High-heat-dissipation inductor shell structure

Abstract

The utility model discloses a high heat dissipation inductor shell structure which comprises a shell body, a heat dissipation assembly and an inductor installation assembly, and the heat dissipation assembly, the inductor installation assembly and the shell body are all of an integrally-formed structure. The heat dissipation assemblies are installed on multiple side walls of the shell, the inductor installation assemblies are arranged at the bottom of the shell side by side, and the inductor installation assemblies are used for installing inductors in the shell. The inductor installation assemblies are arranged at the bottom of the shell, so that the inductors can be fixedly installed in the shell, and the problem that the inductors are prone to displacement when a traditional shell is filled is solved. Through the synergistic effect of the heat dissipation assemblies of the side walls, it can be ensured that the inductor can still keep low temperature during high-power operation, the performance and reliability of the inductor are improved, and the problem that a traditional inductor shell is poor in heat dissipation effect is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of inductor shells, in particular to a high-heat dissipation inductor shell structure. Background Art

[0002] With the continuous improvement of inductors, the application of linear coil inductors wound with flat wires has gradually become popular. However, under long-term working conditions, the internal temperature cannot be dissipated in time. In the existing technology, heat dissipation is generally achieved by adding a heat dissipation shell. For example, the electromagnetic coil assembly is placed in the heat dissipation shell, and then a potting compound with thermal conductivity is injected between the electromagnetic coil assembly and the heat dissipation shell. The heat inside the product is transferred to the heat dissipation shell through the potting compound through the potting compound, and then the heat is transferred to the external environment through the heat dissipation shell.

[0003] However, during the potting process, the inductor is susceptible to the impact of the potting compound flow and slight vibrations during operation, causing it to wobble. This wobble can lead to uneven potting compound distribution, affect thermal conductivity, and even damage the inductor's internal structure.

[0004] Moreover, the heat dissipation effect of traditional shells is poor, which causes the inductor to be in a high-temperature environment for a long time, and the coil material, insulation material and magnetic core material inside the inductor will accelerate aging. Utility Model Content

[0005] In view of the above defects, the present invention proposes a high heat dissipation inductor shell structure, which solves the problems of poor heat dissipation effect of traditional inductor shells and easy displacement of the inductor during the filling process.

[0006] To achieve this purpose, the present invention adopts the following technical solutions:

[0007] A high heat dissipation inductor housing structure, comprising a housing, a heat dissipation component and an inductor mounting component, wherein the heat dissipation component, the inductor mounting component and the housing are all integrally formed structures;

[0008] The heat dissipation components are installed on multiple side walls of the shell, and multiple inductor mounting components are arranged in parallel at the bottom of the shell. The inductor mounting components are used to install inductors inside the shell.

[0009] The housing includes a bottom wall, a heat dissipation surface and a mounting surface, wherein the mounting surface and the three heat dissipation surfaces are arranged around the outer edge of the bottom wall, the mounting surface is vertically connected to the bottom wall, and the heat dissipation surface is vertically connected to the bottom wall;

[0010] The heat dissipation surface arranged opposite to the mounting surface is bent outward, and the longitudinal section of the shell and the bottom wall are both pentagonal structures.

[0011] The heat dissipation assembly includes a first heat dissipation fin. A plurality of the first heat dissipation fins are evenly arranged and installed on the heat dissipation surface. The first heat dissipation fins are perpendicular to the corresponding heat dissipation surface.

[0012] The heat dissipation assembly further includes second heat dissipation fins. A plurality of second heat dissipation fins are evenly arranged and mounted on the bottom wall. The second heat dissipation fins and the bottom wall are perpendicular to each other.

[0013] The inductor mounting assembly includes a first boss and a second boss, each of the first boss and the second boss includes a recessed portion and a vertical portion, the bottom of the vertical portion is fixedly connected to the bottom wall, the top of the recessed portion is fixedly connected to the top of the vertical portion, and the bottom of the recessed portion is fixedly connected to the bottom wall;

[0014] The recessed portion of the first boss and the recessed portion of the second boss are arranged opposite to each other;

[0015] The outer sides of the recessed portions are fixedly connected to the corresponding plurality of second heat sinks.

[0016] The heat dissipation surface arranged opposite to the mounting surface is provided with a plurality of columns, and the columns and the first heat sink are an integrally formed structure;

[0017] The outer sides of the columns are respectively fixedly connected to the corresponding plurality of first heat sinks.

[0018] A plurality of sidewall points of the first heat sink on a side away from the heat dissipation surface are all located on a horizontal straight line.

[0019] The tops of the heat dissipation surface and the mounting surface are both provided with mounting edges, and the mounting edges are provided with a plurality of mounting holes at intervals.

[0020] The technical solution of the utility model may have the following beneficial effects:

[0021] 1. Multiple inductor mounting components are provided at the bottom of the housing, so that multiple inductors can be fixedly installed in the housing, solving the problem that the inductors are easily displaced during filling in traditional housings.

[0022] 2. The synergistic effect of the heat dissipation components on multiple side walls can ensure that the inductor maintains a low temperature even when running at high power, improving the performance and reliability of the inductor and solving the problem of poor heat dissipation effect of traditional inductor housings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the housing structure of one embodiment of the present invention;

[0024] Figure 2 This is a cross-sectional view of the housing structure of one embodiment of the present invention;

[0025] Figure 3 yes Figure 2 Enlarged view of point A in the middle;

[0026] Among them, 1. Shell; 11. Bottom wall; 12. Heat dissipation surface; 13. Mounting surface; 2. Heat dissipation assembly; 21. First heat sink; 22. Second heat sink; 3. Inductor mounting assembly; 31. First boss; 32. Second boss; 33. Recessed portion; 34. Vertical portion; 4. Column; 5. Mounting edge. DETAILED DESCRIPTION

[0027] The technical solution of the present invention will be further described below with reference to the accompanying drawings and through specific implementation methods.

[0028] In the description of the present invention, it should be understood that the terms "length", "middle", "upper", "lower", "left", "right", "top", "bottom", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0029] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of this utility model, unless otherwise specified, "plurality" means more than two.

[0030] In the description of this utility model, it should be noted that, unless otherwise specified or limited, the terms "installation," "splicing," and "connection" should be understood in a broad sense. For example, they may refer to fixed connection, detachable connection, or integral connection; they may refer to direct connection, indirect connection through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on the specific circumstances.

[0031] The following combination Figures 1 to 3 , describing a high heat dissipation inductor housing structure of an embodiment of the present utility model.

[0032] A high heat dissipation inductor housing structure, comprising a housing 1, a heat dissipation component 2 and an inductor mounting component 3, wherein the heat dissipation component 2, the inductor mounting component 3 and the housing 1 are all integrally formed structures;

[0033] The heat dissipation components 2 are installed on multiple side walls of the housing 1 , and multiple inductor mounting components 3 are arranged in parallel at the bottom of the housing 1 . The inductor mounting components 3 are used to install inductors inside the housing 1 .

[0034] The present invention provides a high heat dissipation inductor housing structure, in which a plurality of inductor mounting components 3 are provided at the bottom of the housing 1, so that a plurality of inductors can be fixedly mounted in the housing 1, thereby solving the problem that the inductors are easily displaced during filling of the traditional housing 1.

[0035] Moreover, since the heat dissipation component 2, the inductor mounting component 3 and the housing 1 are all integrally formed structures, there are no joint gaps or connection weaknesses between the various parts, which can better withstand external mechanical stress, making the entire inductor housing highly structurally integrated. It can also more quickly transfer the inductor heat to the heat dissipation component 2, reducing the impact of thermal resistance on heat dissipation performance.

[0036] Furthermore, heat sinks 2 are mounted on multiple sidewalls of the housing 1. Regardless of where the inductor's heat is concentrated during operation, it is quickly dissipated through the nearby heat sinks 2. The synergistic effect of the heat sinks 2 on multiple sidewalls ensures the inductor maintains a low temperature even during high-power operation, improving its performance and reliability and addressing the poor heat dissipation issues associated with conventional inductor housings 1.

[0037] The housing 1 includes a bottom wall 11, a heat dissipation surface 12, and a mounting surface 13. The mounting surface 13 and the three heat dissipation surfaces 12 are mounted on the outer edge of the bottom wall 11. The mounting surface 13 is vertically connected to the bottom wall 11, and the heat dissipation surface 12 is vertically connected to the bottom wall 11.

[0038] The heat dissipation surface 12 , which is arranged opposite to the mounting surface 13 , is bent outward. The longitudinal section of the housing 1 and the bottom wall 11 are both pentagonal structures.

[0039] Bottom wall 11 is perpendicularly connected to heat dissipation surface 12 and mounting surface 13, allowing heat within housing 1 to be conducted from the inductor's interior to the outside of housing 1 via the shortest possible path, improving heat conduction efficiency. Furthermore, the curved heat dissipation surface 12 further increases its surface area, allowing heat to dissipate more quickly into the surrounding environment, preventing localized heat accumulation and further optimizing the heat dissipation path.

[0040] In addition, the longitudinal section of the housing 1 and the bottom wall 11 are both pentagonal structures, which can effectively guide the flow of heat, make the heat distribution more uniform, and further avoid the occurrence of local overheating.

[0041] The heat dissipation assembly 2 includes a first heat dissipation fin 21 . A plurality of the first heat dissipation fins 21 are evenly arranged and installed on the heat dissipation surface 12 . The first heat dissipation fins 21 and the corresponding heat dissipation surface 12 are perpendicular to each other.

[0042] The vertical connection between heat dissipation surface 12 and first heat sink 21 creates an excellent heat conduction path. Heat can be quickly transferred from the inductor to heat dissipation surface 12 and then quickly dissipated through the vertical first heat sink 21, reducing heat conduction obstacles and improving heat conduction efficiency.

[0043] Air channels are formed between the multiple first heat sinks 21, which is conducive to air convection. When the inductor is working, the air near the first heat sink 21 is heated and rises, and cold air is sucked in to fill the gaps, forming natural convection, accelerating heat dissipation and further improving the heat dissipation effect.

[0044] The heat dissipation assembly 2 further includes second heat dissipation fins 22 . A plurality of second heat dissipation fins 22 are evenly arranged and mounted on the bottom wall 11 . The second heat dissipation fins 22 and the bottom wall 11 are perpendicular to each other.

[0045] The second heat sink 22 is vertically mounted on the bottom wall 11 , which can enhance the rigidity of the bottom wall 11 , prevent the bottom wall 11 from deforming during long-term use, and better withstand external pressure, impact, and vibration.

[0046] Furthermore, the second heat sink 22 cooperates with the first heat sink 21 to ensure that heat can be quickly conducted out of the inductor and dissipated into the surrounding environment, thereby further enhancing the heat dissipation effect of the housing 1 .

[0047] The inductor mounting assembly 3 includes a first boss 31 and a second boss 32. The first boss 31 and the second boss 32 each include a recessed portion 33 and a vertical portion 34. The bottom of the vertical portion 34 is fixedly connected to the bottom wall 11, the top of the recessed portion 33 is fixedly connected to the top of the vertical portion 34, and the bottom of the recessed portion 33 is fixedly connected to the bottom wall 11.

[0048] The recessed portion 33 of the first boss 31 and the recessed portion 33 of the second boss 32 are arranged opposite to each other;

[0049] The outer sides of the recessed portions 33 are fixedly connected to the corresponding second heat sinks 22 .

[0050] The recessed portion 33 of the first boss 31 and the recessed portion 33 of the second boss 32 together form a space for accommodating the inductor, securely fixing the inductor within the housing 1. The recessed portion 33 fits snugly against the outer wall of the inductor, effectively preventing the inductor from shaking or shifting during use. Furthermore, during installation, workers can accurately place the inductor in the intended position, ensuring accurate connections between the inductor and other circuit components.

[0051] The outer side of the recessed portion 33 is fixedly connected to multiple second heat sinks 22, which can increase the contact area between the inductor and the second heat sink 22, ensuring that the heat generated by the inductor can be conducted to the second heat sink 22 more quickly and dissipated into the surrounding environment through the second heat sink 22.

[0052] The heat dissipation surface 12 arranged opposite to the mounting surface 13 is provided with a plurality of columns 4, and the columns 4 and the first heat sink 21 are an integrally formed structure;

[0053] The outer sides of the columns 4 are fixedly connected to the corresponding first heat sinks 21 .

[0054] The column 4 and the first heat sink 21 are integrally formed, which greatly enhances the connection strength between the two, thereby better withstanding external pressure, impact and vibration, and improving the stability of the housing 1.

[0055] Furthermore, the outer side of the column 4 is fixedly connected to the first heat sink 21, allowing heat generated by the inductor to be conducted to the column 4 through the heat dissipation surface 12, and then from the column 4 to the first heat sink 21. This multi-path heat conduction method can accelerate the dissipation of heat and improve the heat dissipation efficiency of the inductor housing structure of this embodiment.

[0056] A plurality of sidewall points of the first heat sink 21 on a side away from the heat dissipation surface 12 are all located on a horizontal straight line.

[0057] When multiple side wall points of the first heat sink 21 away from the heat dissipation surface 12 are all located on a horizontal straight line, the shell structure of this solution is a conventional installation structure, ensuring that the shell structure of this solution better adapts to space limitations and improves the integration of the entire electronic system.

[0058] The tops of the heat dissipation surface 12 and the mounting surface 13 are both provided with mounting edges 5 , and the mounting edges 5 are provided with a plurality of mounting holes at intervals.

[0059] The setting of the mounting edge 5 provides a mounting fixing point for the inductor housing. Through the multiple mounting holes on the mounting edge 5, fasteners such as screws and bolts can be used to firmly fix the inductor housing on the mounting position.

[0060] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and should not be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will be able to devise other specific implementations of the present invention without inventive effort, and such implementations will fall within the scope of protection of the present invention.

Claims

1. A high heat dissipation inductor housing structure, characterized in that: It includes a housing, a heat dissipation assembly and an inductor mounting assembly, wherein the heat dissipation assembly, the inductor mounting assembly and the housing are all integrally formed structures; The heat dissipation components are installed on multiple side walls of the shell, and multiple inductor mounting components are arranged in parallel at the bottom of the shell. The inductor mounting components are used to install inductors inside the shell.

2. The high heat dissipation inductor housing structure according to claim 1, characterized in that: The housing includes a bottom wall, a heat dissipation surface and a mounting surface, wherein the mounting surface and the three heat dissipation surfaces are arranged around the outer edge of the bottom wall, the mounting surface is vertically connected to the bottom wall, and the heat dissipation surface is vertically connected to the bottom wall; The heat dissipation surface arranged opposite to the mounting surface is bent outward, and the longitudinal section of the shell and the bottom wall are both pentagonal structures.

3. The high heat dissipation inductor housing structure according to claim 2, characterized in that: The heat dissipation assembly includes a first heat dissipation fin. A plurality of the first heat dissipation fins are evenly arranged and installed on the heat dissipation surface. The first heat dissipation fins are perpendicular to the corresponding heat dissipation surface.

4. The high heat dissipation inductor housing structure according to claim 2, characterized in that: The heat dissipation assembly further includes second heat dissipation fins. A plurality of second heat dissipation fins are evenly arranged and mounted on the bottom wall. The second heat dissipation fins and the bottom wall are perpendicular to each other.

5. The high heat dissipation inductor housing structure according to claim 4, characterized in that: The inductor mounting assembly includes a first boss and a second boss, each of the first boss and the second boss includes a recessed portion and a vertical portion, the bottom of the vertical portion is fixedly connected to the bottom wall, the top of the recessed portion is fixedly connected to the top of the vertical portion, and the bottom of the recessed portion is fixedly connected to the bottom wall; The recessed portion of the first boss and the recessed portion of the second boss are arranged opposite to each other; The outer sides of the recessed portions are fixedly connected to the corresponding plurality of second heat sinks.

6. The high heat dissipation inductor housing structure according to claim 3, characterized in that: The heat dissipation surface arranged opposite to the mounting surface is provided with a plurality of columns, and the columns and the first heat sink are an integrally formed structure; The outer sides of the columns are respectively fixedly connected to the corresponding plurality of first heat sinks.

7. The high heat dissipation inductor housing structure according to claim 3, characterized in that: A plurality of sidewall points of the first heat sink on a side away from the heat dissipation surface are all located on a horizontal straight line.

8. The high heat dissipation inductor housing structure according to claim 2, characterized in that: The tops of the heat dissipation surface and the mounting surface are both provided with mounting edges, and the mounting edges are provided with a plurality of mounting holes at intervals.

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