Gold spot plating mold
By designing the dot gold plating mold, the problems of high cost of gold plating potions and inaccurate experimental results are solved, the efficient use of gold plating potions and the accuracy of experimental results are achieved, and the production efficiency and product quality of the electroplating factory are improved.
Patent Information
- Application Number
- CN202422338506.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2025-08-29
- Estimated Expiration
- 2034-09-24
AI Technical Summary
The existing gilding potions are costly and cannot obtain accurate experimental results, which leads to difficulties in electroplating efficiency and experimental results of gold plating plants.
A dot gold-plating mold is designed, including a mold tray, a mold fixing base, a dot plating chamber and a mold pump, equipped with a mother tank, a partition, a nozzle, anode wiring base and a cathode wiring base. The plating solution is transported to the nozzle and sprayed onto the cathode through the mold pump. The temperature is controlled by a pure copper cathode contact sheet and heating device to achieve the testing of the performance of the gold-plating water.
It reduces the cost of gold-plated potions, can accurately measure current density, guide the current density setting of mass-produced products, avoid burning, provide correct experimental results, and improve production efficiency.
Smart Images
Figure CN223280957U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of electroplating molds, in particular to a point gold plating mold. Background Art
[0002] Gold is a golden-yellow precious metal with a relative atomic mass of 196.97, a density of 19.3 g / cm³, a melting point of 1063°C, and atomic valence states of monovalent and trivalent, with standard electrode potentials of +1.68 V and +1.50 V, respectively. The electrochemical equivalent of Au+ is 7.357 g / (A·h), and the electrochemical equivalent of Au3+ is 2.4497 g / (A·h).
[0003] Gold has extremely high chemical stability. It is insoluble in ordinary acids and only soluble in aqua regia. Therefore, gold plating has strong corrosion resistance and good anti-tarnishing ability. At the same time, gold alloy plating has a variety of color tones, good ductility and easy polishing. Therefore, it is often used for decorative plating, such as jewelry, watch parts, and artworks. However, due to the high price of gold, its application is subject to certain restrictions.
[0004] Gold has good electrical conductivity, is easy to weld, is resistant to high temperatures, and has a certain degree of wear resistance (hard gold). The thermal conductivity of gold is 70% of that of silver. Due to these physical and chemical properties, gold is widely used in the electroplating of parts that require long-term stable electrical parameters, such as precision instruments, printed circuits, integrated circuits, military electronic tubes and housings, and electrical contacts.
[0005] Due to the extremely high value and price of gold, in the field of electroplating, gold plating factories do not conduct as in-depth performance verification and exploration of their gold plating solutions as they do for other series of solutions, such as silver plating, tin plating, nickel plating, and copper plating. The reasons are as follows: ① Gold salts are expensive. A 1L gold plating solution with a gold ion concentration of 6g / L costs several thousand yuan. ② The plating efficiency of cyanide system gold plating is only about 35%, and the stirring requirements are relatively high. If the laboratory cannot restore the exchange speed of the production line pump, it is more likely to burn at the same current density, and correct experimental results cannot be obtained. Utility Model Content
[0006] The utility model aims to provide a point gold plating mold, aiming to solve the technical problems in the prior art of high cost of gold plating solution and inability to obtain accurate experimental results.
[0007] To achieve the above-mentioned purpose, the embodiment of the present invention provides a spot gold plating mold, comprising a mold tray, a mold fixing base, a spot plating chamber and a mold pump, wherein the mold fixing base is connected to the mold tray, the spot plating chamber is connected to the mold fixing base, and the mold pump is connected to the mold tray;
[0008] The mold pump is connected to a pump water inlet and a pump water outlet, and the pump water inlet is arranged on one side of the pump water outlet;
[0009] The spot plating chamber is provided with a mother tank, a partition and a nozzle, the partition is arranged in the mother tank and connected to the spot plating chamber, and the nozzle is connected to the partition; the side of the spot plating chamber is connected to an anode terminal block and a cathode terminal block, and the anode terminal block and the cathode terminal block are arranged at intervals; the top of the spot plating chamber is connected to a top plate, and a cathode contact piece is installed on the top side of the top plate. The top of the top plate is provided with a spot plating hole, and the cathode contact piece is arranged between the cathode terminal block and the spot plating hole; the side of the spot plating chamber is provided with a spot plating mold water inlet and a spot plating mold water outlet, and the spot plating mold water inlet and the spot plating mold water outlet are arranged on one side of the mold pump, the pump water inlet is connected to the spot plating mold water outlet, and the pump water outlet is connected to the spot plating mold water inlet; the nozzle is connected to the spot plating mold water inlet.
[0010] As an optional solution of the present invention, the mother tank is filled with plating solution, and the plating solution is separated from the nozzle by the partition, and the volume of the mother tank is 700 mL.
[0011] As an optional solution of the present invention, the cathode contact piece is made of pure copper.
[0012] As an optional solution of the present invention, the diameter of the point-plated hole is 8-12 mm.
[0013] As an optional solution of the present invention, a heating pen fixing block is fixedly connected to the side of the mold fixing base, and the heating pen fixing block is arranged on one side of the spot plating chamber. Two heating pen slots are provided on the heating pen fixing block.
[0014] As an optional solution of the present invention, a heating pen hole is provided on the side of the spot plating chamber, and there are two heating pen holes and two heating pen slots, and the heating pen hole and the heating pen slot are arranged to overlap.
[0015] The above one or more technical solutions in the gold-plating mold provided by the embodiment of the utility model have at least one of the following technical effects:
[0016] The point gold plating mold provided in the present application is used by pouring the required test solution into the master tank. Under the action of the experimental pump, the solution in the master tank is sprayed onto the cathode through the nozzle. The diameter of the point plating hole is 10 mm. The current size under different current densities is calculated based on its area, and the performance of the gold plating solution can be compared and the size of the limiting current density can be obtained. Compared with the gold plating solution, the solution saves costs and is conducive to guiding the improvement of the current density of mass-produced products. It is not easy to burn under the same current density and can produce correct experimental results. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0018] Figure 1 A three-dimensional diagram of a point gold plating mold provided in an embodiment of the present utility model.
[0019] Figure 2 This is a three-dimensional view of the interior of the point gold plating mold provided by an embodiment of the present utility model.
[0020] Figure 3 This is a comparison table of the corresponding current values under different current densities.
[0021] Among them, the reference numerals in the figures are:
[0022] 1. Mold tray; 2. Mold pump; 3. Mold fixing base; 4. Pump water inlet; 5. Pump water outlet; 6. Spot plating mold water outlet; 7. Spot plating mold water inlet; 8. Spot plating holes; 9. Cathode contact piece; 10. Cathode terminal block; 11. Anode terminal block; 12. Partition; 13. Nozzle; 14. Heating pen fixing block; 15. Heating pen hole; 16. Spot plating chamber; 17. Top plate. DETAILED DESCRIPTION
[0023] The following describes in detail embodiments of the present invention, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the embodiments of the present invention, and should not be construed as limiting the present invention.
[0024] In the description of the embodiments of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the embodiments of the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.
[0025] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be understood to indicate or imply relative importance or implicitly specify the number of the technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present invention, "plurality" means two or more, unless otherwise specifically defined.
[0026] In the embodiments of the present invention, unless otherwise expressly specified or limited, the terms "installed," "connected," "connected," "fixed," etc. should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection; direct connection, indirect connection through an intermediate medium; internal communication between two components, or interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in the embodiments of the present invention based on specific circumstances.
[0027] In one embodiment of the present invention, Figures 1-2 As shown, a spot gold plating mold is provided, including a mold tray 1, a mold fixing base 3, a spot plating chamber 16 and a mold pump 2. The mold fixing base 3 is fixedly connected to the mold tray 1, the spot plating chamber 16 is fixedly connected to the mold fixing base, and the mold pump 2 is fixedly connected to the mold tray 1.
[0028] A pump water inlet 4 and a pump water outlet 5 are fixedly connected to the mold pump 2 , and the pump water inlet 4 is arranged on one side of the pump water outlet 5 .
[0029] The spot plating chamber 16 is provided with a mother tank, a partition 12, and a nozzle 13. The partition 12 is arranged in the mother tank and fixedly connected to the spot plating chamber 16. The nozzle 13 is fixedly connected to the partition 12. The anode terminal holder 11 and the cathode terminal holder 10 are fixedly connected to the side of the spot plating chamber 16, and the anode terminal holder 11 and the cathode terminal holder 10 are spaced apart. The top of the spot plating chamber 16 is fixedly connected to a top plate 17, and a cathode contact piece 9 is installed on the top side of the top plate 17. The top of the top plate 17 is provided with a spot plating hole 8. The cathode contact piece 9 is arranged between the cathode terminal holder 10 and the spot plating hole 8. The spot plating mold water inlet 7 and the spot plating mold water outlet 6 are fixedly connected to the side of the spot plating chamber 16. The spot plating mold water inlet 7 and the spot plating mold water outlet 6 are arranged on one side of the mold pump 2. The pump water inlet 4 is connected to the spot plating mold water outlet 6, and the pump water outlet 5 is connected to the spot plating mold water inlet 7. The nozzle 13 is connected to the spot plating mold water inlet 7. Under the action of mold pump 2, the plating solution is delivered through the spot plating mold outlet 6 to the pump inlet 4. The mold pump 2 then pumps the plating solution through its pump outlet 5 to the spot plating mold inlet 7. Finally, the plating solution is sprayed from the spot plating mold inlet 7 through the nozzle 13, through the spot plating hole 8, and onto the cathode contact sheet 9. The cathode terminal block 10 is connected to the negative terminal of the rectifier via a wire, and the anode terminal block 11 is connected to the positive terminal of the rectifier via a wire. The cathode contact sheet 9 is made of pure copper, measuring 0.3mm*20mm*18mm. The pure copper sheet is placed over the spot plating hole 8 and a cover is installed, ensuring that the cathode contact sheet 9 is in contact with the pure copper cathode sheet. A 3kg weight is placed on the cover to prevent the plating solution from being pushed away by excessive pump pressure. By setting the current value according to the desired current density, the operable current density range of the gold plating solution can be determined.
[0030] During use of the point gold plating mold provided by the present application, the potion to be tested is poured into the master tank. Under the action of the experimental pump, the potion in the master tank is sprayed onto the cathode through the nozzle 13. The diameter of the point plating hole 8 is 10 mm. The current size under different current densities is calculated based on its area, and the performance of the gold plating potion can be compared and the size of the limiting current density can be obtained. Compared with the gold plating potion, the potion saves costs and is conducive to guiding the improvement of the current density of mass-produced products. It is not easy to burn under the same current density and can produce correct experimental results.
[0031] In another embodiment of the present invention, the master tank of the dot gold plating mold is filled with plating solution, and the plating solution is separated from the nozzle 13 by the partition 12. The volume of the master tank is 700 mL.
[0032] In another embodiment of the present invention, the diameter of the spot-plating hole 8 of the spot-plating mold is 8-12 mm, preferably 10 mm.
[0033] In another embodiment of the present invention, a heater pen fixing block 14 is fixedly connected to the side of the mold fixing base 3 of the spot gold plating mold. The heater pen fixing block 14 is positioned on one side of the spot plating chamber 16 and is provided with two heater pen slots. Furthermore, heater pen holes 15 are provided on the side of the spot plating chamber 16. There are two heater pen holes 15 and two heater pen slots, and the holes 15 and the heater pen slots are arranged to overlap. To ensure the continuity of the experiment, a thermostat is added for control. The heater pen enters the mother tank through the heater pen hole 15 and is secured by the heater pen fixing block 14 to prevent damage. The temperature of the heater pen can be adjusted to suit the experimental requirements. The temperature range of the heater pen is from room temperature to 90°C, providing a wide range of options. Because the mother tank is only 700mL, the heating rate is very fast, effectively reducing experimental waiting time.
[0034] The point gold plating mold provided by the present application is used to pour the test solution into the master tank. Under the action of the experimental pump, the solution in the master tank is sprayed onto the cathode through the nozzle 13. The diameter of the point plating hole 8 is 10 mm. The current size under different current densities is calculated based on its area, and the performance of the gold plating solution can be compared and the size of the limiting current density can be obtained. Compared with the gold plating solution, the solution saves costs and is helpful in guiding the improvement of the current density of mass-produced products. It is not easy to burn at the same current density, and can produce correct experimental results. In addition, the higher the current density is, the higher the film thickness is within the same time without burning. Therefore, production capacity can be improved. Figure 3 Shown are the corresponding current values at different current densities.
[0035] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.
Claims
1. A point gold plating mold, characterized in that, It includes a mold tray, a mold fixing base, a spot plating chamber and a mold pump, wherein the mold fixing base is connected to the mold tray, the spot plating chamber is connected to the mold fixing base, and the mold pump is connected to the mold tray; The mold pump is connected to a pump water inlet and a pump water outlet, and the pump water inlet is arranged on one side of the pump water outlet; The spot plating chamber is provided with a mother tank, a partition, and a nozzle, the partition is arranged in the mother tank and connected to the spot plating chamber, and the nozzle is connected to the partition; The side of the spot plating chamber is connected to an anode terminal block and a cathode terminal block, and the anode terminal block and the cathode terminal block are spaced apart; the top of the spot plating chamber is connected to a top plate, and a cathode contact piece is installed on the top side of the top plate. A spot plating hole is provided on the top of the top plate, and the cathode contact piece is arranged between the cathode terminal block and the spot plating hole; the side of the spot plating chamber is provided with a spot plating mold water inlet and a spot plating mold water outlet, and the spot plating mold water inlet and the spot plating mold water outlet are arranged on one side of the mold pump, the pump water inlet is connected to the spot plating mold water outlet, and the pump water outlet is connected to the spot plating mold water inlet; the nozzle is connected to the spot plating mold water inlet.
2. A dot gold plating mold according to claim 1, characterized in that: The master tank is filled with plating solution, which is separated from the nozzle by the partition plate. The volume of the master tank is 700 mL.
3. A dot gold plating mold according to claim 1, characterized in that: The cathode contact piece is made of pure copper.
4. A dot gold plating mold according to claim 1, characterized in that: The diameter of the point-plated hole is 8-12 mm.
5. The dot gold plating mold according to claim 1, characterized in that: A heating pen fixing block is fixedly connected to the side of the mold fixing base. The heating pen fixing block is arranged on one side of the spot plating chamber. Two heating pen slots are provided on the heating pen fixing block.
6. A dot gold plating mold according to claim 5, characterized in that: A heating pen hole is provided on the side of the spot plating chamber. There are two heating pen holes and two heating pen slots, and the heating pen hole and the heating pen slot are overlapped.