Dehumidification and anti-blocking treatment device for semiconductor waste gas treatment and waste gas treatment system

Abstract

The utility model discloses a dehumidification and anti-blocking treatment device and system for semiconductor waste gas treatment. The dehumidification and anti-blocking treatment device comprises a swirler, a first pipeline and a second pipeline, the first pipeline and the second pipeline are connected with the swirler, the first pipeline is connected with the dehumidification area, and the second pipeline is connected with the dust removal area; the swirler is provided with a swirl chamber; gas is input into the vortex chamber along the tangential direction; the first pipeline is shorter than the second pipeline; cold airflow in the vortex chamber is input into the dehumidification area, and hot air in the vortex chamber is input into the dust removal area. Gas is fed into the swirler, after the input gas forms a vortex, gas flow advances in a rotating mode, peripheral gas in friction contact with the inner side wall of the swirler in the gas flow is heated to form hot gas flow, and gas in the center of the gas flow forms cold gas flow. Cold air flow is connected into the dehumidification area through the first pipeline, the generation amount of acidic corrosive liquid and the like is reduced, and corrosion to the inner side wall of the factory service acid discharge pipeline is reduced. Hot air flows into the dust removal area through the second pipeline, so that pipeline blockage caused by combination of dust carried by waste gas and condensate water is avoided.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor waste gas treatment, and in particular to a treatment device and a waste gas treatment system for semiconductor waste gas treatment, dehumidification and anti-blocking. Background Art

[0002] Semiconductor manufacturing processes utilize a variety of process gases, generating a variety of waste gases. These gases require high-temperature treatment and water scrubbing to eliminate toxic and hazardous waste gases and ensure they meet environmental standards before discharge. Combustion-water scrubbing is a common waste gas treatment method used in semiconductor manufacturing. This involves first subjecting the waste gases to high-temperature oxidation, followed by water scrubbing to remove water-soluble byproducts and cool the high-temperature gases before discharge to the facility's service end.

[0003] Exhaust gas often carries dust. During the exhaust gas input process, the condensed water inside the pipe condenses and combines with the dust carried by the exhaust gas, and easily condenses inside the pipe wall, thereby adhering to the inside of the pipe wall and causing pipe blockage, thereby causing high intake pressure and machine failure.

[0004] In addition, during the water washing process, the waste gas is discharged into the plant acid discharge pipe along with water vapor. The combination of waste gas and water vapor will generate acidic and other corrosive liquids, thereby accelerating the corrosion inside the plant acid discharge pipe. Utility Model Content

[0005] The purpose of the utility model is to provide a treatment device and waste gas treatment system for dehumidification and anti-blocking of semiconductor waste gas, which can effectively solve the technical problems of blockage of the waste gas treatment system pipeline due to dust and accelerated corrosion of the factory acid discharge pipeline caused by corrosive liquids such as acid.

[0006] The embodiment of the present utility model is achieved as follows:

[0007] In the first aspect, an embodiment of the present application provides a treatment device for dehumidification and anti-blocking of semiconductor waste gas, which is applied to a waste gas treatment system, and includes a vortex finder, a first pipe and a second pipe; the air inlet ends of the first pipe and the second pipe are respectively connected to the two sides of the vortex finder, the air outlet end of the first pipe is connected to the dehumidification area of ​​the waste gas treatment system, and the air outlet end of the second pipe is connected to the dust removal area of ​​the waste gas treatment system; a cylindrical vortex chamber is provided inside the vortex finder, and the first pipe and the second pipe are coaxially arranged with the vortex chamber and are respectively connected to the vortex chamber; the vortex chamber is input with a set pressure and a set temperature along its tangential direction, and the length of the first pipe is smaller than the length of the second pipe; the cold air flow in the vortex chamber is input into the dehumidification area through the first pipe, and the hot air flow in the vortex chamber is input into the dust removal area through the second pipe; wherein the pressure of the gas is at least higher than one atmosphere, and the temperature of the gas matches the ambient temperature of the vortex finder.

[0008] In a possible embodiment, the processing device also includes a gas source and a gas source control device, and a gas nozzle is provided on the outside of the vortex finder; the gas inlet of the gas nozzle is connected to the gas source, and the gas outlet of the gas nozzle is connected to the vortex chamber, and the gas outlet direction of the gas outlet of the gas nozzle is along the tangent direction of the vortex chamber; the gas source control device controls the gas source to transport the gas along the tangent of the vortex chamber to the inside of the vortex finder through the gas nozzle.

[0009] In a possible embodiment, the inner wall of the vortex chamber is provided with a plurality of grooves, both ends of the plurality of grooves extend along the axis direction of the vortex chamber, and the plurality of grooves are arranged at equal angles along the inner circumference of the vortex chamber.

[0010] In a possible embodiment, the second duct includes a first sub-duct, a second sub-duct and a third sub-duct arranged coaxially, and the first sub-duct, the second sub-duct and the third sub-duct are arranged in sequence and connected in a direction away from the vortex finder; the inner diameter of the second sub-duct is smaller than that of the first sub-duct and the third sub-duct, the first sub-duct is connected to the vortex chamber, and the third sub-duct is connected to the dust removal area of ​​the exhaust gas treatment system.

[0011] In a possible embodiment, the processing device also includes a flow control valve, which includes a valve core and a driving device; the valve core is connected to the third sub-pipeline and extends into the interior of the third sub-pipeline, and the driving device is connected to the valve core to drive the valve core to move along the radial direction of the third sub-pipeline.

[0012] In a possible embodiment, the processing device also includes a first temperature sensor and a first control device, the first temperature sensor is electrically connected to the first control device, and the first control device is electrically connected to the gas source control device; the first temperature sensor is arranged at the outlet end of the first pipe, for collecting the first temperature value of the cold air flow inside the first pipe; when the first temperature value is lower than a first temperature threshold, the first control device controls the gas source through the gas source control device to stop transporting the gas to the inside of the vortexer.

[0013] In a possible implementation manner, the processing device further includes a first temperature display, which is electrically connected to the first temperature sensor and is configured to display the first temperature value in real time.

[0014] In a possible embodiment, the processing device also includes a second temperature sensor and a second control device, the second temperature sensor is electrically connected to the second control device, and the second control device is electrically connected to the gas source control device; the second temperature sensor is arranged at the outlet end of the third sub-pipeline, and is used to collect the second temperature value of the hot air flow inside the third sub-pipeline; when the second temperature value exceeds a second temperature threshold, the second control device controls the gas source through the gas source control device to stop transporting the gas to the inside of the vortex finder.

[0015] In a possible implementation manner, the processing device further includes a second temperature display, which is electrically connected to the second temperature sensor and is configured to display the second temperature value in real time.

[0016] In the second aspect, an exhaust gas treatment system of an embodiment of the present application includes a dehumidification area, a dust removal area and the above-mentioned treatment device; the air outlet end of the first pipe is connected to the dehumidification area, and the air outlet end of the second pipe is connected to the dust removal area.

[0017] The beneficial effects of the embodiments of the present utility model are: the treatment device and waste gas treatment system for semiconductor waste gas treatment, dehumidification and anti-blocking of the present application, send high-pressure and normal-temperature gas (such as air) into the vortex chamber, and after the gas input into the inside of the vortex chamber forms a vortex, the airflow rotates forward, and the peripheral gas in the airflow that is in frictional contact with the inner wall of the vortex chamber heats up to form a hot airflow, and the gas in the center of the airflow forms a cold airflow.

[0018] On the one hand, the cold air flow enters the dehumidification area through the first pipe. A large amount of water vapor in the dehumidification area cools down after contacting the cold air flow, thus condensing in advance. The condensed water flows back to the machine water tank, thereby achieving the purpose of dehumidification, reducing the water vapor carried in the internal gas input into the plant acid discharge pipe, and then reducing the generation of acidic and other corrosive liquids, reducing the corrosion of the inner wall of the plant acid discharge pipe.

[0019] On the other hand, the hot air flow enters the dust removal area through the second pipe, thus forming a local high-temperature area. The water vapor inside the pipe is not easy to condense, which prevents the dust carried by the exhaust gas from combining with the condensed water to cause pipe blockage, extending the maintenance cycle of the machine and making the machine operation more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following is a brief introduction to the drawings required for use in the embodiments. It should be understood that the following drawings only illustrate certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying any creative work.

[0021] Figure 1 This is an overall structural diagram of a treatment device for semiconductor waste gas treatment, dehumidification and anti-blocking according to an embodiment of the utility model;

[0022] Figure 2 This is a gas flow diagram of a treatment device for semiconductor waste gas treatment, dehumidification and anti-clogging according to an embodiment of the present utility model;

[0023] Figure 3 This is a structural diagram of a vortex finder of a treatment device for dehumidification and anti-clogging of semiconductor exhaust gas according to an embodiment of the present utility model;

[0024] Figure 4 This is a cross-sectional view of a vortex finder of a treatment device for dehumidification and anti-clogging of semiconductor exhaust gas according to an embodiment of the present utility model;

[0025] Figure 5 This is a structural diagram of a flow regulating valve of a treatment device for dehumidifying and preventing semiconductor waste gas from being treated in an embodiment of the present utility model.

[0026] Icons: 1. Swirl finder; 11. Swirl chamber; 12. Gas nozzle; 2. First pipeline; 3. Second pipeline; 31. First sub-pipeline; 32. Second sub-pipeline; 33. Third sub-pipeline; 4. Flow control valve; 41. Valve core; 42. Drive device; 51. First temperature sensor; 52. Second temperature sensor; 61. First temperature display; 62. Second temperature display; DETAILED DESCRIPTION

[0027] To make the purpose, technical solutions, and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Generally, the components of the embodiments of the present invention described and shown in the drawings herein can be arranged and designed in various different configurations.

[0028] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but rather merely represents selected embodiments of the present invention. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of the present invention without creative effort are also within the scope of protection of the present invention.

[0029] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0030] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer" and the like, indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, or are the orientations or positional relationships in which the utility model product is typically placed when in use. These terms are intended solely to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or component referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used solely to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0031] Furthermore, terms such as "horizontal" and "vertical" do not necessarily mean that a component must be absolutely horizontal or overhanging, but rather that it can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but rather that it can be slightly tilted.

[0032] It should also be noted that, in the description of this utility model, unless otherwise expressly specified or limited, the terms "disposed," "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0033] like Figures 1 to 5 As shown, considering that the exhaust gas from the current semiconductor waste gas treatment device is accompanied by water vapor after combustion and water washing treatment, the exhaust humidity is high and more acidic corrosive liquids are formed, thereby accelerating the corrosion of the factory acid exhaust pipe and the powder adhesion of the air intake pipe causes blockage, affecting the stable operation of the equipment and increasing the maintenance cost and maintenance cycle of the gas pipeline.

[0034] The treatment device and waste gas treatment system for semiconductor waste gas treatment, dehumidification and anti-blocking of the present application send high-pressure and normal-temperature gas (such as air) into the vortex finder 1. After the gas input into the vortex chamber 11 forms a vortex, the airflow rotates forward, and the peripheral gas in the airflow that is in frictional contact with the inner wall of the vortex finder 1 heats up to form a hot airflow, and the gas in the center of the airflow forms a cold airflow.

[0035] On the one hand, the cold air flow is connected to the dehumidification area through the first pipe 2. A large amount of water vapor in the dehumidification area is cooled down after contacting with the cold air flow, thereby condensing in advance. The condensed water flows back to the machine water tank, thereby achieving the purpose of dehumidification, reducing the water vapor carried in the gas inside the input plant acid discharge pipeline, and then reducing the amount of corrosive liquids such as acid generated, reducing the corrosion of the inner wall of the plant acid discharge pipeline.

[0036] On the other hand, the hot air flow enters the dust removal area through the second pipe 3, thereby forming a local high-temperature area. The water vapor inside the pipe is not easy to condense, which prevents the dust carried by the exhaust gas from combining with the condensed water to cause pipe blockage, extending the maintenance cycle of the machine and making the machine operation more stable.

[0037] A treatment device for dehumidification and anti-blocking of semiconductor waste gas according to an embodiment of the present application is applied to a waste gas treatment system, comprising a vortex finder 1, a first pipe 2 and a second pipe 3; the air inlet ends of the first pipe 2 and the second pipe 3 are respectively connected to the two sides of the vortex finder 1, the air outlet end of the first pipe 2 is connected to the dehumidification zone of the waste gas treatment system, and the air outlet end of the second pipe 3 is connected to the dust removal zone of the waste gas treatment system; a cylindrical vortex chamber 11 is provided inside the vortex finder 1, and the first pipe 2 and the second pipe 3 are coaxially arranged with the vortex chamber 11 and are respectively connected to the vortex chamber 11; the vortex chamber 11 inputs gas with a set pressure and a set temperature along its tangential direction, and the length of the first pipe 2 is less than the length of the second pipe 3; the cold air flow in the vortex chamber 11 is input into the dehumidification zone through the first pipe 2, and the hot air flow in the vortex chamber 11 is input into the dust removal zone through the second pipe 3; wherein the pressure of the gas is at least higher than one atmospheric pressure, and the temperature of the gas matches the ambient temperature of the vortex finder 1.

[0038] In combination with the above embodiment, the gas (such as air) input into the vortex finder 1 is a high-pressure, normal-temperature gas. The gas is input along the tangential direction of the vortex chamber 11. After the gas forms a vortex, it rotates and moves forward along the first pipe 2 and the second pipe 3. The outer layer of gas rubs against the inner wall of the vortex chamber 11, so that the temperature will rise rapidly. The inner and outer layers of gas are stratified into cold air flow and hot air flow due to the temperature difference.

[0039] On the one hand, the hot air flow enters the dehumidification area through the first pipe 2 of smaller length. A large amount of water vapor in the dehumidification area cools down after contacting with the cold air flow and condenses in advance, thereby achieving the purpose of dehumidification, reducing the water vapor carried in the gas input into the plant acid discharge pipe, and further reducing the amount of corrosive liquids such as acid generated, reducing the corrosion of the inner wall of the plant acid discharge pipe.

[0040] On the other hand, the cold air flow enters the dust removal area through the second pipe 3 with a longer length, thereby forming a local high-temperature area. The water vapor inside the pipe of the dust removal area is not easy to condense, which prevents the dust carried by the exhaust gas from combining with the condensed water to cause the pipe of the dust removal area to be blocked, thereby extending the maintenance cycle of the machine and making the machine operation more stable.

[0041] The embodiment of the present application is a treatment device for semiconductor waste gas treatment, dehumidification and anti-blocking, and the treatment device also includes a gas source and a gas source control device. A gas nozzle 12 is provided on the outside of the vortex finder 1; the gas inlet of the gas nozzle 12 is connected to the gas source, and the gas outlet of the gas nozzle 12 is connected to the vortex chamber 11, and the gas outlet direction of the gas nozzle 12 is along the tangent direction of the vortex chamber 11; the gas source control device controls the gas source to transport gas along the tangent of the vortex chamber 11 to the inside of the vortex finder 1 through the gas nozzle 12.

[0042] In conjunction with the above-described embodiment, the gas nozzle 12 is configured in a trumpet-like shape, i.e., the inner diameter of the gas inlet end of the gas nozzle 12 is much smaller than the inner diameter of the gas outlet end. When high-pressure gas is introduced into the vortex finder 1 through the gas nozzle 12, it expands and accelerates through the gas nozzle 12, thereby increasing the gas injection velocity. Even gas at room temperature (around 23°C) can be rapidly heated within the vortex chamber 12, thereby achieving stratification of hot and cold airflows and accelerating dehumidification and anti-clogging efficiency.

[0043] In the treatment device for semiconductor waste gas treatment, dehumidification and anti-blocking according to the embodiment of the present application, a plurality of grooves are provided on the inner wall of the vortex chamber 11, both ends of the plurality of grooves extend along the axial direction of the vortex chamber 11, and the plurality of grooves are arranged at equal angles along the inner circumference of the vortex chamber 11.

[0044] In combination with the above embodiments, each groove is in the shape of a long strip and is arranged at equal angles on the inner wall of the vortex chamber 11. When the gas rotates and moves forward in the vortex chamber 11, the friction between the gas and the tube wall is increased by the grooves, which can achieve rapid heating of the outer layer of the gas, thereby achieving stratification of hot air flow and cold air flow, and accelerating the dehumidification and anti-blocking processing efficiency.

[0045] The embodiment of the present application is a treatment device for semiconductor waste gas treatment, dehumidification and anti-blocking, and the second pipe 3 includes a first sub-pipe 31, a second sub-pipe 32 and a third sub-pipe 33 arranged coaxially, and the first sub-pipe 31, the second sub-pipe 32 and the third sub-pipe 33 are arranged and connected in sequence in a direction away from the vortex finder 1; the inner diameter of the second sub-pipe 32 is smaller than that of the first sub-pipe 31 and the third sub-pipe 33, the first sub-pipe 31 is connected to the vortex chamber 11, and the third sub-pipe 33 is connected to the dust removal area of ​​the waste gas treatment system.

[0046] In combination with the above embodiment, the inner diameter of the second sub-pipe 32 is much smaller than that of the first sub-pipe 31 and the third sub-pipe 33, thereby forming a "necking zone" in the middle of the second pipe 32 near the air inlet of the dust removal area. Since the length of the first sub-pipe 31 is relatively long, the flow rate of the hot air flow is lost during the rotation process. When passing through the second sub-pipe 32, the inner diameter of the second sub-pipe 32 is greatly reduced, and the inner diameter of the third sub-pipe 33 is the same as the inner diameter of the first sub-pipe 31, the hot air flow is compressed and expanded successively, thereby achieving accelerated expansion of the hot air flow, which can improve the dust removal efficiency of the hot air flow in the dust removal area.

[0047] The embodiment of the present application is a treatment device for semiconductor waste gas treatment, dehumidification and anti-blocking, and the treatment device also includes a flow control valve 4, which includes a valve core 41 and a drive device 42; the valve core 41 is connected to the third sub-pipe 33 and extends into the interior of the third sub-pipe 33, and the drive device 42 is connected to the valve core 41 to drive the valve core 41 to move along the radial direction of the third sub-pipe 33.

[0048] In conjunction with the above embodiment, the flow rate of the hot air flow is controlled by adjusting the cross-sectional area of ​​the third sub-pipe 33 via the flow control valve 4. The flow control valve 4 is selectively adjusted based on the dust content of the exhaust gas. For example, when the exhaust gas contains a high dust content, the flow control valve 4 is opened to a larger degree, enabling rapid dust removal. When the exhaust gas contains a low dust content, the flow control valve 4 is opened to a smaller degree, saving gas input from the gas source, reducing the gas pressure of the entire system, and extending the service life of the equipment.

[0049] The embodiment of the present application is a treatment device for semiconductor waste gas treatment, dehumidification and anti-blocking, and the treatment device also includes a first temperature sensor 51 and a first control device. The first temperature sensor 51 is electrically connected to the first control device, and the first control device is electrically connected to the gas source control device; the first temperature sensor 51 is arranged at the outlet end of the first pipe 2, and is used to collect the first temperature value of the cold air flow inside the first pipe 2; when the first temperature value is lower than the first temperature threshold, the first control device controls the gas source through the gas source control device to stop supplying gas to the inside of the vortexer 1.

[0050] Furthermore, the processing device further includes a first temperature display 61 , which is electrically connected to the first temperature sensor 51 and is configured to display the first temperature value in real time.

[0051] In conjunction with the above embodiment, the first temperature sensor 51 measures the temperature at the outlet of the first pipe 2. When the temperature of the cold airflow is too low, air supply to the vortex finder 1 is immediately stopped to prevent damage to the entire device. Simultaneously, the first temperature display 61 displays the first temperature value in real time. When the first temperature value is too low, an alarm device on the first temperature display 61 can sound an alarm.

[0052] The embodiment of the present application is a treatment device for semiconductor waste gas treatment, dehumidification and anti-blocking, and the treatment device also includes a second temperature sensor 52 and a second control device, the second temperature sensor 52 is electrically connected to the second control device, and the second control device is electrically connected to the gas source control device; the second temperature sensor 52 is arranged at the outlet end of the third sub-pipe 33, and is used to collect the second temperature value of the hot air flow inside the third sub-pipe 33; when the second temperature value exceeds the second temperature threshold, the second control device controls the gas source through the gas source control device to stop supplying gas to the inside of the vortexer 1.

[0053] Furthermore, the processing device further includes a second temperature display 62 , which is electrically connected to the second temperature sensor 52 and is configured to display the second temperature value in real time.

[0054] In conjunction with the above embodiment, the second temperature sensor 52 measures the temperature at the outlet of the second pipe 2. If the temperature of the hot air flow is too high, the air supply to the vortex finder 1 is immediately stopped to prevent damage to the entire device. Simultaneously, the second temperature display 62 displays the second temperature value in real time. If the second temperature value is too high, an alarm device on the second temperature display 62 can sound an alarm.

[0055] Based on the same inventive concept, the present application also provides a waste gas treatment system. Since the basic principle of the first waste gas treatment system of the present application is the same as that of a treatment device for dehumidification and anti-blocking of semiconductor waste gas treatment in the present application, the specific implementation method of a waste gas treatment system of the present application can refer to a treatment device for dehumidification and anti-blocking of semiconductor waste gas treatment, and the repetitions will not be repeated.

[0056] An embodiment of the present application provides an exhaust gas treatment system, comprising a dehumidification zone, a dust removal zone and the above-mentioned treatment device; the outlet end of the first pipe 2 is connected to the dehumidification zone, and the outlet end of the second pipe 3 is connected to the dust removal zone.

[0057] In combination with the above embodiment, the cold air flow is connected to the dehumidification area through the first pipe 2. A large amount of water vapor in the dehumidification area is cooled down after contacting the cold air flow, thereby condensing in advance. The condensed water flows back to the machine water tank, thereby achieving the purpose of dehumidification, reducing the water vapor carried in the internal gas input into the plant acid discharge pipe, and then reducing the amount of corrosive liquids such as acid generated, reducing the corrosion of the inner wall of the plant acid discharge pipe.

[0058] At the same time, the hot air flow enters the dust removal area through the second pipe 3, thereby forming a local high-temperature area. The water vapor inside the pipe is not easy to condense, which prevents the dust carried by the exhaust gas from combining with the condensed water to cause pipe blockage, extending the maintenance cycle of the machine and making the machine operation more stable.

[0059] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Those skilled in the art will readily appreciate that the present invention is susceptible to various modifications and variations. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A treatment device for semiconductor waste gas treatment, dehumidification and anti-blocking, applied to waste gas treatment system, characterized in that: It includes a vortex finder, a first pipe and a second pipe; the air inlet ends of the first pipe and the second pipe are respectively connected to the two sides of the vortex finder, the air outlet end of the first pipe is connected to the dehumidification area of ​​the exhaust gas treatment system, and the air outlet end of the second pipe is connected to the dust removal area of ​​the exhaust gas treatment system; a cylindrical vortex chamber is provided inside the vortex finder, and the first pipe and the second pipe are coaxially arranged with the vortex chamber and are respectively connected to the vortex chamber; the vortex chamber inputs gas with a set pressure and a set temperature along its tangential direction, and the length of the first pipe is smaller than the length of the second pipe; the cold air flow in the vortex chamber is input into the dehumidification area through the first pipe, and the hot air flow in the vortex chamber is input into the dust removal area through the second pipe; wherein the pressure of the gas is at least higher than one atmosphere, and the temperature of the gas matches the ambient temperature of the vortex finder.

2. The device for treating, dehumidifying and preventing semiconductor waste gas according to claim 1, characterized in that: The processing device also includes a gas source and a gas source control device. A gas nozzle is provided on the outside of the vortex finder; the gas inlet of the gas nozzle is connected to the gas source, the gas outlet of the gas nozzle is communicated with the vortex chamber, and the gas outlet direction of the gas outlet of the gas nozzle is along the tangent direction of the vortex chamber; the gas source control device controls the gas source to transport the gas along the tangent of the vortex chamber to the inside of the vortex finder through the gas nozzle.

3. The device for treating, dehumidifying and preventing semiconductor waste gas according to claim 1, characterized in that: The inner wall of the vortex chamber is provided with a plurality of grooves, both ends of the plurality of grooves extend along the axis direction of the vortex chamber, and the plurality of grooves are arranged at equal angles along the inner circumference of the vortex chamber.

4. The device for treating, dehumidifying and preventing semiconductor waste gas according to claim 2, characterized in that: The second pipe includes a first sub-pipe, a second sub-pipe and a third sub-pipe arranged coaxially, and the first sub-pipe, the second sub-pipe and the third sub-pipe are arranged in sequence and connected in a direction away from the vortex finder; the inner diameter of the second sub-pipe is smaller than that of the first sub-pipe and the third sub-pipe, the first sub-pipe is connected to the vortex chamber, and the third sub-pipe is connected to the dust removal area of ​​the exhaust gas treatment system.

5. The device for treating, dehumidifying and preventing semiconductor waste gas according to claim 4, characterized in that: The processing device also includes a flow control valve, which includes a valve core and a driving device; the valve core is connected to the third sub-pipeline and extends into the interior of the third sub-pipeline, and the driving device is connected to the valve core to drive the valve core to move along the radial direction of the third sub-pipeline.

6. The device for treating, dehumidifying and preventing semiconductor waste gas according to claim 2, characterized in that: The processing device also includes a first temperature sensor and a first control device, the first temperature sensor is electrically connected to the first control device, and the first control device is electrically connected to the gas source control device; the first temperature sensor is arranged at the outlet end of the first pipeline, and is used to collect the first temperature value of the cold air flow inside the first pipeline; when the first temperature value is lower than a first temperature threshold, the first control device controls the gas source through the gas source control device to stop supplying the gas to the inside of the vortex finder.

7. The device for treating, dehumidifying and preventing semiconductor waste gas according to claim 6, characterized in that: The processing device further includes a first temperature display, which is electrically connected to the first temperature sensor and is configured to display the first temperature value in real time.

8. The device for treating, dehumidifying and preventing semiconductor waste gas according to claim 4, characterized in that: The processing device also includes a second temperature sensor and a second control device, the second temperature sensor is electrically connected to the second control device, and the second control device is electrically connected to the gas source control device; the second temperature sensor is arranged at the outlet end of the third sub-pipeline, and is used to collect the second temperature value of the hot air flow inside the third sub-pipeline; when the second temperature value exceeds a second temperature threshold, the second control device controls the gas source through the gas source control device to stop supplying the gas to the inside of the vortex finder.

9. The device for treating, dehumidifying and preventing semiconductor waste gas according to claim 8, characterized in that: The processing device further includes a second temperature display, which is electrically connected to the second temperature sensor and is configured to display the second temperature value in real time.

10. An exhaust gas treatment system, characterized in that: It comprises a dehumidification area, a dust removal area and a processing device according to any one of claims 1 to 9; the air outlet end of the first pipe is connected to the dehumidification area, and the air outlet end of the second pipe is connected to the dust removal area.

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