Reflow soldering process clamp compatible with multi-specification BOX packaging high-power blue-light lasers

Abstract

The utility model provides a compatible multi-specification BOX package high-power blue light laser reflow soldering process fixture, including bottom plate subassembly, guide subassembly and counterweight briquetting, said bottom plate subassembly includes bottom plate, equal height column and locating plate, bottom plate and locating plate are both frame structure, locating plate is embedded in the frame of bottom plate, equal height column is vertically installed on the surface of bottom plate, and the guide subassembly is equipped with the counterweight briquetting. The plurality of groups are symmetrically distributed; the guide assembly comprises a fixing plate and a guide plate, a groove is formed in the surface of the fixing plate, a hole is formed in the middle of the groove, the guide plate is placed in the groove, the position of the guide plate can be fixed and adjusted in a sliding mode, and a plurality of inserting holes are formed in the guide plate; the fixing plate is installed above the bottom plate through the equal-height columns, the balance weight pressing blocks can be freely inserted into the inserting holes, and the lower ends of the balance weight pressing blocks can reach the position height of the positioning plate. The fixture can realize simultaneous backflow of multiple COS in Box tube shells with multiple dimensions and specifications, and has the characteristics of simplicity and convenience in operation, high process stability, better process consistency, low product switching cost and the like.

Description

Technical Field

[0001] The utility model belongs to the technical field of laser reflow soldering process fixtures, in particular to a reflow soldering process fixture for high-power blue lasers that is compatible with multiple specifications of BOX packaging. Background Art

[0002] Fiber lasers are a core component of industrial laser equipment. These lasers consist of numerous parallel-connected lasers packaged in a box, creating a stable, constant-power pump source that excites rare-earth-doped glass fibers, generating exponentially higher power output. These lasers are used in heavy-duty industrial applications, such as cutting and welding, with power levels reaching kilowatts.

[0003] In addition to serving as a pump source for fiber lasers, box-packaged lasers can also be used directly in industrial and consumer applications. Power consumption should be within 300W. Applications include conventional laser cutting, welding, rust removal, and marking.

[0004] Typical Box package laser ( Figure 1 Internally, multiple COS lasers are combined through beam shaping and spatial combining, and then output via optical fiber. The box-encapsulated laser generates significant heat, placing extremely high demands on the welding process between the internal COS laser components and the box housing. Otherwise, the final output power will drop rapidly due to thermal conductivity issues, impacting reliability.

[0005] Currently, only reflow soldering is suitable for mass production of COS lasers and box housings. While the reflow oven is standard equipment and provides the required atmosphere, custom fixtures are required for alignment and pressure application, tailored to the specific product.

[0006] Many companies strictly control the number of internal optical paths when designing this type of tube and fixture due to technical difficulties such as heat dissipation. The fixture generally adopts a slope downward pressure method ( Figure 2 This type of fixture typically consists of a base, counterweight, and stoppers. Each product change requires remanufacturing all parts, resulting in high production costs. Furthermore, the increased number of internal optical paths significantly increases the volume of the Box housing, making the traditional ramp-down method more limited. This also significantly increases the size of the fixture, making it cumbersome to operate. Relocating the fixture can easily cause the counterweight to contact, making it difficult to move. Thermal conductivity also deteriorates, affecting welding quality.

[0007] For larger tube shells, another method is to use the inner wall of the tube shell as a positioning reference, make guide parts and install them on the tube shell, and then use the counterweight to press the COS ( Figure 3This method is suitable for tubes and cases within a certain volume and cannot be used with multi-channel boxes. Furthermore, this fixture requires customized guide components for each product. The overall machining accuracy is high, relying on the precision of the tube and case. Removing the fixture can also be difficult; touching the guide components can damage the COS.

[0008] Therefore, the existing reflow fixture design has the following disadvantages:

[0009] (1) Poor compatibility, almost only one-to-one use;

[0010] (2) The operation is inconvenient, especially after heating, it is difficult to operate while wearing heat-insulating gloves, which can easily cause burns.

[0011] (3) When the volume of multi-channel products increases, there is no operating space, which is not conducive to transportation;

[0012] (4) After reflux, due to volume reasons, there is no operating space and cooling is required in the furnace cavity, resulting in low equipment utilization.

[0013] (5) The overall cost is relatively high. Utility Model Content

[0014] Purpose of the utility model: In order to overcome the problems in the prior art, the utility model provides a reflow soldering process fixture compatible with multi-specification BOX packaging high-power blue lasers, which can realize the simultaneous reflow of multiple COS in Box tube shells of multiple sizes and specifications, and has the characteristics of simple operation, high process stability, good process consistency, and low product switching cost.

[0015] Technical solution: To achieve the above purpose, the present invention adopts the following technical solution:

[0016] A reflow soldering process fixture for high-power blue lasers that is compatible with multiple specifications of BOX packaging, including a base plate assembly, a guide assembly and a counterweight block. The base plate assembly includes a base plate, equal-height columns and a positioning plate. The base plate and the positioning plate are both frame structures. The positioning plate is embedded in the frame of the base plate. The equal-height columns are vertically installed on the surface of the base plate. Several groups of equal-height columns are arranged and symmetrically distributed. The guide assembly includes a fixed plate and a guide plate. The surface of the fixed plate is provided with a groove and a hole is opened in the middle of the groove. The guide plate is placed in the groove and can be fixed and slid to adjust the position. The guide plate is provided with several sockets. The fixed plate is installed above the base plate through the equal-height columns. The counterweight block can be freely inserted into the socket, and the lower end can reach the position height of the positioning plate.

[0017] As a specific implementation scheme, the base plate is rectangular, and four equal-height columns are provided, distributed at the four corners of the base plate.

[0018] As a specific implementation scheme, a plurality of raised positioning pins are provided on the surface of the positioning plate.

[0019] As a specific implementation scheme, the top of the equal-height column is provided with a connecting piece for connecting to a fixing plate; preferably, the connecting piece is selected from a thumb screw.

[0020] As a specific implementation scheme, a strip hole is provided on the edge of the guide plate, and a locking device for locking the guide plate is provided in the strip hole; preferably, the locking device is selected from a cylindrical head locking screw.

[0021] As a specific implementation scheme, the side wall of the fixed plate is provided with an adjusting device for adjusting the position of the guide plate. The adjusting device passes through the side wall of the fixed plate and extends into the groove on the surface of the fixed plate, and its end can rest against the side wall of the guide plate; preferably, the adjusting device is selected from an adjusting screw.

[0022] Beneficial effects: Compared with the existing technology, the reflow soldering fixture of the present invention serves as a reflow carrier, which is backward compatible with the reflow processes of multiple large tube shells and various small tube shells or devices. It is easy to operate, and the quality of the device will not be affected by touching the parts during transportation. When switching between different products, only one part needs to be made, and the overall cost is very low. Moreover, the switching adopts a fast design, which is easy to operate and highly efficient. After the reflow is completed, you can wear heat-insulating gloves to carry it to avoid burns, and the cooling does not occupy the equipment, which improves the efficiency of the equipment. Therefore, the reflow soldering fixture overcomes many disadvantages of existing fixtures in the industry, and has the characteristics of unique structure, compatibility, convenient operation, easy transportation, high reflow efficiency, and good reflow heat conduction effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is an example of a typical Box packaged laser.

[0024] Figure 2 This is an example of a fixture that uses a ramp-down pressure method.

[0025] Figure 3 This is an example of a fixture that uses the inner wall of the tube shell as a positioning reference.

[0026] Figure 4 This is a schematic diagram of the overall structure of the reflow soldering process fixture of the present invention.

[0027] Figure 5 This is a structural schematic diagram of the base assembly in the reflow soldering process fixture of the present invention.

[0028] Figure 6 This is a schematic diagram of the structure of the guide component in the reflow soldering process fixture of the present invention.

[0029] Figure 7 Schematic diagram of the Box tube shell and cos laser installed on the base assembly.

[0030] Figure 8This is a schematic diagram of the Box tube shell and cos laser installed on the base assembly and the guide assembly after installation.

[0031] Figure 9 This is a schematic diagram of the Box tube shell and cos laser installed on the base assembly, and the guide assembly and counterweight block after installation.

[0032] Figure 10 Schematic diagram of the assembled fixture grabbing area. DETAILED DESCRIPTION

[0033] The present invention will be further described below with reference to the accompanying drawings.

[0034] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0035] In the description of this utility model, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; mechanical connections, electrical connections; direct connections, indirect connections through an intermediate medium, and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in this utility model based on specific circumstances.

[0036] Example

[0037] A reflow soldering fixture compatible with multiple specifications of BOX packaged high-power blue lasers, such as Figure 4 As shown, it includes a base plate assembly 1, a guide assembly 2 and a counterweight pressing block 3.

[0038] like Figure 5As shown, the base plate assembly 1 includes a base plate 101, contour columns 102, a positioning plate 103, positioning pins 104, and connectors 105. The base plate 101 and the positioning plate 103 are both frame structures. The positioning plate 103 is embedded in the frame of the base plate 101. The contour columns 102 are vertically mounted on the surface of the base plate 101. Several groups of contour columns 102 are arranged and symmetrically distributed. Several raised positioning pins 104 are provided on the surface of the positioning plate 103. Connectors 105 for connecting to the fixed plate 201 are provided at the top of the contour columns 102.

[0039] In this embodiment, the connecting member 105 is selected from a thumb screw. The bottom plate 101 is rectangular, and four equal-height columns 102 are provided, which are respectively distributed at the four corners of the bottom plate 101.

[0040] like Figure 6 As shown, the guide assembly 2 includes a fixed plate 201, a guide plate 202, a locking device 203 and an adjusting device 204. The surface of the fixed plate 201 is provided with a groove and a hole is opened in the middle of the groove. The guide plate 202 is placed in the groove. The edge of the guide plate 202 is provided with a strip hole, and the strip hole is provided with a locking device 203 for locking the guide plate 202; the side wall of the fixed plate 201 is provided with an adjusting device 204 for adjusting the position of the guide plate 202, the adjusting device 204 passes through the side wall of the fixed plate 201, extends into the groove on the surface of the fixed plate 201, and its end can resist the side wall of the guide plate 202 (the guide plate 202 is adjusted in position by pushing the adjusting device 204); a plurality of sockets 2021 are provided on the guide plate 202.

[0041] In this embodiment, the locking device 203 is selected from a cylindrical head locking screw, and the adjusting device 204 is selected from an adjusting screw.

[0042] like Figure 1 As shown, the fixing plate 201 is installed above the base plate 101 through the equal height column 102, and the counterweight block 3 can be freely inserted into the insertion hole 2021, and the lower end can reach the position height of the positioning plate 103.

[0043] The working process and principle of the above reflow process fixture are as follows:

[0044] First, place the fixture flat on the work surface, remove the guide assembly 2 and the counterweight block 3, and then place the Box tube shell in the positioning plate 103. The positioning plate 103 is positioned by the positioning pin 104. Then place the COS laser in the welding position in sequence, such as Figure 7 shown.

[0045] Adjust the position of the guide plate 202 in advance by adjusting the screw 204, and fix the guide plate 202 by the locking device 203, then place the guide assembly 2 as a whole on the equal height column 102, and tighten the thumb screw 105 to tighten it. Figure 8 shown.

[0046] Next, the counterweight pressing block 3 is inserted into the insertion hole 2021 of the guide plate 202 according to the position of the COS, and naturally falls to press the COS (such as Figure 9 The counterweight block 3 plays a compacting role, and its weight is calculated based on parameters such as the COS contact area.

[0047] Finally, press the assembled fixture as a whole Figure 10 Grab the part shown and place it in the reflow oven. After reflow is complete, remove it from the oven wearing heat-insulating gloves and wait for it to cool down before reversing the process.

[0048] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A reflow soldering fixture compatible with multiple specifications of BOX packaging high-power blue lasers, characterized in that: The invention comprises a base plate assembly (1), a guide assembly (2) and a counterweight pressing block (3); the base plate assembly (1) comprises a base plate (101), equal height columns (102) and a positioning plate (103); the base plate (101) and the positioning plate (103) are both frame structures; the positioning plate (103) is embedded in the frame of the base plate (101); the equal height columns (102) are vertically installed on the surface of the base plate (101), and are arranged in several groups and symmetrically distributed; the guide assembly (2) comprises a fixing plate (201) and a guide plate (202); a surface of the fixing plate (201) is provided with a groove and a hole is opened in the middle of the groove; the guide plate (202) is placed in the groove and can be fixed and slid to adjust the position; a plurality of insertion holes (2021) are provided on the guide plate (202); the fixing plate (201) is installed above the base plate (101) through the equal height column (102); the counterweight pressing block (3) can be freely inserted into the insertion hole (2021), and the lower end can reach the position height of the positioning plate (103).

2. The reflow soldering fixture for high-power blue lasers compatible with multiple specifications of BOX packaging according to claim 1 is characterized in that: The bottom plate (101) is rectangular, and four equal-height columns (102) are provided, respectively distributed at the four corners of the bottom plate (101).

3. The reflow soldering fixture for high-power blue lasers compatible with multiple specifications of BOX packaging according to claim 1 is characterized in that: The surface of the positioning plate (103) is provided with a plurality of protruding positioning pins (104).

4. The reflow soldering fixture for high-power blue lasers compatible with multiple specifications of BOX packaging according to claim 1 is characterized in that: A connecting piece (105) for connecting to a fixing plate (201) is provided on the top of the equal-height column (102).

5. The reflow soldering fixture for high-power blue lasers compatible with multiple specifications of BOX packaging according to claim 1 is characterized in that: A strip-shaped hole is provided on the edge of the guide plate (202), and a locking device (203) for locking the guide plate (202) is provided in the strip-shaped hole.

6. The reflow soldering fixture for high-power blue lasers compatible with multiple specifications of BOX packaging according to claim 1 is characterized in that: The side wall of the fixed plate (201) is provided with an adjusting device (204) for adjusting the position of the guide plate (202); the adjusting device (204) passes through the side wall of the fixed plate (201) and extends into a groove on the surface of the fixed plate (201), and its end can abut against the side wall of the guide plate (202).

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