Sequencing reaction liquid cooling system and gene sequencing reaction platform

Abstract

The utility model provides a sequencing reaction liquid cooling system and a gene sequencing reaction platform, the liquid cooling system comprises a heating and refrigerating assembly, a liquid storage assembly and a liquid cooling circulation assembly, the heating and refrigerating assembly comprises a TEC element and a liquid cooling piece, the liquid storage assembly comprises a first storage space used for containing heating liquid and a second storage space used for containing cooling liquid, the liquid cooling circulation assembly comprises a first switching valve and a second switching valve, and the outlet end of the liquid cooling part selectively communicates with one of the first storage space and the second storage space through the first switching valve. And the inlet end of the liquid cooling piece is selectively communicated with one of the first storage space and the second storage space through the second switching valve.

Description

Technical Field

[0001] The utility model relates to the technical field of gene sequencing, in particular to a sequencing reaction liquid cooling system and a gene sequencing reaction platform. Background Art

[0002] In a gene sequencing reaction platform, the gene samples loaded into the sequencing chip need to undergo a biochemical reaction before they can be sequenced. However, the biochemical reaction requires a suitable temperature. Therefore, the gene sequencing reaction platform is provided with a TEC element. One end of the TEC element is connected to the gene sequencing chip for heat exchange, providing a suitable temperature for the biochemical reaction of the gene sample. The other end of the TEC element is connected to a liquid cooling component for heat exchange, and the liquid cooling component dissipates heat from the other end of the TEC element (TEC element characteristics: TEC elements transfer heat from one side to the other side. When heat accumulates on the other side, the working efficiency decreases or even fails to work normally. Therefore, when one side of the TEC element needs to be cooled quickly, the other side of the TEC element also needs to dissipate heat quickly). For the convenience of the full description, the end of the TEC element 2 that is connected to the gene sequencing chip for heat exchange is referred to as end A, and the end of the TEC element 2 that is connected to the liquid cooling component for heat exchange is referred to as end B. Figure 1 As shown, the gene sequencing chip is set on the heating adsorption platform 1, and the A end of the TEC element 2 is used to heat or cool the heating adsorption platform 1, so that the heating adsorption platform 1 heats or cools the gene sequencing chip to provide it with a suitable reaction temperature. The A end of the TEC element is indirectly connected to the gene sequencing chip for heat exchange. When the A end of the TEC element 2 needs to be cooled quickly, the B end of the TEC element 2 also needs to dissipate heat (due to the characteristics of the TEC element 2, when the A end needs to be cooled quickly, the B end also needs to dissipate heat quickly. The faster the B end dissipates heat, the faster the temperature of the A end drops. Or when the A end needs to be heated quickly, the B end also needs to be heated quickly. The faster the end is heated, the faster the temperature of end A rises). To dissipate heat from end B, the coolant circulation pump 5 is used to draw the liquid from the liquid storage tank 4 to the liquid cooling component 3. At the liquid cooling component 3, the liquid is heat-exchanged with end B of the TEC element 2, and the heat from end B of the TEC element 2 is removed by liquid cooling to dissipate heat from end B. The liquid that has passed through the liquid cooling component 3 becomes hot liquid and then enters the heat dissipation pipe in the heat dissipation component 6. The heat dissipation pipe is then blown by the heat dissipation fan in the heat dissipation component 6, and the heat in the liquid is discharged into the air by air heat dissipation. The hot liquid that has passed through the heat dissipation pipe becomes room temperature liquid again, and finally flows back to the liquid storage tank 4 for storage.

[0003] In addition, when end A of the TEC element 2 is heated, end A of the TEC element 2 heats the heating adsorption platform 1. At this time, end B of the TEC element 2 cools down the liquid cooling element 3 (the TEC element 2, i.e., a thermoelectric cooling plate, is a semiconductor device that uses the Peltier effect to achieve cooling or heating. It transmits direct current between two different conductor materials, and heat is transferred from the cold end of the element to the hot end, thereby achieving a cooling effect at end A of the TEC element 2 and a heating effect at end B of the TEC element 2. If the current direction is opposite, the cooling and heating effects at ends A and B of the TEC element 2 will be reversed). The liquid after passing through the liquid cooling element 3 is cooled by the liquid cooling element 3 and becomes a cold liquid. After passing through the heat dissipation pipe, the cold liquid is heated to room temperature liquid through heat exchange in the heat dissipation pipe and then enters the liquid storage tank 4. When the A end of the TEC switches to cooling mode, the B end of the TEC heats the liquid cooling element 3. The liquid passing through the liquid cooling element 3 is heated and becomes hot liquid. After the hot liquid passes through the heat dissipation pipe, it is cooled to room temperature liquid through heat exchange in the heat dissipation pipe and then enters the liquid storage tank 4 for storage.

[0004] As can be seen from the above, the existing technology has at least the following two problems: when end A of TEC element 2 needs to be heated or cooled quickly, the temperature of end B of TEC element 2 limits the heating and cooling speed of end A, thereby affecting the external heating and cooling speed of the gene sequencing reaction platform. In addition, when end A switches between heating and cooling, the hot and cold liquids produced at end B are neutralized by the room temperature air. In other words, the heat and cold energy generated by end B are wasted and not utilized, resulting in low energy utilization. Utility Model Content

[0005] The purpose of the embodiments of the present utility model is to provide a sequencing reaction liquid cooling system and a gene sequencing reaction platform to solve the technical problems of how to improve the external heating and cooling speed of the gene sequencing reaction platform and how to improve the energy utilization rate of the gene sequencing reaction platform.

[0006] In order to achieve the above-mentioned purpose, the technical solution of the embodiment of the present utility model is as follows:

[0007] A sequencing reaction liquid cooling system, comprising:

[0008] A heating and cooling assembly includes a TEC element and a liquid cooling element. The TEC element includes an A end and a B end. The A end of the TEC element is used for heat exchange connection with the gene sequencing chip, and the B end of the TEC element is used for heat exchange connection with the liquid cooling element.

[0009] a liquid storage assembly comprising a first storage space for accommodating heating liquid and a second storage space for accommodating cooling liquid;

[0010] A liquid cooling circulation assembly includes a first switching valve and a second switching valve;

[0011] The outlet of the liquid cooling element is selectively connected to one of the first storage space and the second storage space through a first switching valve, and the inlet of the liquid cooling element is selectively connected to one of the first storage space and the second storage space through a second switching valve.

[0012] Further,

[0013] The liquid cooling circulation assembly further includes a liquid outlet pipe connected between the outlet end of the liquid cooling element and the liquid storage assembly, and a liquid inlet pipe connected between the liquid storage assembly and the inlet end of the liquid cooling element;

[0014] The liquid outlet pipe includes a first liquid outlet section connected between the first switching valve and the outlet end of the liquid cooling element, a second liquid outlet section connected between the first switching valve and the first storage space, and a third liquid outlet section connected between the first switching valve and the second storage space;

[0015] The liquid inlet pipe includes a first liquid inlet section connected between the first storage space and the second switching valve, a second liquid inlet section connected between the second storage space and the second switching valve, and a third liquid inlet section connected between the second switching valve and the inlet end of the liquid cooling component.

[0016] Further,

[0017] The heating and cooling component includes a cooling mode and a heating mode;

[0018] In the cooling mode, the first switching valve switches the first liquid outlet section to communicate with the second liquid outlet section, and the second switching valve switches the second liquid inlet section to communicate with the third liquid inlet section;

[0019] In the heating mode, the first switching valve switches the first liquid outlet section to communicate with the third liquid outlet section, and the second switching valve switches the first liquid inlet section to communicate with the third liquid inlet section.

[0020] Further,

[0021] The heating and cooling components include two groups, and the liquid cooling circulation components include two groups, wherein one group of the liquid cooling circulation components is used to connect one group of the heating and cooling components with the liquid storage component, and the other group of the liquid cooling circulation components is used to connect the other group of the heating and cooling components with the liquid storage component;

[0022] When one of the heating and cooling components works in the cooling mode, the other heating and cooling component works in the heating mode; or, the two heating and cooling components work in the cooling mode at the same time; or, the two heating and cooling components work in the heating mode at the same time.

[0023] Further,

[0024] The second liquid outlet section is provided with a heat dissipation component, which includes a heat dissipation fan and a heat dissipation pipe.

[0025] Further,

[0026] The third liquid inlet section is provided with a coolant circulation pump, the water outlet of the coolant circulation pump is connected to the inlet end of the liquid cooling component, and the water inlet of the coolant circulation pump is connected to the water outlet of the second switching valve.

[0027] Further,

[0028] A refrigeration component is further provided outside the second storage space, and the refrigeration component is used to cool the coolant stored in the second storage space.

[0029] Further,

[0030] The cooling element is another TEC element, and a cooling end of the TEC element is in contact with the bottom of the second storage space.

[0031] Further,

[0032] A balancing pipeline is provided between the first storage space and the second storage space, and the balancing pipeline is used to connect the portions between the first storage space and the second storage space that are above a preset liquid level.

[0033] Further,

[0034] The first switching valve is a two-position three-way valve; and / or,

[0035] The second switching valve is a two-position three-way valve.

[0036] Another object of an embodiment of the present invention is to provide a gene sequencing reaction platform, comprising: a platform carrier and the liquid cooling system described in any one of the aforementioned embodiments.

[0037] Compared with the prior art, the embodiments of the present invention have at least the following technical effects:

[0038] The utility model adopts two storage spaces, namely the first storage space and the second storage space, and is provided with a first switching valve and a second switching valve. When the A end of the TEC element is used for external heating, the B end of the TEC element is cooling the liquid cooling part. The first switching valve is switched to connect the liquid cooling part with the second storage space, and the second switching valve is switched to connect the liquid cooling part with the first storage space. When the B end of the TEC element is cooling the liquid cooling part, the liquid flowing through the liquid cooling part is converted into cold liquid, and the cold liquid is stored in the second storage space to be filled into the liquid cooling part and used for heat dissipation of the B end of the TEC element. When the A end of the TEC element is cooling the external, the B end of the TEC element is heating the liquid cooling part. The first switching valve selects to connect the liquid cooling part with the first storage space. The first storage space is connected to the second storage space, and the second switching valve selects to connect the liquid cooling element to the second storage space. When the B end of the TEC element heats the liquid cooling element, the liquid flowing through the liquid cooling element becomes hot liquid. The hot liquid is ultimately stored in the first storage space to be filled into the liquid cooling element and then used to heat the B end of the TEC element. This fully utilizes the heat and cold energy generated by the B end of the TEC element, thereby improving the energy utilization rate of the gene sequencing reaction platform. In addition, by injecting hot liquid and cold liquid into the liquid cooling element, the B end of the TEC element can be quickly heated or cooled, thereby accelerating the temperature increase or decrease rate of the A end of the TEC element, thereby accelerating the heating or cooling rate of the gene sequencing reaction platform to external objects, and quickly providing a suitable temperature for the biochemical reaction before sequencing. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 This is a schematic diagram of the existing gene sequencing reaction platform heating or cooling the heating adsorption platform;

[0040] Figure 2a Schematic diagram of the structure of the TEC element when end A is heated in one embodiment;

[0041] Figure 2b This is a schematic diagram of the structure of the TEC element A during cooling in one embodiment;

[0042] Figure 3a Schematic diagram of the structure of the TEC element when end A is heated in another embodiment;

[0043] Figure 3b This is a schematic structural diagram of the TEC element A during cooling in another embodiment;

[0044] Figure 4a Schematic diagram of the structure of one TEC element A end and another TEC element A end when heated in another embodiment;

[0045] Figure 4b Schematic diagram of the structure of one TEC element A end and another TEC element A end during cooling in another embodiment;

[0046] Figure 4cA schematic diagram of the structure of a TEC element A when end A is heated and another TEC element A when end A is cooled in another embodiment;

[0047] Figure 4d FIG. 1 is a structural diagram of another embodiment in which end A of a TEC element is cooled and end A of another TEC element is heated.

[0048] Description of Figure Numbers:

[0049] 1. Heating adsorption platform; 2. TEC element; 3. Liquid cooling element; 4. Liquid storage tank; 5. Coolant circulation pump; 6. Heat dissipation component; 7. First storage space; 8. Second storage space; 9. Balance pipe; 10. Second switching valve; 11. First switching valve; 12. Refrigeration element; 13. First liquid outlet section; 14. Second liquid outlet section; 15. Third liquid outlet section; 16. First liquid inlet section; 17. Second liquid inlet section; 18. Third liquid inlet section. DETAILED DESCRIPTION

[0050] The following is a further detailed description of the technical solution of the present invention in conjunction with the accompanying drawings and specific embodiments of the specification. Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are for the purpose of describing specific embodiments only and are not intended to limit the present invention. In the following description, reference is made to "some embodiments", which describes a subset of all possible embodiments, but it should be understood that "some embodiments" may be the same subset or different subsets of all possible embodiments, and may be combined with each other without conflict.

[0051] It should also be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be an intermediate element. When an element is referred to as being "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "inner," "outer," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only implementation methods.

[0052] In gene sequencing reaction platforms (such as Figure 1As shown, the heating adsorption platform is disposed below the gene sequencing chip to provide a suitable temperature for the biochemical reaction required for gene sequencing. The gene sequencing reaction platform utilizes the A-end of the TEC element to heat or cool the heating adsorption platform to provide a suitable temperature for the biochemical reaction. However, the heat and cold energy generated by the B-end of the TEC element in the existing gene sequencing reaction platform is not utilized, resulting in low energy utilization of the gene sequencing reaction platform. In addition, the existing reaction platform has poor heat dissipation or heating effect on the B-end of the TEC element, and the temperature rise and fall speed of the A-end is limited, which results in limited external heating and cooling speed of the gene sequencing reaction platform.

[0053] In light of this, the inventors of this application proposed a technical concept: "Using two storage spaces, when the B end of the TEC element cools the liquid cooling element, the liquid flowing through the liquid cooling element is converted into cold liquid. This cold liquid is stored in the second storage space to be used to dissipate heat from the B end of the TEC element after it is filled into the liquid cooling element. When the B end of the TEC element heats the liquid cooling element, the liquid flowing through the liquid cooling element is converted into hot liquid. The hot liquid is ultimately stored in the first storage space to be used to heat the B end of the TEC element after it is filled into the liquid cooling element. This fully utilizes the heat and cold energy generated by the B end of the TEC element, improving energy utilization. By injecting hot and cold liquids into the liquid cooling element, the B end of the TEC element can be quickly heated or dissipated, accelerating the temperature rise and fall rate of the A end of the TEC element, and quickly providing a suitable temperature for biochemical reactions." The technical solution based on this technical concept is detailed in the following specific embodiments.

[0054] like Figure 2a As shown in FIG2b, in this embodiment, a sequencing reaction liquid cooling system includes a heating and cooling component, a liquid storage component, and a liquid cooling circulation component.

[0055] The heating and cooling assembly includes a TEC element 2 and a liquid cooling element 3. The TEC element 2 includes an A end and a B end. The gene sequencing chip is arranged on the heating and adsorption platform 1. The A end of the TEC element 2 is used to heat or cool the heating and adsorption platform 1, so that the heating and adsorption platform 1 heats or cools the gene sequencing chip. That is, the A end of the TEC element 2 is indirectly connected to the gene sequencing chip for heat exchange. Of course, in other embodiments, the user can set the A end of the TEC element 2 to be directly connected to the gene sequencing chip for heat exchange according to actual needs. This is not limited here. The B end of the TEC element 2 is connected to the liquid cooling element 3 for heat exchange. The liquid cooling element 3 can be a box or a pipe. The specific shape and structure are not limited here, as long as it can exchange heat with the B end.

[0056] The liquid storage assembly includes a first storage space 7 for accommodating heating liquid and a second storage space 8 for accommodating cooling liquid. The first storage space 7 and the second storage space 8 can be two independent spaces separated in a box, or two independent boxes, which is not limited here.

[0057] The liquid cooling circulation component includes a liquid outlet pipe connected between the outlet end of the liquid cooling component 3 and the liquid storage component, a liquid inlet pipe connected between the liquid storage component and the inlet end of the liquid cooling component 3, a first switching valve 11 provided on the liquid outlet pipe, and a second switching valve 10 provided on the liquid inlet pipe.

[0058] Among them, the first switching valve 11 switches the outlet end of the liquid cooling component 3 to be connected to one of the first storage space 7 and the second storage space 8, and the second switching valve 10 switches one of the first storage space 7 and the second storage space 8 to be connected to the inlet end of the liquid cooling component 3.

[0059] Optionally, the liquid outlet pipe includes a first liquid outlet section 13 connected between the first switching valve 11 and the outlet end of the liquid cooling component 3, a second liquid outlet section 14 connected between the first switching valve 11 and the first storage space 7, and a third liquid outlet section 15 connected between the first switching valve 11 and the second storage space 8; the liquid inlet pipe includes a first liquid inlet section 16 connected between the first storage space 7 and the second switching valve 10, a second liquid inlet section 17 connected between the second storage space 8 and the second switching valve 10, and a third liquid inlet section 18 connected between the second switching valve 10 and the inlet end of the liquid cooling component 3.

[0060] The heating and cooling component includes a cooling mode and a heating mode; in the cooling mode, the first switching valve 11 switches the first liquid outlet section 13 to be connected to the second liquid outlet section 14, and the second switching valve 10 switches the second liquid inlet section 17 to be connected to the third liquid inlet section 18; in the heating mode, the first switching valve 11 switches the first liquid outlet section 13 to be connected to the third liquid outlet section 15, and the second switching valve 10 switches the first liquid inlet section 16 to be connected to the third liquid inlet section 18.

[0061] The following is a further explanation of the specific working process of the liquid cooling system:

[0062] 1. Working process of the heating and cooling assembly in cooling mode: When end A of the TEC element 2 cools the heated adsorption platform 1, due to the characteristics of the TEC element 2, end B of the TEC element 2 heats the liquid cooling element 3. The first switching valve 11 selects to connect the liquid cooling element 3 with the first storage space 7, and the second switching valve 10 selects to connect the liquid cooling element 3 with the second storage space 8. The liquid in the second storage space 8 flows into the liquid cooling element 3. As the end B of the TEC element 2 heats the liquid cooling element 3, the liquid flowing through the liquid cooling element 3 cools down and becomes hot liquid. The hot liquid is stored in the first storage space 7. When end A of the TEC element 2 is used to heat the heated adsorption platform 1, the hot liquid is filled into the liquid cooling element 3 and then used to heat end B of the TEC element 2. The faster the end B is heated, the faster the temperature of end A rises, thereby accelerating the heating speed of the heated adsorption platform 1 (e.g., Figure 2a as well as Figure 2b shown).

[0063] 2. Working process of the heating and cooling component in heating mode: When the A end of the TEC element 2 heats the heating adsorption platform 1, due to the characteristics of the TEC element 2, the B end of the TEC element 2 cools the liquid cooling element 3. The first switching valve 11 selects to connect the liquid cooling element 3 with the second storage space 8, and the second switching valve 10 selects to connect the liquid cooling element 3 with the first storage space 7. The hot liquid previously stored in the first storage space 7 flows into the liquid cooling element 3. The medium flowing through the liquid cooling element 3 will cool down and become cold liquid. The cold liquid is stored in the second storage space 8 for future use. When the A end of the TEC element 2 cools the heating adsorption platform 1, the cold liquid is filled into the liquid cooling element 3 and used to dissipate heat from the B end of the TEC element 2. The faster the heat dissipation at the B end, the faster the temperature of the A end will cool down (such as Figure 2a as well as Figure 2b shown).

[0064] Optional, such as Figure 2a As shown in Figure 2b, the second liquid outlet section is provided with a heat dissipation component 6, which includes a heat dissipation fan and a heat dissipation pipe. The third liquid inlet section is provided with a coolant circulation pump 5, the water outlet of the coolant circulation pump 5 is connected to the inlet end of the liquid cooling element 3, and the water inlet of the coolant circulation pump 5 is connected to the water outlet of the second switching valve 10. When the liquid cooling element 3 is connected to the first storage space 7 or when the liquid cooling element 3 is connected to the second storage space 8, the coolant circulation pump 5 can draw the liquid in the first storage space 7 and the second storage space 8 into the liquid cooling element 3. The coolant circulation pump 5 can ensure a stable liquid flow into the liquid cooling element 3, providing stable flow support for the heat exchange between the liquid cooling element 3 and the B end of the TEC element.

[0065] Optional, such as Figure 2aAs shown in Figure 2b, a balancing pipeline is provided between the first storage space 7 and the second storage space 8, and the balancing pipeline connects the portion between the first storage space and the second storage space that is above the preset liquid level. When the liquid stored in the first storage space 7 exceeds the total capacity of the storage space, the liquid can be transported to the second storage space 8 through the balancing pipeline. Of course, when the liquid stored in the second storage space 8 exceeds the total capacity of the storage space, the liquid can be transported to the first storage space 7 through the balancing pipeline 9. The balancing pipeline 9 can be used to temporarily balance the amount of liquid in the two storage spaces. To facilitate heat preservation, an insulation layer can be provided outside the first storage space 7 and the second storage space 8. In an optional specific example, the first storage space 7 and the second storage space 8 are the first water tank and the second water tank, respectively. In addition, in this embodiment, the liquid can be water used for cooling or heating. Of course, water is only an example. Users can choose other liquids that can be used for liquid cooling according to actual needs. This is not limited here.

[0066] Optional, such as Figure 2a As shown in FIG2b, the first switching valve 11 is a two-position three-way valve, and the second switching valve 10 is a two-position three-way valve. Of course, the user can select the valve body type according to actual needs, and there is no limitation here, as long as the valve body type can be switched between the two communication states of connecting the liquid cooling element 3 with the first storage space 7 and connecting the liquid cooling element 3 with the second storage space 8.

[0067] In another embodiment, Figure 3a and Figure 3b As shown, a cooling element is also provided outside the second storage space 8 to cool the coolant stored in the second storage space. Furthermore, the cooling element is another TEC element 12, the cooling end of which contacts the bottom of the second storage space. This TEC element further lowers the temperature of the coolant stored in the second storage space 8, improving the heat dissipation effect at end B of the TEC element 2.

[0068] In other embodiments, Figure 4a 、 Figure 4b 、 Figure 4c as well as Figure 4d As shown, the heating and cooling components include two groups, and the liquid cooling circulation components include two groups, wherein one group of the liquid cooling circulation components connects one group of the heating and cooling components with the liquid storage component, and the other group of the liquid cooling circulation components connects the other group of the heating and cooling components with the liquid storage component, wherein when one of the heating and cooling components works in the cooling mode, the other heating and cooling component works in the heating mode; or, the two heating and cooling components work in the cooling mode at the same time; or, the two heating and cooling components work in the heating mode at the same time. Specifically, as Figure 4cAs shown in Figure 4d, when one of the heating and cooling components operates in cooling mode and the other heating and cooling component operates in heating mode, the cold water produced by the B-end of the TEC element 2 in one heating and cooling component is used to dissipate heat from the B-end of the TEC element 2 in the other heating and cooling component, while the hot water produced by the B-end of the TEC element 2 in the other heating and cooling component can be used to heat the B-end of the TEC element 2 in this heating and cooling component, thereby further improving the energy utilization rate of the gene sequencing reaction platform.

[0069] Another object of an embodiment of the present invention is to provide a gene sequencing reaction platform, comprising: a platform carrier and a liquid cooling system as described in any of the aforementioned embodiments.

[0070] The above are only specific embodiments of the present invention, but the scope of protection of the present invention is not limited to them. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this utility model should be included in the scope of protection of the present utility model. The scope of protection of the present utility model should be based on the scope of protection of the claims.

Claims

1. A sequencing reaction liquid cooling system, characterized in that: include: A heating and cooling assembly includes a TEC element and a liquid cooling element. The TEC element includes an A end and a B end. The A end of the TEC element is used for heat exchange connection with the gene sequencing chip, and the B end of the TEC element is used for heat exchange connection with the liquid cooling element. a liquid storage assembly comprising a first storage space for accommodating heating liquid and a second storage space for accommodating cooling liquid; A liquid cooling circulation assembly includes a first switching valve and a second switching valve; The outlet end of the liquid cooling element is selectively connected to one of the first storage space and the second storage space through a first switching valve, and the inlet end of the liquid cooling element is selectively connected to one of the first storage space and the second storage space through a second switching valve.

2. The sequencing reaction liquid cooling system according to claim 1, characterized in that: The liquid cooling circulation assembly further includes a liquid outlet pipe connected between the outlet end of the liquid cooling element and the liquid storage assembly, and a liquid inlet pipe connected between the liquid storage assembly and the inlet end of the liquid cooling element; The liquid outlet pipe includes a first liquid outlet section connected between the first switching valve and the outlet end of the liquid cooling element, a second liquid outlet section connected between the first switching valve and the first storage space, and a third liquid outlet section connected between the first switching valve and the second storage space; The liquid inlet pipe includes a first liquid inlet section connected between the first storage space and the second switching valve, a second liquid inlet section connected between the second storage space and the second switching valve, and a third liquid inlet section connected between the second switching valve and the inlet end of the liquid cooling component.

3. The sequencing reaction liquid cooling system according to claim 2, characterized in that: The heating and cooling component includes a cooling mode and a heating mode; In the cooling mode, the first switching valve switches the first liquid outlet section to communicate with the second liquid outlet section, and the second switching valve switches the second liquid inlet section to communicate with the third liquid inlet section; In the heating mode, the first switching valve switches the first liquid outlet section to communicate with the third liquid outlet section, and the second switching valve switches the first liquid inlet section to communicate with the third liquid inlet section.

4. The sequencing reaction liquid cooling system according to claim 3, characterized in that: The heating and cooling components include two groups, and the liquid cooling circulation components include two groups, wherein one group of the liquid cooling circulation components is used to connect one group of the heating and cooling components with the liquid storage components, and the other group of the liquid cooling circulation components is used to connect the other group of the heating and cooling components with the liquid storage components; When one of the heating and cooling components works in cooling mode, the other heating and cooling component works in heating mode; or, the two heating and cooling components work in cooling mode at the same time; or, the two heating and cooling components work in heating mode at the same time.

5. The sequencing reaction liquid cooling system according to claim 2, characterized in that: The second liquid outlet section is provided with a heat dissipation component, which includes a heat dissipation fan and a heat dissipation pipe.

6. The sequencing reaction liquid cooling system according to claim 2, characterized in that: The third liquid inlet section is provided with a coolant circulation pump, the water outlet of the coolant circulation pump is connected to the inlet end of the liquid cooling component, and the water inlet of the coolant circulation pump is connected to the water outlet of the second switching valve.

7. The sequencing reaction liquid cooling system according to claim 1, characterized in that: A refrigeration component is further provided outside the second storage space, and the refrigeration component is used to cool the coolant stored in the second storage space.

8. The sequencing reaction liquid cooling system according to claim 7, characterized in that: The cooling element is another TEC element, and a cooling end of the TEC element is in contact with the bottom of the second storage space.

9. The sequencing reaction liquid cooling system according to claim 1, characterized in that: A balancing pipeline is provided between the first storage space and the second storage space, and the balancing pipeline is used to connect the portions between the first storage space and the second storage space that are above a preset liquid level.

10. A gene sequencing reaction platform, characterized in that: include: A platform carrier and a liquid cooling system as described in any one of claims 1 to 9.

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