Rapid alignment device for BGA chip repair equipment

Abstract

The utility model relates to the technical field of chip processing, in particular to a rapid alignment device for BGA chip repair equipment. Comprising a mounting seat, an adsorption assembly, an objective table and an alignment assembly, the adsorption assembly is used for adsorbing the BGA chip and can move on the mounting base in the Z direction; the objective table is used for placing a PCB, and the objective table can rotate on the mounting seat; the alignment assembly can move on the mounting base in the X direction; the alignment assembly comprises a shell, a reflector and a camera; the reflector and the camera are oppositely arranged, diffuse reflection light of the BGA chip and diffuse reflection light of the PCB can both be incident to the reflector, an image of the BGA chip and an image of the PCB reflected by the reflector can be received by the camera, and when an identification area of the image of the BGA chip received by the camera is matched with an identification area of the image of the PCB, the adsorption assembly is moved in the Z direction, and the BGA chip and the PCB are adsorbed by the adsorption assembly. Therefore, the BGA chip adsorbed on the adsorption assembly is arranged right above the PCB. Therefore, the BGA chip and the PCB are successfully aligned.

Description

Technical Field

[0001] The utility model relates to the technical field of chip processing, in particular to a fast alignment device for BGA chip repair equipment. Background Art

[0002] BGA chip rework equipment can solder BGA chips to PCB boards to improve the soldering efficiency of chips on PCB boards.

[0003] When using BGA chip rework equipment to solder chips, the BGA chip is sucked by the suction tube of the suction assembly, and then the suction assembly is controlled to move vertically to move the BGA chip above the PCB board, and then the BGA chip and PCB board are soldered. During the above BGA chip placement process on the PCB board, the BGA chip is easily misaligned due to the deviation in the placement angle of the BGA chip, which in turn reduces the soldering efficiency of the BGA chip and PCB board. Utility Model Content

[0004] The technical problem to be solved by the embodiment of the present utility model is to provide a fast alignment device for BGA chip rework equipment to solve the problem in the prior art that the chip and the PCB board are easily misaligned during the process of setting the chip on the PCB board, thereby reducing the processing efficiency of the BGA chip.

[0005] The utility model discloses a fast alignment device for BGA chip rework equipment, comprising: a mounting seat, an adsorption component, a stage and an alignment component, wherein the adsorption component is arranged on the mounting seat, the adsorption component is used to adsorb the BGA chip, and the adsorption component can move on the mounting seat along the Z direction; the stage is arranged on the mounting seat, the stage is used to place the PCB board, and the stage can rotate on the mounting seat; the alignment component is arranged on the mounting seat, the alignment component can move on the mounting seat along the X direction so that the alignment component can move between the stage and the adsorption component; The alignment component includes a shell and a reflector and a camera arranged in the shell, and the shell is arranged on the mounting seat; the reflector and the camera are arranged opposite to each other, and the diffuse reflected light of the BGA chip and the diffuse reflected light of the PCB board can both be incident on the reflector, and the image of the BGA chip and the image of the PCB board reflected by the reflector can be received by the camera. When the identification area of ​​the image of the BGA chip received by the camera matches the identification area of ​​the image of the PCB board, the adsorption component is moved along the Z direction so that the BGA chip adsorbed on the adsorption component is located directly above the PCB board.

[0006] Optionally, a first linear module, a second linear module and a drive motor are provided on the mounting seat; the adsorption component is provided on the first linear module, and the first linear module is used to drive the adsorption component to move along the Z direction on the mounting seat; the alignment component is provided on the second linear module, and the second linear module is used to drive the alignment component to move along the X direction on the mounting seat; the worktable is provided on the drive motor, and the drive motor is used to drive the worktable to rotate on the mounting seat.

[0007] Optionally, a accommodating cavity having a first light port and a second light port is formed on the shell, the first light port and the second light port are respectively located on opposite sides of the shell, and the first light port is set toward the adsorption component, and the second light port is set toward the stage, the reflector and the camera are both arranged in the accommodating cavity, and the reflector is located between the first light port and the second light port.

[0008] Optionally, LED ring light strips are respectively provided around the first light port and the second light port to adjust the brightness of the light irradiated on the BGA chip and the PCB board, and control the clarity of the image of the first reflected light and the image of the second reflected light received by the camera.

[0009] Optionally, a first material tray is provided on one side of the housing, and solder is placed in the first material tray.

[0010] Optionally, a second material tray is provided on one side of the housing, the first material tray and the second material tray are distributed on both sides of the housing along the X direction, and the second material tray is used for placing soldering flux.

[0011] Optionally, the adsorption component includes a mounting frame, a heating component, a guide member and an adsorption tube, and the mounting frame is arranged on the first linear module; the heating component includes an air supply component and a heater, and the air supply component and the heater are both arranged on the mounting frame, and the air supply component is used to generate an air flow to blow the heat generated in the heater to form a hot air flow; the guide member is arranged on the side of the mounting frame close to the heater, and an air inlet and an air outlet are formed on the guide member, and the air inlet is connected to the heater; the adsorption tube is inserted into the mounting frame, passes through the heating component and the guide member in sequence and extends along the air outlet, and the end of the adsorption tube close to the air outlet is used to adsorb the BGA chip.

[0012] Optionally, the air supply assembly includes a second shell, a first air supply and a second air supply, the second shell is arranged on the mounting bracket, and a storage space with a third opening and a fourth opening arranged opposite to each other is formed on the second shell, the first air supply is arranged on the third opening, and the second air supply is arranged on the fourth opening, and the heater is located between the first air supply and the second air supply and is connected to the storage space.

[0013] Optionally, the heater includes a first shell, which forms a accommodating cavity having a first opening and a second opening. At least one heating plate is provided on the first shell, and a heating wire is embedded in the heating plate. The first opening is connected to the accommodating space, and the second opening is connected to the air inlet.

[0014] Optionally, the reflector is formed with a first reflecting surface and a second reflecting surface, the first reflecting surface is arranged close to the first light port, and the second reflecting surface is arranged close to the second light port, the diffuse reflected light of the BGA chip can be incident on the first reflecting surface, and the image of the BGA chip reflected by the first reflecting surface is received by the camera, and the diffuse reflected light of the PCB board can be incident on the second reflecting surface, and the image of the BGA chip reflected by the second reflecting surface is received by the camera.

[0015] Compared with the prior art, the BGA chip rework equipment quick alignment device provided by the embodiment of the utility model has the following beneficial effects: the setting of the mounting seat provides a setting environment for the adsorption component, the stage, and the alignment component; the adsorption component is arranged on the mounting seat, and the BGA chip is adsorbed by the adsorption component; the stage is arranged on the mounting seat for placing the PCB board; the alignment component is arranged on the mounting seat, and the alignment component can move on the mounting seat along the X direction so that the alignment component can be moved between the stage and the adsorption component; further, the alignment component includes a housing and a reflector and a camera arranged in the housing; BGA chip is adsorbed by the adsorption component; the stage is arranged on the mounting seat for placing the PCB board; the alignment component is arranged on the mounting seat; the alignment component can move on the mounting seat along the X direction so that the alignment component can be moved between the stage and the adsorption component; further, the alignment component includes a housing and a reflector and a camera arranged in the housing; The diffusely reflected light of the BGA chip can be incident on the reflector, and the image of the BGA chip reflected by the reflector can be received by the camera. The diffusely reflected light of the PCB board can be incident on the reflector, and the image of the PCB board reflected by the reflector can be received by the camera. The stage is rotated to adjust the angle of the PCB board on the stage. When the identification area of ​​the image of the BGA chip received by the camera matches the identification area of ​​the image of the PCB board, it means that the BGA chip and the PCB board are successfully aligned. The adsorption component is moved along the Z direction so that the BGA chip adsorbed on the adsorption component is located directly above the PCB board. The above setting of the alignment component can successfully align the BGA chip and the PCB board, so that the BGA chip and the PCB board are matched, thereby improving the welding efficiency of the BGA chip and the PCB board. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments, in which:

[0017] Figure 1 This is a schematic diagram of the overall structure of the BGA chip repair equipment fast alignment device provided by the embodiment of the utility model;

[0018] Figure 2 This is a diagram showing the coordination structure of the reflector, BGA chip, PCB board and camera provided by an embodiment of the present utility model;

[0019] Figure 3 This is a schematic diagram of the overall structure of the alignment assembly provided by an embodiment of the present utility model;

[0020] Figure 4 It is a schematic diagram of the housing and its internal structure provided by an embodiment of the present utility model;

[0021] Figure 5 It is a structural diagram of the adsorption assembly provided by an embodiment of the utility model;

[0022] Figure 6 This is a schematic structural diagram of a heating assembly provided by an embodiment of the present utility model;

[0023] Figure 7 It is a structural schematic diagram of a heater provided in an embodiment of the present utility model.

[0024] The reference numerals in the figures are:

[0025] 10. Mounting base; 110. First linear module; 120. Second linear module; 20. Adsorption assembly; 201. Protective cover; 210. Mounting bracket; 220. Heating assembly; 221. Air supply assembly; 2211. Second housing; 2212. First air supply; 2213. Second air supply; 222. Heater; 2221. First housing; 2222. Heating plate; 2223. First opening; 2224. Second opening; 230. Air guide; 231 , first air guide shell; 232, second air guide shell; 2301, air inlet; 2302, air outlet; 240, adsorption tube; 30, stage; 40, alignment component; 410, housing; 4101, first optical port; 4101, second optical port; 420, reflector; 421, first reflecting surface; 422, second reflecting surface; 430, camera; 510, first material tray; 520, second material tray; 610, BGA chip; 620, PCB board. DETAILED DESCRIPTION

[0026] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. Now, in conjunction with the accompanying drawings, a detailed description of the preferred embodiments of the present utility model will be given.

[0027] The present invention provides a BGA chip repair equipment fast alignment device, such as Figures 1 to 4 As shown, it includes: a mounting base 10, an adsorption component 20, a stage 30 and an alignment component 40, the adsorption component 20 is provided on the mounting base 10, the adsorption component 20 is used to adsorb the BGA chip 610, and the adsorption component 20 can move on the mounting base 10 along the Z direction; the stage 30 is provided on the mounting base 10, the stage 30 is used to place the PCB board 620, and the stage 30 can rotate on the mounting base 10; the alignment component 40 is provided on the mounting base 10, and the alignment component 40 can move on the mounting base 10 along the X direction so that the alignment component 40 can move between the stage 30 and the adsorption component 20; the alignment component 40 includes a shell 410 and a shell 410 provided on the shell 41 0, and the housing 410 is arranged on the mounting base 10; the reflector 420 and the camera 430 are arranged opposite to each other, and the diffuse reflected light of the BGA chip 610 and the diffuse reflected light of the PCB board 620 can both be incident on the reflector 420, and the image of the BGA chip 610 and the image of the PCB board 620 reflected by the reflector 420 can be received by the camera 430. When the identification area of ​​the image of the BGA chip 610 received by the camera 430 matches the identification area of ​​the image of the PCB board 620, the adsorption component 20 is moved along the Z direction so that the BGA chip 610 adsorbed on the adsorption component 20 is located directly above the PCB board 620.

[0028] The mounting base 10 is provided with an adsorption component 20, a stage 30, and an alignment component 40 to provide a setting environment. The adsorption component 20 is provided on the mounting base 10, and the BGA chip 610 is adsorbed by the adsorption component 20. The stage 30 is provided on the mounting base 10 for placing the PCB board 620. The alignment component 40 is provided on the mounting base 10, and the alignment component 40 can move along the X direction on the mounting base 10 so that the alignment component 40 can move between the stage 30 and the adsorption component 20. Furthermore, the alignment component 40 includes a housing 410 and a reflector 420 and a camera 430 provided in the housing 410. The diffuse reflected light of the BGA chip 610 can be incident on the reflector 420, and the reflected light can be reflected by the reflector 420. The image of the BGA chip 610 reflected by the reflector 420 can be received by the camera 430, and the diffusely reflected light of the PCB board 620 can be incident on the reflector 420. The image of the PCB board 620 reflected by the reflector 420 can be received by the camera 430. The stage 30 is rotated to adjust the angle of the PCB board 620 on the stage 30. When the identification area of ​​the image of the BGA chip 610 received by the camera 430 matches the identification area of ​​the image of the PCB board 620, it indicates that the BGA chip 610 and the PCB board 620 are successfully aligned. The adsorption component 20 is moved along the Z direction so that the BGA chip 610 adsorbed on the adsorption component 20 is located directly above the PCB board 620. The above-mentioned arrangement of the alignment component 40 can successfully align the BGA chip 610 and the PCB board 620, so that the BGA chip 610 and the PCB board 620 are matched, thereby improving the soldering efficiency of the BGA chip 610 and the PCB board 620.

[0029] Attachment Figure 1 The Z direction and the X direction are shown in FIG.

[0030] As a preferred solution of this embodiment, refer to Figure 1 , a first linear module 110, a second linear module 120 and a drive motor (not shown in the figure) are provided on the mounting base 10; the adsorption component 20 is provided on the first linear module 110, and the first linear module 110 is used to drive the adsorption component 20 to move along the Z direction on the mounting base 10; the alignment component 40 is provided on the second linear module 120, and the second linear module 120 is used to drive the alignment component 40 to move along the X direction on the mounting base 10; the stage 30 is provided on the drive motor, and the drive motor is used to drive the stage 30 to rotate on the mounting base 10.

[0031] The first linear module 110 is configured to drive the adsorption assembly 20 to move along the Z direction on the mounting base 10, causing the adsorption assembly 20 to reciprocate in the Z direction, thereby smoothly adjusting the height of the adsorption assembly 20 on the mounting base 10, thereby adjusting the height of the BGA chip 610 adsorbed on the adsorption assembly 20, so that the BGA chip 610 can be placed on the PCB board 620. The second linear module 120 is configured to drive the alignment assembly 40 to move along the X direction on the mounting base 10, causing the alignment assembly 40 to reciprocate in the X direction, thereby smoothly adjusting the position of the alignment assembly 40 on the mounting base 10, thereby moving the alignment assembly 40 between the stage 30 and the adsorption assembly 20. The drive motor is configured to drive the stage 30 to rotate on the mounting base 10, thereby smoothly adjusting the position of the stage 30 on the mounting base 10, thereby adjusting the angle of the PCB board 620 on the stage 30, thereby aligning the PCB board 620 with the BGA chip 610.

[0032] The first linear module 110 and the second linear module 120 may both be ball screw linear modules, which is not specifically limited here.

[0033] As a preferred solution of this embodiment, refer to Figure 3 and Figure 4 A accommodating cavity having a first optical port 4101 and a second optical port 4101 is formed on the outer shell 410. The first optical port 4101 and the second optical port 4101 are respectively located on opposite sides of the outer shell 410, and the first optical port 4101 is set toward the adsorption component 20, and the second optical port 4101 is set toward the stage 30. The reflector 420 and the camera 430 are both arranged in the accommodating cavity, and the reflector 420 is located between the first optical port 4101 and the second optical port 4101.

[0034] Among them, the setting of the first optical port 4101 and the second optical port 4101 is used to enable the diffuse reflected light of the BGA chip 610 and the diffuse reflected light of the PCB board 620 to enter the housing 410 along the first optical port 4101 and the second optical port 4101 respectively and be incident on the reflector 420. Then, under the action of the reflector 420, the camera 430 can receive the image of the BGA chip 610 and the image of the PCB board 620 to assist in the alignment of the BGA chip 610 and the PCB board 620. The PCB board 620 on the stage 30 is controlled to rotate by the driving motor so that the identification area of ​​the image of the BGA chip 610 matches the identification area of ​​the image of the PCB board 620, thereby completing the alignment of the BGA chip 610 and the PCB board 620.

[0035] As a preferred solution of this embodiment, LED ring light strips (not shown in the figure) are respectively arranged around the first light port 4101 and the second light port 4101, which are used to adjust the brightness of the light irradiated on the BGA chip 610 and the PCB board 620, and control the clarity of the image of the BGA chip 610 and the image of the PCB board 620 received by the camera 430.

[0036] The LED ring light strips provided on the first and second optical ports 4101 and 4101 can enhance the light intensity irradiating the BGA chip 610 and the PCB board 620, thereby improving the clarity of the images of the BGA chip 610 and the PCB board 620. This facilitates comparison of the identification area of ​​the image of the BGA chip 610 with the identification area of ​​the image of the PCB board 620, ensuring that the identification areas of the two are aligned, thereby improving the alignment of the BGA chip 610 and the PCB board 620. In actual operation, the camera 430 is connected to a display, which displays the images of the first and second reflected lights.

[0037] As a preferred solution of this embodiment, refer to Figure 3 and Figure 4 A first material tray 510 is provided on one side of the housing 410 , and the first material tray 510 is used to place solder.

[0038] Among them, after the BGA chip 610 and the PCB board 620 are aligned, solder needs to be set on the BGA chip 610. The second linear module 120 can be used to make the alignment component 40 move along the X direction so that the BGA chip 610 on the adsorption component 20 can be located above the first material tray 510. The first linear module 110 is used to control the BGA chip 610 on the adsorption component 20 to extend into the material tray so that solder adheres to the surface of the BGA chip 610. Then, the second linear module 120 is used to move the alignment component 40 away from between the BGA chip 610 and the PCB board 620, and the first linear module 110 is controlled again so that the side of the BGA chip 610 with solder is located on the PCB board 620.

[0039] As a preferred solution of this embodiment, refer to Figure 3 A second material tray 520 is provided on one side of the housing 410 , and the first material tray 510 and the second material tray 520 are distributed on both sides of the housing 410 along the X direction. The second material tray 520 is used to place flux.

[0040] Among them, the second material tray 520 is used to place flux, which can improve the welding quality of the BGA chip 610 and the PCB board 620. After the solder is adhered to the surface of the BGA chip 610, the second linear module 120 is used to move the alignment component 40 along the X direction so that the position of the BGA chip 610 on the adsorption component 20 can be located above the second material tray 520. The first linear module 110 is used to control the BGA chip 610 on the adsorption component 20 to extend into the second material tray 520 so that flux is adhered to the surface of the BGA chip 610.

[0041] As a preferred solution of this embodiment, refer to Figure 1 and Figure 5 The adsorption component 20 includes a mounting frame 210, a heating component 220, a guide member 230 and an adsorption tube 240. The mounting frame 210 is arranged on the first linear module 110; the heating component 220 includes an air supply component 221 and a heater 222 that are interconnected. The air supply component 221 and the heater 222 are both arranged on the mounting frame 210. The air supply component 221 is used to generate an air flow to blow the heat generated in the heater 222 to form a hot air flow; the guide member 230 is arranged on the side of the mounting frame 210 close to the heater 222. The guide member 230 includes an air inlet 2301 and an air outlet 2302. The air inlet 2301 is connected to the heater 222; the adsorption tube 240 is inserted into the mounting frame 210, passes through the heating component 220 and the guide member 230 in sequence and extends along the air outlet 2302. The end of the adsorption tube 240 close to the air outlet 2302 is used to adsorb the BGA chip 610.

[0042] exist Figure 1 In the embodiment, the outer cover of the adsorption component 20 is provided with a protective cover 201. Figure 5 No protective cover 201 is provided on the outside of the adsorption component 20.

[0043] When the BGA chip 610 is arranged on the PCB board 620, the heating component 220 includes an air supply component 221 and a heater 222 that are interconnected. The air supply component 221 is used to generate an air flow to blow the heat generated in the heater 222 to form a hot air flow. The hot air flow enters the guide member 230 along the air inlet 2301. The adsorption tube 240 is inserted into the mounting frame 210 and passes through the heating component 220 and the guide member 230 in turn and extends along the air outlet 2302. During operation, the end of the adsorption tube 240 close to the air outlet 2302 is used to adsorb the BGA chip 610. When the BGA chip 610 is arranged on the PCB board 620, the heating component 220 works to generate a hot air flow. The hot air flow flows along the guide member 230 and is output from the air outlet 2302, which can heat the BGA chip 610 and melt the solder on the BGA chip 610 so that the BGA chip 610 is soldered to the PCB board 620.

[0044] As a preferred solution of this embodiment, refer to Figure 5 The air supply assembly 221 includes a second shell 2211, a first air supply unit 2212 and a second air supply unit 2213. The second shell 2211 is arranged on the mounting frame 210. The second shell 2211 is formed with a third opening (not shown in the figure) and a fourth opening (not shown in the figure) that are relatively arranged to form an accommodating space. The first air supply unit 2212 is arranged on the third opening, and the second air supply unit 2213 is arranged on the fourth opening. The heater 222 is located between the first air supply unit 2212 and the second air supply unit 2213 and is connected to the accommodating space.

[0045] The air supply assembly 221 includes a second housing 2211 and a first air blower 2212 and a second air blower 2213 disposed on both sides of the second housing 2211. The second housing 2211 is disposed on the mounting frame 210 to secure the air supply assembly 221 to the mounting frame 210. During operation, the airflow generated by the first air blower 2212 enters the accommodating space along the third opening and reaches the heater 222. The airflow generated by the second air blower 2213 enters the accommodating space along the fourth opening and reaches the heater 222. In this embodiment, the first air blower 2212 and the second air blower 2213 can operate simultaneously to deliver airflow to the heater 222. If one of the first air blower 2212 and the second air blower 2213 fails, the other air blower can operate to generate airflow, thereby ensuring the continuity of operation of the chip adsorption heating module.

[0046] In this embodiment, both the first air blower 2212 and the second air blower 2213 can be fans.

[0047] As a preferred solution of this embodiment, refer to Figure 6 and Figure 7 The heater 222 includes a first shell 2221, which forms a accommodating cavity with a first opening 2223 and a second opening 2224. At least one heating plate 2222 is provided in the first shell 2221, and a heating wire is embedded in the heating plate 2222. The first opening 2223 is connected to the accommodating space, and the second opening 2224 is connected to the air inlet 2301.

[0048] Among them, the heater 222 includes a first shell 2221, and the heater 222 is fixed on the mounting frame 210. The first opening 2223 and the second opening 2224 formed on the first shell 2221 are used to allow air flow to pass through. During actual operation, the first opening 2223 is used to communicate with the air supply component 221, and the air flow enters the accommodating cavity along the first opening 2223. The heating wire embedded in the heating plate 2222 generates and releases heat, and heats the air flow in the accommodating cavity to generate hot air flow. The hot air flow is output along the second opening 2224, enters the guide member 230 through the air inlet 2301, and under the action of the guide member 230, the hot air flow is transported to the BGA chip 610, thereby melting the solder on the BGA chip 610 and welding it to the PCB board 620.

[0049] The arrangement and number of the heating plates 2222 are not specifically limited. Figure 7 There are four heating plates 2222 , which are arranged in pairs in a group and are opposite to each other in the first shell 2221 .

[0050] The arrangement of the heating wires in the heating plate 2222 is not specifically limited here. For example, the heating wires are arranged in an S-shaped structure on the heating plate 2222. The above arrangement can improve the heating efficiency of the heating wires.

[0051] As a preferred solution of this embodiment, refer to Figure 2 The reflector 420 is formed with a first reflecting surface 421 and a second reflecting surface 422. The first reflecting surface 421 is arranged close to the first optical port 4101, and the second reflecting surface 422 is arranged close to the second optical port 4101. The diffusely reflected light of the BGA chip 610 can be incident on the first reflecting surface 421, and the image of the BGA chip 610 reflected by the first reflecting surface 421 is received by the camera 430. The diffusely reflected light of the PCB board 620 can be incident on the second reflecting surface 422, and the image of the PCB board 620 reflected by the second reflecting surface 422 is received by the camera 430.

[0052] The diffusely reflected light of the BGA chip 610 and the diffusely reflected light of the PCB board 620 are reflected by the first reflective surface 421 and the second reflective surface 422 of the reflector 420 .

[0053] It should be understood that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Those skilled in the art may modify the technical solutions described in the above embodiments, or make equivalent replacements for some of the technical features therein; and all these modifications and replacements should fall within the scope of protection of the claims attached to the present invention.

Claims

1. A BGA chip repair equipment rapid alignment device, characterized in that: include: Mounting seat; An adsorption component is provided on the mounting seat, the adsorption component is used to adsorb the BGA chip, and the adsorption component can move on the mounting seat along the Z direction; A loading platform is provided on the mounting base, the loading platform is used to place the PCB board, and the loading platform can rotate on the mounting base; an alignment component, disposed on the mounting seat, capable of moving on the mounting seat along an X direction so as to be moved between the stage and the adsorption component; The alignment assembly includes a housing and a reflector and a camera disposed in the housing, wherein the housing is disposed on the mounting seat; The reflector is arranged opposite to the camera, and the diffuse reflected light of the BGA chip and the diffuse reflected light of the PCB board can both be incident on the reflector. The image of the BGA chip and the image of the PCB board reflected by the reflector can be received by the camera. When the identification area of ​​the image of the BGA chip received by the camera matches the identification area of ​​the image of the PCB board, the adsorption component is moved along the Z direction so that the BGA chip adsorbed on the adsorption component is located directly above the PCB board.

2. The BGA chip repair equipment rapid alignment device according to claim 1, characterized in that: The mounting seat is provided with a first linear module, a second linear module and a driving motor; The adsorption component is provided on the first linear module, and the first linear module is used to drive the adsorption component to move on the mounting seat along the Z direction; The alignment component is provided on the second linear module, and the second linear module is used to drive the alignment component to move on the mounting seat along the X direction; The loading platform is arranged on the driving motor, and the driving motor is used to drive the loading platform to rotate on the mounting seat.

3. The BGA chip repair equipment rapid alignment device according to claim 2, characterized in that: A accommodating cavity having a first optical port and a second optical port is formed on the shell, the first optical port and the second optical port are respectively located on opposite sides of the shell, and the first optical port is set toward the adsorption component, and the second optical port is set toward the stage, the reflector and the camera are both arranged in the accommodating cavity, and the reflector is located between the first optical port and the second optical port.

4. The BGA chip repair equipment rapid alignment device according to claim 3, characterized in that: LED ring light strips are respectively arranged around the first light port and the second light port to adjust the brightness of the light irradiated on the BGA chip and the PCB board, and control the clarity of the image of the first reflected light and the image of the second reflected light received by the camera.

5. The BGA chip repair equipment rapid alignment device according to claim 4, characterized in that: A first material tray is provided on one side of the shell, and solder is placed in the first material tray.

6. The BGA chip repair equipment rapid alignment device according to claim 5, characterized in that: A second material tray is provided on one side of the housing. The first material tray and the second material tray are distributed on both sides of the housing along the X direction. The second material tray is used for placing soldering flux.

7. The BGA chip repair equipment rapid alignment device according to claim 6, characterized in that: The adsorption assembly includes a mounting frame, a heating assembly, a flow guide and an adsorption tube, and the mounting frame is mounted on the first linear module; The heating assembly includes an air supply assembly and a heater, both of which are arranged on the mounting frame, and the air supply assembly is used to generate airflow to blow the heat generated in the heater to form a hot airflow; The guide member is provided on a side of the mounting frame close to the heater, and an air inlet and an air outlet are formed on the guide member, and the air inlet is communicated with the heater; The adsorption tube is inserted into the mounting frame, passes through the heating component and the guide member in sequence and extends along the air outlet. One end of the adsorption tube close to the air outlet is used for adsorbing the BGA chip.

8. The BGA chip repair equipment rapid alignment device according to claim 7, characterized in that: The air supply assembly includes a second shell, a first air supply and a second air supply. The second shell is arranged on the mounting bracket. The second shell is formed with a storage space with a third opening and a fourth opening arranged opposite to each other. The first air supply is arranged on the third opening, and the second air supply is arranged on the fourth opening. The heater is located between the first air supply and the second air supply and is connected to the storage space.

9. The BGA chip repair equipment rapid alignment device according to claim 8, characterized in that: The heater includes a first shell, which forms a accommodating cavity with a first opening and a second opening. At least one heating plate is provided on the first shell, and a heating wire is embedded in the heating plate. The first opening is connected to the accommodating space, and the second opening is connected to the air inlet.

10. The BGA chip repair equipment rapid alignment device according to claim 9, characterized in that: The reflector is formed with a first reflecting surface and a second reflecting surface, the first reflecting surface is arranged close to the first optical port, and the second reflecting surface is arranged close to the second optical port. The diffusely reflected light of the BGA chip can be incident on the first reflecting surface, and the image of the BGA chip reflected by the first reflecting surface is received by the camera. The diffusely reflected light of the PCB board can be incident on the second reflecting surface, and the image of the PCB board reflected by the second reflecting surface is received by the camera.

Images