Resin feeding device for chip substrate packaging

Abstract

The utility model belongs to the technical field of semiconductor packaging, and provides a resin supply device for packaging a chip substrate, which mainly comprises a cleaning assembly, a film pasting assembly, a resin dusting assembly and a transfer table which are arranged on a second mounting platform, the cleaning assembly is used for cleaning a resin tray, the film pasting assembly is used for pasting a film on the resin tray, and the transfer table is used for transferring the resin tray. The resin dusting assembly is used for laying resin, and the transfer table is used for transferring and waiting of the resin trays on which the resin is laid. The overturning box is rotationally arranged, the discharging opening of the overturning box is matched with the width of the chip substrate, the film pasting platform can move between the film pasting assembly and the resin powder scattering assembly, and the moving direction is consistent with the length direction of the chip substrate. Through movement of the film pasting platform and rotation of the overturning box, linear and uniform powder scattering is achieved, one-time powder scattering forming is achieved, the uniformity of the powder scattering thickness is guaranteed, and the powder scattering efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor chip substrate packaging, in particular to a resin feeding device used for chip substrate packaging. Background Art

[0002] Over time, semiconductor technology has continued to advance, gradually developing more complex semiconductor devices such as integrated circuits and large-scale integrated circuits. These technological developments have greatly promoted progress in fields such as computers, communications, and medicine, making our lives more convenient and efficient.

[0003] Existing traditional packaging systems heat and inject large particles into the mold cavity, resulting in residual resin and waste. Furthermore, the pressure and resin flow generated by injection can damage and shift chip leads and solder joints. Furthermore, existing powder spreading technology uses a staggered, reciprocating vibration method. This vibration-based spreading method results in uneven resin distribution, and the staggered, reciprocating spreading method reduces resin delivery efficiency, making the entire packaging process take longer. Utility Model Content

[0004] The utility model provides a fully automatic semiconductor packaging equipment, which solves the safety and precision problems caused by the need for manual loading assistance of traditional packaging equipment in the above technical background, as well as the problem of complex and low efficiency in the process of transferring chip substrates and resins to the press.

[0005] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0006] A resin supply device for chip substrate packaging, comprising:

[0007] Second installation platform;

[0008] A cleaning assembly is provided on the second mounting platform, and is used for cleaning the recycled resin tray;

[0009] A film laminating assembly is provided on the second mounting platform. The film laminating assembly is provided with a film laminating platform that can move back and forth linearly along the second mounting platform. The film laminating platform is used for vacuum laminating the cleaned resin tray.

[0010] A resin powder sprinkling assembly includes a powder sprinkling base and a flip box disposed on the powder sprinkling base, wherein the powder sprinkling base is disposed on the second mounting platform and can translate relative to the second mounting platform, and the flip box is rotatably disposed on the powder sprinkling base, and the powder sprinkling base can translate relative to the second mounting platform;

[0011] The unloading port of the flip box matches the width of the chip substrate, the moving direction of the film laminating platform is consistent with the length direction of the chip substrate, and the film laminating platform can be moved to the bottom of the flip box, and the film laminating platform is directly opposite the unloading port of the flip box;

[0012] The transfer table is arranged on the second installation platform in a liftable manner. The transfer table is used for transferring and waiting the resin tray after the resin is laid.

[0013] In some embodiments, the cleaning assembly includes a cleaning base, a cleaning support, and a cleaning airbag. The cleaning base is raised and lowered relative to the second mounting platform. The cleaning support is fixed under the cleaning base. The cleaning airbag is fixed between the cleaning support and the cleaning base. The cleaning airbag is foldable and compressible. A plurality of cleaning holes are arranged on the cleaning airbag, and the positions of the plurality of cleaning holes correspond to the edges of the inner frame of the resin tray.

[0014] In some embodiments, a cleaning cylinder is provided on the cleaning support, a cleaning base is provided at the free end of the cleaning cylinder, the cleaning base matches the size of the cleaning airbag, and the cleaning base is connected to the lower end of the cleaning airbag.

[0015] In some embodiments, the cleaning airbag is provided with a plurality of first recovery holes and a second recovery hole, wherein the plurality of first recovery holes are arranged close to one side of the resin tray, and the second recovery holes are arranged close to the cleaning support, and both the first recovery holes and the second recovery holes are connected to the cleaning airbag.

[0016] In some embodiments, the resin powder sprinkling assembly further includes a flip assembly, the flip assembly including a flip motor, a flip transmission member, and a flip shaft, the flip motor being arranged on the powder sprinkling base, the flip shaft being rotatably arranged on the powder sprinkling base, the flip box being fixedly arranged on the flip shaft, and the output end of the flip motor being transmission-connected to the flip shaft via the flip transmission member.

[0017] In some embodiments, a flip notch is provided on the powder sprinkling base, the length of the flip notch is greater than the rotation radius of the flip box, and the flip box is rotated at the flip notch.

[0018] In some embodiments, the resin powder spreading assembly further comprises a resin box, a resin transfer assembly, a resin metering unit, and a weighing device, wherein the resin metering unit is in communication with the resin box to control the release of the resin;

[0019] The resin transfer assembly includes a resin pipe, an auger rotatably arranged in the resin pipe, and a spiral motor arranged at one end of the resin pipe, the output end of the spiral motor is connected to the auger, the resin box is arranged on the powder sprinkling base and is connected to the resin pipe, the resin pipe is arranged on the weighing device, the weighing device is arranged on the powder sprinkling base, and a spray port is arranged at the other end of the resin pipe, and the spray port corresponds to the position of the flip box.

[0020] In some embodiments, a second pallet transport assembly is further included, comprising a conveying substrate and a pallet transport clamping mechanism, wherein the conveying substrate is horizontally movable and disposed on the second mounting platform, and the pallet transport clamping mechanism is liftably disposed below the conveying substrate;

[0021] The pallet transport clamping mechanism includes a second upper base, a second lower base, a second main clamping mechanism and a second auxiliary clamping mechanism, the second upper base is movably connected to the conveying base plate, the second upper base is connected to the second lower base, the second main clamping mechanism includes two second main clamping links arranged parallel to each other, the second main clamping links are movably arranged on the second lower base, and both ends of the second main clamping links are provided with second main clamping jaws that can be opened and closed;

[0022] The second secondary clamping mechanism includes two secondary movable seats arranged relative to the second lower base, and the secondary movable seats are provided with a first main clamping block that can be raised and lowered and a first secondary clamping block that is fixedly arranged;

[0023] The first main clamping block can be lifted and lowered relative to the first auxiliary clamping block, thereby realizing the opening and closing of the first main clamping block and the first auxiliary clamping block;

[0024] The two auxiliary movable seats can move away from or towards each other, thereby driving the first auxiliary clamping block to open and close.

[0025] In some embodiments, a first pallet handling assembly is further included, which includes a film substrate and a first film clamping mechanism. The film substrate is movably set on the second mounting platform, and the first film clamping mechanism is movably set on the film substrate and can be raised and lowered relative to the film substrate, wherein the first film clamping mechanism has the same structure as the second main clamping mechanism.

[0026] In some embodiments, it also includes two parallel first conveying brackets and two parallel second conveying brackets arranged on the second mounting platform, the two ends of the film substrate are movably set on the first conveying brackets, and the two ends of the conveying substrate are movably set on the second conveying brackets, wherein the first conveying bracket and the second conveying bracket are relatively parallel, and the film substrate and the conveying substrate are both set at a preset distance from the second mounting platform.

[0027] Compared with the prior art, the beneficial effects brought by the present invention are:

[0028] The utility model realizes the recycling of resin pallets by arranging a cleaning component, a film-sticking component, a resin powder-sprinkling component and a transfer table, and realizes the true automatic supply of resin by arranging a first pallet conveying component and a second pallet conveying component to convey the cleaned resin pallet and the pallet for laying resin. At the same time, by rotating the flip box, the discharge port of the flip box is consistent with the width of the chip substrate, combined with the horizontal movement of the film-sticking platform along the length direction of the chip substrate, the resin is formed once during the laying process and laid in a straight line, so that the resin is evenly laid and the resin laying efficiency is improved.

[0029] Additional aspects and advantages of the present application will be given in part in the following description, which will become apparent from the following description, or will be learned through practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 This is a three-dimensional schematic diagram of a resin feeding device for chip substrate packaging according to the present invention;

[0031] Figure 2 for Figure 1 A three-dimensional schematic diagram of the additional resin mounting mechanism;

[0032] Figure 3 It is a three-dimensional diagram of the first conveying assembly and the second conveying assembly of the present invention;

[0033] Figure 4 This is a first perspective view of the cleaning assembly of the present invention;

[0034] Figure 5 This is a second perspective view of the cleaning assembly of the present invention;

[0035] Figure 6 is a cross-sectional view of the cleaning component of the present invention;

[0036] Figure 7 This is a first perspective view of the film assembly of the present invention;

[0037] Figure 8 This is a second perspective view of the film assembly of the present invention;

[0038] Figure 9 A schematic diagram of the resin box and resin transfer mechanism of the present invention;

[0039] Figure 10 This is a schematic diagram of the three-dimensional structure of the resin powder sprinkling component of the present invention;

[0040] Figure 11 A schematic diagram of the three-dimensional structure of the flip box of the resin powder spreading assembly of the present invention;

[0041] Figure 12 It is a cross-sectional view of the flip box of the resin powder sprinkling assembly of the present invention;

[0042] Figure 13 A schematic diagram of the resin paving of the present invention;

[0043] Figure 14 This is a schematic diagram of the three-dimensional structure of the transfer station of the present utility model;

[0044] Figure 15 This is an exploded view of the pallet handling clamp mechanism of the second pallet handling assembly of the present invention;

[0045] Figure 16 It is a schematic diagram of a second embodiment of the pallet handling clamping mechanism of the second pallet handling assembly of the present invention;

[0046] Figure 17 This is an exploded view of the second main clamping mechanism of the pallet handling clamping mechanism of the present invention. DETAILED DESCRIPTION

[0047] The present application is further described in detail below with reference to the accompanying drawings. In the description of this embodiment, unless otherwise specified, the terms "left" and "right" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings and are intended only to facilitate the description of the present application and simplify the description. They do not indicate or imply that the present application must have a specific direction, be constructed, or operate in a specific direction. Therefore, they should not be construed as limiting the present application.

[0048] In one embodiment, Figure 1 As shown, a resin supply device for chip substrate packaging provided by the present invention mainly includes a second mounting platform 102, a cleaning component 601, a film attaching component 602, a resin powder spreading component 603, a transfer table 604, a first pallet conveying component 605 and a second pallet conveying component 606;

[0049] The cleaning assembly 601 is mainly used for cleaning the dirty resin tray 40344, and is arranged close to one side of the third guide rail 1025. Figure 2 As shown, a movable resin loading mechanism 800 is provided on the third guide rail 1025. The resin loading mechanism 800 is used to transport the resin tray 40344 filled with resin from the transfer table 604 to the next process, and after the resin is transported, the dirty resin tray 40344 is transported to the cleaning assembly 601 for cleaning so that the dirty resin tray 40344 can be reused.

[0050] The film laminating assembly 602 is located near the cleaning assembly 601 and is mainly used for vacuum laminating. It lays a film on the bottom of the resin tray 40344. After the film is laid, the resin tray 40344 with the film is transferred to the bottom of the resin powder spreading assembly 603 for powder spreading. The resin powder spreading assembly 603 is mainly used to spread resin powder so that the resin powder is evenly spread on the film of the resin tray 40344.

[0051] The transfer table 604 is mainly used for temporarily transferring and placing the resin tray 40344 covered with resin so that the tray transport mechanism 8031 ​​can grab it.

[0052] In this embodiment, the resin tray 40344 moves in a straight line between the cleaning component 601 and the film sticking component 602, and its movement trajectory is perpendicular to the third guide rail 1025. The resin tray 40344 moves in a straight line between the turntable 604 and the resin powder sprinkling component 603, and its movement trajectory is perpendicular to the third guide rail 1025. The movement trajectory of the resin tray 40344 between the film sticking component 602 and the resin powder sprinkling component 603 is straight and parallel to the third guide rail 1025. The resin powder sprinkling component 603 and the turntable 604 are arranged close to the side of the press unit 500. Among them, a first pallet conveying component 605 that is movable relative to the second installation platform is set between the cleaning component 601 and the film sticking component 602, and is used to convey the cleaned resin pallet to the film sticking platform. A second pallet conveying component 606 that can move relative to the second installation platform is set between the resin powder sprinkling component 603 and the transfer table 604, and is used to convey the resin pallet 40344 after the resin is laid to the transfer table 604, so that the resin loading mechanism 800 can grab the resin pallet 40344 filled with resin and enter the next process.

[0053] Specifically, if Figure 4-Figure 6As shown, the cleaning assembly 601 includes a cleaning base 6011 that can be raised and lowered relative to the second mounting platform 102, that is, a first lifting cylinder 60111 is set on the second mounting platform 102, and the free end of the first lifting cylinder 60111 is fixedly connected to the bottom of the cleaning base 6011. A plurality of first cleaning guide shafts 6015 are set between the cleaning base 6011 and the second mounting platform 102 to support the lifting of the cleaning base 6011. A cleaning mounting position for placing the resin tray 40344 is provided on the cleaning base 6011, and a plurality of cleaning fixing rods 6015 are provided below the cleaning base 6011. 22 is connected to a cleaning support 6011, wherein the cleaning support 6011 is provided with a cleaning cylinder 60121, and a cleaning base plate 60123 is provided at the free end of the cleaning cylinder 60121. A foldable cleaning airbag 6014 is provided on the cleaning base plate 60123. The cleaning base plate 60123 matches the size of the cleaning airbag 6014 to fully compress the cleaning airbag 6014. The cleaning airbag 6014 is provided with a plurality of cleaning holes, which are aligned with the inner frame edge of the resin tray. The free end of the cleaning cylinder 60121 is repeatedly raised and lowered to compress the cleaning airbag 6014, thereby cleaning the resin tray 40344.

[0054] Furthermore, the cleaning airbag 6014 is provided with a first recovery hole 60141 and a second recovery hole 60142, which are connected to the cleaning airbag. The first recovery hole 60141 is located on the upper side of the cleaning airbag 6014 near the resin tray 40344, and the second recovery hole 60142 is located on the side of the cleaning airbag 6014 near the cleaning support 6012, for recovering residual particulate matter. In this embodiment, there are two cleaning installation positions, so that two resin trays 40344 can be cleaned simultaneously. In this embodiment, a negative pressure mechanism, such as a vacuum pump or a similar structure, can be provided on the second recovery hole to provide negative pressure to absorb the residue from the resin tray.

[0055] like Figure 7-Figure 8As shown, the film assembly 602 includes a first reel 6028, a support roller 60281, two parallel film holders 6025, and a film beam 6025. The film holders 6025 are set at a certain distance from the second mounting platform 102. The film beam 6026 is slidably set on the two parallel film holders 6025. A film pressing mechanism is set at one end of the film holder 6025 close to the first reel 6028. The film pressing mechanism includes a film pressing base 6024, a lower pressing module 60244 fixedly set on the film pressing base 6024, and an upper film pressing block 60241 that can be raised and lowered relative to the film pressing base 6024. The film can be movably passed between the upper film pressing block 60241 and the lower pressing module 60244. When the upper pressing module 60241 and the lower pressing module 60244 are closed, the film is fixed. The lifting and lowering of the upper pressure module 60241 is controlled by the film pressing cylinder 60242. The upper pressure module 60241 is arranged at the free end of the film pressing cylinder 60242. The film pressing cylinder 60242 is fixedly arranged on the film pressing base 6024. Two parallel film pressing guide shafts 60243 are also provided on the upper pressure module 60241 to further provide stable support for the lifting and lowering movement of the upper pressure module 60241. One end of the film pressing guide shaft 60243 is fixedly connected to the upper pressure module 60241, and the other end thereof is movably passed through the film pressing base 6024. The installation direction of the film pressing guide shaft 60243 is consistent with the extension and retraction direction of the free end of the film pressing cylinder 60241.

[0056] Furthermore, if Figure 8 As shown, the first reel 6028 is slidably arranged so that the tension of the film can be adjusted. The adjustment of the tension of the film can be achieved by setting the support roller 60281 into a movable structure. In this embodiment, the rotation of the first reel 6028 is driven by a motor, thereby reducing the tension during the film transportation process to prevent the film from being broken or torn.

[0057] Furthermore, a film cutting knife 60215 is provided on the film sticking assembly 602. The film cutting knife 60215 can move in a direction perpendicular to the film conveying direction to cut the film. Specifically, a film cutting screw 60211 and a film cutting guide rail 60213 axially parallel to each other are provided on the film pressing base 6024, and the film cutting screw 60211 and the film cutting guide rail 60213 are horizontally arranged relative to the second mounting platform 102, a film cutting nut 60212 is provided on the film cutting screw 60211, and a film cutting slider 60214 is provided on the film cutting guide rail 60213, wherein the film cutting slider 60214 and the film cutting nut 60212 are connected by a fifth connecting block, and the film cutting knife is provided on the fifth connecting block 602151, and the film cutting motor 6021 is provided on the second mounting platform 102, and the output end of the film cutting motor 6021 is connected to one end of the film cutting screw 60211 for power. In this embodiment, power transmission is achieved by means of a synchronous wheel and synchronous belt. Optionally, it can also be a gear meshing method, or the output shaft of the film cutting motor 6021 can be directly connected to the film cutting screw 60211 for power through a coupling.

[0058] Furthermore, a preset film cutting distance is set between the film cutting knife 60215 and the upper pressure module 60241 in the direction of film movement, so that a preset length can be left after the film is cut, so that the film clamping block of the film beam 6026 can clamp the film for the next round of film laying.

[0059] Further, refer again to Figure 7, parallel film sticking guide rails 60251 are respectively set on two parallel film sticking brackets 6025, and the film sticking guide rails 60251 are set horizontally. At least one film sticking slider 602511 is respectively set on the two film sticking guide rails 60251, and the film sticking crossbeam 6026 is connected to the film sticking slider 602511, and the film sticking crossbeam 6026 is perpendicular to the two film sticking brackets 6025. A film sticking active wheel 6022 and a film sticking driven wheel 6023 are set at both ends of the film sticking bracket 6025, and are powered by a film sticking synchronous belt 60221. Part of the film sticking crossbeam 6025 is fixed to the film sticking synchronous belt 60221; further, in order to avoid a large span of the film sticking crossbeam 6026, uneven power, and a stuck response during movement, the film sticking active wheel 6022, the film sticking driven wheel 6023 and the film sticking synchronous belt 60221 are fixed to the film sticking synchronous belt 60221. Belt 60221 is simultaneously arranged on two film-sticking brackets 6025, and a film-sticking shaft 6027 is arranged between the two film-sticking driving wheels 6022 for fixed connection. The film-sticking shaft 6027 is rotatably arranged on the film-sticking bracket 6025, and the two ends of the film-sticking beam 6026 are respectively connected to the two film-sticking synchronous belts 60221. In this embodiment, in order to facilitate the installation of the film-sticking motor 60272 and occupy less installation space, the film-sticking motor 60272 is arranged on the second installation platform 102, and a first driven transmission pulley 60271 is arranged on the film-sticking shaft 6027, and a first driving transmission pulley 60273 is arranged on the output shaft of the film-sticking motor 60272. The first driven synchronous pulley 60271 and the first driving transmission pulley 60273 are connected in power through the first transmission synchronous belt 60274. Optionally, in this embodiment, the film-sticking motor 60272 can also be directly connected to the film-sticking shaft through a coupling for power transmission, or the power transmission between the film-sticking motor 60272 and the film-sticking shaft 6027 can be performed through gear meshing.

[0060] Furthermore, in order to ensure the automation of film laminating, a film clamping group is set on the film laminating beam 6026, and the film clamping group includes a film clamping cylinder 60261, a main film clamping module 60262 and an auxiliary film clamping block 60263. The fixed end of the film clamping cylinder 60261 is set on the film laminating beam 6026, and the free end of the film clamping cylinder 60261 is connected to the main film clamping block 60262 to drive the main film clamping block 60262 to move up and down, thereby realizing the clamping and movement of the film with a preset length left at the film pressing mechanism. In this embodiment, the up and down lifting direction is the perpendicular direction to the second mounting platform 102; the width of the main film block 60262 and the auxiliary film block 60263 is greater than the width of the broadcast film, so that the film can be completely clamped between the main film block 60262 and the auxiliary film block 60263. In this embodiment, the clamping part of the main film block 60262 is an L-shaped structure, so that the film with a preset length left by the film cutting knife 60215 can be clamped.

[0061] In one embodiment, Figure 3 As shown, two first conveying brackets 6058 are provided on the second mounting platform 102, and a first conveying assembly is provided on the first conveying brackets 6058. The two first conveying brackets 6058 are provided at a certain distance from the second mounting platform 102. The first conveying assembly includes a first pallet conveying guide rail 6056 provided on one of the first conveying brackets 6058, a first pallet conveying slider 6057 provided on the first pallet conveying guide rail 6056, and a first pallet conveying motor 6054, a first pallet conveying screw and a first pallet conveying nut provided on the other first conveying bracket 6058. A first pallet conveying mounting block 6055 is provided on the first pallet conveying nut. The axis of the first pallet conveying screw is parallel to the axis of the first pallet conveying guide rail 6056. The first pallet conveying motor 6054 is fixedly provided on the first conveying bracket 6058. The first pallet conveying screw is rotatably provided on the first conveying bracket 6058 through a bearing. The first pallet conveying nut is sleeved on the first pallet conveying screw through threaded engagement.

[0062] like Figure 7 As shown, the film-sticking assembly 602 also includes a film-sticking platform 6029 movably arranged on the second mounting platform 102. The film-sticking platform 6029 moves back and forth between the film-sticking assembly 602 and the resin powder-sprinkling assembly 603, and moves the resin tray 40344 with the film stuck on it to the bottom of the resin powder-sprinkling assembly 603 for uniform powder sprinkling.

[0063] Specifically, a rotating first moving screw and a fixed first moving guide rail are provided on the second mounting platform 102, and a first moving guide rail is provided below the first moving slider, and the line of the first moving guide rail is parallel to the axis of the first moving screw. In this embodiment, the first moving screw is provided directly above the first moving guide rail, and a first moving nut is provided on the first moving screw, and the first moving nut is fixedly connected to the first moving slider. A first moving motor 60291 is provided at one end of the first moving screw, and the first moving motor 60291 is provided on the second mounting platform 102. The output end of the first moving motor 60291 is power-connected to one end of the first moving screw, and the first moving nut is moved back and forth along the first moving screw through the forward and reverse rotation of the first moving motor 60291.

[0064] Furthermore, if Figure 7 As shown, a first mounting block 60292 is provided on the first movable nut, a platform lifting cylinder 60293 is provided on the first mounting block 60292, a film laminating platform 6029 is provided at the free end of the platform lifting cylinder 60293, and a mounting position is provided on the film laminating platform 6029 for placing the resin tray 40344;

[0065] Furthermore, a plurality of first adsorption holes are provided on the film-sticking platform 6029, and the plurality of first adsorption holes are used for vacuum extraction. When the film is on the film-sticking platform, it can be fixed by vacuum adsorption through the first adsorption holes.

[0066] In this embodiment, the transmission combination of the first movable screw and the first movable nut can be replaced by a synchronous wheel and synchronous belt combination. When the stroke is short, it can also be replaced by the extension and retraction of the free end of the cylinder. It can be known that the reciprocating structure of the first mounting block 60292 in this embodiment is not limited by the present utility model. The purpose is to drive the film platform 6029 on the first mounting block 60292 to move back and forth between the film assembly 602 and the powder spreading assembly 603.

[0067] In one embodiment, Figure 3 As shown, two second conveying brackets 6068 are set on the second mounting platform 102, and a certain distance is set between the second conveying bracket 6068 and the second mounting platform 102. In this embodiment, the second conveying bracket 6068 and the first conveying bracket 6058 are of the same height, and one of the second conveying brackets 6068 and one of the first conveying brackets 6058 are shared as a whole. A second conveying assembly is set on the second conveying bracket 6068. The second conveying assembly has the same structure and principle as the aforementioned first conveying assembly, and will not be elaborated on here.

[0068] like Figure 10 As shown, the resin powder sprinkling assembly 603 includes a powder sprinkling base 60310, a flip assembly and a flip box 60325. The powder sprinkling base 60310 is connected to the second conveying assembly and can move back and forth linearly on the second conveying bracket 6068. A through flip slot 603101 is provided on the powder sprinkling base 60310, and the flip box 60325 is rotatably provided on the flip slot 603101. The flip box 60325 is rotatably provided on the powder sprinkling base 60310 through the flip assembly.

[0069] Specifically, the flip assembly includes a flip motor 60311, a flip transmission member and a flip shaft 60313. The flip motor 60311 is fixedly arranged on the powder sprinkling base 60310, and the output end of the flip motor 60311 is connected to the flip shaft 60313 through the flip transmission member.

[0070] Specifically, the flip transmission element includes a flip driving pulley, a flip driven pulley, and a flip timing belt. The flip driving pulley is mounted on the output shaft of the flip motor 60311. The flip shaft 60313 is rotatably mounted on the powder spreading base 60310 via a bearing and is disposed along the edge of the flip notch 603101. The flip driven pulley is fixedly mounted at one end of the flip shaft 60313 and is located on the same side as the flip driving pulley. The flip timing belt 60312 is wound around the flip driving pulley and the flip driven pulley to transmit power. In this embodiment, the size of the flip notch 603101 is larger than that of the flip box 60325 to allow the flip box 60325 to flip at a certain angle. In this embodiment, the structure of the flip transmission element can be replaced by a meshing driving gear and a driven gear, or the flip motor 60311 can be directly connected to the flip shaft 60313 for power via a coupling.

[0071] Furthermore, if Figure 11-12 As shown, the flip box 60325 includes a horizontal storage area 603254 and a discharge port 603253. The discharge port 603253 of the flip box 60325 matches the width of the chip substrate. The discharge port 603253 is connected to the horizontal storage area 603254. A plurality of parallel spacers 603251 are arranged in the flip box 60325. The spacers 603251 are evenly distributed along the length direction of the flip box 60325 to separate the horizontal storage area 603254 into a plurality of storage troughs 603252, so that the resin entering the flip box 60325 is evenly distributed to avoid resin clumping and make the resin laying more uniform.

[0072] In one embodiment, Figure 9 As shown, the resin supply mechanism 600 further includes a resin box 60321, a resin funnel 60322, a resin transmission assembly, a spray port 60324, and a weighing device 60326. The weighing device 60326 cooperates with the resin box 60321 for accurate weighing and releasing of the resin. The lower discharge port of the resin box 60321 faces the resin funnel 60322. The resin transmission assembly includes a resin pipe 60323, a screw 60328, and a screw motor 60327. The screw motor 60327 is arranged at At one end of the resin pipe 60323, an auger 60328 is rotatably disposed within the resin pipe 60323, one end of which is connected to the output of the auger motor 60327. A resin hopper 60322 communicates with the resin pipe 60323. A spray port 60324 is disposed at the end of the resin pipe 60323 away from the auger motor 60327, its position corresponding to that of the flip box 60325. The outer side of the resin pipe 60323 is connected to a scale 60326 for weighing the resin. In this embodiment, the auger 60328 and scale 60326 are conventional devices and will not be elaborated upon here.

[0073] Furthermore, to ensure accurate resin release, the resin dusting assembly 603 also includes a resin metering unit. This unit is primarily used to receive data on the number and volume of chips on the chip substrate, measured during chip substrate loading, and accurately release the required amount of resin for chip substrate packaging. This avoids resin waste or insufficient resin, saving material. In this embodiment, the resin metering unit cooperates with the resin box to achieve precise resin supply by weight.

[0074] In one embodiment, the present invention further provides a resin laying method, the specific process of which is as follows: after the film is laid and the film-laminating platform carrying the resin tray 43044 is moved to the bottom of the flip box 60325, after the resin metering unit receives the data of the volume and number of the chip substrates measured by the measuring instrument 3064, the resin box 60321 and the weighing device 60326 cooperate to release a certain weight of resin from the resin box 60321, which falls into the resin pipe 60323 through the resin funnel 60322. The resin is then moved to the spray port 60324 by the screw 60328, and the spray port transfers the resin to the flip box 60325.

[0075] At the initial position, the discharge port 603253 of the flip box 60325 is close to an inner side of the resin tray 40344, and the first moving motor 60291 drives the film-sticking platform 6029 to move slowly and uniformly. At the same time, the flip motor 60311 drives the flip box 60325 to rotate, so that the flip box 60325 is slowly tilted. The resin is evenly sprinkled from the discharge port 603253 of the flip box 60325 into the resin tray 40344 with the film and laid in a straight line. On the one hand, the resin is evenly laid. On the other hand, combined with the flipping of the flip box 60325 and the uniform movement of the film-sticking platform 6029, the resin is directly laid according to the width of the chip substrate. Figure 13 As shown, compared with the existing resin laying method, while ensuring uniform resin laying, there is no need to swing back and forth, which improves the resin laying efficiency.

[0076] In one embodiment, the second pallet handling assembly includes a conveying base plate 6063 and a pallet handling clamp mechanism. The conveying base plate 6063 is horizontally movable and disposed on the second mounting platform. The pallet handling clamp mechanism is escalably disposed below the conveying base plate 6063. A pallet handling clamp mechanism 6061 is escalably disposed on the conveying base plate 6063. Specifically, a fifth lifting cylinder 6062 is disposed on the conveying base plate 6063, and the free end of the fifth lifting cylinder 6062 is fixedly connected to the pallet handling clamp mechanism 6061.

[0077] like Figure 15As shown, the pallet handling clamp mechanism 4034 includes a second upper base 40341 ​​and a second lower base 40342 fixedly connected to each other from top to bottom. A preset distance is set between the second upper base 40341 ​​and the second lower base 40342. The second upper base 40341 ​​is movably connected to the conveying base plate 6063. The pallet handling clamp mechanism 4034 also includes a second main clamp mechanism and a second auxiliary clamp mechanism. The specific structure is as follows;

[0078] like Figure 17 As shown, the second main clamping mechanism includes four second main clamping jaws 403424, two second main clamping connecting rods 403423 arranged in parallel with each other, a main clamping cylinder 403433 with two opening and closing free ends, and the two free ends can move back or towards each other at the same time to realize the opening and closing of the second main clamping jaws 303424; two main clamping push rods 403422, wherein the four second main clamping jaws 403424 are divided into two groups, each group is fixedly arranged at the two ends of the second main clamping connecting rod 403423, and the second main clamping jaws 403424 are connected to the resin The main clamping cylinder 403433 is fixed on the second lower base 40342, and the two main clamping push rods 403422 are respectively fixed on the two opening and closing free ends of the main clamping cylinder 403433. The two free ends of the main clamping cylinder 403433 move toward or away from each other, driving the four second main clamping jaws 403424 to open and close, thereby grabbing or putting down the resin tray 40344. In this embodiment, the second main clamping jaw 403424 is an L-shaped hook.

[0079] Furthermore, four second main guide rails 403426 are arranged on the second lower base 40342, and four corresponding second main sliders 403425 are arranged on the four second main guide rails 403426. The axial direction of the second main guide rails 403426 is consistent with the opening and closing direction of the free end of the main clamping cylinder 403433. The four second main sliders 403425 are respectively fixed at the two ends of the corresponding two main clamping connecting rods 403423, thereby supporting the second main clamping connecting rods 403423.

[0080] Alternatively, as Figure 16As shown, the second main clamping jaw 403424 can also be set as a rotating structure, and two parallel second main clamping connecting rods 403434 are rotatably set on the second lower base 40342. Specifically, four rotating brackets 403435 are set on the second lower base 40342, and the second main clamping connecting rod 403434 is rotatably set on the four rotating brackets 403425 through bearings. A second main clamping rocker 403436 is set between the two free ends of the main clamping cylinder 403433 and the corresponding two second main clamping connecting rods 403434, and one end of the second main clamping rocker 403436 is fixedly connected to the second main clamping connecting rod 40344. The other end of the clamping rocker 403436 is movably connected to a free end of the main clamping cylinder 403433. For example, a first connecting rod having a first connecting notch in an elongated structure is provided. One end of the first connecting rod is movably connected to a free end of the main clamping cylinder 403433. The end of the first connecting rod with the first connecting notch is positioned away from the second lower base 40342, so that the first connecting notch compensates for vertical movement of the first connecting rod to avoid motion interference. The first connecting notch can be a rectangular or U-shaped structure, so that the openable free end of the main clamping cylinder 403433 drives the second main clamping jaw 403424 to rotate. For example, when the two free ends of the main clamping cylinder 403433 are open and separated, the second main clamping jaw 403424 is not engaged with the resin tray 40344. When the two free ends of the main clamping cylinder 403433 are closed and brought closer together, the second main clamping jaw 403424 engages and abuts the clamping groove 403441 of the resin tray.

[0081] like Figure 15As shown, the second secondary clamping mechanism includes a secondary clamping cylinder 403421, which is provided with two free ends that can move toward or away from each other, a secondary moving seat 403428 provided at the free end of the secondary clamping cylinder 403421, and a first secondary clamping block 403431 provided on the secondary moving seat 403428. The first secondary clamping block 403431 can clamp and cover one side of the resin tray 40344, and a first main clamping block 403430 that can be raised and lowered is provided on the secondary moving seat 403428. Specifically, A second lifting cylinder 403429 is provided on the movable base 403428. The free end of the second lifting cylinder 403429 is connected to the first main clamping block 403430. By raising and lowering the first main clamping block 403430, the first auxiliary clamping block 403431 is closed and opened, thereby clamping and securing the film. The auxiliary clamping cylinder 403421 is then used to move the auxiliary movable base 403428 closer together, thereby securing the edge of the film loaded with resin, thereby securing the film relative to the resin tray 40344. In this embodiment, the auxiliary movable base 403428, the first auxiliary clamping block 40341, the first main clamping block 40340, and the second lifting cylinder 403429 are each provided in two groups, symmetrically arranged about the second upper base 40341, thereby clamping and securing the film at the edge of the resin tray 40344, ensuring that the resin tray 40344 and the film move synchronously.

[0082] Furthermore, a second secondary guide rail 403411 is provided on the second upper base 40341, and a second secondary slider 403432 is provided on the second secondary guide rail 403411. The second secondary slider 403432 is connected to the secondary movable seat 403428, thereby providing support for the secondary movable seat 403428. The axial direction of the second secondary guide rail 403411 is consistent with the opening and closing movement direction of the free end of the secondary clamp cylinder 403421.

[0083] In this embodiment, Figure 15 As shown, the first auxiliary clamping block 403431 and the first main clamping block 403430 are located on two opposite sides of the resin tray 40344 , and the second main clamping jaw 403424 is located on the other two opposite sides of the resin tray 40344 .

[0084] In one embodiment, the first pallet transport assembly 605 includes a film substrate 6053 and a first film clamping mechanism 6051. The film substrate 6053 can be movably set on the second mounting platform 102. The first film clamping mechanism 6051 is movably set on the film substrate 6053 and can be raised and lowered relative to the film substrate 6053. Specifically, a fourth lifting cylinder 6052 is set on the film substrate 6053. The first film clamping mechanism 6051 is connected to the free end of the fourth lifting cylinder 6052, driving the first film clamping mechanism 6051 to move up and down relative to the second mounting platform 102. Among them, it should be pointed out in particular that since the first film clamping mechanism 6051 is used to transport the cleaned resin tray 40344 to the film laminating platform 6029, the first film clamping mechanism 6051 does not need to consider the fixation of the film. Therefore, the structure and principle of the first film clamping mechanism 6051 and the second main clamping mechanism of the aforementioned pallet transporting clamping mechanism 6061 are exactly the same, and no further details will be given here.

[0085] In one embodiment, Figure 14 As shown, the transfer platform 604 is a liftable structure, located below the pallet handling gripper mechanism 6061. The transfer platform 604 is provided with a mounting area primarily for storing resin trays 40344 containing film and resin, serving as a waiting area for the resin trays 40344. Specifically, a sixth lift cylinder 6041 is mounted on the second mounting platform 102. One end of the sixth lift cylinder 6041 is fixed to the second mounting platform 102, and the free end of the sixth lift cylinder 6041 is connected to the transfer platform 6042.

[0086] Furthermore, to ensure a stable lifting structure for the transfer platform 604, multiple sixth guide shafts 6043 are disposed between the transfer platform 6042 and the second mounting platform 102, parallel to the free ends of the sixth lifting cylinders 6041. One end of each sixth guide shaft 6043 is fixedly connected to the transfer platform bottom 6042, while the other end is movably threaded through the second mounting platform 102 via a guide sleeve. In this embodiment, there are four sixth guide shafts, but alternatively, there may be three, two, or other sixth guide shafts. It should be understood that the number of sixth guide shafts 6043 is not limited by the present invention.

[0087] The above is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principles of the present invention. Such improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A resin supply device for chip substrate packaging, characterized in that: include: Second installation platform; A cleaning assembly is provided on the second mounting platform, and is used for cleaning the recycled resin tray; A film laminating assembly is provided on the second mounting platform. The film laminating assembly is provided with a film laminating platform that can move back and forth linearly along the second mounting platform. The film laminating platform is used for vacuum laminating the cleaned resin tray. A resin powder sprinkling assembly includes a powder sprinkling base and a flip box disposed on the powder sprinkling base, wherein the powder sprinkling base is disposed on the second mounting platform and can translate relative to the second mounting platform, and the flip box is rotatably disposed on the powder sprinkling base, and the powder sprinkling base can translate relative to the second mounting platform; The unloading port of the flip box matches the width of the chip substrate, the moving direction of the film laminating platform is consistent with the length direction of the chip substrate, and the film laminating platform can be moved to the bottom of the flip box, and the film laminating platform is directly opposite the unloading port of the flip box; The transfer table is arranged on the second installation platform in a liftable manner. The transfer table is used for transferring and waiting the resin tray after the resin is laid.

2. The resin supply device for chip substrate packaging according to claim 1, characterized in that: The cleaning assembly includes a cleaning base, a cleaning support and a cleaning airbag. The cleaning base is raised and lowered relative to the second mounting platform. The cleaning support is fixed under the cleaning base. The cleaning airbag is fixed between the cleaning support and the cleaning base. The cleaning airbag is foldable and compressible. Multiple cleaning holes are set on the cleaning airbag, and the positions of the multiple cleaning holes correspond to the edges of the inner frame of the resin tray.

3. The resin supply device for chip substrate packaging according to claim 2, characterized in that: The cleaning support is provided with a cleaning cylinder, the free end of the cleaning cylinder is provided with a cleaning base plate, the size of the cleaning base plate matches the cleaning air bag, and the cleaning base plate is connected to the lower end of the cleaning air bag.

4. The resin supply device for chip substrate packaging according to claim 2, characterized in that: The cleaning airbag is provided with a plurality of first recovery holes and a second recovery hole. The plurality of first recovery holes are arranged close to one side of the resin tray, and the second recovery holes are arranged close to the cleaning support. Both the first recovery holes and the second recovery holes are connected to the cleaning airbag.

5. The resin supply device for chip substrate packaging according to claim 1, characterized in that: The resin powder sprinkling assembly also includes a flip assembly, which includes a flip motor, a flip transmission member and a flip shaft. The flip motor is arranged on the powder sprinkling base, and the flip shaft is rotatably arranged on the powder sprinkling base. The flip box is fixedly arranged on the flip shaft, and the output end of the flip motor is connected to the flip shaft through the flip transmission member.

6. The resin supply device for chip substrate packaging according to claim 5, characterized in that: The powder sprinkling base is provided with a flip notch, the length of the flip notch is greater than the rotation radius of the flip box, and the flip box is rotatably arranged at the flip notch.

7. The resin supply device for chip substrate packaging according to claim 5, characterized in that: The resin powder spreading assembly further includes a resin box, a resin transmission assembly, a resin metering unit, and a weighing device. The resin metering unit is in communication with the resin box to control the release of the resin. The resin transfer assembly includes a resin pipe, an auger rotatably arranged in the resin pipe, and a spiral motor arranged at one end of the resin pipe, the output end of the spiral motor is connected to the auger, the resin box is arranged on the powder sprinkling base and is connected to the resin pipe, the resin pipe is arranged on the weighing device, the weighing device is arranged on the powder sprinkling base, and a spray port is arranged at the other end of the resin pipe, and the spray port corresponds to the position of the flip box.

8. The resin supply device for chip substrate packaging according to claim 1, characterized in that: The second pallet transport assembly includes a conveying base plate and a pallet transport clamping mechanism, wherein the conveying base plate can be horizontally moved and arranged on the second mounting platform, and the pallet transport clamping mechanism can be raised and lowered and arranged below the conveying base plate; The pallet transport clamping mechanism includes a second upper base, a second lower base, a second main clamping mechanism and a second auxiliary clamping mechanism, the second upper base is movably connected to the conveying base plate, the second upper base is connected to the second lower base, the second main clamping mechanism includes two second main clamping links arranged parallel to each other, the second main clamping links are movably arranged on the second lower base, and both ends of the second main clamping links are provided with second main clamping jaws that can be opened and closed; The second secondary clamping mechanism includes two secondary movable seats arranged relative to the second lower base, and the secondary movable seats are provided with a first main clamping block that can be raised and lowered and a first secondary clamping block that is fixedly arranged; The first main clamping block can be lifted and lowered relative to the first auxiliary clamping block, thereby realizing the opening and closing of the first main clamping block and the first auxiliary clamping block; The two auxiliary movable seats can move away from or towards each other, thereby driving the first auxiliary clamping block to open and close.

9. The resin supply device for chip substrate packaging according to claim 8, characterized in that: It also includes a first pallet transport ship, which includes a film substrate and a first film clamping mechanism. The film substrate can be movably set on the second mounting platform. The first film clamping mechanism is movably set on the film substrate and can be raised and lowered relative to the film substrate. The first film clamping mechanism has the same structure as the second main clamping mechanism.

10. The resin supply device for chip substrate packaging according to claim 9, characterized in that: It also includes two parallel first conveying brackets and two parallel second conveying brackets arranged on the second mounting platform, the two ends of the film-laminating substrate are movably arranged on the first conveying brackets, and the two ends of the conveying substrate are movably arranged on the second conveying brackets, wherein the first conveying bracket and the second conveying bracket are relatively parallel, and the film-laminating substrate and the conveying substrate are both set at a preset distance from the second mounting platform.

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