High-temperature-resistant integrated circuit board

Abstract

The utility model belongs to the technical field of circuit boards, in particular to a high-temperature-resistant integrated circuit board, which comprises a circuit board body and a circuit element, a mounting plate is arranged at the bottom end of the circuit board body, a plurality of groups of springs are fixedly mounted on the mounting plate, a damper is mounted on the circuit board body, and the circuit element is fixedly mounted on the circuit board body. The circuit board body is provided with a plurality of groups of buffer plates, and the buffer plates are provided with buffer pads. According to the utility model, the springs and the buffer plates are installed to protect the integrated circuit board from being damaged by impact, the springs and the dampers can absorb impact energy through elastic deformation and damping effects, impact force is prevented from directly acting on the front and back surfaces of the circuit board body, external force is effectively dispersed through the buffer plates and the buffer pads made of silica gel materials, and the service life of the circuit board is prolonged. And the impact energy is further absorbed, the side surface of the circuit board is protected from being damaged by external force, the impact resistance of the integrated circuit board in various directions is ensured, and the stability and safety of the integrated circuit board in a complex environment are ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a high-temperature resistant integrated circuit circuit board. Background Art

[0002] Integrated circuit boards are an indispensable component of modern electronic equipment. Integrated circuit boards fix electronic components on an insulating substrate through surface mounting, welding or plug-in, and connect various components through conductive paths, connecting power supply voltage, signal current and ground wires together to form a complete circuit system. Integrated circuit boards are widely used in computers, communications, home appliances, medical equipment, automotive electronics, aerospace and many other fields.

[0003] Patent document CN217445670U discloses a circuit board for easy installation of integrated circuits, "including a mounting plate and supporting legs, with gussets installed at the upper and lower ends of the mounting plate, and screw holes are provided on the surface of the gussets, bolts are passed through the screw holes, a positioning level is installed on the upper surface of the gussets, a circuit substrate is installed in the middle of the surface of the mounting plate, and a nano-waterproof layer is provided on the outside of the circuit substrate, a fixing buckle is installed on the surface of the circuit substrate, and a heat dissipation slot is installed in the middle of the rear of the mounting plate. The circuit board for easy installation of integrated circuits is protected by the nano-waterproof layer when the circuit substrate is in use, to prevent moisture from entering the interior of the device and causing damage to electrical components, thereby affecting the service life of the device. The heat dissipation slot increases the heat dissipation. The contact area between the heat strip and the air improves the heat dissipation efficiency, ensures that the heat inside the circuit board is quickly dissipated, and prevents the electronic components from being burned. However, the integrated circuit circuit board for easy installation in the above-mentioned public document mainly considers ensuring that the heat inside the circuit board is quickly dissipated to prevent the electronic components from being burned. It does not take into account that during the use of the integrated circuit circuit board installed in the electronic device, the electronic device carrying the integrated circuit circuit board may be subjected to vibration, impact or falling. These external forces may be transmitted to the integrated circuit circuit board in the electronic device, causing the components on the integrated circuit circuit board to fall off, break or the solder joints to break, thereby causing damage to the integrated circuit circuit board. Therefore, it is necessary to develop a high-temperature resistant integrated circuit circuit board that can protect the integrated circuit circuit board from impact damage. Utility Model Content

[0004] The purpose of the present invention is to provide a high-temperature resistant integrated circuit circuit board to solve the technical problem in the above-mentioned background technology that the integrated circuit circuit board is damaged by external force.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a high-temperature resistant integrated circuit circuit board, comprising a circuit board body and circuit elements, a mounting plate being provided at the bottom end of the circuit board body, a plurality of sets of springs being fixedly mounted on the mounting plate, and the other ends of the springs being connected to the circuit board body, a damper being fixedly mounted on the circuit board body, and one end of the damper passing through the interior of the spring and connected to the circuit board body, a plurality of sets of buffer plates being fixedly mounted on the four sides of the circuit board body, and buffer pads being provided on the buffer plates.

[0006] Preferably, the buffer plate is made of plastic material, and the buffer pad is made of silicone material.

[0007] Preferably, a layer board is fixedly installed at the bottom end of the circuit board body, and multiple groups of heat pipes are distributed in the layer board. A storage box is fixedly installed at one end of the layer board, and one end of the storage box extends to the interior of the layer board. A fan is fixedly installed in the storage box, and an air duct is fixedly installed on the fan, and the output end of the air duct passes through the back of the storage box and is connected to the input end of the heat pipe.

[0008] Preferably, a filter is fixedly mounted on the storage box, and the filter is used to connect the storage box with the outside world.

[0009] Preferably, a plurality of air outlets are provided at the other end of the added layer plate, and the air outlets are connected to the output end of the heat pipe.

[0010] Preferably, a power supply block is fixedly installed in the storage box, and the power supply block is connected to the fan circuit.

[0011] Compared with the prior art, the beneficial effects of the present invention are:

[0012] 1. The utility model protects the integrated circuit circuit board from damage by installing a spring and a buffer plate. First, when the front and back of the electronic device carrying the integrated circuit circuit board are impacted, the spring and damper will absorb the impact energy through elastic deformation and damping, preventing the impact force from directly acting on the circuit board body. Then, when the side of the electronic device carrying the integrated circuit circuit board is impacted, the impact force will act on the buffer plate. The plastic buffer plate adopts a circular arc design to effectively disperse the external force. At the same time, the silicone cushion utilizes the elasticity and buffering properties of silicone to further absorb the impact energy and protect the side of the circuit board from external damage. The coordinated cooperation of the spring and the buffer plate forms a comprehensive protection system for the integrated circuit circuit board, ensuring the integrated circuit circuit board's ability to resist impact in various directions and ensuring the stability and safety of the integrated circuit circuit board in complex environments.

[0013] 2. The utility model facilitates heat dissipation of the integrated circuit circuit board by installing a heat pipe and a fan. The heat pipe is made of a material with high thermal conductivity. The material with high thermal conductivity can ensure that heat energy is quickly transferred from the circuit board body to the heat pipe. When the circuit components generate heat during operation, the heat is transferred through the circuit board body to the heat pipe closely located below. Through the principle of heat conduction, the heat of the circuit board body is quickly absorbed and transferred to avoid local overheating of the circuit board. Then the fan is started, and the airflow generated by the fan is transferred to the heat pipe through the air duct. The airflow quickly takes away the heat in the heat pipe and dissipates it into the surrounding environment through the air outlet, ensuring that the integrated circuit circuit board maintains a stable temperature under high-load working conditions. The coordinated cooperation of the heat pipe and the fan significantly improves the performance stability of the circuit board in a high-temperature environment, further extending the service life of the integrated circuit circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0015] Figure 2 for Figure 1 A magnified schematic diagram of the structure A in the middle;

[0016] Figure 3 This is a schematic diagram of the damper structure of the utility model;

[0017] Figure 4 This is a schematic diagram of the heat pipe distribution structure of the utility model;

[0018] Figure 5 This is a schematic diagram of the fan structure of the present utility model.

[0019] In the figure: 1. Circuit board body; 2. Circuit components; 3. Mounting plate; 4. Spring; 5. Damper; 6. Buffer plate; 7. Buffer pad; 8. Layer board; 9. Heat pipe; 10. Storage box; 11. Fan; 12. Air duct; 13. Filter; 14. Air outlet; 15. Power supply block. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0021] See also Figure 1 - Figure 4, a high-temperature resistant integrated circuit circuit board, including a circuit board body 1 and circuit elements 2, a mounting plate 3 is provided at the bottom end of the circuit board body 1, multiple groups of springs 4 are fixedly installed on the mounting plate 3, and the other end of the spring 4 is connected to the circuit board body 1, a damper 5 is fixedly installed on the circuit board body 1, and one end of the damper 5 passes through the interior of the spring 4 and is connected to the circuit board body 1, multiple groups of buffer plates 6 are fixedly installed on the four sides of the circuit board body 1, and buffer pads 7 are provided on the buffer plates 6, the buffer plates 6 are made of plastic, and the buffer pads 7 are made of silicone. The integrated circuit board is mainly composed of an insulating substrate, a conductive path (including copper foil circuits, vias, pads, etc.), electronic components (such as resistors, capacitors, integrated circuits, etc.) and welding materials (such as solder, flux, etc.). The integrated circuit board is installed in an electronic device and is mainly used to provide power supply, signal transmission, signal processing and output results for the electronic device. However, during the use of the integrated circuit circuit board installed in the electronic device, the electronic device carrying the integrated circuit circuit board may be subjected to vibration, impact or falling, and these external forces may be transmitted to the electronic device. The integrated circuit circuit board inside may cause the components on the integrated circuit circuit board to fall off, break or the solder joints to break, thereby causing the problem of damage to the integrated circuit circuit board. When the electronic device carrying the integrated circuit circuit board is impacted, the integrated circuit circuit board is protected from impact damage by installing a spring 4 and a buffer plate 6. First, when the front and back of the electronic device carrying the integrated circuit circuit board are impacted, the spring 4 and the damper 5 will absorb the impact energy through elastic deformation and damping, avoiding the impact force from directly acting on the circuit board body 1. Then, when the side of the electronic device carrying the integrated circuit circuit board is impacted, the impact force will act on the buffer plate 6. The plastic buffer plate 6 adopts an arc-shaped design to effectively disperse the external force. At the same time, the silicone cushion pad 7 uses the elasticity and buffering properties of silicone to further absorb the impact energy and protect the side of the circuit board from external force damage. Through the coordinated cooperation of the spring 4 and the buffer plate 6, a comprehensive protection system is formed for the integrated circuit circuit board, ensuring the impact resistance of the integrated circuit circuit board in various directions and ensuring the stability and safety of the integrated circuit circuit board in complex environments.

[0022] See also Figure 1 、 Figure 2 、 Figure 4 and Figure 5, a layer board 8 is fixedly installed at the bottom end of the circuit board body 1, and multiple groups of heat pipes 9 are distributed in the layer board 8. A storage box 10 is fixedly installed at one end of the layer board 8, and one end of the storage box 10 extends to the inside of the layer board 8. A fan 11 is fixedly installed in the storage box 10, and an air duct 12 is fixedly installed on the fan 11, and the output end of the air duct 12 passes through the back of the storage box 10 and is connected to the input end of the heat pipe 9. When the integrated circuit circuit board is cooled, the heat pipe 9 and the fan 11 are installed to facilitate the heat dissipation of the integrated circuit circuit board. The heat pipe 9 is made of a material with high thermal conductivity. The material with high thermal conductivity can ensure that heat energy is quickly transferred from the circuit board body 1 To the heat pipe 9, when the circuit element 2 generates heat during operation, the heat is transferred through the circuit board body 1 to the heat pipe 9 closely located below. Through the principle of heat conduction, the heat of the circuit board body 1 is quickly absorbed and transferred to avoid local overheating of the circuit board. Then the fan 11 is started, and the airflow generated by the fan 11 is transferred to the heat pipe 9 through the air duct 12. The airflow quickly takes away the heat in the heat pipe 9 and dissipates it into the surrounding environment through the air outlet 14, ensuring that the integrated circuit circuit board maintains a stable temperature under high-load working conditions. The coordinated cooperation of the heat pipe 9 and the fan 11 significantly improves the performance stability of the circuit board in a high-temperature environment, further extending the service life of the integrated circuit circuit board.

[0023] See also Figure 4 and Figure 5 A filter 13 is fixedly installed on the storage box 10, and the filter 13 is used to connect the storage box 10 with the outside world. A plurality of air outlets 14 are provided at the other end of the added layer plate 8, and the air outlet 14 is connected to the output end of the heat pipe 9. The fan 11 extracts the outside air through the filter 13 and converts it into wind power. At the same time, the filter 13 also blocks external impurities from entering the storage box 10. The hot air in the heat pipe 9 flows to the outside world through the air outlet 14. At the same time, a filter 13 is also provided in the air outlet 14.

[0024] See also Figure 5 A power supply block 15 is fixedly installed in the storage box 10 , and the power supply block 15 is connected to the fan 11 circuit. The power supply block 15 is used to provide power to the fan 11 .

[0025] Working principle: when the electronic device carrying the integrated circuit circuit board is impacted, the integrated circuit circuit board is protected from damage by installing a spring 4 and a buffer plate 6. First, when the front and back of the electronic device carrying the integrated circuit circuit board is impacted, the spring 4 and the damper 5 will absorb the impact energy through elastic deformation and damping to prevent the impact force from directly acting on the circuit board body 1. Then, when the side of the electronic device carrying the integrated circuit circuit board is impacted, the impact force will act on the buffer plate 6. The plastic buffer plate 6 adopts an arc-shaped design to effectively disperse external force. At the same time, the silicone cushion pad 7 uses the elasticity and buffering properties of silicone to further absorb impact energy and protect the side of the circuit board from external force damage. Through the coordinated cooperation of the spring 4 and the buffer plate 6, a comprehensive protection system is formed for the integrated circuit circuit board to ensure the impact resistance of the integrated circuit circuit board in various directions and the stability of the integrated circuit circuit board in complex environments. Stability and safety. When the integrated circuit circuit board is to be cooled, the heat pipe 9 and the fan 11 are installed to facilitate the heat dissipation of the integrated circuit circuit board. The heat pipe 9 is made of a material with high thermal conductivity. The material with high thermal conductivity can ensure that the heat energy is quickly transferred from the circuit board body 1 to the heat pipe 9. When the circuit element 2 generates heat during operation, the heat is transferred through the circuit board body 1 to the heat pipe 9 close to the bottom. Through the principle of heat conduction, the heat of the circuit board body 1 is quickly absorbed and transferred to avoid local overheating of the circuit board. Then the fan 11 is started, and the airflow generated by the fan 11 is transferred to the heat pipe 9 through the air supply pipe 12. The airflow quickly takes away the heat in the heat pipe 9 and dissipates it into the surrounding environment through the air outlet 14, ensuring that the integrated circuit circuit board maintains a stable temperature under high load working conditions. The coordinated cooperation of the heat pipe 9 and the fan 11 significantly improves the performance stability of the circuit board in a high temperature environment, and further extends the service life of the integrated circuit circuit board.

[0026] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention. Therefore, the embodiments should be considered in all respects as illustrative and non-restrictive, and the scope of the present invention is defined by the appended claims, not the foregoing description, and all variations within the meaning and range of equivalents of the claims are intended to be encompassed within the present invention. Any reference sign in a claim should not be construed as limiting the claim to which it relates.

Claims

1. A high-temperature resistant integrated circuit circuit board, comprising a circuit board body (1) and a circuit element (2), characterized in that: A mounting plate (3) is provided at the bottom end of the circuit board body (1), a plurality of groups of springs (4) are fixedly mounted on the mounting plate (3), and the other end of the spring (4) is connected to the circuit board body (1), a damper (5) is fixedly mounted on the circuit board body (1), and one end of the damper (5) passes through the interior of the spring (4) and is connected to the circuit board body (1), a plurality of groups of buffer plates (6) are fixedly mounted on the four sides of the circuit board body (1), and a buffer pad (7) is provided on the buffer plate (6).

2. The high temperature resistant integrated circuit circuit board according to claim 1, characterized in that: The buffer plate (6) is made of plastic, and the buffer pad (7) is made of silicone.

3. The high temperature resistant integrated circuit circuit board according to claim 1, characterized in that: A layered plate (8) is fixedly mounted on the bottom end of the circuit board body (1), and a plurality of heat pipes (9) are distributed in the layered plate (8). A storage box (10) is fixedly mounted on one end of the layered plate (8), and one end of the storage box (10) extends into the interior of the layered plate (8). A fan (11) is fixedly mounted in the storage box (10), and an air supply pipe (12) is fixedly mounted on the fan (11), and the output end of the air supply pipe (12) passes through the back of the storage box (10) and is connected to the input end of the heat pipe (9).

4. The high temperature resistant integrated circuit circuit board according to claim 3, characterized in that: A filter (13) is fixedly mounted on the storage box (10), and the filter (13) is used to connect the storage box (10) with the outside world.

5. The high temperature resistant integrated circuit circuit board according to claim 3, characterized in that: The other end of the added layer plate (8) is provided with a plurality of air outlets (14), and the air outlets (14) are connected to the output end of the heat pipe (9).

6. The high temperature resistant integrated circuit circuit board according to claim 3, characterized in that: A power supply block (15) is fixedly installed in the storage box (10), and the power supply block (15) is connected to the fan (11) circuit.

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