Diode TRR parameter testing device

Abstract

The utility model relates to the technical field of diode TRR parameter testing, in particular to a diode TRR parameter testing device which is used in cooperation with a TRR tester and a silicon wafer, is used for testing TRR parameters of a diode made of the silicon wafer, and comprises an object placing plate, a wafer bearing table body, an insulation testing table body, a spotlight assembly and a testing pen assembly. The wafer bearing table body, the insulation test table body and the spotlight assembly are all arranged on the object placing plate, the wafer bearing table body and the insulation test table body are both of a rectangular frame structure with the top face open, in the using process, when a meter pen is in contact and pressed downwards, a pen core is stressed to move towards the rear end, a spring is driven to stretch, an insulation cap is in contact with a touch switch, and the wafer bearing table body and the insulation test table body are fixed. When the tester is triggered to test and the meter pen is lifted, the pen core moves forwards under the elastic force of the spring, the insulating cap is separated from the touch switch, the tested silicon wafer can be clamped from the semicircular through hole of the insulating test table body after the test is finished, and the metal state on the back of the silicon wafer is observed by using the spotlight, so that personnel operation is facilitated.

Description

Technical Field

[0001] The utility model relates to the technical field of diode TRR parameter testing, in particular to a diode TRR parameter testing device. Background Art

[0002] The existing TRR parameter test method generally uses a dedicated tester. During the test, the operator presses the test switch with his left hand and touches the diode die on the silicon wafer with the contact head on the tester with his right hand. During this process, the silicon wafer is inconvenient to handle and store, which can easily cause scratches on the silicon wafer. The contact head often accidentally touches the silicon wafer, resulting in incorrect measurement parameters and affecting the accuracy of the parameter test. The silicon wafer is prone to slipping during the test, making the test process inconvenient.

[0003] Chinese patent publication CN111398774B discloses a method and apparatus for testing minority carrier lifetimes in silicon wafers. The microwave probe emits microwaves perpendicular to the silicon wafer, while the laser generator emits laser light perpendicular to the horizontal plane. This method enables minority carrier lifetime testing on silicon wafers with epitaxial layers of varying thicknesses. However, it does not disclose how to test the TRR parameters of diodes.

[0004] In summary, how to design a diode TRR parameter test device that is convenient for taking and storing silicon wafers and prevents scratches on the silicon wafers; prevents the recording of incorrect measurement parameters that affect the accuracy of parameter testing; and can handle the situation where the silicon wafers are prone to slipping during testing has become a problem that needs to be solved at present. Utility Model Content

[0005] The purpose of the present invention is to provide a diode TRR parameter testing device to solve the above problems.

[0006] In order to achieve the above objectives, the following technical solutions are provided:

[0007] A diode TRR parameter testing device is used in conjunction with a TRR tester and a silicon wafer to test the TRR parameters of diodes made of silicon wafers. The testing device includes a storage plate, a wafer support platform, an insulation test platform, a spotlight assembly, and a test pen assembly. The wafer support platform, the insulation test platform, and the spotlight assembly are all arranged on the storage plate. The wafer support platform and the insulation test platform are both rectangular frame structures with an opening on the top surface, and are respectively arranged on the left and right sides of the storage plate. The spotlight assembly is located between the wafer support platform and the insulation test platform and is arranged along the width direction of the storage plate. The insulation test platform and the test pen assembly are both provided with conductive parts. The TRR tester is electrically connected to the conductive parts on the insulation test platform and the test pen assembly. The test pen assembly includes two parts that can move relative to each other. The test pen assembly also includes an elastic member and a touch switch that can control the activation of the TRR tester. The two ends of the elastic member are respectively fixed to the two parts that move relative to each other, for assisting in controlling the opening and closing of the touch switch.

[0008] Preferably, the wafer support body is provided with a fixed number of wafer basket slots along its length direction for fixing silicon wafers, and the front and rear ends of the wafer basket slots are fixed to the inner side wall of the wafer support body, and the front and rear ends of the wafer basket slots have a fixed height difference along the vertical direction.

[0009] Preferably, the spotlight assembly is arranged at the edge of one side of the storage plate, and the spotlight assembly includes a support and a lamp body. The top end of the support is bent toward the other side of the storage plate, and the lamp body is fixed on the bent part of the support.

[0010] Preferably, a copper plate is provided on the inner bottom surface of the insulation test bench body, on which a terminal and a positioning block are fixed. The terminal is connected to the copper plate, and the positioning block is arranged along a circular track, with its top bent toward the center of the copper plate.

[0011] Preferably, a semicircular through hole is provided at one side edge of the storage plate close to the insulation test bench body, and the semicircular through hole passes through the insulation test bench body, the copper plate and the storage plate in sequence from top to bottom, and the copper plate is tilted downward by 10° in the direction away from the semicircular through hole.

[0012] Preferably, the test pen assembly also includes a shell, a metal refill, a test wire and a threading body. The shell is hollow and one end of the shell is set to be inwardly reduced in diameter. The metal refill is limited in the shell and can move relative to the shell. The touch switch is fixed to the inner bottom surface of the shell. An insulating plastic cap is provided at the end of the metal refill facing the touch switch, which is used to control the opening and closing of the touch switch. The elastic member is a spring. The two ends of the spring are respectively fixed to the shell and the metal refill, which is used to drive the metal refill to reset. The side wall of the bottom of the shell is provided with an opening, and the threading body is fixed at the opening. There are multiple test wires, and the multiple test wires pass through the threading body and are electrically connected to the metal refill and the touch switch respectively.

[0013] The beneficial effects of the utility model are:

[0014] 1. During use, the operator uses tweezers to remove the silicon wafer from the wafer basket, places it on the insulation test bench, turns on the tester, turns on the spotlight switch, connects one end of the tester lead to the terminal, and the other end of the lead to the test probe assembly. The right hand uses the test probe to touch the diode core on the surface of the silicon wafer. When the probe is pressed down, the pen core is forced to move toward the rear end and drives the spring to stretch. The insulating cap contacts the touch switch, triggering the tester test. When the probe is lifted, the pen core moves forward under the elastic force of the spring, and the insulating cap is separated from the touch switch. The test is completed. The tested silicon wafer can be clamped from the semicircular through hole of the insulation test bench. The metal condition on the back of the silicon wafer can be observed with a spotlight, which is convenient for personnel operation.

[0015] 2. The utility model uses the inclined wafer basket slot and copper plate to tilt the silicon wafer to observe the wafer mark and prevent the silicon wafer from sliding, making it easier for personnel to operate; BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the structure of the utility model without the test pen component;

[0017] Figure 2 It is a schematic side cross-sectional view of the wafer support platform;

[0018] Figure 3 is a side view schematic diagram of a spotlight assembly;

[0019] Figure 4 It is a structural diagram of the positioning block;

[0020] Figure 5 is a schematic cross-sectional view of a test pen assembly;

[0021] In the picture:

[0022] 1- storage plate, 101- semicircular through hole;

[0023] 2- film receiving platform, 201- film basket slot;

[0024] 3-insulation test bench body, 301-copper plate, 302-binding post, 303-positioning block;

[0025] 4-spotlight assembly, 401-support, 402-lamp body;

[0026] 501-touch switch, 502-housing, 503-metal refill, 504-test wire, 505-threading body, 506-spring, 507-insulating plastic cap. DETAILED DESCRIPTION

[0027] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions of the schematic diagrams in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts shall fall within the scope of protection of the present invention.

[0028] like Figure 1-5 As shown, a diode TRR parameter testing device is used in conjunction with a TRR tester and a silicon wafer to test the TRR parameters of a diode made of a silicon wafer. The testing device includes a storage plate 1, a wafer support platform 2, an insulation test platform 3, a spotlight assembly 4, and a test pen assembly. The wafer support platform 2, the insulation test platform 3, and the spotlight assembly 4 are all arranged on the storage plate 1. The wafer support platform 2 and the insulation test platform 3 are both rectangular frame structures with an opening on the top surface, and are respectively arranged on the left and right sides of the storage plate 1. The spotlight assembly 4 is located between the wafer support platform 2 and the insulation test platform 3 and is arranged along the width direction of the storage plate 1. Conductive parts are provided on the insulation test platform 3 and the test pen assembly. The TRR tester is electrically connected to the conductive parts on the insulation test platform 3 and the test pen assembly. The test pen assembly includes two parts that can move relative to each other. The test pen assembly also includes an elastic member and a touch switch 501 that can control the activation of the TRR tester. The two ends of the elastic member are respectively fixed to the two parts that move relative to each other, for assisting in controlling the opening and closing of the touch switch 501.

[0029] During use, the operator uses tweezers to take the silicon wafer out of the wafer basket, places it on the insulation test bench body 3, turns on the tester, turns on the spotlight switch, connects one end of the tester lead to the terminal 302, and the other end of the lead to the test probe assembly, and touches the diode core on the surface of the silicon wafer with the test probe in the right hand. When the probe is pressed down, the lead moves toward the rear end under the force, and drives the spring 506 to stretch, and the insulating cap contacts the touch switch 501, triggering the tester test. When the probe is lifted, the lead moves forward under the elastic force of the spring 506, and the insulating cap is separated from the touch switch 501, and the test is completed. The tested silicon wafer can be picked up from the semicircular through hole 101 of the insulation test bench body 3, and the metal condition on the back of the silicon wafer can be observed with a spotlight, which simplifies the detection workflow and improves the detection accuracy.

[0030] In some embodiments, the wafer stage 2 is provided with a fixed number of wafer basket slots 201 along its length for securing silicon wafers. The front and rear ends of the wafer basket slots 201 are both secured to the inner sidewall of the wafer stage 2, and the front and rear ends of the wafer basket slots 201 have a fixed height difference along the vertical direction.

[0031] In some embodiments, the spotlight assembly 4 is disposed at an edge of one side of the storage plate 1. The spotlight assembly 4 includes a support 401 and a lamp body 402. The top end of the support 401 is bent toward the other side of the storage plate 1, and the lamp body 402 is fixed to the bent portion of the support 401.

[0032] In some embodiments, a copper plate 301 is provided on the inner bottom surface of the insulation test bench body 3, and a terminal 302 and a positioning block 303 are fixed on the copper plate 301. The terminal 302 is connected to the copper plate 301, and the positioning block 303 is arranged along a circular track, and its top is bent toward the center of the copper plate 301;

[0033] In some embodiments, a semicircular through-hole 101 is provided at an edge of one side of the storage plate 1 near the insulation test platform 3. The semicircular through-hole 101 passes through the insulation test platform 3, the copper plate 301, and the storage plate 1 from top to bottom. The copper plate 301 is tilted downward at 10° away from the semicircular through-hole 101. The tilted wafer basket slot 201 and the copper plate 301 respectively serve to tilt the silicon wafer for viewing the silicon wafer mark and prevent the silicon wafer from sliding, thereby facilitating operation.

[0034] In some embodiments, the test pen assembly also includes a shell 502, a metal refill 503, a test wire 504 and a threading body 505. The shell 502 is hollow and one end of it is set to be inwardly reduced in diameter. The metal refill 503 is limited in the shell 502 and can move relative to the shell 502. The touch switch 501 is fixed to the inner bottom surface of the shell 502. The end of the metal refill 503 facing the touch switch 501 is provided with an insulating plastic cap 507 for controlling the opening and closing of the touch switch 501. The elastic member is a spring 506. The two ends of the spring 506 are respectively fixed to the shell 502 and the metal refill 503, and are used to drive the metal refill 503 to reset. The side wall of the bottom of the shell 502 is provided with an opening, and the threading body 505 is fixed at the opening. There are multiple test wires 504, and the multiple test wires 504 pass through the threading body 505 and are electrically connected to the metal refill 503 and the touch switch 501 respectively.

Claims

1. A diode TRR parameter test device, used in conjunction with a TRR tester and a silicon wafer, for testing the TRR parameters of a diode made of a silicon wafer, characterized in that: The testing device includes a storage plate, a wafer support table, an insulation test table, a spotlight assembly and a test pen assembly. The wafer support table, the insulation test table and the spotlight assembly are all arranged on the storage plate. The wafer support table and the insulation test table are both rectangular frame structures with an opening on the top surface, and are respectively arranged on the left and right sides of the storage plate. The spotlight assembly is located between the wafer support table and the insulation test table, and is arranged along the width direction of the storage plate. The insulation test table and the test pen assembly are both provided with conductive parts. The TRR tester is electrically connected to the conductive parts on the insulation test table and the test pen assembly. The test pen assembly includes two parts that can move relative to each other. The test pen assembly also includes an elastic part and a touch switch that can control the startup of the TRR tester. The two ends of the elastic part are respectively fixed on the two parts that move relative to each other, for assisting in controlling the opening and closing of the touch switch.

2. A diode TRR parameter testing device according to claim 1, characterized in that: The wafer support body is provided with a fixed number of wafer basket slots along its length direction for fixing silicon wafers. The front and rear ends of the wafer basket slots are fixed to the inner side wall of the wafer support body, and the front and rear ends of the wafer basket slots have a fixed height difference along the vertical direction.

3. A diode TRR parameter testing device according to claim 2, characterized in that: The spotlight assembly is arranged at the edge of one side of the storage plate. The spotlight assembly includes a support and a lamp body. The top end of the support is bent toward the other side of the storage plate, and the lamp body is fixed on the bent part of the support.

4. A diode TRR parameter testing device according to claim 3, characterized in that: A copper plate is provided on the inner bottom surface of the insulation test bench body, on which a terminal and a positioning block are fixed. The terminal is connected to the copper plate, and the positioning block is arranged along a circular track with its top bent toward the center of the copper plate.

5. A diode TRR parameter testing device according to claim 4, characterized in that: A semicircular through hole is provided on one side edge of the storage plate close to the insulation test bench body. The semicircular through hole passes through the insulation test bench body, the copper plate and the storage plate from top to bottom. The copper plate is tilted downward by 10° in the direction away from the semicircular through hole.

6. A diode TRR parameter testing device according to claim 5, characterized in that: The test pen assembly also includes a shell, a metal refill, a test wire and a threading body. The shell is hollow and one end of the shell is set to be inwardly reduced in diameter. The metal refill is limited in the shell and can move relative to the shell. The touch switch is fixed to the inner bottom surface of the shell. The end of the metal refill facing the touch switch is provided with an insulating plastic cap for controlling the opening and closing of the touch switch. The elastic member is a spring. The two ends of the spring are respectively fixed to the shell and the metal refill, and are used to drive the metal refill to reset. The side wall of the bottom of the shell is provided with an opening. The threading body is fixed at the opening. There are multiple test wires, and the multiple test wires pass through the threading body and are electrically connected to the metal refill and the touch switch respectively.

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