured to move a workpiece to be scanned placed on the carrier plate along a first direction;

[0009] an exposure component, wherein the exposure component is configured to scan the workpiece to be scanned;

[0010] an alignment component, the alignment component being configured to calibrate the position of the workpiece to be scanned on the carrier plate;

[0011] Wherein, each of the workbenches includes a rotating mechanism for driving the workpiece to be scanned to rotate.

[0012] In one embodiment of the present invention, the workbench includes a first workbench and a second workbench.

[0013] In one embodiment of the present invention, the base is provided with a column and a beam located on the column, and the exposure assembly includes an exposure structure, which is provided on the beam and passes through a slot provided on the beam toward the workbench on the base;

[0014] The crossbeam is provided with a third guide rail, the exposure structure is movably connected to the third guide rail, and the exposure structure moves along a second direction to scan the workpiece to be scanned, and the first direction and the second direction are in a spatially vertical relationship.

[0015] In one embodiment of the present invention, the base is provided with a column and a beam located on the column, and the exposure assembly includes a plurality of exposure structures, which are provided on the beam and pass through a slot provided on the beam toward the workbench on the base;

[0016] In which, the crossbeam is provided with a third guide rail, and the multiple exposure structures are movably connected to the third guide rail. The multiple exposure structures move along the second direction to scan the workpiece to be scanned, and the first direction and the second direction are in a spatially vertical relationship; or, the multiple exposure structures are fixedly connected to the crossbeam and correspond one-to-one with the multiple workbenches to respectively scan the workpieces to be scanned on the multiple workbenches.

[0017] In one embodiment of the present invention, the alignment assembly includes an alignment structure, and the alignment structure is located above the workbench;

[0018] It also includes a second guide rail located above the base, the alignment structure is movably connected to the second guide rail, and the alignment structure moves along a second direction to align with the workpiece to be scanned, and the first direction and the second direction are in a spatially vertical relationship.

[0019] In one embodiment of the present invention, the alignment assembly includes a plurality of alignment structures, and the plurality of alignment structures are located above the workbench;

[0020] It also includes a second guide rail located above the base, and multiple alignment structures are movably connected to the second guide rail. Multiple alignment structures move along the second direction to align with the workpiece to be scanned, and the first direction and the second direction are in a spatially vertical relationship; or, multiple alignment structures are fixedly arranged above the workbench and correspond one-to-one with multiple workbenches to respectively align with the workpieces to be scanned on multiple workbenches.

[0021] In one embodiment of the present invention, it also includes a pre-alignment mechanism, a manipulator, a loading platform and a ground rail arranged on one side of the base, the pre-alignment mechanism is used to preliminarily position the workpiece to be scanned, the manipulator is movably connected to the ground rail, the loading platform is used to store the workpiece to be scanned, and the manipulator is used to transport the workpiece to be scanned.

[0022] In one embodiment of the present invention, the rotating mechanism includes a first driving mechanism, a rotating shaft connected to the first driving mechanism, and a bearing sleeved on the outer circumference of the rotating shaft. The first driving mechanism is used to drive the rotating shaft to rotate. The rotating shaft is connected to a carrying plate for carrying the part to be scanned. The rotating shaft is also connected to a circular grating, and a first reading head corresponding to the circular grating is provided on one side of the circular grating.

[0023] In one embodiment of the present utility model, the workbench also includes a lifting mechanism connected to the rotating mechanism, and the lifting mechanism is movably connected to the first guide rail; the lifting mechanism includes a fifth guide rail, a second wedge block connected to the fifth guide rail, a first wedge block arranged above the second wedge block and adapted to the second wedge block, a fourth guide rail connected between the first wedge block and the second wedge block, and a second driving mechanism connected to the second wedge block, the second driving mechanism is used to drive the second wedge block to move along the fifth guide rail, and the first wedge block is connected to the rotating mechanism; a linear grating is provided below the second wedge block, and a second reading head corresponding to it is provided on one side of the linear grating.

[0024] In one embodiment of the present invention, the lifting mechanism also includes an elastic sheet and a third driving mechanism connected to the bottom of the second wedge block; one end of the elastic sheet is connected to the first wedge block, and the other end is connected to a fixed seat arranged on the outside of the first wedge block, and the third driving mechanism is used to lift the second wedge block.

[0025] Compared with the prior art, the beneficial effects of the present invention are:

[0026] The utility model provides a wafer rotary laser direct writing exposure device, which adopts center alignment and rotary exposure to replace the traditional linear reciprocating alignment exposure method. Without adding an additional vibration-proof structure, it effectively avoids vibration. In the case of a double workbench, it avoids the resonance caused by the reciprocating motion of the double workbench, and avoids the vibration caused by the reciprocating exposure of one workbench when one workbench is aligned. Similarly, it also avoids the vibration caused by the reciprocating alignment of one workbench when the other workbench is exposed, thereby greatly improving the alignment accuracy and exposure accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1A three-dimensional diagram of the wafer rotation laser direct writing exposure equipment provided in an embodiment of the present application.

[0028] Figure 2 A three-dimensional diagram from another perspective of the wafer rotation laser direct writing exposure equipment provided in an embodiment of the present application.

[0029] Figure 3 This is a front view of the wafer rotary laser direct writing exposure equipment provided in an embodiment of the present application.

[0030] Figure 4 Schematic diagram of the rotary exposure of the workbench provided in an embodiment of the present application.

[0031] Figure 5 A three-dimensional diagram of the rotating mechanism provided in an embodiment of the present application.

[0032] Figure 6 A top view of the rotating mechanism provided in an embodiment of the present application.

[0033] Figure 7 for Figure 6 AA section view in.

[0034] Figure 8 A top view of the lifting mechanism provided in an embodiment of the present application.

[0035] Figure 9 for Figure 8 BB section view in.

[0036] Figure 10 for Figure 8 CC section view in.

[0037] In the figure: 1. Pre-alignment mechanism; 2. Manipulator; 3. Base; 4. First guide rail; 5. Second guide rail; 6. Crossbeam; 7. First fixed plate; 8. Exposure assembly; 9. Third guide rail; 10. Column; 11. Second fixed plate; 12. Alignment assembly; 13. Loading platform; 14. Ground rail; 15. Carrier; 16. Rotation mechanism; 161. First drive mechanism; 162. Rotation shaft; 163. Bearing; 164. Cover; 165. Circular grating; 166, first reading head; 17, lifting mechanism; 171, fourth guide rail; 172, first wedge block; 173, second wedge block; 174, second driving mechanism; 175, elastic sheet; 176, fifth guide rail; 177, third driving mechanism; 178, second reading head; 179, linear grating; 18, third fixing plate; 19, notch; 100, workbench; 101, first workbench; 102, second workbench. DETAILED DESCRIPTION

[0038] The present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are intended only to illustrate the present invention and are not intended to limit the present invention. It should also be noted that, for ease of description, the accompanying drawings only illustrate portions relevant to the present invention, not all of its components.

[0039] In this utility model, unless otherwise specified or limited, the terms "connected," "connect," and "fixed" should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two components or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0040] In the present invention, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.

[0041] Please refer to Figure 1 、 Figure 2 、 Figure 3 and Figure 4 The embodiments of the present application provide a wafer rotary laser direct writing exposure device. In some embodiments, the device includes a base 3, a plurality of workbenches 100 disposed on the base 3, and an exposure assembly 8 and an alignment assembly 12 located above the workbenches 100. A first guide rail 4 is disposed on the base 3, and a plurality of workbenches 100 are movably connected to a plurality of first guide rails 4. The workbenches 100 include a carrier plate 15, and each workbenches 100 is configured to be able to drive a workpiece to be scanned placed on the carrier plate 15 to move along a first direction. The exposure assembly is configured to scan the workpiece to be scanned, and the alignment assembly is configured to calibrate the position of the workpiece to be scanned on the carrier plate. Each workbench 100 includes a rotating mechanism 16 for driving the workpiece to be scanned to rotate. The scanning imaging method and corresponding components of the exposure assembly, as well as the method and corresponding components of the alignment assembly to calibrate the position of the workpiece to be scanned on the carrier plate, are prior arts of direct writing exposure devices and will not be elaborated on here.

[0042] In this embodiment, the workbench 100 moves along a first direction on the base 3, and a plurality of first guide rails 4 are arranged in parallel to provide a guide for the movement of the plurality of workbench 100. The first direction may be the Y-axis direction.

[0043] In some embodiments, the workbench 100 includes a first workbench 101 and a second workbench 102. The two workbench are used to realize a wafer rotary laser direct writing exposure device with a dual-table structure.

[0044] This embodiment of the present application provides a wafer rotary laser direct writing exposure device, which includes two worktables, and the two worktables adopt a cyclic reciprocating loading and unloading and alignment exposure. That is, when the first worktable 101 performs loading and alignment, the second worktable 102 is in a standby state; when the first worktable 101 is aligned and exposed, the second worktable 102 performs loading and alignment; when the first worktable 101 is exposed, the unloading operation is performed, followed by a cyclic operation of loading and alignment, at which time the second worktable 102 is exposed; when the second worktable 102 is exposed, the unloading operation is performed, followed by a cyclic operation of loading and alignment, at which time the first worktable 101 is exposed. The embodiment of the present application adopts a serial operation method to realize wafer processing, which saves processing time and improves processing efficiency. However, during the processing, the traditional Y-axis reciprocating motion of the two workbenches will cause resonance, affecting the exposure accuracy and alignment accuracy. Therefore, in order to solve this problem, the present application adopts center alignment and rotary exposure to replace the traditional linear reciprocating alignment exposure method. Through center alignment and rotary exposure, only the workbench is rotated during alignment or exposure, and the first guide rail is not used, thereby avoiding the situation where the vibration of a certain guide rail drives the base to vibrate slightly, and then drives the other guide rail to resonate during use.

[0045] In summary, in the case of two workbenches, the present application saves processing time, improves work efficiency, avoids the resonance caused by the reciprocating motion of the two workbenches, avoids the vibration caused by the reciprocating exposure of one workbench when the other workbench is aligned, and similarly avoids the vibration caused by the reciprocating alignment of the other workbench when one workbench is exposed, greatly improving the alignment accuracy and exposure accuracy. In addition, the existing method of alignment and exposure using linear reciprocating motion, whether it is an air-floating guide rail or a mechanical guide rail, will cause wear of the equipment's motion axis and a decrease in operating accuracy due to long-term reciprocating motion impact, while rotary exposure has no motion impact, effectively overcoming the above problems. In addition, if a bottom shaft reciprocating scanning method is adopted, there are strict requirements for the bottom shaft's motion straightness, yaw value, and speed uniformity. Therefore, the equipment provided by the present application adopts center alignment, and the required accuracy of each axis of rotary exposure is reflected in point-to-point positioning accuracy, reducing the processing difficulty of each axis.

[0046] In some embodiments, a column 10 and a beam 6 located on the column 10 are provided on the base 3. The exposure assembly 8 may include an exposure structure, which is provided on the beam 6 and passes through a slot 19 provided on the beam 6 toward the workbench 100 on the base 3; wherein the beam 6 is provided with a third guide rail 9, and the exposure structure is movably connected to the third guide rail 9. The exposure structure moves along the second direction to scan the workpiece to be scanned, and the first direction and the second direction are in a spatially vertical relationship.

[0047] In this embodiment, the crossbeam 6 can be provided with a third guide rail 9, which can enable an exposure structure of the exposure assembly 8 to move along the second direction. Thus, the exposure structure can move along the second direction to scan the workpieces to be scanned on multiple workbenches 100, thereby enabling a single exposure structure to complete scanning of the workpieces to be scanned on multiple workbenches 100, thereby saving costs. The second direction can be the X-axis direction.

[0048] In some embodiments, a column 10 and a beam 6 located on the column 10 are provided on the base 3, and the exposure assembly 8 may also include multiple exposure structures, and the multiple exposure structures are provided on the beam 6 and pass through the slot 19 provided on the beam 6 toward the workbench 100 on the base 3; wherein, the beam 6 is provided with a third guide rail 9, and the multiple exposure structures are movably connected to the third guide rail 9, and the multiple exposure structures move along the second direction to scan the workpiece to be scanned, and the first direction and the second direction are in a spatially vertical relationship; or, the multiple exposure structures are fixedly connected to the beam 6 and correspond one-to-one to the multiple workbenches 100 to respectively scan the workpiece to be scanned on the multiple workbenches 100.

[0049] In this embodiment, the crossbeam 6 may be provided with a third guide rail 9, which enables the multiple exposure structures of the exposure assembly 8 to move along a second direction, where the second direction may be the X-axis direction. Thus, the multiple exposure structures can move along the second direction to scan the workpieces to be scanned on the multiple worktables 100, thereby enabling multiple exposure structures to move and scan, expanding the exposure range and enabling exposure of wafer patterns of different sizes. Alternatively, the crossbeam 6 may not be provided with the third guide rail 9, and the multiple exposure structures may be directly fixedly connected to the crossbeam 6. The multiple exposure structures correspond one-to-one with the multiple worktables 100, respectively scanning the workpieces to be scanned on the multiple worktables 100, thereby achieving point-to-point exposure.

[0050] Optionally, the exposure structure of the exposure assembly 8 can be movably connected to the third guide rail 9 through the first fixed plate 7; or, the exposure structure of the exposure assembly 8 can also be fixedly connected to the beam 6 through the first fixed plate 7.

[0051] In some embodiments, the alignment assembly 12 may include an alignment structure, which is located above the workbench 100; wherein, it also includes a second guide rail 5 located above the base 3, and the alignment structure is movably connected to the second guide rail 5. The alignment structure moves along the second direction to align with the workpiece to be scanned, and the first direction and the second direction are in a spatially vertical relationship.

[0052] In this embodiment, a second guide rail 5 can be provided above the base 3. The second guide rail 5 can enable an alignment structure of the alignment assembly 12 to move along a second direction. Thus, the alignment structure can move along the second direction to align with the workpieces to be scanned on multiple workbenches 100, thereby achieving alignment of the workpieces to be scanned on multiple workbenches 100 using a single alignment structure, thereby saving costs. The second direction can be the X-axis direction.

[0053] In some embodiments, the alignment assembly 12 may further include a plurality of alignment structures, and the plurality of alignment structures are located above the workbench 100; wherein, it also includes a second guide rail 5 located above the base 3, and the plurality of alignment structures are movably connected to the second guide rail 5, and the plurality of alignment structures move along the second direction to align with the workpiece to be scanned, and the first direction and the second direction are in a spatially vertical relationship; or, the plurality of alignment structures are fixedly arranged above the workbench 100 and correspond one-to-one to the plurality of workbenches 100 to align the workpieces to be scanned on the plurality of workbenches 100 respectively.

[0054] In this embodiment, a second guide rail 5 can be provided above the base 3. The second guide rail 5 can enable the multiple alignment structures of the alignment assembly 12 to move along a second direction, wherein the second direction can be the X-axis direction. Thus, the multiple alignment structures can move along the second direction to align with the components to be aligned on the multiple workbenches 100, thereby achieving mobile alignment of the multiple alignment structures, expanding the alignment range, and enabling alignment of wafer patterns of different sizes. Alternatively, the second guide rail 5 can be omitted from the base 3. The multiple alignment structures can be fixed directly above the workbenches 100, with the multiple alignment structures corresponding one-to-one to the multiple workbenches 100, and aligning the components to be aligned on the multiple workbenches 100, thereby achieving point-to-point alignment.

[0055] Alternatively, the second guide rail 5 and the third guide rail 9 can be mounted on the same crossbeam 6, or on different crossbeams provided on the uprights 10. Mounting the second guide rail 5 and the third guide rail 9 on the same crossbeam 6 can reduce equipment costs. The alignment structure of the alignment assembly 12 can be removably connected to the second guide rail 5 via a second fixing plate 11; alternatively, the alignment structure of the alignment assembly 12 can be directly fixed to the crossbeam provided on the uprights 10 via the second fixing plate 11, positioned above the workbench 100. Camera data feedback from the alignment structure enables precise positioning of the workpiece to be scanned on the workbench 100.

[0056] In some embodiments, a pre-alignment mechanism 1 is further included on one side of the base 3. The pre-alignment mechanism 1 is used to perform preliminary positioning of the scanned part. Specifically, the pre-alignment mechanism 1 finds the notch angle and the center position of the wafer by finding the edge, and rotates to the specified angle for preliminary positioning. It cooperates with the robot 2 to achieve full automation, avoiding vibration caused by people walking, saving labor and ensuring the cleanliness of the space.

[0057] In some embodiments, the base 3 further includes a robot 2, a loading platform 13, and a ground rail 14. The robot 2 is movably connected to the ground rail 14. The loading platform 13 is used to store the scanned parts, and the robot 2 is used to transport the scanned parts. Specifically, the robot 2 is used to transfer the scanned parts (wafers) between the loading platform 13, the pre-alignment mechanism 1, and the workbench 100.

[0058] Please refer to Figure 5 、 Figure 6 and Figure 7 In some embodiments, the rotating mechanism 16 includes a first driving mechanism 161, a rotating shaft 162 connected to the first driving mechanism 161, and a bearing 163 sleeved on the outer periphery of the rotating shaft 162. The first driving mechanism 161 is used to drive the rotating shaft 162 to rotate. The rotating shaft 162 is connected to a carrying plate 15 for carrying the part to be scanned. The rotating shaft 162 is also connected to a circular grating 165. A first reading head 166 corresponding to the circular grating 165 is provided on one side of the circular grating 165.

[0059] Furthermore, a cover 164 is provided on the outer side of the first driving mechanism 161 for protecting the internal structure of the rotating mechanism 16. For example, the first driving mechanism 161 can be a rotating motor.

[0060] In this embodiment, the rotating mechanism 16 drives the rotating shaft 162 to rotate through the first driving mechanism 161, and the rotating shaft 162 drives the carrying plate 15 for carrying the part to be scanned to rotate. The rotation accuracy is controlled by relying on the precision bearing 163, and the first reading head 166 is used to read the circular grating 165 to provide feedback on the rotation accuracy, thereby realizing high-precision rotational movement of the rotating mechanism 16.

[0061] Please refer to Figure 8 、 Figure 9 and Figure 10In some embodiments, the workbench 100 also includes a lifting mechanism 17 connected to the rotating mechanism 16, and the lower part of the lifting mechanism 17 is movably connected to the first guide rail 4 through a third fixed plate 18; the lifting mechanism 17 includes a fifth guide rail 176, a second wedge block 173 connected to the fifth guide rail 176, a first wedge block 172 arranged above the second wedge block 173 and adapted to the second wedge block 173, a fourth guide rail 171 connected between the first wedge block 172 and the second wedge block 173, and a second driving mechanism 174 driven and connected to the second wedge block 173, the second driving mechanism 174 is used to drive the second wedge block 173 to move along the fifth guide rail 176, and the first wedge block 172 is connected to the rotating mechanism 16.

[0062] Furthermore, an elastic piece 175 is included, one end of which is connected to the first wedge block 172 and the other end is connected to a fixed seat provided outside the first wedge block 172. The second wedge block 173 and the second driving mechanism 174 can be connected by bolts. The second driving mechanism 174 drives the second wedge block 173 to move linearly. Conversely, the first wedge block 172, due to the restriction of the elastic piece 175 in the X-axis and Y-axis directions, moves vertically under the guidance of the fourth guide rail 171.

[0063] Furthermore, the lifting mechanism 17 includes a third drive mechanism 177 connected to the bottom of the second wedge block 173. The third drive mechanism 177 is used to lift the second wedge block 173. When there is a load on the carrier 15, such as a wafer load, the upward driving force of the third drive mechanism 177 offsets the load, so that the lifting mechanism 17 can move smoothly both with and without a load.

[0064] Furthermore, the lifting mechanism 17 also includes a linear grating 179 arranged below the second wedge block 173, and a second reading head 178 corresponding to the linear grating 179 is provided on one side of the linear grating 179.

[0065] In this embodiment, the lifting mechanism 17 drives the second wedge block 173 along the fifth guide rail 176 via the second drive mechanism 174, thereby lifting the first wedge block 172. The third drive mechanism 177 is used to offset the load, thereby achieving smooth movement of the lifting mechanism 17 both with and without load. The lifting mechanism 17 rises with the second reading head 178 reading the linear grating 179 feedback, thereby ensuring the positioning accuracy of the lifting mechanism 17 as it rises. The elastic sheet 175 is used to limit the vertical deviation of the lifting mechanism 17, thereby ensuring high vertical straightness during the ascent. For example, the second drive mechanism 174 can be a linear motor, and the third drive mechanism 177 can be a pneumatic cylinder.

[0066] The operation process of a wafer rotary laser direct writing exposure device provided in this application includes:

[0067] S1. The robot 2 moves through the ground rail 14 to remove the first wafer to be exposed from the loading platform 13 and place it in the pre-alignment mechanism 1. By finding the edge, find the notch angle and center position of the wafer and rotate it to the specified angle for preliminary positioning;

[0068] S2. The robot 2 forks the first wafer that has been initially positioned, moves to the loading position of the workpiece stage 100 through the ground rail 14, and is placed on the carrier plate 15 of the first workbench 101;

[0069] S3. The third fixed plate 18 of the first workbench 101 is driven by a motor and moves along the first guide rail 4. The grating ruler position feedback is used to move the plate into the field of view of the fine positioning alignment assembly 12. The camera data feedback of the alignment assembly 12 is used to adjust the lifting mechanism 17 and the rotating mechanism 16 of the first workbench 101 for fine positioning of the product.

[0070] S4. After fine positioning, the third fixing plate 18 is moved to the processing position;

[0071] S5. The exposure assembly 8 aligns the optical path and the first wafer by the precise positioning position of the third guide rail 9 on the beam 6 and the alignment assembly 12 according to visual feedback;

[0072] S6. After the centering is completed, the exposure assembly 8 starts the exposure process, the processing strip covers the radius of the wafer, the first workbench 101 of the rotating mechanism 16 rotates at a constant speed, the first wafer is subjected to rotary exposure processing, and the direct write exposure process is completed in one rotation;

[0073] S7. The robot 2 moves through the ground rail 14 to remove the second wafer to be exposed from the loading platform 13 and place it in the pre-alignment mechanism 1. By finding the edge, find the notch angle and center position of the wafer and rotate it to the specified angle for preliminary positioning;

[0074] S8. The robot 2 forks the second wafer that has been initially positioned, moves to the loading position of the workpiece table 100 through the ground rail 14, and places it on the carrier plate 15 of the second workbench 102;

[0075] S9. The third fixed plate 18 of the second workbench 102 is driven by a motor and moves along the first guide rail 4. The third fixed plate 18 is moved into the field of view of the alignment assembly 12 for fine positioning. The lifting mechanism 17 and the rotating mechanism 16 of the second workbench 102 are adjusted based on the camera data feedback from the alignment assembly 12 to achieve fine positioning of the product.

[0076] S10. Wait after the second wafer is precisely positioned;

[0077] S11. After the first wafer is processed, the third fixing plate 18 of the first workbench 101 returns to the unloading position;

[0078] S12. The exposure assembly 8 is moved to the second processing station position of the second workbench 101 by the third guide rail 9 on the beam 6, and the second wafer is positioned and exposed in the same manner as described above;

[0079] S13. The robot 2 moves through the ground rail 14, retrieves the first wafer, and places it back into the wafer box on the loading platform 13;

[0080] S14. The robot arm 2 takes out the third wafer, and repeats the above steps.

[0081] In summary, the present application provides a wafer rotary laser direct writing exposure device that uses center alignment and rotary exposure, replacing the traditional linear reciprocating alignment exposure method. This effectively avoids vibration without adding additional vibration-isolating structures. In the case of two worktables, this avoids resonance caused by the reciprocating motion of the two worktables. This also avoids vibration caused by the reciprocating exposure of one worktable while the other is aligned. Similarly, this also avoids vibration caused by the reciprocating alignment of one worktable while the other is exposed, significantly improving alignment and exposure accuracy. Furthermore, existing linear reciprocating motion alignment and exposure methods, whether using air-bearing guides or mechanical guides, can cause wear and tear on the device's motion axis and reduce operating accuracy due to long-term reciprocating motion impact. Rotary exposure, however, eliminates motion impact, effectively overcoming these issues. Furthermore, if a bottom-axis reciprocating scanning method is used, strict requirements are placed on the bottom axis's motion linearity, yaw value, and speed uniformity. Therefore, the device provided in this application uses center alignment, and the required precision of each axis of rotary exposure is reflected in point-to-point positioning accuracy, reducing the processing difficulty of each axis.

[0082] The above embodiments merely illustrate several implementations of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the utility model patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the concept of the present invention, and these variations and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present utility model patent shall be determined by the appended claims.

Claims

1. A wafer rotary laser direct writing exposure device, characterized in that: include: a base, wherein the base is provided with a first guide rail; a plurality of workbenches, each of which is movably connected to the plurality of first guide rails, the workbenches including a carrier plate, each of which is configured to move a workpiece to be scanned placed on the carrier plate along a first direction; an exposure component, wherein the exposure component is configured to scan the workpiece to be scanned; an alignment component, the alignment component being configured to calibrate the position of the workpiece to be scanned on the carrier plate; Wherein, each of the workbenches includes a rotating mechanism for driving the workpiece to be scanned to rotate.

2. The wafer rotary laser direct writing exposure equipment according to claim 1, characterized in that: The workbench includes a first workbench and a second workbench.

3. The wafer rotary laser direct writing exposure equipment according to claim 1, characterized in that: The base is provided with a column and a beam located on the column, the exposure assembly includes an exposure structure, the exposure structure is provided on the beam and passes through a slot provided on the beam toward the workbench on the base; The crossbeam is provided with a third guide rail, the exposure structure is movably connected to the third guide rail, and the exposure structure moves along a second direction to scan the workpiece to be scanned, and the first direction and the second direction are in a spatially vertical relationship.

4. The wafer rotary laser direct writing exposure equipment according to claim 1, characterized in that: The base is provided with a column and a beam located on the column, the exposure assembly includes a plurality of exposure structures, and the plurality of exposure structures are provided on the beam and pass through the slots provided on the beam toward the workbench on the base; In which, the crossbeam is provided with a third guide rail, and the multiple exposure structures are movably connected to the third guide rail. The multiple exposure structures move along the second direction to scan the workpiece to be scanned, and the first direction and the second direction are in a spatially vertical relationship; or, the multiple exposure structures are fixedly connected to the crossbeam and correspond one-to-one with the multiple workbenches to respectively scan the workpieces to be scanned on the multiple workbenches.

5. The wafer rotary laser direct writing exposure equipment according to claim 1, characterized in that: The alignment assembly includes an alignment structure, and the alignment structure is located above the workbench; It also includes a second guide rail located above the base, the alignment structure is movably connected to the second guide rail, and the alignment structure moves along a second direction to align with the workpiece to be scanned, and the first direction and the second direction are in a spatially vertical relationship.

6. The wafer rotary laser direct writing exposure equipment according to claim 1, characterized in that: The alignment assembly includes a plurality of alignment structures, and the plurality of alignment structures are located above the workbench; It also includes a second guide rail located above the base, and multiple alignment structures are movably connected to the second guide rail. Multiple alignment structures move along the second direction to align with the workpiece to be scanned, and the first direction and the second direction are in a spatially vertical relationship; or, multiple alignment structures are fixedly arranged above the workbench and correspond one-to-one with multiple workbenches to respectively align with the workpieces to be scanned on multiple workbenches.

7. The wafer rotary laser direct writing exposure equipment according to claim 1, characterized in that: It also includes a pre-alignment mechanism, a robot, a loading platform and a ground rail arranged on one side of the base, the pre-alignment mechanism is used to preliminarily position the workpiece to be scanned, the robot is movably connected to the ground rail, the loading platform is used to store the workpiece to be scanned, and the robot is used to carry the workpiece to be scanned.

8. The wafer rotary laser direct writing exposure equipment according to any one of claims 1 to 7, characterized in that: The rotating mechanism includes a first driving mechanism, a rotating shaft connected to the first driving mechanism, and a bearing sleeved on the outer circumference of the rotating shaft. The first driving mechanism is used to drive the rotating shaft to rotate. The rotating shaft is connected to a carrying plate for carrying the part to be scanned. The rotating shaft is also connected to a circular grating, and a first reading head corresponding to the circular grating is provided on one side of the circular grating.

9. The wafer rotary laser direct writing exposure equipment according to any one of claims 1 to 7, characterized in that: The workbench also includes a lifting mechanism connected to the rotating mechanism, and the lifting mechanism is movably connected to the first guide rail; the lifting mechanism includes a fifth guide rail, a second wedge block connected to the fifth guide rail, a first wedge block arranged above the second wedge block and adapted to the second wedge block, a fourth guide rail connected between the first wedge block and the second wedge block, and a second driving mechanism connected to the second wedge block, the second driving mechanism is used to drive the second wedge block to move along the fifth guide rail, and the first wedge block is connected to the rotating mechanism; a linear grating is provided below the second wedge block, and a second reading head corresponding to the linear grating is provided on one side of the linear grating.

10. The wafer rotary laser direct writing exposure equipment according to claim 9, characterized in that: The lifting mechanism also includes an elastic sheet and a third driving mechanism connected to the bottom of the second wedge block; one end of the elastic sheet is connected to the first wedge block, and the other end is connected to a fixed seat arranged on the outside of the first wedge block, and the third driving mechanism is used to lift the second wedge block.

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