Device for desoldering gallium-based liquid metal chip

Abstract

The utility model relates to the technical field of electronic product assembly, in particular to a device for a gallium-based liquid metal desoldering chip. The device for desoldering the gallium-based liquid metal chip comprises a storage chamber and a reaction chamber which are communicated from top to bottom, a filter screen is arranged at the upper end of the reaction chamber; a control valve for controlling opening and closing of the storage chamber is arranged at the lower end of the storage chamber; and the control valve is positioned above the filter screen. The device has the advantages that the flowing gallium-based liquid metal is completely limited in the area where the chip brazing filler metal is located, the risk that the gallium-based liquid metal overflows is avoided, the solid solution reaction of the gallium-based liquid metal and silver can be effectively accelerated through the provided window in cooperation with measures such as ultrasound, the chip desoldering process is greatly accelerated, and the chip desoldering efficiency is improved. And the chip is not damaged.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic product assembly, in particular to a device for desoldering gallium-based liquid metal chips. Background Art

[0002] With the rapid development of the electronics industry, electronic devices are increasingly used in daily life and industrial production. Chips are core components in these electronic devices, and the choice of soldering materials is crucial to their performance and stability. In the context of "lead-free" technology, silver-based solders are widely used due to their superior performance. However, with the miniaturization and high performance of electronic devices, the disassembly and cleaning of silver-based solders has become a technical challenge. Existing disassembly methods often fail to meet the requirements of efficiency, environmental protection, and cost-effectiveness, and there is also the risk of damaging the chip and its pads.

[0003] Prior art CN202210897898.1 discloses a chip disassembly device, which relates to the field of chip recycling and includes a fixture mechanism and a disassembly mechanism. The fixture mechanism is used to fix the carrier plate. The disassembly mechanism includes a base, a movable part movably connected to the base, a pusher head rotatably connected to the movable part, and a drive unit for driving the movable part. The pusher head has a pushing state and a release state. In the release state, the carrier plate can be loaded and unloaded from the fixture mechanism. In the pushing state, the pusher head faces the chip on the fixed seat, and the drive unit drives the pusher head to move in the direction of the fixture mechanism. The disassembly device is designed with a reversible pusher head, which can quickly disassemble the chip. First, the pusher head is rotated to the release state to fix the carrier plate, then the pusher head is rotated to the pushing state adjacent to the chip side to disassemble the chip, and then the pusher head is rotated to the release state to remove the substrate, completing the disassembly of the chip. This solves the problem of low efficiency and high cost of disassembling laser chips in COC (chip on ceramic) optical modules. However, the invention has a complex structure, high equipment cost, and cannot disassemble non-COC packaged chips.

[0004] Prior art CN201110296931.7 relates to the field of chip technology and discloses a chip removal tool. The chip removal tool mainly includes a removal head, a heating block, a heat conducting rod, a heat source device, and a power cord. The tool is characterized in that the removal head and the heating block are connected by a dovetail groove wedge. This structure makes the heat transferred to the removal head more concentrated. The end face of the removal head is provided with a soldering groove, and the edge of the soldering groove is provided with a wedge-shaped blade. The heat conducting rod is used to connect the heat source device and the heating block. The present invention discloses a chip removal tool. The packaging tool has a reasonable structural design. The special structural design of the removal head end face makes the removal head heat up faster and the heat more concentrated. It can perform solder melting operations on multiple chip pins, effectively improving the efficiency and quality of chip removal. At the same time, the removal head is replaceable and suitable for removing different types of chips. However, this invention requires an external energy source to generate high temperature, which consumes energy and has the risk of damaging the PCB and chip body during the removal process, which is not conducive to chip and PCB recovery. Utility Model Content

[0005] The utility model aims to provide a device for desoldering gallium-based liquid metal chips, so as to solve the problem that the desoldering equipment is too complicated and difficult to operate.

[0006] To achieve the above purpose, the technical solution of the utility model is as follows:

[0007] A device for desoldering gallium-based liquid metal chips comprises a storage chamber and a reaction chamber connected from top to bottom; the reaction chamber is sealed at the lower end and provided with a filter at the upper end; a control valve for controlling the opening and closing of the storage chamber is provided at the lower end of the storage chamber; the control valve is located above the filter.

[0008] When the gallium-based liquid metal is stored in the storage chamber, a control valve is inserted to prevent leakage and maintain standby mode. When chip desoldering is required, the control valve is removed, allowing the gallium-based liquid metal to fall by gravity, desoldering the chip and entering operational mode. A filter is installed at the top of the reaction chamber. Once chip desoldering is complete, the storage chamber is inverted to allow the gallium-based liquid metal to flow back into the chamber. Any residual solder residue is filtered through the filter. Once it has completely returned to the chamber, the control valve is inserted to prevent leakage.

[0009] In one preferred embodiment, the control valve includes a handle and a connected blocking plate; and an opening having the same shape as the blocking plate is provided on the side wall of the storage chamber.

[0010] In one preferred embodiment, the opening is U-shaped; the control valve is a matching lock-shaped one.

[0011] In one preferred embodiment, when the storage chamber is closed, the outer wall of the blocking plate is connected to the inner wall of the storage chamber.

[0012] In one preferred embodiment, the handle and the blocking plate are detachably connected by bolts.

[0013] In one preferred embodiment, the storage chamber is in the shape of a hollow cylinder; the top is provided with rounded corners for easy gripping.

[0014] In one preferred embodiment, the side wall of the reaction chamber is provided with an opening and a window adapted therewith.

[0015] A window is provided on the side wall of the reaction chamber, which can be used to apply ultrasonic vibration to the gallium-based liquid metal to accelerate its reaction rate, and can also be used as an observation window.

[0016] In one preferred embodiment, the side wall and the bottom of the reaction chamber are connected by a leak-proof rubber ring.

[0017] In one of the preferred embodiments, the leak-proof rubber ring is in a trident shape, with the two lower forks used to form negative pressure adsorption side walls, and the upper ridge-shaped fork used to nest in the bottom of the reaction chamber to firmly constrain the entire device.

[0018] In one preferred embodiment, the reaction chamber is semi-conical in shape, and the storage chamber is nested on the top of the reaction chamber.

[0019] Different reaction chamber sizes can be used to meet the desoldering requirements of different chip models. After selecting the appropriate reaction chamber size, the chip to be desoldered is placed in the center of the circular area at the bottom of the reaction chamber. The leak-proof rubber rings are tightened to secure the side walls and bottom of the reaction chamber, expelling air to create a negative pressure and prevent the gallium-based liquid metal from escaping the reaction chamber. The chip desoldering operation can then begin.

[0020] In one preferred embodiment, the material of the storage chamber, reaction chamber, control valve and filter is a substance that does not react with the gallium-based liquid metal, preferably a high molecular polymer; more preferably polyethylene (PE), polypropylene (PP) or polyvinyl alcohol (PE).

[0021] In one preferred embodiment, the composition of the gallium-based liquid metal includes, by weight: 0-50 parts of indium, 0-50 parts of tin, 0-50 parts of zinc, 0-50 parts of copper, 0-50 parts of silver, 0-50 parts of aluminum, 0-50 parts of bismuth, 0-50 parts of cobalt, 0-50 parts of titanium, 0-50 parts of iron; and 51-95 parts of gallium.

[0022] In one preferred embodiment, the melting point of the gallium-based liquid metal is 5°C to 120°C.

[0023] The advantage of the present invention is that the flowing gallium-based liquid metal is completely confined to the area where the chip solder is located, avoiding the risk of gallium-based liquid metal overflow. The provided window, combined with ultrasound and other measures, can effectively accelerate the solid solution reaction between the gallium-based liquid metal and silver, greatly accelerating the chip desoldering process without causing damage to the chip itself.

[0024] The entire device is easy to operate, all accessories are easy to maintain, the structure is simple and durable, and the failure rate is low. At the same time, it does not require heating, has low energy consumption, low cost, and high cost performance. The materials used include gallium-based liquid metal, which is non-toxic and harmless, environmentally friendly, and compatible with the desoldering needs of most silver-based solder-soldered chips on the market, and has broad application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 A schematic structural diagram of a device for desoldering chips using gallium-based liquid metal;

[0026] In the figure: 01, storage chamber; 02, control valve; 03, filter screen; 04, reaction chamber; 05, leak-proof rubber ring;

[0027] Figure 2 Schematic diagram of the structure of the storage chamber;

[0028] Figure 3 Schematic diagram of the control valve structure;

[0029] In the figure: 06, handle; 07, blocking plate;

[0030] Figure 4 Schematic diagram of the filter structure;

[0031] Figure 5 Schematic diagram of the reaction chamber structure;

[0032] In the picture: 08, opening; 09, window;

[0033] Figure 6 Schematic diagram of the structure of the leak-proof rubber ring. DETAILED DESCRIPTION

[0034] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0035] Reference Figure 1-6 A device for desoldering gallium-based liquid metal chips includes a storage chamber 01 and a reaction chamber 04 connected from top to bottom; the lower end of the reaction chamber 04 is sealed, and the upper end is provided with a filter 03; the lower end of the storage chamber 01 is provided with a control valve 02 for controlling the opening and closing of the storage chamber; the control valve 02 is located above the filter 03.

[0036] The control valve 02 includes a handle 06 and a connected blocking plate 07; the handle 06 and blocking plate 07 are detachably connected by bolts. The side wall of the storage chamber 01 is provided with an opening that matches the shape of the blocking plate 07. The opening is U-shaped, and the control valve 02 is a compatible lock-shaped opening.

[0037] When the storage chamber 01 is in a closed state, the outer wall of the blocking plate 07 is connected to the inner wall of the storage chamber 01 .

[0038] The top of the storage chamber 01 has rounded corners for easy gripping. The sidewalls of the reaction chamber 04 are equipped with openings and corresponding windows. The sidewalls and bottom of the reaction chamber 04 are connected by a leak-proof rubber ring 05. This leak-proof rubber ring 05 is trifurcated, with two prongs on the bottom forming the negative pressure adsorption sidewalls, and a ridged prong on the top that nestles into the bottom of the reaction chamber, securing the entire device. The reaction chamber 04 is semi-conical in shape, with the storage chamber nested on top.

[0039] The materials of the storage chamber, the reaction chamber, the control valve and the filter are substances that do not react with the gallium-based liquid metal.

[0040] Gallium-based liquid metal contains 0-50 parts indium, 0-50 parts tin, 0-50 parts zinc, 0-50 parts copper, 0-50 parts silver, 0-50 parts aluminum, 0-50 parts bismuth, 0-50 parts cobalt, 0-50 parts titanium, and 0-50 parts iron, along with 51-95 parts gallium. The melting point of gallium-based liquid metal is between 5°C and 120°C.

[0041] In general, the device for desoldering gallium-based liquid metal chips includes: a storage chamber 01 for storing gallium-based liquid metal raw materials, which includes a control valve 02 for opening and closing the storage chamber and a filter 03 for filtering solder residue; a reaction chamber 04 for chip desoldering, which includes a circular opening 08 and a circular window 09; and a leak-proof rubber ring 05 for preventing the gallium-based liquid metal from overflowing from the reaction chamber.

[0042] The storage chamber 01 is cylindrical in shape, with a sealed top and rounded corners for easy gripping. A U-shaped groove is located on the lower sidewall, providing a passage for the entry and exit of the control valve 02. The device can be adjusted by inserting and removing the control valve 02. When gallium-based liquid metal is stored in the storage chamber 01, the control valve 02 is inserted to prevent leakage and enter the standby state. When chip desoldering is required, the control valve 02 is removed, and the gallium-based liquid metal falls under its own gravity, desoldering the chip and entering the working state. A filter 03 is located in the upper middle portion of the reaction chamber. When chip desoldering is complete, the device for desoldering the gallium-based liquid metal is inverted to allow the gallium-based liquid metal to flow back into the storage chamber 01. Any residual solder residue is filtered through the filter 03. Once it has completely returned to the storage chamber 01, the control valve 02 is inserted to prevent leakage. The reaction chamber 04 is semi-conical in shape, with the storage chamber 01 nestled within its top. The bottom of the sidewalls features a groove for a leak-proof rubber ring. The sidewalls are provided with an opening 08 and a corresponding window 09, which can be used to apply ultrasonic vibrations to the gallium-based liquid metal to accelerate its reaction rate and also serve as an observation window. Different sizes of devices can be used to meet the desoldering requirements for different chip models. After selecting the appropriate reaction chamber size, the chip to be desoldered is placed in the center of the circular area at the bottom of the reaction chamber 04. The leak-proof rubber ring 05 is then tightened to expel air and create a negative pressure, preventing the gallium-based liquid metal from escaping the chamber. The chip desoldering operation can then begin.

[0043] To use, first invert storage chamber 01 and fill it with an appropriate amount of gallium-based liquid metal, ensuring the liquid level is below the plane of the notch in control valve 02. Once completed, insert control valve 02 and flip it over. Assemble filter screen 03, the selected reaction chamber 04, and the leak-proof rubber ring 05 in order, keeping circular window 09 closed. Once assembled, place the chip to be desoldered and its pads on a clean glass plate, ensuring a stable work surface. Then, press the bottom of the reaction chamber sidewall into the leak-proof rubber ring to expel air and create negative pressure to secure the solder. After confirming that everything is in place, slowly remove control valve 02, allowing the gallium-based liquid metal to fall freely. Observe through circular window 09. Once the gallium-based liquid metal has submerged the solder, re-insert control valve 03 and stop feeding. At this point, the gallium-based liquid metal has begun to desolder the chip due to its solid solution with silver. If necessary, insert a tool such as an ultrasonic vibrator through circular opening 08 to accelerate the desoldering process. After the chip is desoldered, first close the circular window 09, pull out half of the control valve 02, turn the entire device upside down, and recover the gallium-based liquid metal. After completion, plug the control valve 002 tightly and remove the reaction chamber 04 to obtain the desoldered chip.

[0044] The device of the utility model has a simple structure, convenient operation, low cost, and is environmentally friendly, and is compatible with the desoldering needs of most chips soldered with silver-based solders on the market.

Claims

1. A device for desoldering gallium-based liquid metal chips, characterized in that: It includes a storage chamber and a reaction chamber connected from top to bottom; the lower end of the reaction chamber is sealed, and the upper end is provided with a filter screen; the lower end of the storage chamber is provided with a control valve for controlling the opening and closing of the storage chamber; the control valve is located above the filter screen.

2. The device according to claim 1, characterized in that The control valve includes a handle and a connected blocking plate; an opening having the same shape as the blocking plate is provided on the side wall of the storage chamber.

3. The device according to claim 2, characterized in that The opening is U-shaped; the control valve is an adapted lock-shaped valve; when the storage chamber is in a closed state, the outer wall of the blocking plate is connected to the inner wall of the storage chamber.

4. The device according to claim 2, characterized in that The handle and the blocking plate are detachably connected by bolts.

5. The device according to claim 1, characterized in that The storage chamber is in the shape of a hollow cylinder, and a rounded corner is arranged on the top.

6. The device according to claim 1, characterized in that The side wall of the reaction chamber is provided with an opening and a window adapted to the opening.

7. The device according to claim 1, characterized in that The side wall and bottom of the reaction chamber are connected by a leak-proof rubber ring.

8. The device according to claim 1, characterized in that The reaction chamber is semi-conical in shape, and a storage chamber is nested on the top of the reaction chamber.

9. The device according to any one of claims 1 to 8, characterized in that The storage chamber, reaction chamber, control valve and filter screen are made of high molecular polymer.

10. The device according to claim 9, characterized in that The storage chamber, reaction chamber, control valve and filter screen are made of polyethylene, polypropylene or polyvinyl alcohol.

Images