Storm wind double-layer ball mounting head
The double-layer ball transplanting head of Storm solves the problem of uneven ball transplanting by rotating the air inlet shaft and brush disk, achieving uniform distribution of solder balls on the substrate and efficient ball transplanting.
Patent Information
- Application Number
- CN202422401021.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-30
- Publication Date
- 2025-09-02
- Estimated Expiration
- 2034-09-30
AI Technical Summary
Existing ball transplant heads are prone to uneven ball transplantation when the solder ball size is large, resulting in a high risk of missing ball transplantation.
The Storm double-layer ball planting head is adopted, including a goal component, a rotating air inlet shaft and a brush disk. The rotating air inlet shaft drives the brush disk to rotate, combining the central air supply and the surrounding goal design to achieve uniform tiling of the solder balls.
It effectively solves the problem of uneven ball transplantation, improves the uniform distribution of solder balls on the substrate, reduces the risk of missing ball transplantation, and improves the efficiency and success rate of ball transplantation.
Smart Images
Figure CN223297804U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of ball planting equipment, in particular to a storm double-layer ball planting head. Background Art
[0002] The function of a ball placement head is to accurately place solder balls onto substrates such as circuit boards and chips. To ensure an even distribution of the solder balls on the substrate, existing ball placement heads often use a blower-type structure, which disperses the solder balls by blowing air to ensure an even distribution (specifically, even distribution means that the solder balls are laid out in a single layer, not stacked).
[0003] When the solder balls are small, blowing air works well. However, when the solder balls are larger, they are difficult to move. This significantly reduces the uniformity of ball placement and increases the risk of missed balls. Specifically, missed balls occur when solder balls are not placed at certain predetermined pad locations during the placement process, resulting in a lack of solder balls at these locations.
[0004] Therefore, it is necessary to improve the existing ball planting head to solve the problem of uneven ball planting.
[0005] The above information disclosed in this Background section is included only for enhancement of understanding of the background of the disclosure and therefore it may contain information that does not form the prior art that is currently known to a person of ordinary skill in the art. Utility Model Content
[0006] One purpose of the present invention is to provide a double-layer ball planting head of Baofeng, which can effectively solve the problem of uneven ball planting in existing ball planting heads.
[0007] To achieve the above objectives, the present invention provides a double-layer ball head, comprising:
[0008] A ball-ball assembly, the ball-ball assembly being provided with a ball-planting cavity opening downward, a relief hole communicating with the center of the ball-planting cavity, and a ball-ball channel communicating with the edge of the ball-planting cavity;
[0009] A rotating air inlet shaft, wherein the upper portion of the rotating air inlet shaft is rotatably mounted in the avoidance hole, and the lower portion of the rotating air inlet shaft extends into the ball planting cavity; wherein the rotating air inlet shaft is provided with an air inlet hole connected to the ball planting cavity, and a ball-passing gap is left between the rotating air inlet shaft and the cavity wall of the ball planting cavity for the solder ball to pass through;
[0010] A brush plate is located on the bottom surface of the rotating air inlet shaft.
[0011] Optionally, the lower portion of the rotating air inlet shaft divides the ball planting cavity into an upper cavity and a lower cavity; wherein the upper cavity and the lower cavity are connected through the ball gap.
[0012] Optionally, a surface of the rotating air inlet shaft close to the upper chamber is a slope structure that is inclined downward toward the cavity wall of the ball planting cavity.
[0013] Optionally, the brush disc is annular in structure and is fixed to the edge of the bottom surface of the rotating air inlet shaft.
[0014] Optionally, an air inlet grille for covering the opening of the air inlet hole is provided at the center of the bottom surface of the rotating air inlet shaft.
[0015] Optionally, the brush disc is provided with anti-static bristles.
[0016] Optionally, a bearing is provided between the rotating air inlet shaft and the ball assembly.
[0017] Optionally, the ball ball assembly includes a bottom frame provided with the ball planting cavity, and a top cover plate located above the bottom frame and provided with the avoidance hole and the ball ball channel.
[0018] Optionally, a sealing gasket is provided between the bottom frame and the top cover plate.
[0019] The beneficial effects of the present invention are: providing a Storm double-layer ball planting head, when ball planting is required, first place the Storm double-layer ball planting head above the substrate to be planted; then, feed the solder balls into the Storm double-layer ball planting head through the ball channel, and the solder balls will pass through the ball gap into the space below the brush plate; then, blow air to the solder balls below the brush plate through the air inlet hole, so that the solder balls achieve a preliminary uniform tiling effect; synchronously, the rotating air inlet shaft is driven by a rotating drive mechanism such as a motor belt assembly to drive the brush plate to rotate, and during the rotation of the brush plate, the stacked solder balls will be dispersed, so that the solder balls below the brush plate are completely and evenly spread out.
[0020] Therefore, the Storm double-layer ball planting head provided by the present invention can effectively solve the problem of uneven ball planting in existing ball planting heads. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0022] Figure 1This is a schematic diagram of the exterior of the Baofeng double-layer ball implant provided in the embodiment;
[0023] Figure 2 A cross-sectional schematic diagram of the Baofeng double-layer ball implant provided in an embodiment.
[0024] In the picture:
[0025] 1. Ball assembly; 101. Bottom frame; 1011. Ball implant cavity; 1011a. Upper chamber; 1011b. Ball gap; 1011c. Lower chamber; 102. Top cover; 1021. Avoidance hole; 1022. Ball channel; 103. Sealing gasket;
[0026] 2. Rotating air inlet shaft; 201. Air inlet hole; 202. Inclined structure;
[0027] 3. Brush plate;
[0028] 4. Air inlet grille;
[0029] 5. Bearings. DETAILED DESCRIPTION
[0030] References to "embodiments" in this utility model mean that the specific features, structures, or characteristics described in conjunction with the embodiments may be included in at least one embodiment of the utility model. The appearance of the term "embodiment" in various places in the specification does not necessarily refer to the same embodiment, nor does it specifically limit its independence or relevance to other embodiments. In principle, in this utility model, as long as there are no technical contradictions or conflicts, the various technical features mentioned in the various embodiments can be combined in any manner to form a corresponding implementable technical solution.
[0031] Unless otherwise defined, the technical terms used herein have the same meanings as those generally understood by those skilled in the art to which the present invention belongs. The use of relevant terms herein is only for describing specific embodiments and is not intended to limit the present invention.
[0032] In the description of this utility model, the term "and / or" is used to describe a logical relationship between objects, indicating that three relationships can exist. For example, A and / or B means: A exists, B exists, and both A and B exist. In addition, the character " / " in this document generally indicates that the objects before and after are in a logical "or" relationship.
[0033] In the present invention, terms such as "first" and "second" are merely used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship of quantity, priority or sequence between these entities or operations.
[0034] Without further restrictions, in the present invention, the words "include", "comprise", "have" or other similar expressions used in sentences are intended to cover non-exclusive inclusion. These expressions do not exclude the presence of additional elements in the process, method or product including the elements, so that the process, method or product including a series of elements may include not only those limited elements, but also other elements not explicitly listed, or also include elements inherent to such process, method or product.
[0035] Consistent with the understanding in the Examination Guidelines, in this utility model, expressions such as "greater than," "less than," and "exceed" are understood to exclude the number itself; expressions such as "above," "below," and "within" are understood to include the number itself. Furthermore, in the description of the embodiments of this utility model, "multiple" means two or more (including two), and similar expressions related to "multiple," such as "multiple groups" and "multiple times," are also understood in this manner, unless otherwise specifically defined.
[0036] In the description of the embodiments of the present invention, the space-related expressions used, such as "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "vertical", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicate the orientation or position relationship based on the orientation or position relationship shown in the specific embodiments or drawings, and are only for the convenience of describing the specific embodiments of the present invention or facilitating the reader's understanding, and do not indicate or imply that the device or component referred to must have a specific position, a specific orientation, or be constructed or operated in a specific orientation. Therefore, it should not be understood as a limitation on the embodiments of the present invention.
[0037] Unless otherwise expressly specified or limited, in the description of the embodiments of the present invention, the terms "installed", "connected", "connected", "fixed", "set", etc. used should be understood in a broad sense. For example, the "connection" can be a fixed connection, a detachable connection, or an integrated setting; it can be a mechanical connection, an electrical connection, or a communication connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the technical field of the present invention, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific circumstances.
[0038] The utility model provides a Storm double-layer ball planting head, which is suitable for application scenarios in which solder balls are laid flat on substrates such as circuit boards or chips, and can effectively solve the problem of uneven ball planting easily caused by existing ball planting heads.
[0039] See also Figure 1 and Figure 2 The Storm double-layer ball planting head provided in this embodiment includes a ball assembly 1, a rotating air inlet shaft 2, and a brush disk 3.
[0040] Optionally, the ball assembly 1 includes a bottom frame 101 having the ball planting cavity 1011, and a top cover 102 located above the bottom frame 101. The top cover 102 covers the upper opening of the ball planting cavity 1011, so that only the lower end of the ball planting cavity 1011 is open. Furthermore, the top cover 102 is further provided with a central avoidance hole 1021 and an edge ball channel 1022.
[0041] Optionally, a sealing gasket 103 is provided between the bottom frame 101 and the top cover plate 102 to ensure airtightness between the bottom frame 101 and the top cover plate 102 .
[0042] The upper portion of the rotating air inlet shaft 2 is rotatably mounted in the avoidance hole 1021 via bearings 5 and other components, while the lower portion of the rotating air inlet shaft 2 extends into the ball implantation cavity 1011. The rotating air inlet shaft 2 is provided with an air inlet hole 201 that connects to the lower chamber 1011c. A ball-passing gap 1011b is provided between the rotating air inlet shaft 2 and the wall of the ball implantation cavity 1011 for the solder balls to pass through. The brush plate 3 is fixed to the bottom surface of the rotating air inlet shaft 2.
[0043] The Storm double-layer ball planting head provided in this embodiment, when ball planting is required, first place the Storm double-layer ball planting head above the substrate to be planted; then, the solder balls are fed into the Storm double-layer ball planting head through the ball channel 1022, and the solder balls will pass through the ball gap 1011b into the space below the brush plate 3; then, air is blown to the solder balls below the brush plate 3 through the air inlet hole 201, so that the solder balls achieve a preliminary uniform tiling effect; synchronously, the rotating air inlet shaft 2 is driven by a rotating drive mechanism such as a motor belt assembly to drive the brush plate 3 to rotate, and during the rotation of the brush plate 3, the stacked solder balls will be dispersed, so that the solder balls below the brush plate 3 are completely evenly spread out.
[0044] Therefore, the Storm double-layer ball planting head provided by the present invention can effectively solve the problem of uneven ball planting in existing ball planting heads.
[0045] Optionally, the lower portion of the rotating air inlet shaft 2 separates the ball planting cavity 1011 into an upper cavity 1011a and a lower cavity 1011c; wherein, the upper cavity 1011a and the lower cavity 1011c are connected through the ball gap 1011b.
[0046] When the length of the ball-passing gap 1011b is too long, the solder balls are easily clogged in the ball-passing gap 1011b. If the ball-passing gap 1011b is too short, the storage capacity of the ball-passing gap 1011b for the solder balls is insufficient, which limits the ball-adding speed at the goal channel 1022. In this embodiment, an upper chamber 1011a is provided between the ball-passing gap 1011b and the goal channel 1022 to store the solder balls. Each time the material is fed, the solder balls can be quickly and in large quantities fed into the upper chamber 1011a through the goal channel 1022; the solder balls in the upper chamber 1011a will then slowly pass through the ball gap 1011b and move downward to the bottom of the brush plate 3. This structural design can not only improve the feeding efficiency of the solder balls, but also avoid the problem of solder ball clogging caused by the excessive length of the ball-passing gap 1011b.
[0047] Furthermore, the surface of the rotating air inlet shaft 2 close to the upper chamber 1011a is a slope structure 202 that is inclined downward toward the cavity wall of the ball planting cavity 1011, so that the solder balls in the upper chamber 1011a can automatically move toward the ball gap 1011b under the action of gravity, thereby maintaining continuous ball delivery to the lower chamber 1011c.
[0048] In this embodiment, an air inlet grille 4 is located at the center of the bottom surface of the rotating air inlet shaft 2, covering the opening of the air inlet hole 201. Accordingly, the brush plate 3 is annular and fixed to the edge of the bottom surface of the rotating air inlet shaft 2. The air inlet grille 4 blocks the opening of the air inlet hole 201, preventing the solder balls in the lower chamber 1011c from moving upward through the air inlet hole 201 to the exterior of the Baofeng double-layer ball implant.
[0049] Optionally, the brush plate 3 is provided with anti-static bristles (such as polyester anti-static bristles, carbon fiber anti-static bristles or polypropylene anti-static bristles, etc.), thereby preventing the solder balls from adhering to the brush plate 3 due to electrostatic effects.
[0050] Optionally, the surface of the rotating air inlet shaft 2 is coated with an antistatic coating (such as a carbon-based coating, a polystyrene coating, a polypropylene coating or a polycarbonate coating, etc.) to prevent the solder balls from adhering to the rotating air inlet shaft 2 during the falling process.
[0051] In summary, the Storm double-layer ball implant provided in this embodiment has the following advantages:
[0052] ① The combined use of the rotating air inlet shaft 2 and the brush disk 3 can effectively and evenly spread the solder balls on a substrate such as a circuit board or chip, solving the problem of uneven ball placement with traditional ball placement heads. Furthermore, since the solder balls can be evenly distributed, the risk of missing solder balls in specific locations is reduced, thereby improving the success rate of ball placement.
[0053] ② The design of the upper chamber 1011a allows for rapid and large-scale feeding of solder balls without clogging the ball gap 1011b, thereby improving ball planting efficiency.
[0054] ③The structural design of central air supply and surrounding balls makes the air blowing more uniform, which is conducive to the dispersion and flattening of solder balls;
[0055] ④ The brush plate 3 and the rotating air inlet shaft 2 are both anti-statically designed, which can effectively prevent the solder balls from adhering to the brush plate 3 or the rotating air inlet shaft 2 due to the static effect, ensuring a smooth ball planting process.
[0056] Finally, it should be noted that although the above embodiments have been described in the specification and drawings of this application, this does not limit the scope of patent protection of this application. All technical solutions generated by replacing or modifying equivalent structures or equivalent processes based on the essential concepts of this application using the contents recorded in the specification and drawings of this application, as well as directly or indirectly implementing the technical solutions of the above embodiments in other related technical fields, are included in the scope of patent protection of this application.
Claims
1. A double-layer ball head, characterized by: include: A ball assembly (1), the ball assembly (1) being provided with a ball planting cavity (1011) opening downward, a avoidance hole (1021) communicating with the center position of the ball planting cavity (1011), and a ball channel (1022) communicating with the edge position of the ball planting cavity (1011); A rotating air inlet shaft (2), wherein the upper portion of the rotating air inlet shaft (2) is rotatably mounted in the avoidance hole (1021), and the lower portion of the rotating air inlet shaft (2) extends into the ball planting cavity (1011); wherein the rotating air inlet shaft (2) is provided with an air inlet hole (201) connected to the ball planting cavity (1011), and a ball-passing gap (1011b) for the solder ball to pass through is reserved between the rotating air inlet shaft (2) and the cavity wall of the ball planting cavity (1011); A brush plate (3), the brush plate (3) is located on the bottom surface of the rotating air inlet shaft (2).
2. The Baofeng double-layer ball implant according to claim 1, characterized in that: The lower portion of the rotating air inlet shaft (2) divides the ball planting cavity (1011) into an upper cavity (1011a) and a lower cavity (1011c); wherein the upper cavity (1011a) and the lower cavity (1011c) are connected via the ball gap (1011b).
3. The Baofeng double-layer ball implant according to claim 2, characterized in that: The surface of the rotating air inlet shaft (2) close to the upper chamber (1011a) is a slope structure (202) that is inclined downward toward the cavity wall of the ball planting cavity (1011).
4. The Baofeng double-layer ball implant according to claim 1, characterized in that: The brush disc (3) is annular in structure and is fixedly arranged at the edge of the bottom surface of the rotating air inlet shaft (2).
5. The Baofeng double-layer ball implant according to claim 1, characterized in that: An air inlet grille (4) for covering the opening of the air inlet hole (201) is provided at the center of the bottom surface of the rotating air inlet shaft (2).
6. The Baofeng double-layer ball implant according to claim 1, characterized in that: The brush disc (3) is provided with anti-static bristles.
7. The Baofeng double-layer ball implant according to claim 1, characterized in that: A bearing (5) is provided between the rotating air inlet shaft (2) and the ball assembly (1).
8. The Baofeng double-layer ball implant according to claim 1, characterized in that: The ball assembly (1) comprises a bottom frame (101) provided with the ball planting cavity (1011), and a top cover plate (102) located above the bottom frame (101) and provided with the avoidance hole (1021) and the ball channel (1022).
9. The Baofeng double-layer ball implant according to claim 8, characterized in that: A sealing gasket (103) is provided between the bottom frame (101) and the top cover plate (102).