Solder ball separating device for soft soldering

Abstract

The utility model relates to the technical field of welding, in particular to a solder ball separating device for soft soldering. Comprising a separation mechanism mounting plate, a lower cover plate is fixedly and hermetically mounted on the bottom surface of the separation mechanism mounting plate, a turntable is rotatably connected between the lower cover plate and the separation mechanism mounting plate, a solder ball conveying hole is formed in the turntable, a ball storage groove corresponding to the solder ball conveying hole is formed in the separation mechanism mounting plate, and solder balls are stored in the ball storage groove; the lower cover plate is provided with a solder ball falling hole corresponding to the solder ball conveying hole, the rotating disc is in transmission connection with a driving assembly, and the rotating disc is provided with a detection mechanism corresponding to the solder ball falling hole. In the process of transferring the solder balls from the ball storage groove to the solder ball falling hole one by one, the detection mechanism can accurately detect and control the rotating angle of the rotating disc, it is guaranteed that the rotating disc can accurately separate the solder balls and convey the solder balls to the solder ball falling hole, and then the solder balls accurately reach the focal point under a focusing lens through the solder ball falling hole; and the efficiency and the effect of soft soldering are ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of welding, in particular to a tin ball separation device used for soft soldering. Background Art

[0002] Microelectronics soldering technology primarily refers to the connection techniques used in the miniaturized design and manufacturing of electronic components and circuits. Microelectronics soldering serves two purposes when connecting two materials: achieving good electrical conductivity and achieving a durable, reliable mechanical connection. Soft soldering is the primary technique used in microelectronics soldering. It is a commonly used connection technique in fields such as electronics manufacturing and precision machining.

[0003] As electronic products are increasingly developing towards miniaturization, high density, and high performance, in order to achieve stable and reliable welding with miniaturized pads, we have proposed a laser-heated soft soldering device. The welding material used in this device is spherical solder, namely solder balls. In order to ensure the efficiency and effect of soft soldering, the solder balls need to be accurately separated and transported to the focal point under the focusing lens.

[0004] Therefore, how to accurately separate the solder balls and transport them to the focal point under the focusing lens is an urgent problem that needs to be solved by those skilled in the art. Utility Model Content

[0005] In order to accurately separate the solder balls and transport them to the focal point under the focusing mirror, the present application provides a solder ball separation device for soft soldering.

[0006] The present application provides a tin ball separation device for soft soldering, which adopts the following technical solution: it includes a separation mechanism mounting plate, a lower cover plate is fixedly and sealedly installed on the bottom surface of the separation mechanism mounting plate, a turntable is rotatably connected between the lower cover plate and the separation mechanism mounting plate, a tin ball delivery hole is provided on the turntable, a ball storage tank is provided on the separation mechanism mounting plate corresponding to the tin ball delivery hole, tin balls are stored in the ball storage tank, a tin ball dropping hole is provided on the lower cover plate corresponding to the tin ball delivery hole, a nozzle assembly is fixedly installed on the bottom surface of the lower cover plate, the nozzle assembly is communicated with the tin ball dropping hole, the turntable is transmission-connected with a drive assembly, a detection mechanism is provided on the turntable corresponding to the tin ball dropping hole, and the detection mechanism is connected to the drive assembly.

[0007] By adopting the above technical solution, the drive component can be used to rotate the turntable, and the turntable will drive the solder ball delivery hole to circulate between the ball storage tank and the solder ball dropping hole during the rotation process. When the solder ball delivery hole passes through the ball storage tank, the numerous solder balls stored inside the ball storage tank will fall into the solder ball delivery hole one by one. When the solder ball delivery hole passes through the solder ball dropping hole, the solder balls in the solder ball delivery hole will fall into the solder ball dropping hole. In the process of the turntable transferring the solder balls from the ball storage tank to the solder ball dropping hole one by one through the solder ball delivery hole, the detection mechanism can accurately detect and control the rotation angle of the turntable, ensuring that the turntable can accurately separate the solder balls and deliver them to the solder ball dropping hole, and then accurately reach the focus under the focusing lens through the solder ball dropping hole, thereby ensuring the efficiency and effect of soft soldering.

[0008] Furthermore, the nozzle assembly includes a nozzle base, which is fixedly connected to the bottom surface of the lower cover plate, and the nozzle is detachably connected to the nozzle base. A laser channel is provided on the nozzle base, and a tin ball sliding channel is provided on the nozzle base corresponding to the tin ball dropping hole. The tin ball sliding channel is connected to the laser channel, and the laser channel is coaxially connected to the nozzle.

[0009] Furthermore, the driving assembly includes a rotating motor, a shaft mounting hole is opened on the separation mechanism mounting plate, a shaft is sealed and rotatably connected inside the shaft mounting hole, and the shaft is connected to the rotating motor through a first coupling.

[0010] Furthermore, an air inlet hole is opened on the separation mechanism mounting plate, and a gas connector is fixedly and sealedly installed on the separation mechanism mounting plate corresponding to the air inlet hole. The end of the gas connector away from the separation mechanism mounting plate is connected to a pressure gauge, a proportional valve, a solenoid valve, an oil mist separator, and an air source in sequence.

[0011] Furthermore, a ball storage bin is fixedly installed on the separation mechanism mounting plate corresponding to the ball storage groove, the interior of the ball storage bin is filled with tin balls, the ball storage bin is sealed and connected to the ball storage groove, and the end of the ball storage bin away from the separation mechanism mounting plate is sealed and connected to a bin cover.

[0012] Furthermore, the detection mechanism includes a first detection hole, which is opened on the separation mechanism mounting plate, a second detection hole is opened on the lower cover corresponding to the first detection hole, a turntable detection hole is opened on the turntable corresponding to the solder ball delivery hole, the turntable detection hole is located between the first detection hole and the second detection hole, and a detection component is provided between the first detection hole and the second detection hole corresponding to the turntable detection hole.

[0013] Furthermore, the detection component includes an optical fiber sensor transmitting end and an optical fiber sensor receiving end. The optical fiber sensor receiving end is fixedly and sealedly installed on the separation mechanism mounting plate at a position corresponding to the first detection hole, and the optical fiber sensor transmitting end is fixedly and sealed inside the second detection hole.

[0014] Furthermore, the first detection hole and the second detection hole are coaxially arranged.

[0015] Furthermore, the rotating motor is connected to a rotation control program, and the rotation control program is connected to the transmitting end of the optical fiber sensor and the receiving end of the optical fiber sensor.

[0016] Furthermore, the turntable detection holes and the solder ball delivery holes are both evenly distributed in a ring shape.

[0017] Beneficial effects achieved:

[0018] The present application utilizes a driving component to rotate the turntable, and the turntable will drive the solder ball delivery hole to circulate between the ball storage tank and the solder ball dropping hole during the rotation. When the solder ball delivery hole passes through the ball storage tank, the numerous solder balls stored inside the ball storage tank will fall into the solder ball delivery hole one by one. When the solder ball delivery hole passes through the solder ball dropping hole, the solder balls in the solder ball delivery hole will fall into the solder ball dropping hole. In the process of the turntable transferring the solder balls from the ball storage tank to the solder ball dropping hole one by one through the solder ball delivery hole, the detection mechanism can accurately detect and control the rotation angle of the turntable, ensuring that the turntable can accurately separate and deliver the solder balls to the solder ball dropping hole, and then accurately reach the focus under the focusing lens through the solder ball dropping hole, thereby ensuring the efficiency and effect of soft soldering. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application.

[0020] Figure 2 It is a schematic diagram of the structural decomposition of an embodiment of the present application.

[0021] Figure 3 This is a schematic diagram of the installation structure of a separation mechanism mounting plate according to an embodiment of the present application.

[0022] Figure 4 This is a schematic diagram of the installation structure of the lower cover plate in one embodiment of the present application.

[0023] Figure 5 This is a schematic diagram of the installation structure of a turntable according to an embodiment of the present application.

[0024] Figure 6This is a schematic diagram of the installation structure of a nozzle according to an embodiment of the present application.

[0025] Figure 7 It is a schematic diagram of the internal structure of an embodiment of the present application.

[0026] Figure 8 It is a structural schematic diagram of an air intake assembly according to an embodiment of the present application.

[0027] Explanation of reference numerals: 1101, bin cover; 1102, ball storage bin; 1103, ball storage tank; 1104, upper component laser through hole; 1106, air inlet hole; 1107, gas connector; 1108, first detection hole; 1109, shaft mounting hole; 1112, optical fiber sensor receiving end; 1114, separation mechanism mounting plate; 1201, annular pad; 1204, lower cover; 1205, solder ball drop hole; 1206, lower component laser through hole; 1207, second detection hole; 1210, solder ball runway; 1211, optical fiber sensor transmitting end; 1212, exhaust pipe; 1301, rotating motor; 1302, first coupling; 130 3. Rotating shaft; 1304. Turntable; 1308. Turntable detection hole; 1309. Solder ball delivery hole; 1310. Solder ball adsorption hole; 1311. Arc-shaped air guide groove; 1312. Air guide hole; 140. Nozzle assembly; 1401. Nozzle base; 1403. Nozzle nut; 1404. Nozzle; 1405. Laser channel; 1407. Solder ball sliding channel; 1406. Air inlet channel; 150. Suction assembly; 1501. Mounting shell; 1502. Exhaust net; 1503. Exhaust frame; 1504. Exhaust motor; 1505. Exhaust fan blade; 1506. Air guide cover; 200. Optical path system; 210. Protective mirror; 211. Protective mirror frame. DETAILED DESCRIPTION

[0028] The following is combined with Figure 1-8 This application is described in further detail.

[0029] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate the description of the present invention and simplify the description. They do not indicate or imply that the devices or components referred to must have a specific orientation, be constructed, or operate in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0030] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections or electrical connections; direct connections or indirect connections through an intermediate medium; and internal connections between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on the specific circumstances.

[0031] The embodiment of the present application discloses a solder ball separation device for soft soldering.

[0032] Please refer to Figure 1 and Figure 2 In one embodiment of the present application, a tin ball separation device for soft soldering includes a separation mechanism mounting plate 1114, the separation mechanism mounting plate 1114 is provided with an upper component laser through-hole 1104, a protective mirror frame 211 is sealed and installed at a position corresponding to the upper component laser through-hole 1104 on the separation mechanism mounting plate 1114, a protective mirror 210 is sealed and installed inside the protective mirror frame 211, and an optical path system 200 is provided at the upper end of the protective mirror frame 211, which can transmit the light beam emitted by the laser to the upper component laser through-hole 1104 through the protective mirror 210.

[0033] Please refer to Figure 2 and Figure 3 In a specific embodiment of the present application, the protective lens frame 211 is cylindrically arranged. The cylindrical arrangement of the protective lens frame 211 can reduce the amount of dust that falls on the surface of the protective lens 210. The protective lens 210 is configured as a flat lens, and its upper and lower surfaces are coated with an anti-reflection film for the wavelength of the laser used to increase the transmittance of the laser and reduce laser loss. During operation, the protective lens 210 can allow the laser beam to pass through the protective lens with low loss and enter the interior of the solder ball separation device, while preventing dust from entering the interior of the solder ball separation device. The protective lens 210 is contaminated and can be easily disassembled and replaced.

[0034] Please refer to Figure 2 and Figure 3In one embodiment of the present application, a ball storage slot 1103 is defined on the separation mechanism mounting plate 1114. A ball storage bin 1102 is fixedly mounted on the separation mechanism mounting plate 1114 corresponding to the ball storage slot 1103. The bin 1102 is sealedly connected to the bin 1103. A bin cover 1101 is sealedly connected to the end of the bin 1102 facing away from the separation mechanism mounting plate 1114. The bin 1102 is filled with tin balls, which are spherical solders. These can be made of a variety of materials, including lead-containing and lead-free solder. Common solder compositions include Au80Sn20, Sn3Ag, Sn3Ag0.5Cu, Sn9Zn, and Sn63Pb37. The diameter of the tin balls ranges from 50µm to 2000µm, with a diameter tolerance within ±1-3% (depending on the diameter of the balls), resulting in a volume tolerance of ±3-9%. Solder balls do not contain flux (brazing agent), so this method eliminates contamination caused by flux splashing during the heating process. It also eliminates the need for post-solder flux cleaning. Solder balls are a common material in the semiconductor packaging and electronics assembly industries and are readily available.

[0035] Please refer to Figure 2 and Figure 3 In one embodiment of the present application, a gas inlet hole 1106 is formed on the separation mechanism mounting plate 1114. A gas connector 1107 is fixedly and sealedly mounted on the separation mechanism mounting plate 1114 corresponding to the gas inlet hole 1106. The end of the gas connector 1107, remote from the separation mechanism mounting plate 1114, is connected in sequence to a pressure gauge, a proportional valve, a solenoid valve, an oil mist separator, and a gas source. The gas source uses high-purity inert gas, such as argon, nitrogen, or carbon dioxide, with a purity exceeding 99%. The oil mist separator removes impurities such as oil, water, and foreign matter from the gas. The solenoid valve opens and closes the valve based on an electrical signal, thereby switching the gas on and off. The electric proportional valve adjusts the gas pressure based on the magnitude of the control signal. The electric proportional valve controls the gas pressure via an electrical signal, enabling continuous and stepless regulation of the gas pressure. It can be remotely controlled or program-controlled. Its characteristic is that the output varies with the input (current or voltage), maintaining a proportional relationship between the output and input. The purpose of a pressure gauge is to digitally display the input gas pressure, making it easy to read the pressure value. A differential pressure sensor can detect the input gas pressure in real time and compare it with the atmospheric pressure. The difference is output as a current or voltage, thus enabling real-time detection of the difference between the input gas pressure and the atmospheric pressure.

[0036] Please refer to Figure 2 and Figure 3In one embodiment of the present application, a first detection hole 1108 is opened on the separation mechanism mounting plate 1114 , and a fiber optic sensor receiving end 1112 is fixedly and sealedly installed on the separation mechanism mounting plate 1114 corresponding to the first detection hole 1108 .

[0037] Please refer to Figure 2 and Figure 4 In one embodiment of the present application, a lower cover plate 1204 is fixedly connected to the bottom surface of the separation mechanism mounting plate 1114, and an annular gasket 1201 is sealed between the lower cover plate 1204 and the separation mechanism mounting plate 1114. A lower component laser through-hole 1206 is defined on the lower cover plate 1204, corresponding to the upper component laser through-hole 1104. A second detection hole 1207 is defined on the lower cover plate 1204, corresponding to the first detection hole 1108. A fiber optic sensor transmitting end 1211 is fixedly and sealedly installed within the second detection hole 1207. A solder ball runway 1210 is defined on the lower cover plate 1204, corresponding to the ball storage bin 1102, and a solder ball drop hole 1205 is defined on the solder ball runway 1210. An exhaust pipe 1212 connected to the lower component laser through hole 1206 is installed on the side of the lower cover plate 1204. The end of the exhaust pipe 1212 away from the lower cover plate 1204 is connected to a pressure difference sensor, which is connected to a control program, and the control program is connected to the laser control.

[0038] Please refer to Figure 2 and Figure 4 In one embodiment of the present application, the first detection hole 1108 and the second detection hole 1207 are coaxially arranged so that the optical fiber sensor receiving end 1112 can receive the light beam energy of the optical fiber sensor transmitting end 1211. Therefore, in other embodiments of the present application, the optical fiber sensor receiving end 1112 can also be installed in the second detection hole 1207, and the optical fiber sensor transmitting end 1211 can be correspondingly installed inside the first detection hole 1108.

[0039] Please refer to Figure 2 and Figure 5In one embodiment of the present application, a shaft mounting hole 1109 is opened on the separation mechanism mounting plate 1114, and a shaft 1303 is sealed and rotatably connected inside the shaft mounting hole 1109. A first coupling 1302 is fixedly installed on one end of the shaft 1303 located outside the separation mechanism mounting plate 1114, and a rotating motor 1301 is transmission-connected to the end of the first coupling 1302 away from the rotating shaft 1303. The rotating motor 1301 is connected to a rotation control program, and the rotation control program is connected to the optical fiber sensor transmitting end 1211 and the optical fiber sensor receiving end 1112. One end of the rotating shaft 1303 located inside the separation mechanism mounting plate 1114 is fixedly connected to a turntable 1304. The turntable 1304 is rotatably installed between the lower cover plate 1204 and the separation mechanism mounting plate 1114 and located inside the annular pad 1201. A tin ball conveying hole 1309 is opened on the turntable 1304 corresponding to the tin ball runway 1210, and a turntable detection hole 1308 is opened on the turntable 1304 corresponding to the tin ball conveying hole 1309. There are multiple turntable detection holes 1308 and tin ball conveying holes 1309 evenly distributed in a ring shape. The turntable detection hole 1308 is located between the first detection hole 1108 and the second detection hole 1207.

[0040] Please refer to Figure 2 and Figure 6 In one embodiment of the present application, a nozzle base 1401 is fixedly installed on the bottom surface of the lower cover plate 1204, and a nozzle 1404 is detachably connected to the nozzle base 1401. The nozzle 1404 is detachably mounted on the nozzle base 1401 through a nozzle nut 1403. A laser channel 1405 is provided on the nozzle base 1401 and is sealed and connected to the laser through-hole 1206 of the lower component. The laser channel 1405 is coaxially connected to the nozzle 1404. A tin ball sliding channel 1407 is provided on the nozzle base 1401 corresponding to the tin ball falling hole 1205. The tin ball sliding channel 1407 is connected to the laser channel 1405. An air inlet channel 1406 is provided on the nozzle base 1401 corresponding to the air inlet hole 1106, and the air inlet channel 1406 is connected to the laser channel 1405.

[0041] Please refer to Figure 2 and Figure 7In one embodiment of the present application, a tin ball adsorption hole 1310 is opened inside the turntable 1304 and is connected to the tin ball feeding hole 1309. The aperture of the tin ball adsorption hole 1310 is smaller than the diameter of the tin ball. The end of the tin ball adsorption hole 1310 away from the tin ball feeding hole 1309 passes through the lower surface of the turntable 1304. The upper surface of the lower cover 1204 is sealed and slidably connected to the lower surface of the turntable 1304. The upper surface of the turntable 1304 is sealed and slidably connected to the lower surface of the separation mechanism mounting plate 1114. The lower cover 1204 is sealed and slidably connected to the lower surface of the separation mechanism mounting plate 1114. An arc-shaped air guide groove 1311 is provided on the upper surface of 204 corresponding to the tin ball adsorption hole 1310. One end of the arc-shaped air guide groove 1311 starts at a position corresponding to the ball storage groove 1103, and the other end of the arc-shaped air guide groove 1311 ends at a position corresponding to the tin ball dropping hole 1205. An air guide hole 1312 that passes through the lower cover plate 1204 is provided inside the arc-shaped air guide groove 1311. An air suction component 150 is fixedly connected to the lower surface of the lower cover plate 1204, and the air suction component 150 is sealed and connected to the air guide hole 1312.

[0042] Please refer to Figure 7 and Figure 8 In one embodiment of the present application, the air suction component 150 includes a mounting shell 1501, which is fixedly mounted on the lower surface of the lower cover plate 1204 by means of a flange structure and screw-locked. The bottom of the mounting shell 1501 is fixedly connected to an exhaust net 1502, and an exhaust rack 1503 is fixedly mounted inside the mounting shell 1501. An exhaust motor 1504 is fixedly connected to the exhaust rack 1503, and an exhaust fan blade 1505 is mounted on the exhaust motor 1504. An air guide cover 1506 is fixedly and sealedly connected to the upper part of the exhaust fan blade 1505 inside the mounting shell 1501, and the top of the air guide cover 1506 is sealed and connected to the air guide hole 1312. The exhaust motor 1504 can drive the exhaust fan blades 1505 to rotate. When the exhaust fan blades 1505 rotate, the gas inside the air guide cover 1506 and the air guide hole 1312 will be discharged from the exhaust net 1502, and a negative pressure will be formed inside the air guide hole 1312, the arc-shaped air guide groove 1311 and the tin ball adsorption hole 1310, and then the tin balls falling into the tin ball delivery hole 1309 will be adsorbed at the intersection of the tin ball adsorption hole 1310 and the tin ball delivery hole 1309, so as to prevent the tin balls from rubbing against the upper surface of the lower cover 1204 and causing wear.

[0043] The implementation principle of a solder ball separation device for soldering in the embodiment of the present application is as follows:

[0044] During operation, solder balls are first poured into the ball storage bin 1102 and accumulated in the ball storage tank 1103. Before the solder balls enter the ball storage tank 1103, the solder ball delivery holes 1309 below the ball storage tank 1103 are all empty. When the solder balls enter the ball storage tank 1103 and accumulate there, several solder ball delivery holes 1309 below the ball storage tank 1103 just fall into them.

[0045] After the solder ball falls into the solder ball delivery hole 1309, the suction component 150 is started to adsorb the solder ball at the intersection of the solder ball adsorption hole 1310 and the solder ball delivery hole 1309, and then the rotation motor 1301 is controlled by the program to slowly drive the turntable 1304 to rotate. During the rotation of the turntable 1304, the solder ball can be prevented from moving inside the solder ball delivery hole 1309, thereby avoiding friction between the solder ball and the upper surface of the lower cover 1204 or the side wall of the solder ball delivery hole 1309 to cause wear.

[0046] When detection hole 1308 on the turntable 1304 is aligned with first detection hole 1108 and second detection hole 1207, the optical fiber sensor receiving end 1112 is aligned with the optical fiber sensor transmitting end 1211. The beam energy received by optical fiber sensor receiving end 1112 is maximized, indicating that solder ball delivery hole 1309 is aligned with solder ball drop hole 1205 of the lower assembly. The optical fiber sensor transmits the alignment signal to the rotation control program, which in turn controls the rotation motor 1301 to pause. Simultaneously, the corresponding solder ball suction hole 1310 leaves the arc-shaped air guide groove 1311, disconnecting the air suction assembly 150 from the solder ball suction hole 1310. The solder ball then falls from solder ball delivery hole 1309 into solder ball drop hole 1205 of the lower assembly, leaving the solder ball delivery hole 1309 empty. The motor 1301 is continuously rotated by a fixed angle a through program control. At this time, the next solder ball delivery hole 1309 is aligned with the solder ball drop hole 1205 of the lower component, and the second solder ball falls.

[0047] As the turntable 1304 rotates, empty solder ball delivery holes 1309 continuously enter the area below the ball storage tank 1103. Therefore, the solder balls accumulated in the ball storage tank 1103 fall into the solder ball delivery holes 1309 one by one, and follow the solder ball delivery holes 1309 to rotate in the solder ball runway 1210 area of ​​the lower cover plate. When the solder ball delivery hole 1309 coincides with the solder ball drop hole 1205 of the lower component, the solder ball falls into the solder ball drop hole 1205 of the lower component, and then falls into the solder ball sliding channel 1407 on the nozzle assembly 140, slides downward along the solder ball sliding channel 1407, and then falls into the nozzle 1404, and just stops at the lower end outlet of the nozzle 1404.

[0048] When the solder ball stops at the lower outlet of the nozzle 1404, the focus formed by the laser beam emitted by the optical system 200 coincides with the center of the solder ball staying at the lower outlet of the nozzle 1404. Therefore, the high-energy density laser at the focus heats the solder ball, and the solder ball melts due to the heat. After melting, the liquid solder ball changes its shape and can be ejected from the outlet at the lower end of the nozzle 1404. At this time, the laser heating is stopped, and the lower outlet of the nozzle 1404 is facing the solder pad of the processed product. Therefore, the liquid solder ball falls on the solder pad of the processed product and immediately begins to cool and re-solidify, forming a re-solid spherical solder joint on the solder pad of the processed product, thereby completing the welding process.

[0049] After the solder ball melts, it is ejected from the outlet at the lower end of the nozzle 1404 by the power of the inert gas. The inert gas continuously enters from the air inlet 1106 and reaches the top of the turntable 1304. When there is a solder ball in the solder ball delivery hole 1309, the inert gas can exert a downward force on the solder ball, making it easier for the solder ball to fall into the lower component solder ball drop hole 1205 and continue to fall downward.

[0050] When the solder ball slides into the nozzle 1404 on the nozzle assembly 140, the diameter of the lower outlet of the nozzle 1404 is equal to or slightly smaller than the diameter of the solder ball, and the solder ball stops here. At this time, a closed cavity is formed inside the entire solder ball separation device. Since the inert gas continuously flows into the solder ball separation device, the air pressure inside the solder ball separation device rises. The rising air pressure inside the solder ball separation device will transmit the air pressure to the differential pressure sensor through the exhaust pipe 1212. The differential pressure sensor senses that its internal pressure is greater than the external atmospheric pressure and will send a signal to the control program. The control program immediately controls the laser to emit a laser beam to heat the solder ball. The solder ball is liquefied and deformed after being heated. The process of the solder ball being heated and liquefied is protected by the inert gas to prevent the solder ball from reacting with oxygen in the air and oxidizing during laser heating.

[0051] After the solder ball is liquefied and deformed by heat, it falls from the lower end outlet of nozzle 1404. The inert gas inside the solder ball separation device escapes from nozzle 1404. Because the distance between nozzle 1404 and the solder pad of the processed product is very small, generally less than 1 mm, the inert gas escaping from the nozzle will be sprayed onto the solder pad of the processed product. Because the liquid solder ball is still protected by the inert gas when cooling at the solder pad position of the processed product, it is prevented from reacting with oxygen in the air and oxidizing.

[0052] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. A solder ball separation device for soldering, characterized in that: The invention comprises a separation mechanism mounting plate (1114), a lower cover plate (1204) is fixedly and sealedly mounted on the bottom surface of the separation mechanism mounting plate (1114), a turntable (1304) is rotatably connected between the lower cover plate (1204) and the separation mechanism mounting plate (1114), a tin ball conveying hole (1309) is provided on the turntable (1304), a ball storage groove (1103) is provided on the separation mechanism mounting plate (1114) corresponding to the tin ball conveying hole (1309), and the ball storage groove (1103) ) stores tin balls inside, a tin ball dropping hole (1205) is provided on the lower cover (1204) corresponding to the tin ball delivery hole (1309), a nozzle assembly (140) is fixedly installed on the bottom surface of the lower cover (1204), the nozzle assembly (140) is connected to the tin ball dropping hole (1205), the turntable (1304) is transmission-connected with a drive assembly, a detection mechanism is provided on the turntable (1304) corresponding to the tin ball dropping hole (1205), and the detection mechanism is connected to the drive assembly.

2. The solder ball separation device for soldering according to claim 1, characterized in that: The nozzle assembly (140) includes a nozzle base (1401), which is fixedly connected to the bottom surface of the lower cover (1204), and the nozzle (1404) is detachably connected to the nozzle base (1401). A laser channel (1405) is provided on the nozzle base (1401), and a tin ball sliding channel (1407) is provided on the nozzle base (1401) corresponding to the tin ball dropping hole (1205). The tin ball sliding channel (1407) is connected to the laser channel (1405), and the laser channel (1405) is coaxially connected to the nozzle (1404).

3. The solder ball separation device for soldering according to claim 1, characterized in that: The driving assembly comprises a rotating motor (1301), a rotating shaft mounting hole (1109) is provided on the separation mechanism mounting plate (1114), a rotating shaft (1303) is sealed and rotatably connected inside the rotating shaft mounting hole (1109), and the rotating shaft (1303) is transmission-connected to the rotating motor (1301) via a first coupling (1302).

4. The solder ball separation device for soldering according to claim 1, characterized in that: An air inlet hole (1106) is provided on the separation mechanism mounting plate (1114), and a gas connector (1107) is fixedly and sealedly installed on the separation mechanism mounting plate (1114) corresponding to the air inlet hole (1106). The end of the gas connector (1107) away from the separation mechanism mounting plate (1114) is connected in sequence to a pressure gauge, a proportional valve, a solenoid valve, an oil mist separator, and a gas source.

5. The solder ball separation device for soldering according to claim 1, characterized in that: A ball storage bin (1102) is fixedly mounted on the separation mechanism mounting plate (1114) corresponding to the ball storage groove (1103), the ball storage bin (1102) is filled with tin balls, the ball storage bin (1102) is sealed and connected to the ball storage groove (1103), and a bin cover (1101) is sealed and connected to one end of the ball storage bin (1102) away from the separation mechanism mounting plate (1114).

6. The solder ball separation device for soldering according to claim 3, characterized in that: The detection mechanism includes a first detection hole (1108), the first detection hole (1108) is opened on the separation mechanism mounting plate (1114), a second detection hole (1207) is opened on the lower cover (1204) corresponding to the first detection hole (1108), a turntable detection hole (1308) is opened on the turntable (1304) corresponding to the solder ball conveying hole (1309), the turntable detection hole (1308) is located between the first detection hole (1108) and the second detection hole (1207), and a detection component is provided between the first detection hole (1108) and the second detection hole (1207) corresponding to the turntable detection hole (1308).

7. The solder ball separation device for soldering according to claim 6, characterized in that: The detection assembly comprises an optical fiber sensor transmitting end (1211) and an optical fiber sensor receiving end (1112); the optical fiber sensor receiving end (1112) is fixedly and sealedly mounted on the separation mechanism mounting plate (1114) at a position corresponding to the first detection hole (1108); and the optical fiber sensor transmitting end (1211) is fixedly and sealedly mounted inside the second detection hole (1207).

8. The solder ball separation device for soldering according to claim 7, characterized in that: The first detection hole (1108) and the second detection hole (1207) are coaxially arranged.

9. The solder ball separation device for soldering according to claim 7, characterized in that: The rotating motor (1301) is connected to a rotation control program, and the rotation control program is connected to the optical fiber sensor transmitting end (1211) and the optical fiber sensor receiving end (1112).

10. A solder ball separation device for soldering according to any one of claims 6 to 9, characterized in that: The turntable detection holes (1308) and the solder ball delivery holes (1309) are both evenly distributed in a ring shape.

Images