Wafer automatic positioning detection device used on die bonder

Abstract

The utility model relates to the field of die bonder devices, in particular to an automatic wafer positioning and detecting device used on a die bonder, which comprises a bottom plate, a plurality of supporting strips are mounted on the upper surface of the bottom plate, the supporting strips are used for guiding and limiting a wafer, a limiting plate is mounted on the upper surfaces of the supporting strips, and the wafer is arranged between the bottom plate and the limiting plate; the right side of the bottom plate is provided with an in-place detection assembly, the in-place detection assembly is used for detecting whether a wafer is pushed in place or not and transmitting a signal to a driving assembly, and the driving assembly is installed on the left side of the bottom plate; the driving assembly comprises a motor and a driving block, and the motor can drive the driving block to rotate so as to push the wafer to be in place. According to the utility model, through the cooperation of the in-place detection assembly and the driving assembly, the wafer which is not pushed in place by an operator is detected, and is actively pushed in place, so that the damage to a chip in the wafer expanding process is avoided, and the rejection rate of products is effectively reduced.

Description

Technical Field

[0001] The utility model relates to the field of crystal bonding machine devices, in particular to a wafer automatic positioning detection device used on a crystal bonding machine. Background Art

[0002] The die bonder is a key device in the semiconductor back-end packaging process. It is an automated production equipment that uses vision-guided technology to automatically pick up chips from wafers and bond them to lead frames.

[0003] The carrier of the chip is called a wafer. During the actual use of the above-mentioned die bonder, the operator is required to push the wafer into the wafer expansion mechanism. However, under manual operation, it is inevitable that the wafer will not be placed in place due to operational errors. When the wafer is not placed in place, it will cause the wafer ring to deform during the expansion process of the equipment, resulting in damage to the chip and causing huge losses. Utility Model Content

[0004] In order to solve the aforementioned technical problems, the present invention provides a wafer automatic positioning detection device for use in a die bonding machine. The device detects whether the operator has pushed the wafer into place and adjusts the position of the wafer according to the detection result, thereby avoiding the problem of chip damage caused by the wafer not being pushed into place. This is specifically achieved through the following technical solutions.

[0005] The utility model discloses a bottom plate of a wafer automatic positioning detection device used in a crystal bonding machine. A plurality of support bars are installed on the upper surface of the bottom plate. The support bars are used for guiding and limiting the wafer. Limiting plates are installed on the upper surfaces of the support bars. The wafer is arranged between the bottom plate and the limiting plates.

[0006] A position detection component is installed on the right side of the base plate. The position detection component is used to detect whether the wafer is pushed into place and transmit the signal to the driving component. The driving component is installed on the left side of the base plate.

[0007] The driving assembly includes a motor and a driving block. The motor is fixed to the base plate. The output shaft of the motor is drivingly connected to the driving block. The driving block can overlap with the side of the wafer. The motor can drive the driving block to rotate, thereby pushing the wafer into place.

[0008] Preferably, the in-place detection component includes a lap joint, the right side of the wafer can overlap the lap joint, the lap joint is coaxially fixed to the core shaft, the core shaft is arranged in a through hole opened on the support bar and moves along it, the outer surface of the core shaft is sleeved with a spring, the first end of the spring is fixed to the lap joint, and the second end of the spring is fixed to the support bar.

[0009] One side of the core shaft is fixed to a limiting ring, and the limiting ring can overlap with the support bar. The core shaft is configured in the gap between the transmitter and the receiver of the third photoelectric sensor and can intermittently block the light beam of the transmitter of the third photoelectric sensor. The third photoelectric sensor is installed on the support bar.

[0010] Preferably, the drive assembly further includes a transmission shaft, the output end of the motor is drivingly connected to the transmission shaft, the transmission shaft is mounted on a bearing seat via a bearing, the bearing seat is mounted on the base plate, and a drive block is mounted on the transmission shaft.

[0011] Preferably, a limiting part is installed on the transmission shaft, and the limiting part includes a first limiting plate, which is coaxially fixed to the transmission shaft. The first limiting plate can be configured in the gap between the first photoelectric sensor transmitter and the receiver and can block the light beam of the first photoelectric sensor transmitter. The first photoelectric sensor is installed on the base plate.

[0012] The transmission shaft is coaxially fixed with the second limiting piece, the second limiting piece can be arranged in the gap between the second photoelectric sensor transmitter and the receiver and can block the light beam of the second photoelectric sensor transmitter, and the first photoelectric sensor is installed on the base plate.

[0013] Preferably, the first limiting piece and the second limiting piece have the same structure, both are semicircular plate structures, and the angle between the bisectors of the two is 90°.

[0014] Preferably, the first photoelectric sensor and the second photoelectric sensor are located on the same straight line, and the straight line and the axis of the transmission shaft are in the same horizontal plane.

[0015] Preferably, a guide block is fixed on the left side of the upper surface of the bottom plate, and the left side of the upper surface of the guide block is chamfered.

[0016] Preferably, the output end of the motor is drivingly connected to the transmission shaft through a coupling.

[0017] Preferably, the motor is mounted on the base plate via a fixing bracket.

[0018] Preferably, the third photoelectric sensor is mounted on the support bar via a mounting bracket, the mounting bracket is L-shaped, the mounting bracket is fixed to the third photoelectric sensor, and the mounting bracket is fastened to the support bar via bolts.

[0019] After adopting the above technical solution, the beneficial effects of the utility model are:

[0020] 1. The above technical solution adopts an in-place detection component to monitor in real time whether the operator has pushed the wafer into place, avoiding the problem of chip damage caused by wafer expansion when the wafer is not pushed in, improving the chip yield and reducing scrap costs.

[0021] 2. The above technical solution uses a drive component to adjust the position of the wafer that is not pushed into place, avoiding the operator's secondary operation and improving production efficiency. In addition, the position adjustment of the wafer is achieved through the drive component with higher precision. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 This is a structural diagram of the wafer automatic positioning detection device;

[0024] Figure 2 for Figure 1 Schematic diagram of the structure of some components in the middle;

[0025] Figure 3 It is a structural diagram of the in-place detection component;

[0026] Figure 4 for Figure 3 A partial enlarged view of

[0027] Figure 5 It is a structural diagram of the drive component;

[0028] Figure 6 Schematic diagram of the structure of the limiting part;

[0029] Figure 7 for Figure 6 Dynamic change diagram.

[0030] Description of reference numerals:

[0031] 101-base plate, 102-support bar, 103-limiting plate, 104-guide block;

[0032] 200 - drive assembly, 201 - motor, 202 - transmission shaft, 203 - bearing seat, 204 - drive block, 205 - fixed bracket, 206 - coupling, 210 - limiter, 211 - first limiter, 212 - first photoelectric sensor, 213 - second limiter, 214 - second photoelectric sensor;

[0033] 300-in-place detection component, 301-lap joint, 302-core shaft, 303-through hole, 304-spring, 305-limiting ring, 306-third photoelectric sensor, 307-mounting bracket. DETAILED DESCRIPTION

[0034] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be implemented without the need for some of these specific details. The following description of the embodiments is merely to provide a better understanding of the present invention by illustrating examples of the present invention.

[0035] The directional terms used in the following description refer to the directions shown in the drawings and do not limit the specific structure of the present invention. It should also be noted that, in the description of the present invention, unless otherwise specified or limited, the terms "installation" and "connection" should be understood broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can be directly connected or indirectly connected. Those skilled in the art will understand the specific meanings of these terms in the present invention based on the specific circumstances.

[0036] The embodiment of the present utility model provides a wafer automatic positioning detection device for a die bonder, see Figure 1 、 Figure 2 The positioning detection device includes a base plate 101, and support bars 102 are fixedly installed on the front, rear and right sides of the upper surface of the base plate 101. The support bars 102 on the front and rear sides guide the wafer, and the support bar 102 on the right side limits the wafer. The front and rear sides of the upper surfaces of several support bars 102 are fixedly installed with limiting plates 103. The wafer is arranged between the base plate 101 and the limiting plate 103 and is pushed in or taken out through the base plate 101 and the left side of the limiting plate 103.

[0037] Among them, a guide block 104 is fixed on the left side of the upper surface of the base plate 101. The left side of the upper surface of the guide block 104 is chamfered. Its purpose is that when the operator pushes the wafer in from the left side, the guide block 104 plays a positioning and guiding role for the wafer, and smoothly sends the wafer into the support bars 102 on the front and rear sides, thereby facilitating operation and improving the operator's work efficiency.

[0038] like Figure 1 、 Figure 5 As shown, an in-position detection component 300 is installed on the support bar 102 on the right side. The in-position detection component 300 includes a lap joint 301, a core shaft 302, a through hole 303, a spring 304, a limit ring 305, and a third photoelectric sensor 306. The right side of the wafer can be overlapped with the lap joint 301. The lap joint 301 is coaxially fixed with the first end of the core shaft 302, and the core shaft 302 is arranged in the through hole 303 opened on the support bar 102 and moves along it. The outer surface of the core shaft 302 is sleeved with a spring 304. The first end of the spring 304 is fixedly connected to the lap joint 301, and the second end of the spring 304 is fixedly connected to the support bar 102.

[0039] The outer surface of the core shaft 302 on the side away from the overlap joint 301 is coaxially fixed with the limit ring 305. The limit ring 305 can overlap with the right surface of the support bar 102. The second end of the core shaft 302 is configured in the gap between the transmitter and the receiver of the third photoelectric sensor 306, and can intermittently block the light beam of the transmitter of the third photoelectric sensor 306. The third photoelectric sensor 306 is fixedly mounted on the support bar 102.

[0040] Among them, when the wafer does not overlap with the overlap joint 301, under the elastic force of the spring 304, the limiting ring 305 overlaps with the right end face of the support bar 102, and the left end face of the overlap joint 301 is located to the left of the left end face of the support bar 102, that is, the overlap joint 301 exceeds the left end face of the support bar 102, so that the wafer first overlaps with the overlap joint 301 during the process of being pushed to the right.

[0041] Among them, the third photoelectric sensor 306 is fixedly installed on the support bar 102 through the mounting bracket 307. The mounting bracket 307 is L-shaped. The first end of the mounting bracket 307 is fixedly connected to the third photoelectric sensor 306 through a bolt, and the second end of the mounting bracket 307 is fixedly connected to the support bar 102 through a screw.

[0042] Through the above structure, when the operator pushes the wafer in, when the wafer is about to fit the support bar 102 on the right side, it first overlaps with the overlap joint 301 and pushes the overlap joint 301 to move synchronously to the right. At this time, the overlap joint 301 compresses the spring 304, and the second end of the core shaft 302 slides synchronously into the gap between the transmitter and the receiver of the third photoelectric sensor 306. When the wafer is in place, the second end of the core shaft 302 just completely blocks the light beam of the transmitter of the third photoelectric sensor 306. At this time, the wafer is determined to be in place. Conversely, when the second end of the core shaft 302 does not completely block the third photoelectric sensor 306, it is determined that the wafer is not in place.

[0043] like Figure 5 、 Figure 6 、 Figure 7 As shown, a drive assembly 200 is fixedly installed on the lower surface of the left end of the base plate 101. The drive assembly 200 includes a motor 201, a transmission shaft 202, a bearing seat 203, and a drive block 204. The motor 201 is fixedly installed on the lower surface of the base plate 101. The output end of the motor 201 is drive-connected to the first end of the transmission shaft 202. The front and rear sides of the transmission shaft 202 are respectively mounted on the bearing seat 203 through bearings. The bearing seat 203 is fixedly installed on the lower surface of the base plate 101. A drive block 204 is fixedly installed in the middle of the transmission shaft 202. The drive block 204 can overlap with the left end of the wafer.

[0044] The output end of the motor 201 is driven and connected to the first end of the transmission shaft 202 through the coupling 206 . The output end of the motor 201 is coaxially fixed with the input end of the coupling 206 . The output end of the coupling 206 is coaxially fixed with the first end of the transmission shaft 202 .

[0045] The motor 201 is fixedly mounted on the lower surface of the base plate 101 via a fixing bracket 205 . The motor 201 is fixedly connected to the fixing bracket 205 . The fixing bracket 205 is fastened to the lower surface of the base plate 101 via bolts, thereby achieving fixed installation of the motor 201 .

[0046] Through the above structure, the position adjustment of the wafer that has not been pushed into place can be automatically achieved. The specific implementation method is: when the operator pushes the wafer in, the drive block 204 is in a horizontal state, thereby avoiding blocking the wafer. When the operator completes pushing the wafer in, and the position detection component 300 detects that the wafer has not been pushed into place, the motor 201 drives the transmission shaft 202 and the drive block 204 to rotate in the forward direction through its output shaft, and the drive block 204 overlaps with the left end of the wafer, pushing the wafer to continue sliding to the right. When the drive block 204 rotates to a vertical state, the wafer is just pushed into place. At this time, the motor 201 drives the transmission shaft 202 and the drive block 204 to rotate in the reverse direction through its output shaft, so that the drive block 204 rotates to a horizontal state again.

[0047] In this embodiment, the in-place detection component 300 located on the right side of the base plate 101 detects whether the wafer is pushed into place, and feeds back the detection result to the drive component 200 located on the left side of the base plate 101. If the wafer has been pushed into place, the drive component 200 will not start. If the wafer has not been pushed into place, the motor 201 will be started, and the transmission shaft 202 and the drive block 204 will be driven to rotate forward through its output shaft to push the wafer into place. Then the motor 201 will drive the transmission shaft 202 and the drive block 204 to rotate in the opposite direction through its output shaft until the drive block 204 returns to a horizontal state, completing the adjustment of the wafer position this time.

[0048] As a further explanation of the present invention, see Figure 5 、 Figure 6 、 Figure 7 The angle and direction of rotation of the transmission shaft 202 and the driving block 204 are monitored and controlled by the limiting part 210. The limiting part 210 includes a first limiting piece 211, a first photoelectric sensor 212, a second limiting piece 213, and a second photoelectric sensor 214. The first limiting piece 211 is coaxially fixed to the side of the transmission shaft 202 away from the motor 201. The first limiting piece 211 can be configured in the gap between the transmitter and receiver of the first photoelectric sensor 212, and can intermittently block the light beam of the transmitter of the first photoelectric sensor 212. The first photoelectric sensor 212 is fixedly mounted on the lower surface of the base plate 101.

[0049] One end of the transmission shaft 202 away from the motor 201 is coaxially fixed with the second limit plate 213. The second limit plate 213 can be configured in the gap between the transmitter and receiver of the second photoelectric sensor 214, and can intermittently block the light beam of the transmitter of the second photoelectric sensor 214. The first photoelectric sensor 212 is fixedly mounted on the lower surface of the base plate 101.

[0050] The first limiting piece 211 and the second limiting piece 213 have the same structure, both are semicircular plate structures, and the angle between the bisectors of the two is 90°.

[0051] The first photoelectric sensor 212 and the second photoelectric sensor 214 are located on the same straight line, and the straight line and the axis of the transmission shaft 202 are in the same horizontal plane.

[0052] In the process of the driving block 204 pushing the wafer into place, the transmission shaft 202 and the driving block 204 rotate forward until the driving block 204 is in a vertical state. When the driving block 204 is in a vertical state, the positions of the first limiting piece 211 and the second limiting piece 213 are as follows: Figure 6 As shown, the bisector of the first limiting piece 211 is vertically downward, and the transmitter beam of the first photoelectric sensor 212 is in a semi-blocked state. The bisector of the second limiting piece 213 is horizontally to the right, and the transmitter beam of the second photoelectric sensor 214 is in a completely blocked state; that is, the receiver of the first photoelectric sensor 212 controls the motor 201 to stop rotating at the moment of receiving the light beam, completing the limitation of the position of the driving block 204, and limiting the motor 201 to only rotate in the reverse direction after the next start.

[0053] On the contrary, during the reset process of the driving block 204, the transmission shaft 202 and the driving block 204 rotate in opposite directions until the driving block 204 is in a vertical state. When the driving block 204 is in a horizontal state, the positions of the first limiting piece 211 and the second limiting piece 213 are as follows: Figure 7 As shown, the bisector of the first limiting piece 211 is horizontally to the right, and the transmitter beam of the first photoelectric sensor 212 is in a completely blocked state. The bisector of the second limiting piece 213 is vertically upward, and the transmitter beam of the second photoelectric sensor 214 is in a semi-blocked state; that is, the receiver of the second photoelectric sensor 214 controls the motor 201 to stop rotating at the moment of receiving the light beam, thereby completing the position limitation of the driving block 204, and limiting the motor 201 to only rotate in the forward direction after the next start.

[0054] The purpose of the above structure and control method is to control the rotation angle of the driving block 204 so that the driving block 204 can only rotate within a range of 90°; when rotating from a horizontal state to a vertical state, it is ensured that the wafer is pushed into place, and when rotating from a vertical state to a horizontal state, it is avoided to hinder the pushing and removal of the wafer.

[0055] Of course, those skilled in the art may also replace the motor 201 with a programmable motor to precisely control the rotation angle and direction of the driving block 204 .

[0056] While the embodiments described above are based on the present invention, these embodiments do not exhaustively describe all details, nor do they limit the present invention to specific embodiments. Clearly, many modifications and variations are possible based on the above description. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, thereby enabling those skilled in the art to better utilize the present invention and its modifications and uses. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A wafer automatic positioning detection device used in a die bonder, characterized in that: It comprises a bottom plate (101), a plurality of support bars (102) are mounted on the upper surface of the bottom plate (101), the support bars (102) are used for guiding and limiting the wafer, a plurality of limit plates (103) are mounted on the upper surfaces of the support bars (102), and the wafer is arranged between the bottom plate (101) and the limit plates (103); A position detection component (300) is installed on the right side of the base plate (101), and the position detection component (300) is used to detect whether the wafer is pushed into place and transmit a signal to the driving component (200). The driving component (200) is installed on the left side of the base plate (101); The driving assembly (200) includes a motor (201) and a driving block (204), wherein the motor (201) is fixed to the base plate (101), and the output shaft of the motor (201) is drivingly connected to the driving block (204), and the driving block (204) can overlap with the side of the wafer, and the motor (201) can drive the driving block (204) to rotate, thereby pushing the wafer into place.

2. The wafer automatic positioning detection device according to claim 1, characterized in that: The in-place detection component (300) includes a lap joint (301), the right side of the wafer can be lapped with the lap joint (301), the lap joint (301) is coaxially fixed with a core shaft (302), the core shaft (302) is arranged in a through hole (303) opened on the support bar (102) and moves along the through hole (303), the outer surface of the core shaft (302) is provided with a spring (304), the first end of the spring (304) is fixed to the lap joint (301), and the second end of the spring (304) is fixed to the support bar (102); One side of the core shaft (302) is fixed to a limiting ring (305), and the limiting ring (305) can overlap with the support bar (102). The core shaft (302) is configured in the gap between the transmitter and the receiver of the third photoelectric sensor (306) and can intermittently block the light beam of the transmitter of the third photoelectric sensor (306). The third photoelectric sensor (306) is installed on the support bar (102).

3. The wafer automatic positioning detection device according to claim 1, characterized in that: The drive assembly (200) further comprises a transmission shaft (202), the output end of the motor (201) being drivingly connected to the transmission shaft (202), the transmission shaft (202) being mounted on a bearing seat (203) via a bearing, the bearing seat (203) being mounted on the base plate (101), and a driving block (204) being mounted on the transmission shaft (202).

4. The wafer automatic positioning detection device according to claim 3, characterized in that: A limiting portion (210) is mounted on the transmission shaft (202), the limiting portion (210) comprising a first limiting piece (211), the first limiting piece (211) being coaxially fixed to the transmission shaft (202), the first limiting piece (211) being capable of being arranged in a gap between a transmitter and a receiver of a first photoelectric sensor (212) and being capable of blocking a light beam of the transmitter of the first photoelectric sensor (212), the first photoelectric sensor (212) being mounted on the base plate (101); The transmission shaft (202) is coaxially fixed with the second limiting piece (213), the second limiting piece (213) can be arranged in the gap between the transmitter and the receiver of the second photoelectric sensor (214) and can block the light beam of the transmitter of the second photoelectric sensor (214), and the first photoelectric sensor (212) is mounted on the base plate (101).

5. The wafer automatic positioning detection device according to claim 4, characterized in that: The first limiting piece (211) and the second limiting piece (213) have the same structure, both are semicircular plate structures, and the angle between the bisectors of the two is 90°.

6. The wafer automatic positioning detection device according to claim 4, characterized in that: The first photoelectric sensor (212) and the second photoelectric sensor (214) are located on the same straight line, and the straight line and the axis of the transmission shaft (202) are located on the same horizontal plane.

7. The wafer automatic positioning detection device according to claim 1, characterized in that: A guide block (104) is fixed on the left side of the upper surface of the bottom plate (101), and the left side of the upper surface of the guide block (104) is provided with a chamfered angle.

8. The wafer automatic positioning detection device according to claim 3, characterized in that: The output end of the motor (201) is drivingly connected to the transmission shaft (202) via a coupling (206).

9. The wafer automatic positioning detection device according to claim 3, characterized in that: The motor (201) is mounted on the base plate (101) via a fixing frame (205).

10. The wafer automatic positioning detection device according to claim 2, characterized in that: The third photoelectric sensor (306) is mounted on the support bar (102) via a mounting frame (307); the mounting frame (307) is L-shaped; the mounting frame (307) is fixed to the third photoelectric sensor (306); and the mounting frame (307) is fastened to the support bar (102) via bolts.

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