Wave soldering modification

Abstract

The utility model relates to the technical field of wave soldering, and discloses wave soldering modification which comprises a preheating box, and a plurality of bottom preheating assemblies arranged at equal intervals are arranged at the bottom of the preheating box; each bottom preheating assembly comprises a bottom box, two air inducing frames, two sets of bottom fans and a first heating pipe. According to the wave soldering modification, the top preheating assembly is additionally arranged, double-face preheating of the upper surface and the lower surface of the circuit board is achieved, the temperature difference between the upper board face and the lower board face of the circuit board is greatly reduced, and the mobility and wettability of solder on the circuit board are effectively improved through the uniform heating mode; welding defects such as pseudo soldering, tip pulling and bridging are reduced, the welding reliability and stability are remarkably improved, the preheating time is shortened and the production efficiency is improved by optimizing the structure and the heating mode of the preheating area, meanwhile, the stability and the controllability of the preheating process can be ensured through a temperature sensor, and the production cost is reduced. And the production interruption and the defective product rate caused by temperature fluctuation are reduced.

Description

Technical Field

[0001] The present application relates to the field of wave soldering technology, and in particular to a wave soldering modification. Background Art

[0002] With the rapid development of electronic technology, the design of circuit boards has become increasingly complex, the integration has continued to increase, and the number of layers of boards has also increased. This trend is particularly evident in electronic devices that pursue higher performance, smaller size and lower power consumption. However, the high integration and multi-layer board design have brought new challenges to the traditional wave soldering process, especially in the preheating stage.

[0003] Traditional wave soldering preheating zones usually use bottom preheating, which means only the bottom of the circuit board is heated. This preheating method can still meet the needs when facing single-layer or low-integration circuit boards, but when the number of circuit board layers increases and the density of components increases, problems will appear. Since only the bottom is preheated, the temperature difference between the upper and lower surfaces of the circuit board will increase significantly. The uneven temperature will make the fluidity and wettability of the solder on the circuit board worse, which is prone to welding defects such as cold solder joints, pull tips, and bridging. The rapid temperature change will generate thermal stress inside the circuit board, which may cause board warping, component damage or solder joint detachment. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the present application provides a wave soldering modification with advantages such as uniform preheating, which solves the problems raised in the background technology.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solutions: a wave soldering modification, comprising a preheating box, wherein a plurality of bottom preheating components arranged at equal distances are provided at the bottom of the preheating box;

[0006] Each of the bottom preheating components includes a bottom box, two air induction frames, two sets of bottom fans and a first heating tube;

[0007] The upper surface of the preheating box is provided with a plurality of inspection slots arranged at equal distances, and the upper portion of the preheating box is provided with a plurality of top preheating components arranged at equal distances;

[0008] Each of the top preheating components includes a top box, a second heating tube and two top fans;

[0009] A supporting tray is fixedly connected to the inner side wall of the bottom end of the preheating box, and a surface of the supporting tray is provided with distributedly arranged through holes.

[0010] Through the above scheme, by adding a top preheating component, double-sided preheating of the upper and lower surfaces of the circuit board is achieved, which greatly reduces the temperature difference between the upper and lower surfaces of the circuit board. This uniform heating method effectively improves the fluidity and wettability of the solder on the circuit board, reduces the occurrence of welding defects such as cold solder joints, pull tips, and bridging, and significantly improves the reliability and stability of welding. By optimizing the structure and heating method of the preheating zone, the preheating time is shortened and production efficiency is improved. At the same time, the temperature sensor can ensure the stability and controllability of the preheating process, reducing production interruptions and defective product rates caused by temperature fluctuations. The top preheating component adopts a hinge design, which is convenient for quick opening and processing when special circumstances occur during the preheating process. Dust-proof measures such as filter holes and filters effectively block the entry of external dust and reduce pollution to the internal environment of the preheating box. At the same time, the setting of the thermal insulation curtain reduces the loss of temperature inside the preheating box, improves energy utilization efficiency, and meets the requirements of modern industrial production for energy saving and environmental protection.

[0011] Furthermore, the rear end bottom of each top box is hinged to the back of the preheating box through a hinge.

[0012] With the above solution, by hinged connection between the top box and the preheating box, when special circumstances occur during the preheating process of the circuit board, it is convenient for the user to open the top box for processing.

[0013] Furthermore, each top fan is fixedly mounted on the back of the top box adjacent to it, and each second heating tube is fixedly connected to the inner wall of the top box adjacent to it.

[0014] Through the above solution, by setting the top fan, external air flow can be introduced into the interior of the top box, and after being heated by the second heating tube, it enters the interior of the preheating box to preheat the upper surface of the circuit board.

[0015] Furthermore, a group of filter holes are provided at the bottom of each of the top boxes.

[0016] Through the above solution, the setting of the filter holes can facilitate the passage of airflow and at the same time intercept external dust.

[0017] Furthermore, each of the bottom boxes is fixedly embedded in the bottom of the preheating box, each of the air induction frames is fixedly embedded in a side surface of the bottom box adjacent to it, each group of the bottom fans is fixedly installed inside the air induction frame adjacent to it, each of the first heating tubes is installed inside the bottom box adjacent to it, and a filter is installed at one end of the two air induction frames.

[0018] Through the above solution, by setting the filter, the purpose of intercepting external dust can be achieved, and the purpose of heating the bottom of the circuit board can be achieved through the first heating tube and the bottom fan.

[0019] Furthermore, two temperature sensors are fixedly installed on the inner bottom wall of the preheating box.

[0020] Through the above solution and the provision of a temperature sensor, the purpose of monitoring the internal temperature of the preheating box can be achieved.

[0021] Furthermore, conveyor rollers are rotatably connected between the front and rear inner walls at the left and right ends of the preheating box, and multiple belts arranged at equal distances are provided between the two conveyor rollers. The two conveyor rollers are connected through multiple belt transmissions, and the rear end of the conveyor roller on the far left is fixedly connected to the output end of the external motor, and the supporting tray is located inside the multiple belts.

[0022] Through the above solution, by setting the belt, the purpose of supporting the circuit board can be achieved, thereby achieving the conveying effect of the circuit board.

[0023] Furthermore, the inner top walls of the left and right ends of the preheating box are installed with insulation curtains, and the front of the preheating box is fixedly installed with a control host, and the temperature sensor, the first heating tube, the second heating tube, the top fan, the bottom fan and the external motor are all electrically connected to the control host.

[0024] Through the above solution, by controlling the setting of the host, the purpose of controlling the electrical components can be achieved, and by setting the thermal insulation curtain, the temperature loss inside the preheating box can be reduced.

[0025] Compared with the existing technology, the technical solution of this application has the following beneficial effects:

[0026] This wave soldering modification realizes double-sided preheating of the upper and lower surfaces of the circuit board by adding a top preheating component, greatly reducing the temperature difference between the upper and lower surfaces of the circuit board. This uniform heating method effectively improves the fluidity and wettability of the solder on the circuit board, reduces the occurrence of welding defects such as cold solder joints, pull tips, and bridging, and significantly improves the reliability and stability of welding. By optimizing the structure and heating method of the preheating zone, the preheating time is shortened and production efficiency is improved. At the same time, the temperature sensor can ensure the stability and controllability of the preheating process, reducing production interruptions and defective product rates caused by temperature fluctuations. The top preheating component adopts a hinge design, which is convenient for rapid opening and processing when special circumstances occur during the preheating process. Dust-proof measures such as filter holes and filter screens effectively block the entry of external dust and reduce pollution to the internal environment of the preheating box. At the same time, the setting of the thermal insulation curtain reduces the loss of temperature inside the preheating box, improves energy utilization efficiency, and meets the requirements of modern industrial production for energy saving and environmental protection. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A three-dimensional diagram of the overall structure of this application Figure 1 ;

[0028] Figure 2 A three-dimensional diagram of the overall structure of this application Figure 2 ;

[0029] Figure 3 A three-dimensional diagram of the overall structure of this application Figure 3 ;

[0030] Figure 4 A cross-sectional view of the front view of the overall structure of this application;

[0031] Figure 5 This is a cross-sectional view of the top view of the overall structure of this application.

[0032] In the picture:

[0033] 1. Preheating box; 2. Bottom preheating assembly; 201. Bottom box; 202. Air induced draft frame; 203. Bottom fan; 204. First heating tube; 3. Inspection slot; 4. Top preheating assembly; 401. Top box; 402. Second heating tube; 403. Top fan; 5. Support tray; 6. Through hole; 7. Filter hole; 8. Filter screen; 9. Temperature sensor; 10. Conveyor roller; 11. Belt; 12. Thermal insulation curtain; 13. Control unit. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of this application to clearly and completely describe the technical solutions in the embodiments of this application. Obviously, the embodiments described are only part of the embodiments of this application, not all of the embodiments. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of this application.

[0035] See also Figure 1 、 Figure 2 and Figure 4 In this embodiment, a wave soldering modification includes a preheating box 1. The bottom of the preheating box 1 is provided with a plurality of bottom preheating components 2 arranged at equal distances. Two temperature sensors 9 are fixedly installed on the inner bottom wall of the preheating box 1. Through the setting of the temperature sensors 9, the internal temperature of the preheating box 1 can be monitored.

[0036] See also Figure 1 、 Figure 3 and Figure 4Each bottom preheating assembly 2 includes a bottom box 201, two air induction frames 202, two groups of bottom fans 203 and a first heating tube 204. By setting the preheating assembly of the bottom box 201, the purpose of preheating the bottom of the circuit board can be achieved. Each bottom box 201 is fixedly embedded in the bottom of the preheating box 1, and each air induction frame 202 is fixedly embedded on a side of the bottom box 201 adjacent to it. Each group of bottom fans 203 is fixedly installed inside the air induction frame 202 adjacent to it, and each first heating tube 204 is installed inside the bottom box 201 adjacent to it. A filter 8 is installed at one end of the two air induction frames 202. The setting of the filter 8 can achieve the purpose of intercepting external dust. The purpose of heating the bottom of the circuit board can be achieved through the first heating tube 204 and the bottom fan 203.

[0037] See also Figure 1 、 Figure 4 and Figure 5 The upper surface of the preheating box 1 is provided with a plurality of inspection slots 3 arranged at equal distances. A plurality of top preheating components 4 arranged at equal distances are provided above the preheating box 1. Each top preheating component 4 includes a top box 401, a second heating tube 402 and two top fans 403. Through the arrangement of the top preheating components 4, the purpose of preheating the upper surface of the circuit board can be achieved. The rear end bottom of each top box 401 is hinged to the back of the preheating box 1 through a hinge. Through the hinged connection between the top box 401 and the preheating box 1, it is convenient for the user to open the top box 4 when special circumstances occur during the preheating process of the circuit board. 01 for processing, each top fan 403 is fixedly installed on the back of the top box 401 close to it, and each second heating tube 402 is fixedly connected to the inner wall of the top box 401 close to it. Through the setting of the top fan 403, external air flow can be introduced into the interior of the top box 401, and after being heated by the second heating tube 402, it enters the interior of the preheating box 1 to preheat the upper surface of the circuit board. A group of filter holes 7 are opened at the bottom of each top box 401. The setting of the filter holes 7 can facilitate the passage of air flow and intercept external dust.

[0038] See also Figure 2 、 Figure 4 and Figure 5A supporting tray 5 is fixedly connected to the inner wall of the bottom end of the preheating box 1. The surface of the supporting tray 5 is provided with distributed through holes 6. The setting of the supporting tray 5 can effectively prevent the circuit board from falling. Conveying rollers 10 are rotatably connected between the front and rear inner walls at both ends of the preheating box 1. A plurality of belts 11 arranged at equal distances are provided between the two conveying rollers 10. The two conveying rollers 10 are connected by a plurality of belts 11. The rear end of the leftmost conveying roller 10 is fixedly connected to the output end of the external motor. The supporting tray 5 is located inside the plurality of belts 11. The setting of the belts 11 can achieve the purpose of supporting the circuit board, thereby achieving the conveying effect of the circuit board.

[0039] See also Figure 1 、 Figure 2 and Figure 3 , the inner top walls of the left and right ends of the preheating box 1 are both installed with insulation curtains 12, and the front of the preheating box 1 is fixedly installed with a control host 13. The temperature sensor 9, the first heating tube 204, the second heating tube 402, the top fan 403, the bottom fan 203 and the external motor are all electrically connected to the control host 13. Through the setting of the control host 13, the purpose of controlling the electrical components can be achieved. Through the setting of the insulation curtains 12, the temperature loss inside the preheating box 1 can be reduced.

[0040] A wave soldering modification in this embodiment achieves double-sided preheating of the upper and lower surfaces of the circuit board by adding a top preheating component 4, greatly reducing the temperature difference between the upper and lower surfaces of the circuit board. This uniform heating method effectively improves the fluidity and wettability of the solder on the circuit board, reduces the occurrence of welding defects such as cold solder joints, pull tips, and bridging, and significantly improves the reliability and stability of welding. By optimizing the structure and heating method of the preheating zone, the preheating time is shortened and production efficiency is improved. At the same time, the temperature sensor 9 can ensure the stability and controllability of the preheating process, reducing production interruptions and defective product rates caused by temperature fluctuations. The top preheating component 4 adopts a hinge design, which is convenient for rapid opening and processing when special circumstances occur during the preheating process. Dust-proof measures such as the filter holes 7 and the filter screen 8 effectively block the entry of external dust and reduce pollution to the internal environment of the preheating box 1. At the same time, the provision of the thermal insulation curtain 12 reduces the loss of temperature inside the preheating box 1, improves energy utilization efficiency, and meets the energy-saving and environmentally friendly requirements of modern industrial production.

[0041] The working principle of the above embodiment is as follows: first, the circuit board is placed on the belt 11 in the preheating box 1, and the through hole 6 of the tray 5 is designed to ensure the circulation of the bottom airflow. Then, the operator starts the control host 13, the system starts to work, the bottom fan 203 starts, and the outside air is sucked in through the air duct 202, and is sent into the bottom box 201 after being filtered by the filter 8. At the same time, the first heating tube 204 starts to heat and mixes with the hot air to form a hot air flow, which uniformly preheats the bottom of the circuit board. The top preheating component 4 also starts to work, and the top fan 403 sucks air from the back of the top box 401, filters it through the filter hole 7, and enters the top box 401. The second heating tube 402 heats the air to form a hot air flow, and enters the inside of the preheating box 1 through the opening of the top box 401. , preheating the upper surface of the circuit board. During the preheating process, the temperature sensor 9 monitors the temperature in the preheating box 1 in real time and feeds the data back to the control host 13. The control host 13 automatically adjusts the power of the first heating tube 204 and the second heating tube 402, as well as the wind speed of the bottom fan 203 and the top fan 403 according to the preset temperature parameters to ensure that the temperature of the upper and lower surfaces of the circuit board is uniform and maintained within the optimal preheating range. During the preheating process, the conveyor roller 10 in the preheating box 1 starts to rotate under the drive of the motor, driving the belt 11 to smoothly convey the circuit board to the next process. If any special situation occurs during the preheating process, such as circuit board deviation or temperature abnormality, the operator can quickly open the top box 401 through the hinge for inspection and processing to ensure production safety.

[0042] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply the existence of any such actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article, or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or elements inherent to such process, method, article, or device. In the absence of further limitations, an element defined by the phrase "comprising a ..." does not exclude the presence of other identical elements in the process, method, article, or device comprising the element.

[0043] Although the embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A wave soldering modification, comprising a preheating box (1), characterized in that: The bottom of the preheating box (1) is provided with a plurality of bottom preheating components (2) arranged at equal distances; Each of the bottom preheating components (2) comprises a bottom box (201), two air induction frames (202), two groups of bottom fans (203) and a first heating tube (204); The upper surface of the preheating box (1) is provided with a plurality of inspection slots (3) arranged at equal distances, and above the preheating box (1) are provided a plurality of top preheating components (4) arranged at equal distances; Each of the top preheating components (4) includes a top box (401), a second heating pipe (402) and two top fans (403); A supporting tray (5) is fixedly connected to the inner side wall of the bottom end of the preheating box (1), and a surface of the supporting tray (5) is provided with distributedly arranged through holes (6).

2. A wave soldering modification according to claim 1, characterized in that: The rear end bottom of each top box (401) is hinged to the back of the preheating box (1) via a hinge.

3. The wave soldering modification according to claim 1, characterized in that: Each top fan (403) is fixedly mounted on the back of the top box (401) adjacent thereto, and each second heating tube (402) is fixedly connected to the inner wall of the top box (401) adjacent thereto.

4. The wave soldering modification according to claim 1, characterized in that: A group of filter holes (7) is provided at the bottom of each top box (401).

5. The wave soldering modification according to claim 1, characterized in that: Each of the bottom boxes (201) is fixedly embedded in the bottom of the preheating box (1), each of the air induction frames (202) is fixedly embedded in a side of the bottom box (201) adjacent thereto, each group of the bottom fans (203) is fixedly installed inside the air induction frame (202) adjacent thereto, each of the first heating tubes (204) is installed inside the bottom box (201) adjacent thereto, and a filter (8) is installed at one end of each of the two air induction frames (202).

6. The wave soldering modification according to claim 1, characterized in that: Two temperature sensors (9) are fixedly mounted on the inner bottom wall of the preheating box (1).

7. The wave soldering modification according to claim 1, characterized in that: Conveyor rollers (10) are rotatably connected between the front and rear inner side walls at the left and right ends of the preheating box (1), and a plurality of belts (11) arranged at equal distances are provided between the two conveyor rollers (10). The two conveyor rollers (10) are connected to each other through the plurality of belts (11). The rear end of the leftmost conveyor roller (10) is fixedly connected to the output end of an external motor, and the support tray (5) is located inside the plurality of belts (11).

8. The wave soldering modification according to claim 1, characterized in that: Insulation curtains (12) are installed on the inner top walls of the left and right ends of the preheating box (1), and a control host (13) is fixedly installed on the front of the preheating box (1). The temperature sensor (9), the first heating tube (204), the second heating tube (402), the top fan (403), the bottom fan (203) and the external motor are all electrically connected to the control host (13).

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